Abstract: An IC carrier on which an integrated circuit (IC) package is loaded when electric testing of the IC package is carried out is described. The present invention enables an IC package to be loaded on or unloaded from the IC carrier smoothly without bending any of closely arranged fine leads, and prevents the lead from being deformed by falling impact when it is dropped. According to the present invention, an IC carrier for an IC package having an array of leads comprises an array of socket means for mating with the array of leads, wherein selected one of said socket means differs in an inner dimension from the other ones in the same array. The technique is applicable to both a flat IC package (QFP or SOP) and a pin grid array IC package (PGA).

Abstract: An IC carrier includes a carrier body for retaining a flexible wiring sheet and an IC in an opposing relation. The carrier body has suction holes formed in a flexible wiring sheet placing surface thereof and extending all the way through the carrier body. A negative pressure is applied to the flexible wiring sheet through the suction holes, thereby retaining a relative position between the flexible wiring sheet and the carrier body.

Abstract: A printed circuit board assembly that has a first electronic package which is coupled to a printed circuit board and a second electronic package that is plugged into the first electronic package. The first electronic package can be coupled to the printed circuit board by leads, pins that plug into corresponding sockets mounted to the circuit board, or a SMT socket adapter that is mounted to the board. The first package also has a plurality of pins that extend through an opening in the printed circuit board. The second package has a plurality of sockets that can be plugged onto the pins of the first package to couple the second package to the first package.

Abstract: Each IC package carrier holds a single ZIP or SIP package between its side walls having openings to provide air flow for cooling the package and to allow heat generated within the package to dissipate. A locking strip member is provided to prevent loosening of the held package. Locking elements of snap fasteners are mounted on the side walls to allow several IC package carriers be attached to each other for producing an IC package assembly. The IC package assembly held by the several attached carriers can be inserted into a socket to connect circuits within the packages with external circuitry.

Abstract: An electronic device (10) includes a package (16) having two posts (30) suitable for insertion in PCB holes. Package (16) presents a lengthwise molding plane (32) along which the upper portion (42) and bottom portion (44) of package (16) are mated during the molding process. Posts (30) are disposed substantially exclusively in bottom portion (44) so that posts (30) are asymmetric about lengthwise molding plane (32). Thus, even if a top mold (42a) and a bottom mold (44a) are misaligned there will be no effect on the dimensional tolerance of posts (30) and thus the tolerance of post (30) can be closely matched with a PCB hole (20) tolerance to insure a snug fit. Thus, device (10) is mounted edgewise on a PCB (18) by insertion of posts (30) into PCB holes (20) so that tips (24) of lead fingers (4 14) can be connected to PCB (18) by surfacing-mounting techniques or the like.

Abstract: An IC contactor including a plurality of contact pins arranged in a line near a periphery of an IC receiving member so as to correspond to a plurality of external lead pins of an IC, mounted on the receiving member. The contact pins include a plurality of first contact pins and a plurality of second contact pins arranged alternately. The first contact pins each have a projecting portion projected in a downward direction, and the second contact pins each have a projecting portion projected in an upward direction. First separators are each interposed between the projecting portions of adjacent first contact pins, and second separators are each interposed between the projecting portions of adjacent second contact pins. Since the directions in which the projection portions of the first and second contact pins are projected are opposite from each other, the separators can be arranged alternately on different lines.

Abstract: An IC socket includes a socket board having a plurality of contacts, and an IC platform vertically movably disposed on the socket board and adapted to support thereon an IC having a plurality of leads projecting sidewards from a body thereof so as to be contacted with the contacts. Inclined wall surfaces are formed at both ends of a row of the contacts and are adapted to guide the leads onto vertical wall surfaces formed at lower ends of the inclined wall surfaces. To this end, the contacts at the ends of the row are guided onto the vertical wall surfaces by the inclined wall surfaces when the IC platform with the IC body supported thereon is lowered, so that the leads are brought into contact with the contacts.

Abstract: A socket for an IC package includes a plurality of contacts arranged in array in such a manner as to correspond to a plurality of IC leads of an IC package. Each of the contacts comprises a first unitary contact extending to a lower surface portion of each of the unitary IC leads so as to be brought into pressure contact with the lower surface portion, and a second unitary contact extending to a side surface portion of the lead so as to be brought into pressure contact with the side surface portion. The first and second unitary contacts have male terminals separately connected to a wiring board, respectively.

Abstract: An IC socket comprising a plurality of partition walls disposed along an IC platform and contacts which are to be brought into pressure contact with leads of an IC package mounted on the IC platform, the contacts being inserted into corresponding slits formed between adjacent the partition walls so that the contacts are orderly arranged with respect to the leads of the IC package, a foremost end face of each of the leads of the IC package being restricted by wall surfaces of a pair of adjacent partition walls for isolating the slits so that the leads are correctly positioned.

Abstract: In a connector having a group of contacts arrayed at narrow pitches on a base member, a contact fixture device is formed separately from the base member forming a connector body. The contact fixture device is provided with retaining claws adapted to secure the fixture device to the base member. The contact fixture device is further provided with a presser portion disposed across a group of seat elements of the group of contacts. The presser portion is laid across the group of seat elements to urge the group of seat elements against a surface of the base member when the fixture device is secured to the base member with the retaining claws. In this manner, the group of contacts can be arrayed on the base member.

Abstract: An apparatus and method for facilitating the installation and removal of standard surface mount clock oscillator modules. A clock oscillator module socket is disclosed which can be mounted on a printed circuit board in the standard recommended land pattern for surface mount clock modules which will provide for easy installation of the clock module and easy removal of the module either for maintenance or for general replacement by a clock of different speed.

Abstract: A chip carrier socket assembly (10) for electrical connecting leads (81) on a chip carrier (80) to a board on which the socket is seated, comprises a base (20) having a chip carrier receiving opening (22) in relation to peripheral walls (24) thereof. A plurality of lower contacts (70) are disposed in the base (20) for electrical connecting to the respective printed circuit board pads. The socket (10) further includes a cover (40) complementarily positioned on the base (20). The cover (40) has therethrough a central opening corresponding to the opening (22) of the base (20) and surrounded by circumferential walls (44). A corresponding plurality of upper contacts (60) are disposed in the cover (40) for mechanically pressing against and electrically connecting to the leads (81) of the chip carrier (80). The chip carrier (80) can be retained within the cover (40) by means of the upper contacts (60) thereof without regard to the base (20).

Abstract: Disclosed is a connector for connecting an IC package to a printed circuit board (PCB). The connector includes a base; a wall perpendicular to and surrounding the bottom base to form a recess for accommodating the IC package, the wall having a plurality of slots formed on the inner side thereof and lining up side-by-side therealong; a plurality of terminals, each of which is fitted within one of the slots, for electrically connecting the pins of the IC package to the printed circuit board.

Abstract: Each contactor 5 is implanted in an insulating substrate 1 at an inclination angle, and its contacting portion 6 is diagonally moved along the inclined axis of movement to accumulate a contacting pressure with respect to an electric part terminal 4.

Abstract: An electrical connector with manual retainer and enhanced contact coupling is provided which comprises: an insulative mounting socket (30) including a base portion (35), slots (38) formed on the top face of the base portion, a wall (31) upstanding from the top of the base portion, and indents (33) formed on the bottom face (39) of the base portion; a retainer (10) including a main surface (11) sized to fit over the electrical component (20) received in the mounting socket, at least a first and a second stuffer (12) depending downward from the main surface and sized to fit against the leads (22) received in the slots; at least a first and a second latch mechanism each including at least one fulcrum (12) coupled to the stuffer, a lever bar (17) coupled to the fulcrum, at least one leg (14) depending downward from the lever bar, a latch protrusion (16) coupled to the leg and formed to extend on the outside of the wall such that the first latch protrusion physically contacts with the indents when the retainer is

Abstract: A high density land grid array test socket comprises a leadless component contact socket assembly and a fixture. The contact socket assembly can be assembled with a variety of contact terminal end configurations and adapted for a desired mode of circuit board interface. In one embodiment, the test socket fixture includes a latching mechanism and a hinged lid assembly which allow quick and reliable manual installation of a device under test (DUT). An alternative embodiment includes snap latches, extension springs and alignment bushings which permit robotically controlled insertion and removal from the test socket. A bias clip or spring is incorporated in the test sockets for assuring proper alignment of the chip carrier with the contact socket assembly. The test socket creates reliable contacts with short electrical paths for low signal distortion and reduced chip loading.

Abstract: A non-invasive connector for testing an integrated circuit package has a connector housing with a substantially rectangular recess adapted to fit over the integrated circuit package. A plurality of teeth made of an insulative material extend laterally inward from the edges of the connector housing into the recess. The spacing between the teeth is predetermined to enable the teeth to be removably inserted between the integrated circuit leads as said connector housing is fitted in place. Test leads extend from the connector housing into the space between said teeth to make electrical contact with the integrated circuit leads. Electrical connections are provided through the connector housing between these test leads and external testing equipment by means of pins and a flexible circuit assembly. In addition, an elastomeric pad can be positioned between the connector housing and the test leads to exert an inward biasing force against the test leads to maintain electrical contact with the integrated circuit leads.

Abstract: A mount-to-contact type contact has a stationary terminal 1, a swinging contact element 3 swingably supported by the stationary terminal 1, and a spring 10 adapted to resiliently hold one swinging end 7 of the swinging contact element 3, the other swinging end 8 serving as a contact end on which a terminal 9 of an electric part 6 is to be mounted to achieve a contact relation.

Abstract: An electrical socket (10) for electrically connecting a leaded chip carrier (24) to a substrate is disclosed. The socket (10) includes a frame-shape base (12) with contacts (14) around the periphery of a central opening. Each contact (14) has a pair of outwardly extending, spaced apart arms (64,72) with one arm (72) having a recess (82) on an inside surface (80). The socket (10) also includes a cover (16) with locking members (18) around the periphery of a central opening. The locking members (18) include cantilever beams (90,92) which enter the space (74) between the contact arms (64,72) to press a lead (28) from the carrier (24) against one arm (64).

Abstract: A chip structure (connector) (20) includes a socket body (21); and a pair of L-shaped reinforcing brackets (23, 24), with a vertical leg (25) attached to either side of the socket body and a horizontal leg (28) provided with an abutment face (29).

Abstract: A surface mount leaded chip connector plug for mating with a standard leaded chip connector socket is described. The plug includes an insulator having an outer circumference and a depth, and a multiplicity of electrical contacts disposed about the outer circumference. Each of the electrical contacts has a body and two arms. The body has a back side, a midline and two ends, and slopes inwardly from the ends toward the midline such that the body slidably locks with the leaded chip connector socket. One of the arms adjoins one of the body ends and the other of the arms adjoins the other of the body ends. Each of the arms extends toward the back side. The arms are separated by a distance greater than the insulator depth such that the electrical contact may be securely disposed about the insulator.

Abstract: A novel wadded wire-plunger contact is provided which possesses excellent durability and desired functional characteristics in a large variety of applications such as the testing of IC chips.

Abstract: An IC socket is provided with an inset bottom formed in a socket board at a region from where a group of male terminals project The IC socket has terminal partition walls arranged in a lattice shape and adapted to partition the interior of the inset bottom. A group of grooves are formed between the adjacent terminal partition walls, and the group of male terminals projects from bottom walls of the grooves.

Abstract: A contact module and method for making a connector for socketing an IC chip carrier is disclosed. The contact module comprised a relatively short body containing a plurality of contacts arranged on a standard center to center spacing, and a locking member. A positioning plate is fabricated having features, such as holes, along its edges for receiving other features, such as projections, formed in the contact modules. A number of the contact modules are assembled to the positioning plate to correspond to a particular chip carrier configuration. The plate and contact modules are then aligned with the pads of a substrate and terminal portions of the contacts are then soldered to the pads. The positioning plate is then removed. The chip carrier is then placed in the connector formed by the contact modules and a locking member inserted into each contact module for contacting the chip carrier leads.

Abstract: A connector assembly particularly adapted for burn-in/testing of IC chips (10) held in a TAB film carrier (16, 18) includes a frame (32) mounted on a printed circuit board (26), a lid (44) pivoted to the frame (32), and a handle (54) pivoted to the lid (44). The frame (32) holds a connector housing assembly (40) which has contact members (42) engaged with contact pads (28) on the printed circuit board (26). The carrier (16, 18) is placed in the frame (32) where it is releasably retained so that contact pads (14) on the film (12) engage the contact members (42) of the contact housing assembly (40). Then handle (54) is utilized to provide a mechanical advantage so that the lid (44) generates appropriate contact forces to ensure electrical connections between the contact pads (14) on the film (12) and the contact pads (28) on the printed circuit board 26 ), and the handle (54) includes a latch mechanism (58, 62) for locking the lid (44) to the frame (32).

Abstract: An IC socket has a socket board having a plurality of contacts for contacting IC leads, and IC accommodating portion formed in a central portion thereof, and an IC supporting platform adapted to support an IC package thereon and disposed in the accommodating portion so as to be movable in an upward and downward direction. The contacts are formed in parallel along opposing sides of the supporting platform. A plurality of grooves for positioning the contacts are formed in parallel in opposing sides of the IC supporting platform. Contacting portions of resilient contacting pieces of the contacts are received in the positioning grooves. The resilient contacting pieces are regulated by partition walls defining the positioning grooves. The IC socket is characterized in that among the partition wall groups formed on four sides, one portion of partition wall groups of at least two opposite sides are interconnected at free ends of the partition walls.

Abstract: A method of and apparatus for connecting electronic components, uses the component pins for insertion in the end of insulated electrical wire. The pin and the electric conductor are held in galvanic contact by the insulation around the wire and a bracket is provided for holding wire ends in the correct configuration for receiving component leads.

Abstract: A connector provides electrical connection between a component and another device such as a circuit board or an input/output connector. The connector has a non-conductive base and adjacent sides extending in a direction away from the base, forming a cavity. The shape and size of the cavity formed physically mates with the component when the connector is placed over the component. Conductive contacts provide the electrical connection between the component pins and the other device. The lower portion of each contact is located inside the cavity and positioned such that it aligns with and touches one of the component pins when the device is placed over the component. The upper portion of each contact is located on the outside surface of base and has a size and shape to physically and electrically mate with individual contacts of the other device.

Abstract: A socket for mounting an integrated circuit unit on a printed circuit board comprises a plurality of inserts of a platable electrically insulating material each having an opening and an exterior surface portion. The inserts are mounted in rows in a support body so the openings are accessible from one side of the body and the exterior surface portions are exposed at an opposite side of the body. Electrically conductive layers are provided on the inner surfaces of the insert openings, preferably by electroless plating techniques using the body as a plating mask, to extend to the exterior surface portions of the inserts to be soldered to circuit paths on the printed circuit board at prescribed circuit locations. Contacts are disposed in the insert openings in electrical engagement with the electrically conductive layers therein for resiliently and detachably electrically engaging terminals of integrated circuit units or the like inserted into the openings.

Abstract: A socket for the use of an electric part has contacts disposed in such a manner as to contact with contact pieces or leads of an electric part and a stage with the electric part supported thereon and able to move between a lower position where the contact pieces are brought into contact with the contacts and an upper position where the contact pieces are brought out of contact with the contacts. The socket further has a swingable crankshaft as means for restraining the stage in the upper or lower position. The crankshaft is provided with a crank bar portion disposed in such a manner as to vertically move upward and downward while supporting the stage and to push up the stage during a raising movement thereof and a crank arm portion which is swung about the crank bar portion and engaged with lock means thereby to restrain the stage in the upper and lower positions.

Abstract: An IC socket which has contacts positioned corresponding to each pin position of an IC to be inserted and a body portion holding the contacts, characterized in that at least a part of the contact is formed of conductive resin.

Abstract: An assembly for testing integrated packages comprising, a test circuit board for simultaneously testing a plurality of integrated circuit packages with each package having a plurality of rows of leads extending in parallel array from the body of the package, the board having a plurality of sockets each shaped with a top, sidewalls and a bottom with the top having means forming a plurality of rows of depending recesses spaced to receive, one each, the leads, and also having a plurality of auxiliary recesses, each positioned within the sidewalls and each shaped to receive a discrete component and each associated with one of the depending lead recesses, and means for electrically connecting discrete components within the auxiliary recesses and integrated circuit package leads in the associated depending lead recesses to each other and through the sockets to the circuit board, each discrete component being electrically connected to no more than one of the circuit package leads.

Abstract: An I.C. chip carrier and header assembly is provided. The assembly comprises a generally rectangular shrouded header with pins force fit therein. The pins are connectable to conductive traces on a printed circuit. A protective tape may be disposed over the header to control the locations at which conformal coatings may be applied, and thereby avoid extensive cleaning operations. The assembly further comprises a carrier with receptacles for receiving box-type double female carrier terminals. The I.C. chip is mountable in the carrier with the leads thereof being connectable to the carrier terminals by soldering. A cover is locked into engagement with the carrier to define a plugable subassembly. The subassembly is then urged into lockable but removable engagement with the header and the pins thereof.

Abstract: A header apparatus for a flat IC pack having at least one conductive terminal includes a header housing which includes an IC pack chamber, an opening communicating with the IC pack chamber, the IC pack being inserted into and extracted from the opening, and a pair of actuation means, each of which includes drive member having a first surface formed inside the IC pack chamber of the header housing and a first rack, operation member which includes a second rack positioned to face the first rack of the drive means and an operation portion formed outside the IC pack chamber, and a pinion engaged with the first and second racks, wherein the first surface of the drive member is moved in an insertion direction of the IC pack by inserting the IC pack into the IC pack chamber, and pushes the IC pack inserted into the IC pack chamber in a direction opposite to the insertion direction of the IC pack by moving the operation portion of the operation means in the insertion direction of the IC pack.

Abstract: A test socket for integrated circuit packages has a body member carrying a plurality of pairs of opposed contacts on either side of a circuit package receiving cavity which seats a depressible spring loaded platform. When a circuit package is inserted, the contacts make electrical contact with the circuit package terminals and are deflected outwardly as the package is pressed downwardly. The force exerted by the deflected contacts and the terminals is sufficient to provide good electrical contact and to overcome the biasing force on the platform to retain the circuit package in the socket. The circuit package is released by a tool which has a cavity to receive the body member and cam elements to deflect the contacts and permit the spring-loaded platform to move upwardly and release the circuit package.

Abstract: An IC connector for an IC package having a plurality of vertically extending J bend type lead wires arranged in parallel rows along the side surfaces of the IC package main body, each lead wire having a vertical portion and a bent portion at each end thereof extending into the package main body.

Abstract: The socket is foreseen for fastening and connecting an electronic component with lined-up conducting pins, whereby the free end of the pins is parallel to the main plane of the component, as it is the case for the SMD components. The socket comprises a carrier of insulating material and contact elements maintained in the carrier and positioned each with its first flexible end in the face of a pin for applying a determined contact pressure on that pin when the component is mounted in the socket. The second end of the contact element can be soldered to a conductor in a circuit. The socket comprises further a comb of insulating material with teeth gliding in a guidance of the carrier.

Abstract: An improved semiconductor burn-in socket assembly board test device includes a plurality of sockets having apertures formed in the cavity bottoms, spring clip type female connectors rigidly mounted in the socket cavities for engaging male connector pins of semiconductor devices (dual-in-line packages, for example), and male connector pins depending from the cavity bottoms. Cermet resistors are rigidly fixed within the cavity bottom apertures, and soldered to the female and male connectors whereby a semiconductor burn-in test board is provided having isolation resistors vertically disposed with respect to the socket's female and male connectors and within the thickness of the socket bottoms.

Abstract: A burn-in test socket for use with flatpack semiconductor components is disclosed. The flatpack burn-in socket is especially adapted for use with robotic assembly techniques. The socket comprises an insulative housing with a plurality of terminals adapted to be in registry with leads on a flatpack semiconductor device located in a conventional flatpack carrier. The terminals are doubly reversely formed to laterally wipe the leads during insertion. Electrical continuity of the socket terminals and dynamic electrical testing of the semiconductor device can be probed from above the socket.

Abstract: An electrical connecting device for disengageable connection to conductors of an electric component comprises an integrated circuit (IC) package having a plurality of leads in dual-in-line configuration. A socket included in such device comprises an insulative housing and first and second pluralities of contacts supported thereon arranged in laterally spaced, longitudinally corresponding positions. Each of the contacts has a first end portion selectively plated, with gold for example, for detachable connection to a conductor of the electric component. A second end of the contacts is selectively tin-plated and soldered to the leads of the IC package. The second end portion of each of the contacts is formed to have thereon at least two laterally spaced contact members, thereby providing for selective securement thereto of IC packages having different laterally spaced leads.

Abstract: An electrical connector for assembly of an electronic component with two parallel rows of terminals onto a printed circuit board, the connector including an insulating block having two rows of cavities, each cavity containing a contact element introduced through an opening provided at the top of the cavity and a leg projecting at the bottom of the cavity for connection to the printed circuit board. The contact element comprises a substantially flat web portion pressing against the side of the cavity adjacent to an outer longitudinal face of the insulating block. A central part of the web portion is cut out and bent to form a contact tab extending out of the plane of the web portion. The tab is resiliently urged towards the bottom of the opposite wall of the cavity to cooperate with a male contact element which is inserted into the cavity.

Abstract: Chip carrier socket has contact terminals therein comprising a web portion and first and second arms extending from the web. The first arm has a contact portion adjacent its free end for contacting a pad on a chip carrier and the second arm has a bearing portion adjacent to its free end. The intermediate portion of the second arm is not supported against wall surfaces of the chip carrier socket. The web is connected to a mounting portion by a neck which is compliantly responsive to stressing of the arms. When the contact portion engages a contact pad on a chip carrier, the entire system including the first and second arms and the web is stressed. The second arm is flexed and the freely supported end of the second arm is moved along its fixed support surface. The design permits the achievement of a high contact force and is capable of accommodating manufacturing tolerances in the chip carrier while maintaining the required contact force.