Abstract: A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10′), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.

Abstract: The present invention is a cost effective module that provides high performance, high density and highly reliability interconnections needed between the various circuit devices that form a functional system or a part of a larger system. It includes circuit members having high speed, impedance-controlled transmission line signal paths, short land grid array interconnections between circuit members and, optionally, driver line terminators built into one of the circuit members, for maintaining high electrical performance. Suitable applications include mainframe computers, workstations, telecommunications networks, or other electronic equipment. The circuit members may be formed on conventional printed circuit cards with unpacked or packed circuit devices attached directly to the circuit members. Thermal control structures may be included to maintain the circuit devices within a reliable range of operating temperatures. A clamp is also included.

Abstract: An adapter apparatus is provided for receiving a packaged device having a plurality of contact elements disposed on a surface thereof. The adapter apparatus includes a perimeter wall member having a length along an adapter axis between a first end of the wall member and a second end of the wall member. A conductive element layer including arranged contact elements is positioned at the first end of the perimeter wall member orthogonal to the adapter axis. The perimeter wall member and the conductive element layer define a socket cavity to receive the packaged device with the contact elements thereof adjacent the arranged conductive elements of the conductive element layer. A cover member is positioned at the second end of the perimeter wall member to close the socket cavity. The cover member is movable to allow the packaged device to be removed from the socket cavity.

Abstract: A socket, such as IC socket, for an electrical part such as IC package comprises a socket body having a mount portion on which an electrical part having terminals is mounted, a plurality of contact pins arranged to the socket body and having an elastic property adapted to contact and separate from the terminals of the electrical part, and an upper operation member arranged for the socket body to be vertically movable in a mounted state and having substantially a rectangular frame shape. Each of the contact pins is formed with a movable contact piece contacting the terminal of the electrical part, and the movable contact pin is deformed by the vertical movement of the operation member so as to contact and separate from the terminal.

Abstract: An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and spring plate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

Abstract: An IC socket which has a moving plate provided so that it can laterally move with respect to a base member, an operation member vertically moveably provided with respect to the base member, and at least one actuation member for moving contact pins arranged on the base member from a contact position to a non-contact position with respect to terminals of an IC package by laterally moving the moving plate in accordance with the depression of the operation member. The actuation member is arranged along the end surface of the moving plate.

Abstract: A retainer clip is shown for retaining a device through an opening in a panel such as a printed circuit board, enclosure wall or similar structure. The clip surrounds the portion of the device projecting through the aperture and by a single longitudinal motion engages cooperating portions of the device to secure the device at the panel opening. The clip includes means for detenting in the assembled, locking position to prevent accidental release of the device from the secured, mounted condition.

Abstract: The socket of the present invention includes a base, a plurality of contacts, a contact moving member slidably supported on the base, a cover allowing the contact moving member to slide on the base, a guiding member for holding an IC package and a swaying mechanism. The guiding member is movably supported on the contact moving member. The swaying mechanism sways the guiding member when the operating member is moved with respect to the base so that the contact moving member slides on the base.

Abstract: A socket for an electric part includes a pair of slide plates 7 and 8 movable in opposite directions. Contact pin-pressingportions 9 are provided on each of the slide plates 7 and 8 for opening each of contact pins 3 to opposite sides, and operating arms 18 are disposed on a socket body 2 of the socket for turning movement about base ends, and are connected to the slide plates 7 and 8 for operating the slide plates 7 and 8, respectively. Operating projections 28 are disposed on an operating member 22 for turning the operating arms 18 by the vertical movement of the operating member 22, so that the operating arms 18 are turned by the operating projections 28 by urging the operating member 22 downwards to move the slide plates 7 and 8. Thus, the slide plates can be moved easily by urging the operating member by a smaller force.

Abstract: A retention module for securing a heat sink (4) to a board-mounted socket connector (2) comprises a pair of metal frames (5) and four screws (54) for securing the frames to the PCB. Each frame includes a bottom wall (50), a pair of first side walls (51) and a second side wall (52) together defining a receiving space (53) for receiving a side portion of the heat sink. The bottom wall includes an integrally formed grounding plate (50c) to contact the heat sink. The retention module further comprises a pair of clips (6) assembled to the frames thereby increasing the securing relationship between the heat sink and the frames.

Abstract: In a socket for an electric part, contact pin-operating bores 12 are provided in a slide plate 10 for opening contact pins 3, and operating grooves 14 are defined in the slide plate 10 and each have a tapered face 16. Operating arms 25 are disposed on an operating member 21 adapted to be engaged into the operating grooves 14 in the slide plate 10, so that the tapered faces 16 of the operating grooves 14 are urged by the operating arms 25 by urging the operating member 21 downwards, thereby directly moving the slide plate 10. Thus, the slide plate can be moved by a simple structure, and the socket can be manufactured easily and at a lower cost. In addition, the stability of contact of the contact pins with terminals can be enhanced.

Abstract: A connector of a modular machine board disposed on an inner edge of a back board of a display apparatus of an electronic device contacts with joint points of the electronic device, such that metal resilient pieces of said connector are assured to tightly contact with said joint points by means of the resilience of resilient component. As a result, even under vibration, the resilient component can regulate the up-and-down position of said connector along with vibration force to enable the metal resilient pieces to maintain a tight contact at the joint points of the electronic device.

Abstract: A mounting assembly for providing bus termination of a signal line on a printed circuit board (PCB). The mounting assembly includes a connector arrangement, a bus termination device, pressure plate and a clamping mechanism. The bus termination device is received by the connector arrangement, such that electrical interface elements of the bus termination device engage electrical interface elements of the connector arrangement to provide electrical communication between the connector arrangement and the signal line of the PCB. The clamping mechanism is engageable with the bus termination device for maintaining electrical contact between the electrical interface elements for securing the connector arrangement and bus termination device to the PCB. The pressure plate member is interposed between the clamping mechanism and the bus termination board.

Abstract: A test socket for an electronic assembly comprising a holder, a plurality of electric terminals, a heat sink, a compliant and thermally conductive thermal interface component, and a heat sink biasing device is provided. The holder has a formation to receive the electronic assembly. The electric terminals are located on the holder, each for making contact with a respective electric contact and the electronic assembly to test an integrated circuit of the electronic assembly. The heat sink is secured to the holder. The thermal interface component is attached to a surface of the heat sink.

Abstract: A card connector for an IC card has a connector body, a card slot formed in the connector body, a cover for covering the card slot, and looking portions disposed in the connector body. The cover is pivotally supported at a first edge portion thereof by a pivotal pin which is supported by the connector body. The cover has a hook at a second edge portion opposite to the first edge portion. The cover can be moved with respect to the connector body along the pivotal pin. When the cover is moved along the pivotal pin in a closed state, the locking portion comes to engage with the hook of the cover, thereby restricting a pivotal movement of the cover for exposing the card slot or the card.

Abstract: A socket for an electrical part comprises an open/close member mounted, to be rotatable about a rotational shaft, to a socket body in which an electrical part is accommodated, an urging member for urging the open/close member in a closed direction thereof, and an operation member vertically movable with respect to the socket body. The open/close member is opened against the urging force of the urging member by depressing the operation member. the urging member has one end portion engaged with a portion of the open/close member apart from a rotation center thereof and another end portion engaged with the operation member.

Abstract: A clamp connector assembly for forming a plurality of electrical connections between two circuit members includes a bottom plate below the circuit members, two retention posts extending upwardly from the bottom plate and through holes in a top plate above the circuit members, two rotary clamp members mounted on the upper ends of the retention posts with offset arms extending outwardly from the posts to facilitate manual rotation of the clamp members and actuation of assembly closing connections between the members and the top plate to force the top plate toward the bottom plate, clamp the circuit members together and form electrical connections between the circuit members.

Abstract: A module (44) for a test system interfaces between (a) a tester mechanism (16 and 42) having tester contacts (152) for carrying test signals and (b) a device-side board (46) having device-side contacts (162) for connection to external leads of an electronic device (40) under test. The interface module contains a tester side body (50) having tester side openings (86) for being positioned opposite the tester-side contacts, a device-side body (52) having device-side openings (136) for being positioned opposite the device-side openings, and interface conductors (54) extending through the tester-side and device-side openings for connecting the tester contacts to the device-side contacts. The tester body is configured, typically as at least five wedge-shaped portions (68), in such a manner as to enable the electronic device under test to have an increased number of external leads.

Abstract: The present invention relates to a socket for testing ICs and, in particular, high speed ICs in BGA packages, and a means of holding an IC package in the test socket. The socket uses resilient conductive test pads positioned on a substrate in an array to match an array of spherical contacts on the bottom of a BGA package. The BGA package is aligned with the test pads by the use of holes centered on the test pads into which the spherical contacts are seated. The test socket is provided with two flexible seals on the top of a support, which encircle the test pads. The flexible seals, together with a top surface of a support and a socket lid, define an enclosed cavity to which a vacuum is applied. The flexible seals are thereby compressed pulling the socket lid inward and forcing the IC package leads into contact with the test pads.

Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises the following components. (1) A base unit, consisting of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) An interposer, comprising flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) An adapter unit, capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.

Abstract: A connector (1) for receiving a microcircuit card, the connector having a resilient arm (9) on a first border (10) of the seat (2) of the connector. The arm is curved inwardly towards the seat to exert pressure on an edge of the card in the direction of a second border (11) of the seat, opposite the first border. It allows to limit a longitudinal mobility of the card in its seat. Further, the connector also has releases (14, 15, 19, 31, 36) on an upper portion of its housing to cover an upper portion of the card, in order to prevent a vertical mobility of the seated card.

Abstract: In a socket for an IC package as an electrical part, the IC package is mounted on a mount surface of a top plate mounted on a socket body of the socket. A number of contact pins are arranged to the socket body to be contacted to or separated from solder balls of the IC package. A slide plate is disposed to the socket body so as to be movable with respect to the socket body. Each of the contact pins has a pair of elastic pieces formed at front end portions thereof with a pair of contact portions, each of the paired contact portions of the paired elastic pieces being opened or closed in accordance with the movement of the slide plate so as to clamp the solder balls of the IC package thereby electrically being connected thereto. A pre-load plate is located to press a middle portion of the elastic piece of the contact pin arranged to the socket body so as to elastically deform the middle portion thereof along a direction in that the paired contact portions are close to each other.

Abstract: A chip carrying socket includes a base and at least one and preferably two cam shafts journaled or supported within the base in a spaced relationship for rotational movement relative to the base. A plate is supported upon the base and extends between the cam shafts. The plate has a plurality of openings formed therein which receive the leads of an IC. In a BGA type IC, these leads are semi-spherical balls which depend from the lower face of the IC. Conductors or pins adapted for connection to testing or operative circuitry are carried by the base and extend into proximity with the leads of the IC as it is supported upon the plate. Each cam shaft engages the plate so as to shift the plate relative to the base causing the conductors carried by the base to forcibly engage the leads of the IC when in one shifted position and causing the conductors to be released from such forcible engagement with the leads of the IC when in a second shifted position.

Abstract: A module carrier includes a liftable upper cover of metal and a plastic seat for securing modules. The bottom portion of the plastic seat is provided with a pair of plastic elements for receiving a plurality of terminals. The contact ends of the terminals have top edges provided with three or four contact points. The rear edge of the upper cover, which has a generally inverted U-shaped cross section, has round posts projecting from the inner portions on both sides thereof. The front edge has slightly lower projecting plates provided on both sides thereof. The upper end of each projecting plate is provided with a boss. The middle portion of the front edge is bent to form an actuating rib. Additionally, the end face is provided with front, rear and middle openings. A pair of downwardly inclined elastic plates are provided above each of the front and rear openings. The plastic seat is provided with front, rear and middle hot air inlets.

Abstract: A cover assembly for IC chip has a lid portion and a retractable chip depressor member extendable from the underside of the lid portion along the lid's z-axis. When the cover assembly is mounted over the chip cavity of an IC socket and is properly indexed in the x-y plane of the socket, the retractable chip depressor member is retractable advanced along the z-axis of the lid portion to contact and depress the chip in the socket's chip cavity by a force that is parallel to the z-axis of the chip cavity and that is normal to the IC chip.

Abstract: A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Abstract: An IC socket which has a moving plate provided so that it can laterally move with respect to a base member, an operation member vertically moveably provided with respect to the base member, and at least one actuation member for moving contact pins arranged on the base member from a contact position to a non-contact position with respect to terminals of an IC package by laterally moving the moving plate in accordance with the depression of the operation member. The actuation member is arranged along the end surface of the moving plate.

Abstract: A connector includes a cover adapted to openably close an opening of a housing, and a locking mechanism for locking the cover in a closed position. The cover is provided with first metallic reinforcement means which is partially embedded in the cover during the molding thereof. Second metallic reinforcement means is fixed to the housing. The cover is locked in the closed position by bringing an engagement portion of the first reinforcement means into engagement with an engagement portion of the second reinforcement means.

Abstract: Subscriber identification module card fixing seat with slidable and laterally latching cover, including: a base seat, a top face of the base seat being recessed to form a receiving cavity in which a subscriber identification module card can be snugly received and bridged, multiple connecting terminals being arranged and inlaid in a bottom board body of the receiving cavity for electrically connecting with the subscriber identification module card, at least one shaft seat being disposed on one side of the receiving cavity of the base seat; and an upper cover including a cover board. A first side of the cover board is connected with a rotary shaft which is slidably pivotally mounted in the shaft seat of the base seat.

Abstract: A socket (10) includes an adaptor (28) which has a seating surface (28b) for an IC (100) and which has a plurality of contact member receiving holes (28d) in the seating surface. The tips (14c) of a plurality of contact members (14) are received through the contact member receiving holes (28d) of the adaptor, with contact established with each respective terminal (101) of the IC (100) that has been placed on the seating surface. The IC on the seating surface is held by means of rotary latches (22). The latches (22) have an opened position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC from above it, rotating about a shaft (32) fixed to the base. A cover (20) is movable between first and second positions and a links (24) connected to the cover (24) open the latches when the cover is at a first position and close the latches when the cover is at a second position.

Abstract: The present invention is intended to solve the problems by providing a structure comprising a cover, a base frame mounted to the cover via a coil spring, a base frame-fixing frame, boards, through-holes for contact elements, contact elements, printed circuit-fixing pins, and locking means. The locking means have locking lever-fixing shafts extending horizontally. Locking levers are pivotally mounted to the locking lever-fixing shafts, respectively. Kick springs are wound around the locking lever-fixing shafts, respectively. The locking levers have locking lever-pushing portions to form IC device-sandwiching portions. The cover is pushed to cause inner corner portions to push against the locking lever-pushing portions. Each of the contact elements has a contact element center-winding portion and contact element both side-winding portions extending from the contact element center-winding portion. The contact elements are inserted in the contact element through-holes.

Abstract: An electrical card connector (1) includes a top lid (10) and a contact module (12). The top lid comprises a metal cover (100) and a pair of elongated grip arms (101) at opposite sides of the metal cover. Each grip arm is separately formed by insert molding at opposite sides of the cover and includes a rail (106) and a rib (107) projecting from a side of the rail. A pivot (108) is provided at a distal end of the rail and a wedge (109) extends from a forward end of the rail opposite the pivot. The contact module includes an insulative housing (120) and plurality of contacts (121). A pair of shaft lids (114) and a pair of lock portions (129) extend rearwardly and forwardly from rear and front corners of the insulative housing. Each shaft lid has a pivot hole (125) for pivotably engaging with a pivot of the grip arms. In use, an electrical card (2) is inserted into the top lid and the top lid is rotated to a closed position.

Abstract: A socket for an electrical part comprises a socket body having a mount portion on which an electrical part having terminals is mounted, a number of contact pins to be contacted to or separated from the terminals of the electrical part and a movable plate disposed to the socket body to be movable perpendicularly with respect to the mount portion in a usable state of the socket. Each of the contact pins has a pair of elastic pieces formed, at front end portions thereof, with contact portions which are opened or closed in accordance with the movement of the movable plate thereby to establish an electrical connection between the contact portions and the terminals of the electrical part when the contact portions are closed. The movable plate is provided with cam portions arranged between adjacent contact pins, respectively, and when the movable plate is moved, the elastic pieces are pressed by a pair of cam portions disposed on both the sides of each of the contact pins thereby to open the contact portions.

Abstract: A socket for an electrical part, the socket having a socket body with a surface and a mount portion in which an electrical part having a plurality of terminals is mounted, a plurality of contact pins mounted on the socket body that are elastically contacted to or separated from the plurality of terminals of the electrical part, the plurality of contact pins having an elastic piece formed at a front end, with a contact portion, a single slide plate slidably connected on a surface of the socket body and an operation member that is vertically movable with respect to the surface of the socket body, wherein either the operation member or the slide plate is formed with an inclined surface and the other of the operation member and the slide plate is formed with a movement roller member which rolls on the inclined surface portion such that when the operation member is moved in a direction normal to the surface of the socket body, the roller member rolls on the inclined surface portion to thereby slide the slide plate

Abstract: A socket for an electrical part includes a socket body, an accommodation portion formed to the socket body and adapted to receive an electrical part to which a plurality of terminals are arranged with a predetermined pitch, a plurality of contact pins arranged to the socket body and adapted to contact to or separate from the terminals, respectively, and a positioning structure, comprising a plurality of projection members, formed to the accommodation portion of the socket body for positioning at least two terminals separated by a plurality of pitches on the accommodation.

Abstract: A socket (1) includes a body (1a) and a cover (3). Body (1a) has a base (2) having a horizontally movable slide (4) thereon on which a BGA package can be mounted and a plurality of contact members (6) arranged on base (2) corresponding to a pattern of solder balls of the BGA package. Each of contact members (6) has a pair of spring arms (6a, 6b) which can be opened and closed in response to movement of slide (4). In one embodiment, a cover (3) is vertically movable relative to body (1a). The cover (3) has motion transfer portions (31) having a wedge shape which are engageable with tapered force receiving portions (43) of slide(4). As cover (3) is pushed down, engagement surfaces (31) of motion transfer portions (30) engage force receiving surfaces (43) of slide (4) and slide (4) moves so that arms (6a, 6b) of contact members (6) are opened. In another embodiment, the motion transfer parts (31) are provided on a head (11) which has an air suction holder for a BGA package.

Abstract: An electrical LGA socket (1) includes an electrical connector portion (11) and an insulative frame portion (10) surrounding the connector portion. The frame portion comprises a stationary element (12) and a driver (14) pivotally assembled to the stationary element. The stationary element comprises an opening (124) for accommodating the connector portion, a Land Grid Package (LGP)(13) and, a heat sink (3) and, a protrusion (120). First and second aligned retainers (22, 24) located opposite to the protrusion and a pair of opposite sides (122) surrounding the opening. The protrusion secures a second flange (312) of the heat sink. The driver comprises a lever (16) rotatable between an open and closed positions, a shaft (18) pivotally assembled to the first and second retainers, and a follower (20) assembled to the shaft and rotatable together with the shaft in response to rotation of the lever. The follower depresses a first flange (311) of the heat sink.

Abstract: A memory card connector 10, which can be locked easily with a small size holder cover 20, includes a housing 11 for a memory card; the holder cover 20 covering the memory card; a plurality of connection terminals 14, are built into the housing so that one end is opposite a contact part of the memory card housed inside the housing and is exposed at the surface of the housing and the other end protrudes from an edge of the housing, the holder cover is supported at one side edge which is sideways with respect to the longitudinal direction of the connector, so that, by pivoting around a rotation shaft 15 provided on one side edge of the housing, the holder cover 20 can be opened and closed with respect to housing 11.

Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises: (1) a base unit, it further consists of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) an interposer, there are a flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) an adapter unit, the unit is capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.

Abstract: A system is provided for testing a bare IC chip having an array of electrode pads. A burn-in socket includes a dielectric housing having a receptacle. A plurality of terminals on the housing include contact portions exposed in the receptacle and terminating portions extending exteriorly of the housing. An adapter socket is configured for positioning in the receptacle in the burn-in socket and includes an opening for removably receiving the bare IC chip. A plurality of conductors have contact portions exposed in the opening for engaging the electrode pads of the bare IC chip. Connection portions of the conductors engage the contact portions of the terminals of the burn-in socket. The conductors are formed on a laminated film which is part of the adapter socket.

Abstract: A compliant contactor interfaces a semiconductor device under test with a tester. The compliant contactor accepts a variety of different sized semiconductor devices along with a variety of different pinouts of the semiconductor devices. The compliant contactor includes an upper alignment block and a lower alignment block which receives the contact pins of the tester. The upper alignment block may move within a predefined distance with respect to the lower alignment block to account for any tester movement, thermal expansion or contraction, or other factors. In an alternative embodiment, the compliant contactor may move in three directions with respect to the test board. In this embodiment, a contact pad provides electrical connection between a daughter card and the test board. The contact pad may be a compressible elastomeric connector.

Abstract: A socket connector includes a rectangular base plate adapted to be positioned on a circuit board and retaining an electronic device, such as an integrated circuit, thereon for establishing electrical connection between the electronic device and the circuit board by means of contacts retained therein. Bumps are formed on the base plate for engaging with notches defined in the electronic device to precisely positioning the electronic device with respect to the base plate. A retention module includes a frame having four wall segments defining an interior space therebetween for receiving the base plate. A pair of sideways projections is formed on one wall segment with aligned holes defined therein for receiving pivots of a resilient clip thereby making the clip movable between an open position where the base plate is exposed for receiving the electronic device and a closed position where the clip resiliently engages with the electronic device thereby securing the electronic device to the base plate.

Abstract: An electrical connector system includes plate-shaped bases (50) that lie on a circuit board (38) and that have contacts (52) with contact tails (58) soldered to traces on the circuit board. A housing (300) that lies on the circuit board around the bases, is coupled to each of the bases to accurately locate the housing with respect to the bases, the housing having a plurality of guides (164) for receiving smart cards that can engage contacting parts of the contacts on the bases. The housing includes a frame (90) that is fixed with respect to the circuit board and bases, and a cover (92) having a rear end pivotally mounted about a lateral axis X-X on the frame and forming the guides for holding the smart cards, so the smart cards can pivot down against the contacts on the bases. The cover can be locked down by a latch (94) formed of a piece of sheet metal that slides on the cover and that has downwardly-extending tabs (228) that fit under slots on a front beam of the frame.

Abstract: A new probe socket is provided that allows for high speed and dependable contacting of points of contact on the Device Under Test. The new probe socket is aimed at a testing environment where semiconductor devices are mounted on device or package strips.

Abstract: A memory card connector 10, wherein when a holder cover 20, which is in contact with an obstacle or stopper and the like, is opened further, deformation and damage to the holder cover can be avoided, by deliberately allowed elastic separation of the holder cover 20 from housing 11 at hinge to prevent damage; the connector 10, includes a housing 11, which houses a memory card; the holder cover 20, covering the memory card; a plurality of connection terminals 14, are built into the housing so that one end is opposite a contact part of the memory card housed inside the housing and is exposed at the surface of the housing and the other end protrudes from an edge of the housing, the holder cover is supported at one side edge which is sideways with respect to the longitudinal direction of the connector, so that, by pivoting around a rotation shaft 15 provided on one side edge of the housing, the holder cover 20 can be opened and closed with respect to housing 11; a hinge part 21, which latches onto the rotation sha

Abstract: An electrical connector for flexible printed board includes a housing with an opening, and a cover rotatable about a pivotal axis for closing or opening the opening. When the cover is closed, a pressure portion disposed along one edge of the cover is clamped between a flexible printed board on a resilient piece of a fork-shaped contact and a fixing piece of the contact while pressing the flexible printed board against the resilient piece. A wire fixed within the cover includes a pair of opposite ends projecting from lateral sides of the cover along the pivotal axis, and an intermediate portion circumventing the pressure portion as spaced a distance from the pivotal axis.

Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

Abstract: In an IC socket, a pressure cover is disposed to be rotatable so as to be opened or closed with respect to a socket body, so that when the pressure cover is closed, an IC package mounted on the socket body is pressed. The pressure cover is provided with a heat sink and a heat of the IC package is radiated therefrom through a press-contact of the heat sink to the IC package. The pressure cover is formed with a heat sink receiver on an inner surface side to the socket body so as to receive the heat sink and a holding member is disposed on an inner surface side of the pressure cover to be detachable so as to detachably hold the heat sink between the heat sink receiver and the holding member.

Abstract: A contacting apparatus comprising: a contact element support and fixedly mounted in said contact element support at least one contact element, wherein A) said contact element comprises: a contact cusp portion, a mounting section adapted to be enclosed by said contacting element support, and a contacting portion, said mounting section forming a step adapted to be located within said contact element support; and B) said contact element support being designed such, that it encloses said contact element only in locations where a load is generated by a contacting force exerted onto said contact cusp portion.

Abstract: A process is provided for manufacturing a layer arrangement (1) having a bump for a flip chip or similar connection. The layer arrangement has a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material and stacked into a layer stack (8). A recess (10) that extends over several layers (2, 3, 4, 5, 6, 7, 11) is made in the layer stack (8) transverse to the coating planes of the layers (2, 3, 4, 5, 6, 7, 11). A bump material (14) is placed in the recess (10). A profiling is created on the lateral boundary wall of the recess (10) by removal of layer material of different layers (2, 3, 4, 5, 6, 7, 11) of the layer stack (8). The profiling, starting from the surface (9) of the layer stack (8) and progressing in layers to the inside of the recess (10), has at least two indentations (12) and at least one projection (13) located between them. After the production of the profiling, a bump material (14) is brought into the recess (10) in such a way that it grasps behind the indentations (12).