Abstract: A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.

Abstract: A printed circuit board assembly includes a printed circuit board, an electronic device, a holder and a heat-dissipation device. The printed circuit board includes a first through hole. The electronic device includes a first surface and a second surface opposite to each other, and a pin passing through the first through hole of the printed circuit board and inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device, and an opening disposed on the supporting surface to receive the pin of electronic device passing therethrough. The holder is configured to provide an accommodation space between the supporting surface and the printed circuit board. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.

Abstract: A substrate is physically attached to the terminals of multiple different power sources. The substrate includes multiple electrical conductors. Each of the electrical conductors is immobilized along its length relative to the substrate. The electrical conductors include interconnect lines and sensing lines. The interconnect lines provide electrical communication between the power sources. At least one of the sensing lines carries an electrical signal indicating a voltage across one or more of the power sources. Electronics that are immobilized on the substrate employ the electrical signal to determine the voltage across the one or more power sources.

Abstract: A connector connectable to another connector includes a connector card including a first surface and a second surface, a cable pad provided on the first surface and configured to be connected to a cable core wire, a contact that is provided on the second surface and corresponds to the cable pad, wherein the contact is positioned across the connector card from the corresponding cable pad and is configured to come into contact with the other connector, and an electrically conductive part provided through the connector card, wherein the conductive part electrically connects the cable pad and the corresponding contact.

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract: A land grid array (LGA) socket apparatus includes an LGA socket, with two guide rails provided respectively on the inner sides of two opposite side walls of the socket. The height of the top surface of each guide rail from the socket's bottom is greater than the height of socket terminals from the socket's bottom. The length of each guide rail is smaller than the length of the sidewall's inner side. The guide rails support at least two protrusions provided at corners at opposite sides of an integrated circuit chip assembly when the assembly is slid into the socket from a side. The guide rails, when the assembly is slid to the end of the guide rail, enable the at least two protrusions to fall into the gaps between the ends of the guide rail and the respective socket end walls to install the assembly in the socket.

Abstract: A floating or compliant plate test socket device and method is disclosed. Three primary components, a fixed frame (20) receives a floating or compliant plate (22), sit together atop a housing (24) which contains contact pins used for the electrical test of the DUT (device under test). In fixed plate (20) are bearings for reducing friction when the floating plate is driven downward by the DUT inserter. Embedded in sidewalls (40) are a plurality of vertical raceways (46) which receive bearings (48). The raceways are borings, which have gap in the boring, in the fixed plate sidewalls (40) with the boring center spaced from the sidewall sufficiently that part of the bore removes part of the sidewall but allows the ball bearings to partially protrude from the gap formed in the incomplete semicircular boarding without the bearings being able to freely escape.

Abstract: Disclosed herein is a dip socket, including: a first pin connecting part and a second pin connecting part provided by forming a plurality of connecting members connected with a plurality of pins of a dip module in a line, respectively; and a width controlling means provided between the first pin connecting part and the second pin connecting part and configured to control a width between the first pin connecting part and the second pin connecting part.

Abstract: An electrical connector includes a substrate, an upper plate, a lower plate, and a number of contacts. The substrate has a number of passageways. The upper plate and the lower plate are mounted upon and below the substrate, respectively. The upper plate and the lower plate both have a number of apertures corresponding to the passageways and a recess to receive the substrate. The contacts are received in the passageways and the apertures.

Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.

Abstract: Provided are a supported catalyst for a fuel cell, a method of preparing the same, an electrode for a fuel cell including the supported catalyst, a membrane electrode assembly including the electrode, and a fuel cell including the membrane electrode assembly. Specifically, the supported catalyst for a fuel cell has a layered structure obtained by sequentially depositing a carbonaceous support, metal oxide particles, and catalyst metal. The supported catalyst has excellent electrical activity, excellent durability, and can be easily mass-produced at low cost. The membrane electrode assembly including the supported catalyst and a fuel cell including the membrane electrode assembly each show excellent output density and high performance.

Abstract: There is provided a substrate that includes a base substrate, a socket that has a step where the step has a first surface and a second surface, the socket being electrically coupled with the base substrate at the first surface; and a connection substrate that is disposed between the second surface and the base substrate, where the connection substrate is electrically coupled with the socket at the second surface.

Abstract: A hybrid connector used for connecting different package modules includes an insulative housing, a plurality of first type of contacts, and a plurality of second type of contacts. The insulative housing has a first area with a plurality of first openings and a second area with a plurality of second openings. The first contacts and the second contacts are received in the first and the second openings respectively. The first and the second contacts both have a base received in the opening, a spring portion upward extending from the base. A lower portion downwardly extends from the first contact base, and a soldering pad downwardly extends from the second contact base. The first contacts connect with one package module and the second contacts connect with another package module.

Abstract: A hybrid connector used for connecting different package modules includes an insulative housing, a plurality of first type of contacts, and a plurality of second type of contacts. The insulative housing has a first area with a plurality of first openings and a second area with a plurality of second openings. The first contacts and the second contacts are received in the first and the second openings respectively. The first and the second contacts both have a base received in the opening, a spring portion upward extending from the base. A lower portion downwardly extends from the first contact base, and a soldering pad downwardly extends from the second contact base. The first contacts connect with one package module and the second contacts connect with another package module.

Abstract: A test socket comprising an insulative base with a plurality of contacts received in the base and a cover pivotally mounted to one end of the base. The cover comprises a pusher with an opening extending therethrough and a lid aligned with the pusher. The lid has a through hole corresponding to the opening of the pusher. Between the pusher and the lid have a plurality of elastic members for making the lid moveably with respect to the pusher.

Abstract: An electric connector is disclosed to include an electrically insulative housing, which has solder ball receiving portions, terminals respectively mounted in the housing corresponding to the solder ball receiving portions, each terminal having an endpiece, which defines with the sidewall of each of the solder ball receiving portions a respective receiving chamber, and solder balls respectively movably accommodated in the receiving chambers defined by the endpieces of the terminals and the sidewalls of the solder ball receiving portions.

Abstract: An adjustable test socket for aligning an electronic device with spring probes in a test fixture is provided having two adjustable walls or four adjustable walls.

Abstract: An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.

Abstract: Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.

Abstract: A socket connector includes a plurality of conductive terminals received in an insulative housing, a stiffener surrounding the housing, a load plate pivotably assembled with one end of the stiffener and a load lever pivotably attached to the other end of the stiffener. The housing has a bottom wall facing the PCB. The bottom wall defines a plurality of semi-cylindrical protrusions. The stiffener body defines a plurality of semi-circular slits corresponding to the semi-cylindrical protrusions. By virtue of the mesh of the semi-cylindrical protrusions and the semi-circular slits, the stiffener body is assembled with the housing completely.

Abstract: An electrical connecting apparatus comprises: a plurality of plate-like probes, each of which electrically connects an electrode of a device under test and a conductive portion formed in a base plate, and each of which has a tip to be pressed against the electrode on one end side of the probe and a curved outer face on one side in the width direction of the probe, and each of which further has a first recess opening on the one side; and an assembler for assembling the probes into the base plate such that the probes are arranged at intervals in the thickness direction and that the tips are projected to the side opposite to the base plate.

Abstract: A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality of alignment ball bearings configured thereon, the ball bearings mounted on cantilevered spring rods.

Abstract: A PGA socket having structure that permits the slide plate to be kept center-aligned while moving on the base housing, thus assuring that reliable electric connections be established between the PGA lead pins and the terminals of the socket. The PGA socket includes a base housing and a slide plate, the slide plate being movable between a first, or lead pin inserting position, in which the lead pins of the pin grid array package can be inserted in the through holes and the terminal mounts and a second, or locking position, in which the lead pins are applied to the terminals in the terminal mounts. The PGA socket includes at least one resilient piece on either the base housing or the slide plate and that other of the base housing or slide plate has an engagement means for receiving the at least one resilient piece.

Abstract: A test device includes a test receptacle from which projects contact elements project and spring contacts that can be electrically contact-connected to the external contacts of an integrated circuit type. Corresponding to the external contact positions of the integrated circuit type, the test device includes module components having at least one electrically conductive contact plate and having an insulating carrier plate, the contact plate being incorporated in cutouts of the carrier plate and having a contact section, a spring section and a holding section.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (102) of the housing. The housing defines a base (100) and four sidewalls (12), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of passageways along a length thereof, for receiving the corresponding terminals therein. Two adjacent sidewalls each define a resilient beam (13) with an incline surface and joining the sidewall at two ends. A space (15) is defined between the beam and the sidewall. When the LGA chip is placed on the base, the two resilient beams can resiliently act on the chip to ensure reliable engagement between the LGA chip and the connector.

Abstract: A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.

Abstract: The IC socket for electrical parts comprises a base plate, a tab film on the base plate on which an IC package is mounted and a pressing jig on the tab film for pressing the IC package toward the tab film. The tab film comprises an electrode pattern to be electrically connected with the IC package and a plate-like connecting electrode to be electrically connected with the base plate. To the base plate, contact pins are arranged. An upper end contact portion of the contact pin is protruded from an upper surface of the base plate for abutting on the connecting electrode. The pressing jig, tab film and base plate are detachably fixed by a bolt and nut and in this state the tab film is pressed by the pressing jig body so that the connecting electrode of the tab film elastically abuts on the upper end contact portion of the contact pin.

Abstract: An LGA socket (1) includes a slab like insulative housing (11), a reinforcing plate (12) attached on an exterior surface of the housing, and a clip (14) and a lever (15). The clip and the lever are respectively mounted on two opposite ends of the housing to fasten an LGA package. The lever includes a driver portion (151), a driven portion (152) adjoining the driver portion, and a baffle (124) extending from a side of the reinforcing plate. The baffle prevents the lever from breaking away from the housing. After the LGA package is positioned on the housing, the rigidity of the housing is improved with the reinforcing plate made of rigid material being equipped on the housing. Steady electrical connection between the contacts pads of the LGA package and respective contacts of the housing is ensured.

Abstract: A connector is provided for reducing the effects of differential coefficient of thermal expansion of the connector and the underlying circuit board. The connector exhibits high coplanarity along the mounting interface by providing an insulative connector housing in which stress buildup is avoided. The connector housing incorporates compliant sections corresponding to the areas where the greatest deformation in the substrate is expected. The housing has notches or slots at locations furthest from the neutral point (NP) of the connector (i.e., around the corners). By means of this arrangement, stress buildup is avoided, so as to minimize warping and twisting of the housing.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (110) received in passageways (101) of the housing. The housing has a base (100) and sidewalls (102, 104), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. Two sidewalls each define recesses (1021), thereby forming projections (1020). When terminals are installed near the projections, a carrier strip (11) connecting the terminals is bent so that connecting sections (111) of the carrier strip are received in corresponding recesses. The connecting sections are cut off, and the carrier strip is removed. The recesses enable the carrier strip to be manipulated so that sufficient space is made available for cutting off of the connecting sections without interfering with the sidewall. The projections provide precise fitting positioning of the LGA chip in the space.

Abstract: An integrated circuit socket with capacitors and shunts is disclosed. According to one embodiment of the invention, a socket is divided into a shunt area, a socket pin area, and a land side capacitor area. The shunt area may contain a variable number of power shunts, ground shunts, and capacitors. The capacitors are connected across, and serve to decouple, power shunts and ground shunts. The shunts are to supply an electrical current from the capacitors to an integrated circuit device. The socket pin area may be surrounded by a metal fence serving as to lessen electromagnetic interference and as a ground and/or signal reference. The fence may be divided into sub-areas each comprising a coaxial differential signal pin opening pair. In alternate designs, an elongated power bar may serve as a power or ground shunt and may be used with several capacitors.

Abstract: In a socket for an electric part, two slide plates 15 and 16 slidably mounted are slid in different directions by applying an urging force for urging an upper operating member 18 downwards, thereby resiliently resilient pieces 5a and 5b of a contact pin 4 in spacing directions to open out contact portions 7. The slide plates 15 and 16 are slid back to their original positions by releasing the urging force to the upper operating member 18, thereby decreasing the resilient deformation of the resilient pieces 5a and 5b in approaching directions to close the contact portions 7 of the contact pin 4. In this manner, the electric part is clamped. Thus, the contact portions can be opened out in equal resiliently deformed amounts by equally pressing the resilient pieces constituting the contact pin.

Abstract: An electrical connector assembly (1) includes a base (10), a fixing member (11), and a clip (13). The base defines at least one installation portion (12, 15). The fixing member is pivotally engaged with the installation portion, and comprises an actuator (110) movably engaged in the at least one installation portion. The clip is attached to the base opposite from the at least one installation portion, and comprises a groove (130) defining a first corner (131) and a second corner (132) adapted to cooperate with the actuator. The actuator can slide from the first corner to the second corner when the fixing member engages with the clip, whereby no lateral movement of the clip relative to the base occurs. Thus, a LGA IC module (2) can be fixed on the electrical connector assembly reliably.

Abstract: In an IC socket of an open top type having a plurality of pin type contacts for electrical connection with an IC package inserted thereinto, the IC socket includes a socket body having a base plate, a vertically movable cover, a platform attached to the base plate and having an IC package mounting portion, and edge moving mechanisms each having a latch lever for holding the IC package placed on the platform and adapted to move the IC package from one side to the opposite side for adjusting and correcting the position of the IC package.

Abstract: An electrical connector assembly (1) includes a base (2), and a frame (3) assembled with the base. The base includes two solid cylindrical fixing posts (231) at two diagonally opposite corners thereof. Each fixing post includes a fixing portion (2312) at a top thereof. The frame defines two fixing holes (32), corresponding to the fixing posts. Each fixing hole is surrounded by a step (321) thereat. When the base and the frame are assembled together, the fixing posts are deformably received through the fixing holes, and the fixing portions hook on the steps. Thus the frame and the base are combined together firmly. Because the fixing posts are solid and generally cylindrical, during assembly, the fixing posts can fasten the frame on the base firmly and securely with minimal risk of breakage.

Abstract: An IC socket is provided which realizes a uniform pressure of contact with an IC package over the entire length of a row of contacts and thereby enables an appropriate evaluation of characteristics of the IC package. The IC socket mounted on a printed circuit board includes: a socket base having a large number of contacts arranged in a row and brought into contact with leads of an IC package; a cover bearing on the contacts through an elastic body; and fixing portions for securing the cover to the socket base; wherein a contact surface between the elastic body and the contacts is curved in a longitudinal direction and the curved surface is so shaped as to generate a uniform contact force between the contacts and the leads of the IC package.

Abstract: An electrical connector assembly (1) includes a base (11) receiving a number of electrical contacts, and a frame (12) assembled on the base. The frame defines an opening (121) in a middle thereof for receiving a CPU (3) therein, two fixing holes (123) at diagonally opposite corners thereof, and two semi-circular orientation holes (122) at two opposite sides thereof. The base includes a planar portion (111) having a top surface (115) and a bottom surface (114). Two orientation projections (119) are formed at the top surface, for interferentially engaging with the orientation holes. Two forked fixing posts (116) are formed at the top surface, for snappingly engaging in the fixing holes of the frame to mount the frame on the base. Two protrusions (117) are formed at the bottom surface, for interferentially engaging in corresponding bores (21) of a PCB (2) to mount the electrical connector assembly on the PCB.

Abstract: An electrical connector (1) for connecting a land grid array (LAG) chip with a printed circuit board (PCBA) includes a housing (10), and terminals (110) received in passageways (101) of the housing. The housing has a base (100) and sidewalls (102, 104), the base and the sidewalls cooperatively defining a space therebetween for retaining the LAG chip. Two sidewalls each define recesses (1021), thereby forming projections (1020). When terminals are installed near the projections, a carrier strip (11) connecting the terminals is bent so that connecting sections (111) of the carrier strip are received in corresponding recesses. The connecting sections are cut off, and the carrier strip is removed. The recesses enable the carrier strip to be manipulated so that sufficient space is made available for cutting off of the connecting sections without interfering with the sidewalls. The projections provide precise fitting positioning of the LAG chip in the space.

Abstract: An interface apparatus for reception and delivery of a package from a first location to a second location. The apparatus comprises a nest assembly having an interior defining a nest for receiving a package. The nest is formed by a plurality of sidewalls each having an interior surface, an exterior surface, and an end surface extending between the interior and exterior surfaces. In one embodiment, the interface between the interior surface and the end surface is constructed and arranged having at least a portion of the interface surface substantially conforming to the shape of the angled portion of the leads.

Abstract: An integrated circuit socket includes one or more cavities formed in a top surface of the socket, where the one or more cavities are formed in a region over which an integrated circuit can be placed. Multiple conductive contacts are attached to the socket, where each contact includes a first member that extends into one of the cavities, and a second member that provides at least part of a conductive path between the first member and the socket. The first member at least partially holds in place a discrete device inserted into the cavity. An integrated circuit package or interposer attached to the top surface over the cavity also can at least partially hold the discrete device in place. The first member makes electrical contact with the discrete device, thus completing a conductive path between the discrete device and the integrated circuit.

Abstract: A socket for an electrical part is provided with a socket body for accommodating an electrical part and a guide member is provided for the socket body so as to guide side surfaces of a body of the electrical part at the time of the accommodation thereof. The socket body is formed with a number of contact pins so as to be contacted to or separated from an electrode as a terminal of the electrical part. The guide member includes a plurality of guide portions, at least one of the guide portions being disposed so as to correspond to each of all the side surfaces of the electrical part body, respectively, and each of the guide portions has an elastic portion for elastically pressing inward the side surfaces.

Abstract: An IC socket is provided which realizes a uniform pressure of contact with an IC package over the entire length of a row of contacts and thereby enables an appropriate evaluation of characteristics of the IC package. The IC socket mounted on a printed circuit board includes: a socket base having a large number of contacts arranged in a row and brought into contact with leads of an IC package; a cover bearing on the contacts through an elastic body; and fixing portions for securing the cover to the socket base; wherein a contact surface between the elastic body and the contacts is curved in a longitudinal direction and the curved surface is so shaped as to generate a uniform contact force between the contacts and the leads of the IC package.

Abstract: A test socket connecting an integrated circuit chip to a printed circuit board is disclosed. The test socket includes a horizontal upper portion connected to the integrated circuit chip, a horizontal lower portion connected to the printed circuit board, and an intermediate portion connected between the horizontal upper portion and the horizontal lower portion.

Abstract: A Land Grid Array electronic package having an array of contact pads is connected to a corresponding array of contact pads on a circuit board through a matching array of conductive pins of a flexible interposer. Alignment of the electronic package to the flexible interposer and flexible interposer to the circuit board is obtained by registration of alignment components to the contact pads and conductive pins. A pair of alignment components, such as pin-like alignment structures, on selected pads of both the electronic package and circuit board mate within alignment holes at the sites of corresponding pin locations in said flexible interposer. Alternatively, the pin-like alignment structures on the electronic package can be extended to pass through the said alignment holes of said flexible interposer into alignment holes which replace the pin-like alignment structure on said circuit board.

Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises: (1) a base unit, it further consists of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) an interposer, there are a flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) an adapter unit, the unit is capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.

Abstract: A handler socket has confronting surfaces to which an electrical part and a circuit substrate are connected for an electrical conduction between the electrical part and the circuit substrate. The handler socket comprises a socket body; a plurality of contact pins contacting with the electrical part and the circuit substrate so as to electrically connect the electrical part with the circuit substrate; and a holder holding the plurality of contact pins and adapted to be engaged with the socket body. Each of the contact pins has a contact portion and is held to the holder, whereby the contact portion projects from the confronting surfaces and the holder is removably mounted on a side of the socket body.

Abstract: A socket for an electrical part comprises a socket body having a stationary portion to which a number of contact pins are disposed so as to be contacted to or separated from a number of terminals disposed to an electrical part, each of the contact pins having first and second contact portions between which each of the terminals is clamped. The socket body is provided with a slide plate to be transversely slidable in a usable state of the socket, and one of the first and second contact portions is displaced by sliding the slide plate to thereby open or close the first and second contact portions.

Abstract: A method and apparatus for improving RF contact positioning in a RF test socket is disclosed. The RF test socket comprises a housing having a plurality of notches along one side for clamping to a RF test board and postioning a plurality of contacts in the notches between the housing and the RF test board. The plurality of notches are formed in a step fashion wherein when the housing is clamped to the RF test board, the housing deflects such that the plurality of contacts contact the RF test board with equal force. The plurality of notches are lower in a center of the housing and higher along the edges thereby defining a catenary shape of notches along the housing and are further machined to a specific height for applying equal force or the plurality of contacts.

Abstract: An IC socket includes a socket body, an IC package receiving portion formed in the socket body and adapted to receive an IC package therein, a plurality of contacts arranged in array along the IC package receiving portion, and a mechanism for resiliently displacing the contacts between a forward displacement position where the contacts are capable of contacting corresponding terminals of the IC package and a backward position where the contacted-relation between the contacts and the terminals can be canceled. Each of the contacts includes an upper contact piece and a lower contact piece supported by a common first spring portion for causing the contact to be displaced forwardly and backwardly.

Abstract: SIP or ZIP packages are provided with locking elements of snap fasteners, or have package alignment tabs to combine several IC packages into an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.