Electron Tube Moved Perpendicularly To Panel Circuit Patents (Class 439/58)
  • Patent number: 11756943
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a photonic receiver; and a die coupled to the photonic receiver by interconnects, wherein the die includes a device layer between a first interconnect layer of the die and a second interconnect layer of the die. In still some embodiments, a microelectronic assembly may include a photonic transmitter; and a die coupled to the photonic transmitter by interconnects, wherein the die includes a device layer between a first interconnect layer of the die and a second interconnect layer of the die.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan
  • Patent number: 11056810
    Abstract: A circuit board with a plug connection comprises a first plug element and a second plug element. The circuit board has a first side and a second side. The first plug element is mechanically connected to the first side in a contact and attachment region on the first side, and electrically conductively connected to at least one component. The first plug element is mechanically connected to a second plug element. An electrical connection of the second plug element to the first plug element lies entirely within a first interior region delimited by the first side of the circuit board, which is separated by the circuit board from a second interior region delimited by the second side, and that the second side has a region lying opposite the contact and attachment region of the first side in which components are arranged and/or in which the conductor paths run.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: July 6, 2021
    Assignee: Marelli Automotive Lighting Reutlingen (Germany) GmbH
    Inventors: Ulrich Holder, Sinisa Rubil
  • Patent number: 10498057
    Abstract: A clip-type contactor and a protective apparatus including the same are provided. A clip-type contactor according to an embodiment of the present invention includes a bent-shaped body having an elastic force and configured to come into electric contact with a conductor of an electronic device; an elastic restriction part configured to extend from an upper side of the bent-shaped body to a lower side of the bent-shaped body to restrict movement of the body; and a stacking means disposed at a lower portion of the body to be stacked in the same space as that of a functional element configured to protect a user or an inner circuit on a circuit board.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: December 3, 2019
    Assignee: AMOTECH CO., LTD.
    Inventors: Jae Su Ryu, Byung Guk Lim, Yun Suk Choi, Yoon-Ho Hwang
  • Patent number: 10403992
    Abstract: A socket assembly includes a socket substrate and socket contacts mounted to the socket substrate and extending through through holes of the socket substrate. Each socket contact includes a fixed end mounted to the socket substrate, a free end independently movable relative to the fixed end, a first mating beam, a second mating beam and a transition beam between the first mating beam and the second mating beam being a monolithic structure. The transition beam passes through the through hole and is flexible to allow relative flexing of the first mating beam and the second mating beam for compression of the socket contacts between an electronic package and a host circuit board.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: September 3, 2019
    Assignee: TE Connectivity Corporation
    Inventor: Jeffery Walter Mason
  • Patent number: 10197532
    Abstract: The present application relates to pulsed discharge ionization detectors (PDIDs) and non-radioactive ionization sources, including miniaturized forms thereof. In some examples, the PDID includes annular electrodes, where each electrode is disposed between annular insulators. Also provided herein are methods of making and using such PDIDs, such as for detecting one or more volatile organic compounds, as well as non-radioactive ionization sources.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: February 5, 2019
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Ronald P. Manginell, Matthew W. Moorman, Kent B. Pfeifer
  • Patent number: 9853375
    Abstract: A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: December 26, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Patent number: 9590329
    Abstract: A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: March 7, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Patent number: 9093775
    Abstract: A connection pin for mounting in a through-hole provided in a component carrier of an electronic assembly, the connection pin comprising an anchoring part adapted for insertion into said through-hole, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin is provided with an internal cavity, which is provided with an outer opening at a free end of the anchoring part. The contact part is provided with a protruding elongated interconnection member at a free end thereof, and the respective shapes of the interconnection member and the internal cavity are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. A method for producing an electronic assembly with stackable modules is also disclosed.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: July 28, 2015
    Assignee: Telefonaktiebolaget L M Ericsson (publ)
    Inventors: Igor Perez-Uria, Ola Arvidsson
  • Patent number: 7791115
    Abstract: Disclosed is an organic light emitting display, which includes a large quantity of a hydroscopic layer having a good hydroscopic ability by changing a mounting structure of the hydroscopic layer. An organic light emitting display includes a first substrate. An organic emission portion is formed at one surface of the first substrate. A second substrate is formed at a surface of the first substrate on which the organic emission portion is formed for sealing the organic emission portion from external air. A first hydroscopic layer is formed between the first and second substrates. A third substrate is formed at another surface of the first substrate for sealing the first substrate. A second hydroscopic layer is formed between the first and third substrates.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: September 7, 2010
    Assignee: Samsung Mobile Display Co., Ltd.
    Inventor: Eunah Kim
  • Patent number: 7631421
    Abstract: A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: December 15, 2009
    Assignee: LG Display Co., Ltd.
    Inventors: Chul Park, Moon Kyo Bae
  • Publication number: 20080139008
    Abstract: A backlight unit for a display device includes a frame; a circuit board extending from an end of and on a first surface of the frame; lamps over the frame; an inverter on a second surface of the frame connected to an end of each of the lamps via a first hole through the frame; and balancing elements on the circuit board for balancing a current through each of the lamps.
    Type: Application
    Filed: June 15, 2007
    Publication date: June 12, 2008
    Applicant: LG. PHILIPS LCD CO., LTD.
    Inventors: Sang-Bum Lee, Seung-Cheol Back, Myeong-Kuk Jin, Kang-Ju Lee
  • Patent number: 7137824
    Abstract: A connecting unit includes a support seat that has inner and outer surfaces, that is formed with an L-shaped channel, and that is provided with a slit. The L-shaped channel is defined by the inner surface, has first and second open ends, receives an end portion of an electrical wire therein through the first open end, and receives an end portion of a fluorescent tube therein through the second open end. The slit extends from the outer surface to the inner surface and from the first open end to the second open end to thereby permit access into the L-shaped channel.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 21, 2006
    Assignee: Chi Lin Technology Co., Ltd.
    Inventor: Tang-Pung Lin
  • Patent number: 6885106
    Abstract: A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one atop the other with the first microelectronic element disposed between the second microelectronic element and the dielectric. The dielectric element has opposed first and second surfaces with conductive features exposed at the first surface and terminals exposed on the second surface. Preferably, the contact-bearing face of the first microelectronic element confronts the first surface of the dielectric with at least some of the conductive features being movable with respect to the contacts or terminals. By providing such movable features, joining units have heights of about 300 microns or less may be joined to the terminals thereby reducing the overall height of the microelectronic assembly to 1.2 mm and less.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: April 26, 2005
    Assignee: Tessera, Inc.
    Inventors: Philip Damberg, Craig S. Mitchell, John B. Riley, Michael Warner, Joseph Fjelstad
  • Patent number: 6224389
    Abstract: The component (5) has a substrate (6), which comprises a number of contact bridges (7) corresponding to the number of contact elements (2) of the meter (1) which are to be electrically bonded, the contact bridges (7) having soldering tags (8, 9) bent at right angles to one another. The soldering tags (8) can be inserted through the printed-circuit board (3) and be soldered to the contact surfaces (4) of the latter. In this case, the substrate (6) is located on that side of the printed-circuit board (3) which is free of contact surfaces. The other soldering tags (9), which likewise project from the electrically insulating substrate (6) made of plastic, are provided with openings (11), through which the contact elements (2) pass when the meter (1) is being mounted on the printed-circuit board (3) and may be soldered mechanically in the same way as the soldering tags (8).
    Type: Grant
    Filed: August 19, 1999
    Date of Patent: May 1, 2001
    Assignee: Mannesmann VDO AG
    Inventor: Antonio Esteve Macia
  • Patent number: 6135823
    Abstract: A disclosed substrate connector comprises a terminal including a contact portion contacting with a mated terminal and a fixed portion fixed to a substrate, and a housing including a housing main body and a spacer member. Here, the housing main body includes a first opening portion which is provided on one side of the housing main body and from which the fixed portion of the terminal is led outside, a second opening portion which is provided on the other side of the housing main body and into which the mated terminal is inserted, and a terminal accommodating chamber accommodating both of the terminal and the mated terminal and provided between the first opening portion and the second opening portion, and the spacer member is attached to the first opening portion of the housing main body.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: October 24, 2000
    Assignee: Yazaki Corporation
    Inventor: Chieko Torii
  • Patent number: 5967837
    Abstract: An assembly for mounting an electric/electronic device (300) to a printed circuit board (PCB) (310) of an electronic system. The printed circuit board (310) is provided with first and second openings (311 and 312, respectively). The assembly includes a connector (320) mounted on a first side of the PCB (310) and the device (300) mounted on a second side of the PCB (310), the device (300) including a bushing (302) which extends through the first opening (311) and is fastened to the connector (320) by a nut (330). Male leads (304) of the device (300) are each plugged into a female terminal opening (324) of the connector (320) through the second opening (312). The connector (320) also includes leads having first ends located in the female terminal (323) for contacting the male device leads (304), and second ends which are soldered to conductive traces formed on the PCB (310) for providing connections between the PCB (310) and the device (300). Nut (330) is used to fasten bushing (302) to connector (320).
    Type: Grant
    Filed: October 1, 1996
    Date of Patent: October 19, 1999
    Assignee: Alps Automotive, Inc.
    Inventors: Bruce M. Wolfe, Hirofumi Kawano
  • Patent number: 5809135
    Abstract: A press locking connector for the antenna of a mobile-phone, the connector is more suitably connected to the antenna of a car and a mobile-phone and is formed a sheet member having at the upper portion thereof a collar with a diameter size coincident with that of the shaft of the antenna, the collar has an opening of suitable size; a hook is provided beside and at a slightly lower portion from the collar, a plug contact device is inserted in a through hole near the bottom of the sheet member, so that the collar opening can be aligned with the antenna and is clamped by a force exerted forwardly from behind on the shaft of the mobile-phone, the hook will snap hook into a recess provided on the top of the mobile-phone, the plug contact device is connected to a socket contact on the mobile-phone by a force exerted in one single direction.
    Type: Grant
    Filed: February 11, 1997
    Date of Patent: September 15, 1998
    Assignee: Auden Technology Mfg. Co., Ltd.
    Inventor: Daniel Chang
  • Patent number: 5809155
    Abstract: An assembling structure for capacitor microphone, in which an insertion seat is inserted on the circuit board and formed with two lateral through holes for respectively receiving two sleeves. The sleeve is disposed with two stopper sections on two sides, whereby when the sleeve is fitted in the through hole, the stopper sections serve to provide a stopping and locating effect so as to prevent the sleeve from rotating and loosening. The insertion pins of the capacitor microphone are tightly inserted in the sleeves. The assembling procedure of the microphone and the insertion seat can be automatically performed by a machine. The conducting ring in the restricting ring of the conducting plate is attached to the ring-shaped circuit formed by the fieldistor in the pad member to form a full electrical signal connection.
    Type: Grant
    Filed: July 2, 1997
    Date of Patent: September 15, 1998
    Inventor: Den-Tsai Su
  • Patent number: 5607314
    Abstract: An electric adapter including a PC board, two electric connectors respectively mounted on the PC board at two opposite sides and insulated from it by a respective insulator, each metal contact having a bottom end, a lead portion radially and outwardly extended from the bottom end of the respective metal contact and closely attached to one insulator, a tip welded to the circuit of the PC board, and a bent portion connected between the lead portion and the tip and closely attached to the periphery of the corresponding insulator.
    Type: Grant
    Filed: June 16, 1995
    Date of Patent: March 4, 1997
    Inventor: Johnson Chuang
  • Patent number: 5356297
    Abstract: A socket carries a lamp and is mountable into an opening of a circuit plate to make a connection between the lamp and a circuit of the circuit plate. The socket comprises a body in which electrical terminals are mounted. Wires which are joined to the lamp are connected to the electrical terminal. The electrical terminals make electrical contact with the circuit when the socket is inserted into the circuit plate. Each terminal includes a contact portion projecting forwardly from the body, and a shank portion mounted in the body. The contact portion has a through-slot therein such that the contact portion presents two relatively movable contact surfaces on opposite sides of the slot. The shank portion includes two slots for receiving and tightly gripping the wire.
    Type: Grant
    Filed: March 12, 1993
    Date of Patent: October 18, 1994
    Assignee: Cooper Industries, Inc.
    Inventor: Steven W. Haskins