Making Or Attaching Electrode On Or To Semiconductor, Or Securing Completed Semiconductor To Mounting Or Housing (437/180) Patents (Class 438/FOR340)
Foreign Patent Art Collections
- Including central layer acting as barrier between outer layers (437/190) (Class 438/FOR350)
- Of polysilicon only (437/191) (Class 438/FOR351)
- Including refractory metal layer of Ti (Titanium), Zr (Zirconium), Hf (Hafnium), V (Vanadium), Nb (Niobium), Ta (Tantalum), Cr (Chromium), Mo (Molybdenum), W (Tungsten) (437/192) (Class 438/FOR352)
- Including polycrystalline silicon layer (437/193) (Class 438/FOR353)
- Including Al (Aluminum) layer (437/194) (Class 438/FOR354)
- Including layer separated by insulator (437/195) (Class 438/FOR355)
- Al (Aluminum) alloy (437/197) (Class 438/FOR357)
- Silicide of Ti (Titanium), Zr (Zirconium), Hf (Hafnium), V (Vanadium), Nb (Niobium), Ta (Tantalum), Cr (Chromium), Mo (Molybdenum), W (Tungsten), (437/200) (Class 438/FOR360)
- Of plantinum metal group Ru (Ruthenium), Rh (Rhodium), Pd (Palladium), Os (Osmium), Ir (Iridium), Pt (Platinum) (437/201) (Class 438/FOR361)
- By fusing metal with semiconductor (alloying) (437/202) (Class 438/FOR362)
- Including contaminant removal (437/210) (Class 438/FOR370)
- Utilizing potting or encapsulating material only to surround leads and device to maintain position, i.e. without housing (437/211) (Class 438/FOR371)
- Utilizing header (molding surface means) (437/214) (Class 438/FOR374)
- Insulating housing (437/215) (Class 438/FOR375)
- Lead frame (437/220) (Class 438/FOR380)
- Metallic housing (437/221) (Class 438/FOR381)
There are no patents to show for this class.
