Securing Completed Semiconductor To Mounting, Housing Or External Lead (437/209) Patents (Class 438/FOR369)

Foreign Patent Art Collections

Including contaminant removal (437/210) (Class 438/FOR370)

Utilizing potting or encapsulating material only to surround leads and device to maintain position, i.e. without housing (437/211) (Class 438/FOR371)

Including application of pressure (437/212) (Class 438/FOR372)
Glass material (437/213) (Class 438/FOR373)

Utilizing header (molding surface means) (437/214) (Class 438/FOR374)

Insulating housing (437/215) (Class 438/FOR375)

Including application of pressure (437/216) (Class 438/FOR376)
And lead frame (437/217) (Class 438/FOR377)
Ceramic housing (437/218) (Class 438/FOR378)
Including encapsulating (437/219) (Class 438/FOR379)

Lead frame (437/220) (Class 438/FOR380)

Metallic housing (437/221) (Class 438/FOR381)

Including application of pressure (437/222) (Class 438/FOR382)
Including glass support base (437/223) (Class 438/FOR383)
Including encapsulating (437/224) (Class 438/FOR384)

There are no patents to show for this class.