Abstract: An IC card connector is provided for connecting an IC card having a terminal array to external equipment. The connector includes a base member having a plurality of electrically conductive contacts exposed on one side of the base member for engaging the terminal array of the IC card. A cover is hinged to the base member for movement toward and away from the one side of the base member. The cover has a receptacle for securing the IC card thereon for pivotal and slidable movement therewith, whereby pivoting of the cover onto the base member of the IC card connector and sliding the cover relative to the base member effects engagement of the IC card terminal array with the contacts.

Abstract: An IC card connector (1) is provided for connecting an IC card (4) having a terminal array (5) to external equipment. The connector includes a base member (2) having a plurality of electrically conductive contacts (16, 17) exposed on one side of the base member (2) for engaging the terminal array of the IC card (4). A cover (3) is hinged to the base member for movement toward and away from the one side of the base member (2). The cover has a receptacle for securing the IC card (4) thereon for pivotal movement therewith and a sliding movement of the IC card (4) relative to the cover in a direction perpendicular to the axis of rotation. Pivoting of the cover (3) onto the base member (2) of the IC card (4) effects engagement of the IC card terminal array (5) with the plurality of contacts (16, 17) and a sliding movement of the IC card (4) relative to the cover (3) locks the IC card (4) and the cover (3) in the closed position of the connector (1).

Abstract: An electrical connector assembly for connecting a chipset to a printed circuit board comprises a dielectric housing having a number of terminal-receiving passageways defined between a top mating face and a bottom terminating face thereof. Two connecting protrusions are respectively formed on opposite sides of the housing. A number of terminals are received in the passageways of the housing. Each terminal has a contact portion and a tail portion extending from the contact portion. A fastening piece is attached to the housing, and includes a body and two legs extending substantially perpendicular from opposite ends of the body. Each leg defines a mating groove on an inner face thereof for mating with the corresponding connecting protrusion of the housing. When the fastening piece is mounted to the housing, the chipset is securely sandwiched between the fastening piece and the housing, and when the fastening piece is removed from the housing, the chipset can be easily detached from the housing.

Abstract: A socket for positioning and installing an integrated circuit chip having terminals on one side thereof on a conductive elastomer includes a base which positions the chip over the elastomer. A camming member is moveable relative to the base between an open position disengaged from the chip and allowing the chip to be installed in the socket to a closed position in which the actuating member engages a side of the chip and exerts a force on the chip to embed the terminals in the elastomer to thereby provide an electrical connection between the terminals and the elastomer.

Abstract: A retention device for mounting a heat sink to a CPU socket comprises a pair of supporting members and a pair of pressing members. Each supporting member is pivotably assembled with one pressing member to form a subassembly. The subassemblies straddle opposite ends of the CPU socket, respectively. Each supporting member comprises a supporting portion defining a supporting face thereon and a pair of side portions. The side portions define a pair of through holes therethrough and a pair of side supporting face thereon. The supporting faces together with the side supporting faces support opposite sides of a heat sink having a pair of retention plates extending therefrom thereon. Each pressing member comprises an operating portion and a pressing portion defining an abutting portion to engage with a corresponding retention plate of the heat sink. Each pressing portion forms a pair of axles extending from two opposite outer surfaces thereof to engage with the through holes of the supporting member.

Abstract: An IC socket is provided with a pressure cover so as to be opened and closed about a rotational shaft with respect to a socket body, and when the pressure cover is closed, an IC package mounted on the socket body is pressed. In the IC socket, a stopper member is disposed to lock the pressure cover in a state that the pressure cover and the socket body are closed, a proximity member for rotating the pressure cover to the socket body side so that the pressure cover further approaches towards the socket body side from the closed state thereof. The stopper member includes a stopper piece mounted to a support shaft, which is supported to be movable in a tangential direction of a circle with the rotational shaft being the center thereof with respect to the pressure cover, and a stopper piece engaging portion formed to the socket body with which the stopper piece is engaged, and the proximity member is provided with a separation member mounted to the support shaft.

Abstract: In an apparatus for testing an electronic device, a life of a measurement board is significantly extended by interposing a plate member between the measurement board and a device mounting member for accommodating the electronic device. The plate member has a plurality of rear pads to be brought into contact with each of the pads of the measurement board on a back surface thereof and a plurality of front pads electrically connected to each of the rear pads through via holes on a front surface thereof. The plate member is places between the measurement board and the device mounting member on testing the electronic device and can be readily replaced by a new one when it is worn away.

Abstract: Disclosed is an improved integrated circuit socket having electrically conductive pads formed on a resilient circuitry component for contacting the terminals of an integrated circuit (IC) package which is positioned on the resilient circuitry. The electrically conductive pads are arranged around the center area of the resilient circuitry to be in one-to-one correspondence with the terminals of the IC package. The electrically conductive pads have individual circuit paths of substantially the same length and which are extending outwardly from the center area of the flexible circuitry, and additional electrically conductive pads are formed on the back side of the flexible circuitry in order to effect the required electrical connections to exterior circuits. These electrically conductive pads on the back side are connected to the conductor pattern on the front side by conductive through holes or vias. With this arrangement all conductors have the same, reduced inductance.

Abstract: Disclosed is an improved IC socket comprising a housing having terminals and an opening-and-closing mechanism to change the terminals from a contact-making position to a contact-releasing position. The housing has a platform to receive the lead wires of the IC, and a movable cover activates a swingable member which rotates. The opening-and-closing mechanism is positioned so that the swingable member tilts the opening-and-closing mechanism toward the contact-releasing position when the movable cover is depressed. The device is designed as to leave between the lead platform and a contact end a clearance C, which is smaller than the thickness T of the lead wire. Clearance C prevents any debris from sticking on the contact end, assuring the reliability of electric contacts with the lead wires of the IC.

Abstract: 1. An IC socket comprises a socket body in which an IC package is accommodated, a press cover mounted to the socket body to be rotatable, and a press member rotatably mounted through a hold shaft to the press cover. One of the socket body and the press member is provided with a guide convex portion projecting toward other thereof, and the other one of the socket body and the press member is provided with a guide groove for guiding the guide convex portion, in which the guide convex portion is adapted to be fitted into the guide groove in accordance with a closing operation of the press cover so that the press member moves vertically with respect to the IC package thereby to press the IC package.

Abstract: The system and method of the present invention facilitate clamping of a land grid array integrated circuit (LGA IC) device through adjustment and calibration of the clamping system in relation to the connector/socket features used for a given type of LGA IC device and connector/socket. In order to accommodate for different connector/socket heights, the clamping system of the present invention includes exchangeable calibrated springs and an exchangeable shim that enable the clamping system to adjust to a specific connector/socket height. Due to the level of calibration, the system and method provides controlled downward vertical force at the level of force required to clamp the pads of the LGA IC device to the contacts of the connector/socket thereby providing complete electric contact therebetween and complete electric contact between the connector/socket and a circuit board.

Abstract: There is provided an IC socket having a plurality of contact pins 1. The plural contact pins 1 are arranged in a matrix form so that the pitch thereof at one end agrees with the electrode pitch of a semiconductor device 13 to be mounted and the pitch at the other end agrees with the pitch of the electrical connection terminals of an external connection body to be connected.

Abstract: An enhanced electrical arrangement for a computer includes a first circuit board, and a second circuit board arranged essentially parallel to the first circuit board. A removable array connector is positionable between the first circuit board and the second circuit board. The array connector causes the first circuit board to be in electrical communication with the second circuit board. A clamping arrangement is provided for urging the first circuit board and the second circuit board toward each other, so as to exert a force against the array connector and cause an electrical connection between the first circuit board and the second circuit board. The clamping arrangement includes a back-up plate positionable adjacent to a major surface of the second circuit board, and an arm pivotally connected to the back-up plate.

Abstract: An electrical connector provides for the connection of the contact pads of an IC card to a printed circuit board. The connector includes a base supportable on the printed circuit board and a cover pivotally removable with respect to the base. The base supports a plurality of electrical contacts. Each contact has a spring element and a contact tail extending from the base for termination to the printed circuit board. The cover is pivotally movable from an open position permitting insertion and removal of the card from the cover to a closed position with the contact pads of the IC card being positioned adjacent the spring elements. The cover is further movable linearly from the closed position to a locked position locking the cover to the base and moving the contact pads over the spring elements and into electrical engagement therewith.

Abstract: In an electrical connector, in which when an upper operation member 17 is vertically moved, a movable plate 14 is horizontally moved through an X-shaped link 18 to thereby displace a contact pin to separate the contact pin from and contact it to a terminal of one of electrical parts, a plurality of X-shaped links 18 are disposed with space at positions corresponding to side surface portions along the horizontally moving direction of the movable plate 14, lower end portions 23b of one link members 23 are pivotally connected to a socket body 13 and lower end portions 25a of another link members 25 are pivotally connected to the movable plate 14, upper end portions 25b of another link members 25 are pivotally connected to the supper operation member 17 and upper end portions 23c of one link members 23 are connected to the upper operation member 17 to be relatively movable in the horizontal direction thereof.

Abstract: A cover assembly for a socket suitable to accommodate modules of varying thicknesses which can be advantageously used for final test and burn-in test is described. The assembly is characterized by having a low profile and includes a hinged lid; a floating shaft coupled to two cams pivoting on the floating shaft; a locking member positioned between the two cams for locking the hinged lid when in a closed position, the locking member pivoting about the floating shaft; a pressure plate for forcing the module into the socket; and stiffening members integral to the hinged lid located on opposing sides of the hinged lid and below the surface of the pressure plate for providing added strength to the assembly. The assembly also includes a heatsink inserted through an aperture located in the pressure plate, to directly contact the chip which is mounted on the module. The force applied to the chip is independent of the force applied to the module.

Abstract: An IC socket includes a socket body (1) for supporting lower end sections of bow-shaped contact pins (3), a floating member (2) provided with holes (2a) for guiding upper end sections of the contact pins (3), and a cover member (4) for pressing the floating member. Borders of the guide holes (2a) act as stoppers for the upper end sections of the contact pins (3) for regulating height of projection thereof from the floating member (2) and contact positions thereof in reference to solder ball terminals to prevent damage to the solder ball terminals of the IC package even if the solder balls are softened under a heat-resistance test or the like. In one embodiment, the IC socket can effectively perform wiping of the solder balls when it is used at an ordinary temperature. The cover member (4) may be used and formed with a surface (4b) for first engaging the IC package and another surface (4a) for subsequently engaging the top surface of the floating member (2).

Abstract: In an IC socket in which IC leads of an IC package are pressed down by a presser member so as to be contacted with and retained by contacts arranged on the socket, an IC socket for an IC package comprises an IC mount which is upwardly and downwardly movably interposed between the socket and the presser member. The IC mount is formed with through-holes or through-grooves, and the contacts each having a vertical slit are inserted into the through-holes or through-grooves. The IC leads of the IC package placed on the IC mount are pressed down together with the IC mount by the presser member such that distal end portions of the contacts are relatively protruded upwardly from the through-holes of the IC mount as the IC leads are pressed down, so that the IC leads are pushed into the vertical slits.

Abstract: An enhanced electrical arrangement for a computer includes a circuit board, and a module arranged essentially parallel to the circuit board. An array connector is positioned between the circuit board and the module. The array connector causes the circuit board to be in electrical communication with the module. A clamping arrangement is provided for urging the circuit board and the module toward each other, by exerting a constant force against the module to cause an electrical connection between the circuit board, array connector and the module. The clamping arrangement includes an alignment assembly that is mounted to the circuit board to help align the module, and a load assembly to provide the force on the module. The alignment assembly and the load assembly are removably engageable with one another. When the load assembly is engaged with the alignment assembly, the load assembly can apply the force on the module which urges the module toward the array connector and the circuit board.

Abstract: An IC seating portion (14) of a socket (2) for a semiconductor device (300) is arranged so that the IC terminal leads can engage with contact heads (22) of contact pins (20) mounted in the socket. Each contact pin (20) is arranged in a respective slit (8) formed by partition members (7) providing electrically isolation of the contact pins from one another. Socket (2) has a blocking member (3) which blocks the gaps or slits at their top to prevent IC terminal leads from becoming entangled with the slits or contact pins (20). A stop member (4) is formed in the IC seating portion (14) to facilitate positioning of a semiconductor device (300) on the seating portion and to prevent the IC terminal leads from interfering with contact pins (20).

Abstract: A connector assembly featuring a socket for receiving a chip carrier insertable therein, whereby the socket is mountable to a circuit board; opposed arms extend from the socket; and actuators are movably secured between the opposed arms for urging the chip carrier towards said circuit board. The actuator is rotatable between an unactuated position and an actuated position on an axis of rotation extending between the arms. The actuator includes a cam portion between the opposed arms having an eccentric portion bearable against a top surface of the chip carrier for urging the chip carrier towards the circuit board.

Abstract: A socket (1) for removably receiving semiconductor devices (8) for testing purposes has film contacts (81) each having a continuous or discontinuous annulus (71, 73, 76, 78) that has been formed on a film substrate and with a recess (72, 74, 77, 79) formed within the annulus exposed at a bottom of a seating or accommodating portion (31). When a BGA type semiconductor device (8) is received in the accommodating part (31) and a cover (16) is closed, electrically conductive balls (9) on the bottom of the semiconductor device (8) are pressed against respective film annular contacts (81, 82, 83, 84) thereby effecting an electric connection. Since the bottom most portion of the electrically conductive balls (9) are located within the recesses of the annular contacts, they will not be deformed. Since the film contacts (81) are prepared by etching and plating, the pitch can be easily narrowed, or otherwise modified.

Abstract: An electrical socket used for interconnecting a multichip module to a printed circuit board or similar electrical system. The electrical socket is independent of the multichip module and permits removal and replacement of the multichip module without damaging the module and its module electrical leads. The socket includes an insulated base strip and an insulated cap strip. The base strip includes a plurality of elongated lower pockets therein for receiving and properly aligning each of the module electrical leads therein. The base strip also includes conductive pads in the bottom of and along the length of each pocket. Each conductive pad is connected to a socket lead. The socket leads are used for connection to the printed circuit board or like electrical system. The cap strip includes a plurality of elongated upper pockets therein which are dimensioned for receipt above the lower pockets of the base strip.

Abstract: An electrical connector (10) is provided for receiving an electronic module (60), the connector (10) having an insulative base (20) which is mountable to a printed circuit board and supports electrical contacts (26) which are also connected to the printed circuit board. A cover (30) is provided for receiving the electronic module (60) and is rotatably mounted to the base (20) and securably thereto by the cooperation of a locking disc (40) with locking projections (21) extending from sidewalls of the base (20).

Abstract: An electrical assembly and actuating mechanism for use therewith in which conductor pairs of two circuit members (e.g., printed circuit board and electronic module or semiconductor chip) are effectively electrically coupled. A rigid plate is fixedly positioned relative to a first of the circuit members (e.g., using upstanding pins), a pressure plate is movably oriented relative to the rigid member, and an actuator (e.g., screw) moves within the rigid member to cause the pressure plate to engage the second circuit. Such engagement in turn causes the conductors of the second circuit member to forcibly engage the first circuit member's conductors. Solder balls and dendritic members can also be used for providing enhanced coupling without harm to either structures. The resulting assembly affords a low profile when in final position, as highly desired in the design of microelectronic packaging structures which the present invention is particularly related to.

Abstract: A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

Abstract: There is disclosed a socket for use with an electronic part, which is simple in structure and easily fabricated and in which a reliable contact between electrode terminals of the electronic part and those of a socket body is obtained when the electronic part is mounted or detached. Each electrode portion 1b of a socket body 10b has a sliding contact which contacts with an electrode terminal of the electronic part and whose contact point is movable by pushing of the electronic part against the socket body in a direction B perpendicular to the push, and a spring contact which biases with its degree of contact with the sliding contact increasing in proportion to a movable amount of the sliding contact.

Abstract: A test fixture for integrated circuits, particularly those having large numbers of contacts. The fixture has a socket for receiving the integrated circuit, with conductive wad pins of the socket contacting lands or solderballs of the integrated circuit. Four clamping and alignment studs having peripheral grooves near their upper ends extend upward from the four corners of the socket. A lid is pivoted about a hinge pin which goes through bearing holes in the two studs and the lid. A pressure pad is resiliently suspended from the lid for applying pressure to the upper surface of an integrated circuit disposed in the socket. A slide-lock plate is mounted on the upper surface of the lid. A pressure pad screw extends from a position above the slide-lock plate, through a hole in the slide-lock plate, to engage threads of the central hole of the lid to apply pressure to the pressure pad when the pressure pad screw is rotated.

Abstract: A socket apparatus for testing a semiconductor package includes a main body having a plurality of contact pins therein, a locking member disposed in the main body for securing the semiconductor package that is to be loaded into the main body, an unlocking member for releasing the package secured by the locking member, and a cover disposed above the locking member and the unlocking member. The socket apparatus improves a contactability between the external terminals of the package and the contact pins during the package testing and decreases production cost due to its simplified composition.

Abstract: A card adapter for insertion of an IC card in a card slot of a receiving member of an electronic apparatus. The IC card is provided with card contacts and the receiving member is provided with a receiving member connector. The card adapter includes a base on which the IC card is positioned with the card contacts in registration with an opening in the base, a circuit board having circuit board contacts and a circuit board connector, and a cover supported on the base. The circuit board contacts project through the opening in the base to make electrical contact with the card contacts and the circuit board connector is connectable to the receiving member connector. The cover movable to a closed position at which it encloses the IC card and exerts pressure on the card contacts to maintain good electrical contact with the circuit board contacts.

Abstract: A socket for the inspection of semiconductor devices is disclosed which has laterally extended leads. The device is mounted in a mounting seat of the socket body and results in improvement of the inspection process because difficult steps such as soldering can be omitted. The socket is composed of a socket body which is mountable on a circuit board having a mounting seat therefor, a lead frame intervening between the socket body and the circuit board and an anisotropically electroconductive elastic connector sheet.

Abstract: An integrated circuit package assembly that allows an integrated circuit package to be plugged into another integrated circuit package that is mounted to a printed circuit board. The assembly includes a first integrated circuit package assembly that is mounted to the printed circuit board. The first assembly includes a first integrated circuit package that contains a plurality of holes on the top surface of the package. The mating pins of a second integrated circuit package assembly can be plugged into the holes to couple the second assembly to the first assembly. The second integrated circuit package assembly can be added without occupying additional board space on the printed circuit board.

Abstract: An electromechanical module is comprised of an electronic component that is attached to a substrate which is bendable. Multiple springy contacts touch respective I/O pads on the substrate. A compressing mechanism compresses the springy contacts against the I/O pads with forces that bend the substrate. The bending of substrate is reduced by including contacts of a first type, each of which exert a relatively small force against its respective I/O pad; and contacts of a second type, each of which exert a substantially larger force against its respective I/O pad.

Abstract: An electrical connector for coupling two circuitized substrates (e.g., a ball grid array module and a printed circuit board) wherein the connector includes a base member fixedly secured (e.g., soldered) to the printed circuit board and having one substrate oriented therein. The connector further includes a 2-part retention member including one part movably oriented in the base and a second part for directly engaging the retained substrate to cause it to move downwardly (and thus in a completely different direction than the direction of rotation of the movable one part within the base) to thereby provide effective connection between substrates. An interposer may be used if desired. An information handling system including a microprocessor and connector electrically coupled thereto is also disclosed.

Abstract: A test socket for an integrated circuit package. The test socket includes a latch arm that is pivotally connected to a socket base so that the arm can move between an open position and closed position. The socket also has a spring that is attached to the base and a cover. The latch arm is pivotally connected to the cover by a linkage arm. An actuator pushes down on the cover and rotates the latch arm to an open position so that an integrated circuit package can be inserted into the socket. Movement of the cover also pushes the spring into a deflected position. When the cover is released, the potential energy of the deflected spring is transferred through the link and rotates the latch arm back to the closed position. The force of the spring is transferred to the latch arm to push the integrated circuit package into a plurality of electrical contacts of the socket.

Abstract: A projection extending substantially perpendicularly from an arm or lever of a zero insertion force (ZIF) socket serves as a retention member for a component assembly in the ZIF socket. The ZIF socket comprises: a body having a plurality of electrical contact apertures for receiving a plurality of component assembly pins from a component assembly placed over the body; a binding member located below and slidably coupled to the body allowing insertion in and extraction of the pins from the plurality of electrical contact apertures of the body when the binding member is in a first position relative to the body, and retaining the plurality of component assembly pins when the binding member is in a second position relative to the body; and a first arm member rotatably coupled to the binding member for positioning the binding member relative to the body.

Abstract: Disclosed is an electrical socket for connecting a generally planar integrated circuit (IC) having a plurality of peripheral laterally extending contacts to a printed wiring board (PWB) comprising an insulative element interposed between the processing unit and the PWB and having means for retaining the IC; a plurality of latching means positioned in spaced peripheral relation adjacent the base element; a cover element superimposed over the base element and comprising an insulative housing being peripherally engageable by said latching means and a resilient control member positioned in concentric relation with said housing and having a plurality of legs each extending radially from said central section toward one of the latching means; and a plurality of contact means positioned in spaced peripheral relation adjacent the base element to abut the contacts on the processing unit and the PWB.

Abstract: A socket which compensates for non-planarities in a semiconductor device. The socket has a base with an aperture for receiving a semiconductor device and a plurality of bond pads within the aperture. The bond pads are typically electrically connected to external circuitry in some fashion. The socket also includes a lid which has a spring loaded portion for applying a force on a back surface of a semiconductor device when a major surface of the lid is in intimate contact with a major surface of the base such that contacts on the semiconductor device may make electrical contact to the bond pads while compensating for non-planarities in the semiconductor device. This compensation scheme is located in the spring loaded portion of the lid. This compensation scheme may also be aided through the use of a compliant, and perhaps compressible, interposer disposed between the semiconductor device's contacts and the bond pads.

Abstract: A backing plate facilitates electrical probing of VLSI IC signals in an array of signal via pads on the back side of a printed circuit board and which correspond to an LGA of socket pads on the front side of the printed circuit board. The backing plate is constructed of electrically non conductive mechanically stiff material that already has drilled therein a hole for each signal via pad that might be probed. Polyamide is a suitable material for such a backing plate. Special symbols, legends and suitable grid identification axes can be silk screened onto the side of the backing plate that remains visible when installed. The drilled insulative backing plate can be equipped with captive threaded studs, if desired. Alternatively, it may simply have holes to receive fasteners, or have captive female threaded fasteners in lieu of holes.

Abstract: Disclosed is method for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During a production phase, the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board. A chuck assembly, configured substantially identical to that formed during the alignment phase, and carrying a component to be mounted, is attached to the base plate so that the alignment plate engages the alignment elements.

Abstract: A combination latch and contact for use in an electrical socket. This ombination latch and contact comprises major resilient generally vertical member having an upper outwardly and downwardly extending cams surface superimposed over an engagement recess, a minor diagonal contact member having a terminal curved contact position adjacent a restraining projection and a base member. The base member may be superimposed on a printed wiring board (PWB) and has a lower contact position with a plurality of contact points.

Abstract: A connector comprises a plurality of movable terminals, a a frame for holding the plurality of movable terminals in a row at prescribed intervals, a contact bar for joining under pressure the plurality of movable terminals and the terminal conductors of a cable disposed on the plurality of the movable terminals, and a cover for pressing the contact bar, whereby the cable is connected to the connector by a simple operation without the use of special tools.

Abstract: A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.

Abstract: A socket (2, 52) for attachment to a printed substrate (10, 60), has a central aperture therethrough. A connective part (3, 53) including a flexible insulative sheet (8, 58) is provided to cover the aperture and act as an electrically connective interface between an electrical part (31, 81) mounted in the socket and the printed substrate. The flexible sheet (8, 58) has a first contact means (5, 55) associated with a first surface of the flexible sheet for electrically connecting with leads (32, 82) of the electrical part and a second contact means (6, 56) associated with a second surface of the flexible sheet for electrically connecting with the printed substrate. An electroconductive member (7, 57) provides electrical connection between the first and second contact means. Such a socket is especially useful for testing electrical parts with high clock speeds and a large number of leads.

Abstract: A surface contact card connector which includes a base section 2 made of an insulating material; a cover section 3 made of an insulating material and attached to the base section at a rear end for rotation between open and close positions; first and second engaging side walls 7 and 15 provided on opposite sides of the base and cover sections, respectively, such that when the cover section is closed, they are opposed to each other; first or second engaging side walls are flexible laterally; engaging windows or depressions 9, 10 being provided in the first or second engaging side walls; engaging and releasing projections 16 and 17 provided on the second or first engaging side walls such that when the cover section is closed, they flex the first or second side walls laterally and engage the engaging members; the engaging projections having a rectangular triangle shape whose upper side 16A is substantially at right angles to the engaging side walls while the release projections being provided at positions flexibl

Abstract: An IC socket in which a presser cover is closed with respect to a socket body, and a body or leads of an IC loaded in the socket body are pressed by an IC pressing member attached to the presser cover so as to be contacted under pressure with contacts of the socket body. The IC pressing member and the presser cover are attached together through a resiliently engageable resilient engagement mechanism.

Abstract: A tray for storing an integrated circuit component has an upper side and an array of terminals on a bottom side, four side walls, and four corners. The tray has a substantially planar base having a top surface and a bottom surface and a periphery. A plurality of pocket areas are formed in the top surface of the base within the periphery, each pocket area adapted to hold an integrated circuit component and to center the integrated circuit component within the pocket area. Each pocket area further comprising a plurality of corner guides with component engagement members contacting and supporting the integrated circuit component at the four principal corner portions thereof and the corner guides preventing further contact between the integrated circuit component and the base. The component engagement members supporting the integrated circuit component at its intersection of the side surfaces and bottom surface. The component engagement members comprise an angled guide-in portion and a seating surface portion.

Abstract: A technique for applying uniform force to an IC chip module, urging the module into electrical contact with one face of a circuit board, is provided. One face of the board has contact pads, and the module has contact members on one surface corresponding to the contact pads. A first clamping member is provided having a pressure applying section and a reaction section mounted for movement toward and away from each other. A second clamping member having a pressure applying section is provided. The module is interposed between the pressure applying element of one of the clamping members and the substrate with the contact members on the module in electrical contact with the pads on the board. Several pins interconnect the reaction section of the first clamping member and the second clamping member to restrain movement of the reaction section of the first clamping member away from the second clamping member.

Abstract: An IC socket includes a retaining cover adapted to be closed onto a socket main body, and an IC retaining member when the cover is closed, the IC retaining member presses against an IC which, in turn presses against IC contacts mounted on the socket main body. In addition, the IC socket includes a spring for idly supporting the IC retaining member on the retaining cover via a shaft, and moreover, biasing the IC retaining member in the IC retaining direction. The spring is borne by the shaft, and a part of the reactive force of the contacts arising at the time of retaining the IC with the IC retaining member is absorbed in the spring.

Abstract: A test socket for integrated circuits includes a base, a lid, and a latch providing a mechanical advantage. The base includes a nest which may move translationally and rotationally relative to the base. The nest is biased upward by coil springs mounted in the base. Spring-loaded contact pins extend through the base and the nest to make electrical connections between the integrated circuit and a circuit board to which the test socket is attached. The base also includes a nest support mounted below the nest to limit the downward travel of the nest to a selected distance. Furthermore, the nest has legs which connect to the base in a manner that limits upward travel to a selected distance. The lid includes a pressure pad which may move translationally relative to the lid. The pressure pad is spring-loaded by means of a flat spring contacting a ramp formed on the top side of the pressure pad in an inverted V-shape.