Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. Patents (Class 439/55)
  • Patent number: 10775427
    Abstract: A circuit board for transmitting a high speed signal and for the high speed signal to be detected comprises a substrate, an insulating layer and two metal printed wires. The insulating layer is disposed on the substrate, and comprises a first surface, a second surface and a test opening, with the first surface facing away from the substrate, the second surface facing the substrate, and the test opening passing through the first surface and formed above the second surface. Said two metal printed wires are configured to transmit the high speed signal and embedded in the insulating layer between the first surface and the second surface. At least one of the metal printed wires comprises a test section which is aligned to the test opening of the insulating layer and exposed by the test opening.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: September 15, 2020
    Assignee: WIWYNN CORPORATION
    Inventors: Yu-Nan Chu, Yung Jung Du, Yi Tang Chen
  • Patent number: 10716232
    Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: July 14, 2020
    Assignee: Raytheon Company
    Inventors: Derek B. Wells, Kenneth P. Walsh, Jr., Gregory S. Renaud, Dimitry Zarkh
  • Patent number: 10680366
    Abstract: A connector assembly and a jumper connector thereof are provided. The jumper connector includes a first jumper connector body case for being coupled to a first board edge connector, a second jumper connector body case for being coupled to a second board edge connector, and conductive terminals. The first and second jumper connector body cases are coupled to each other to form an internal receiving space for accommodating the conductive terminals, and the conductive terminals are movable to correspond in position to the first and second board edge connectors respectively. By such structural design, even if circuit boards incur problems like poor processing quality or position offset, the jumper connector according to the present invention can still effectively bridge and join the board edge connectors on the circuit boards, thereby desirably accomplishing electrical connection between multiple circuit boards on electronic equipment.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: June 9, 2020
    Assignee: TARNG YU ENTERPRISE CO., LTD.
    Inventors: Mu-Jung Huang, Ying-Chung Chen
  • Patent number: 10660228
    Abstract: A storage card insertable into a host system is provided that includes a plurality of storage devices connectors. The storage card include slot offset features to offset a circuit board of the storage card from a host system slot alignment. This offset provides for storage device connector placement on both sides of the storage card. The storage card also can include a Peripheral Component Interconnect Express (PCIe) switch circuit configured to communicatively couple the PCIe signaling of the plurality of storage device connectors and PCIe signaling of a host connector of the storage card, where the PCIe switch circuit is configured to receive storage operations over the PCIe signaling of the host connector of the storage card and transfer the storage operations for delivery over the PCIe signaling of selected ones of the plurality of storage device connectors.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 19, 2020
    Assignee: Liqid Inc.
    Inventors: Bryan Schramm, Andrew Rudolph Heyd, Brenden Michael Rust, Christopher R. Long, Sumit Puri
  • Patent number: 10530081
    Abstract: A dual connector assembly includes first and second electrical connectors. The first electrical connector has a first housing holding a first contact. The first housing has a mating end mated with a first mating connector and a mounting end mounted to a circuit board. The first housing has a first mounting block including a first mounting surface. The second electrical connector has a second housing holding a second contact. The second housing has a mating end mated with a second mating connector and a mounting end coupled to the mounting end of the first housing. The second housing has a second mounting block facing the first mounting block such that the second mounting surface engages the first mounting surface to locate the second housing relative to the circuit board. The mounting end of the second housing is held spaced apart from the circuit board by the first electrical connector.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: January 7, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Brian Patrick Costello, William Charles McGee, III
  • Patent number: 10490917
    Abstract: The present disclosure relates to a motor-driving device with an improved structure of a circuit module. According to the present disclosure, the boards are coupled to each other via a connector or a bolt. This removes wires use, and reduces an assembly tolerance, thereby to improve the device productivity.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: November 26, 2019
    Assignee: LSIS CO., LTD.
    Inventors: Hong-Seok Kim, Dong-Sik Kim, Chun-Suk Yang
  • Patent number: 10453383
    Abstract: An embodiment display panel may include a housing including a recess, a substrate disposed in the recess, and a plurality of light emitting diodes (LEDs) attached to a front side of the substrate, in which the plurality of LEDs form a front surface of the display panel. The display panel may further include a back cover enclosing the recess and a back side of the substrate. The back cover may form a back surface of the display panel, and the back cover may be configured to prevent ingress of water or dust through a thickness of the back cover. The display panel may further include a power supply disposed in the recess and physically attached to the back cover and not to the housing or substrate, in which the power supply is configured to power the plurality of LEDs.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: October 22, 2019
    Assignee: ULTRAVISION TECHNOLOGIES, LLC
    Inventors: Matthew Foster, William Y. Hall
  • Patent number: 10448505
    Abstract: A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: October 15, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventor: Kazushige Akita
  • Patent number: 10431947
    Abstract: An electrical component socket includes a socket body arranged on a circuit board and including a receiving portion configured to receive an electrical component. The socket body includes an arrangement portion in which a row of contact pins to be in contact with leads of an IC package is arranged. At least one of these contact pins and another one of the contact pins adjacent to the at least one of the contact pins have an arrangement pitch that is narrower than a pitch between the terminals of the electrical component, and the other one of the contact pins and still another one of the contact pins adjacent to the other one of the contact pins have an arrangement pitch that is substantially equal to the pitch between the terminals of the electrical component.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: October 1, 2019
    Assignee: ENPLAS CORPORATION
    Inventor: Yuta Sugawara
  • Patent number: 10361498
    Abstract: A board-to-board connector includes a first circuit board and a second circuit board. The first circuit board has at least one cut. The second circuit board includes a tongue assembly disposed corresponding to the cut, a plurality of connection portions disposed on two opposite surfaces of the tongue assembly, and a plurality of conductive portions electrically connected to the first circuit board. Therefore, the board-to-board connector can effectively reduce the distance between the first circuit board and the second circuit board, which is applicable to the increasingly lightweight and compact electronic devices.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 23, 2019
    Assignees: NICECONN TECHNOLOGY CO., LTD.
    Inventors: Yi-Fang Chuang, Nai-Chien Chang
  • Patent number: 10355415
    Abstract: An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 16, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Joon Kim, Min-Seok Kim, Sigwan Kim, Jung-Woo Kim
  • Patent number: 10346333
    Abstract: A system and method for performing an intelligent power dongle operation for information handling systems having a serial bus power connection such as a USB type-C power connection. In certain embodiments, the intelligent power dongle includes hardware and firmware to read a legacy adapter PSID information and convert the information to serial information such as USB Type-C baseboard management controller BMC compliant data. In certain embodiments the intelligent power dongle includes power management circuitry the allow selection and proper switching between a low voltage power mode (e.g., a 5V power mode) and a higher voltage power mode (e.g., a 19.5V power mode) depending on a device attached to the intelligent power dongle. In certain embodiments, the intelligent power dongle may be used to power low voltage devices (e.g., devices powered by 5V).
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: July 9, 2019
    Assignee: Dell Products L.P.
    Inventors: Merle J. Wood, III, Wei-Cheng Yu, Sean P. O'Neal, Thomas E. Voor, Tsung-Cheng Liao, Tun-Chieh Liang
  • Patent number: 10349549
    Abstract: A shielded direct current link (“DC link”) busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: July 9, 2019
    Assignee: General Electric Company
    Inventors: Tobias Schuetz, Xiaoting Dong, Philipp Leuner
  • Patent number: 10249924
    Abstract: Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 2, 2019
    Assignee: INTEL CORPORATION
    Inventors: Kai Xiao, Raul Enriquez Shibayama, Gong Ouyang, Jose Diego Guillen Gonzalez, Beom-Taek Lee
  • Patent number: 10224648
    Abstract: The teachings relate to the improvement of the connection between a stranded conductor and a substrate by using a sleeve for holding the end of the stranded conductor, wherein the end can be crimped to the sleeve and the sleeve can be welded to the substrate via ultrasonic welding or connected thereto by crimping.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: March 5, 2019
    Assignee: GENTHERM GMBH
    Inventor: Markus Ißler
  • Patent number: 10109966
    Abstract: A reversible dual-position electric connector comprises: an insulated seat having a base seat and a docking part fitting together, wherein the docking part has two opposite connection plates to form a fitting frame body, opposite surfaces of the two connection plates have connection surfaces between which a connection slot is formed, and one connection plate has one row of elastic movement spaces much more depressed than the connection surface; one terminal set disposed in the insulated seat and has one row of terminals each having a fixing portion and an extension, which extends to the elastic movement space and is provided with a vertically elastically movable contact; and a metal housing covering the insulated seat and having a four-sided primary housing, which shields the docking part to form a docking structure. A shape of the docking structure can be positioned at a docking electric connector in a reversible dual-position manner.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: October 23, 2018
    Inventor: Chou Hsien Tsai
  • Patent number: 10084254
    Abstract: An electrical connector includes an insulative housing an insulative housing enclosing two row of conductive terminals. Each of the terminals includes a front contacting section, a front spring section behind the front contacting section, a middle retaining section and a rear tail section along the front-to-back direction. In each row, the terminals include a pair of outer grounding terminals, a pair inner power terminals respectively beside the pair of outer grounding terminals, and a plurality of other terminals between the pair of power terminals in the transverse direction wherein for each of the pair of outer grounding terminals and the pair of inner power terminals, the front contacting section, the middle retaining section and the rear tails section are wider than the front contacting section in the transverse direction.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: September 25, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Ming-Qi Ge
  • Patent number: 9972565
    Abstract: The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 15, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: David P. Adams, Kira L. Fishgrab, Karl Douglas Greth, Michael David Henry, Jeffrey Stevens, V. Carter Hodges, Randy J. Shul, Ronald S. Goeke, Robert K. Grubbs
  • Patent number: 9859658
    Abstract: An electrical connector includes a housing and a plurality of ground wafers and signal wafers. A front side is configured to mate with a mating connector. The ground wafers and signal wafers are stacked next to one another along a stack axis. The ground wafers are interleaved between adjacent pairs of the signal wafers. Each signal wafer includes at least one signal conductor held by a signal holder that is composed of a first material. Each ground wafer includes at least one ground conductor held by a ground holder that is composed of second material. The second material is a lossy material and the first material is a low loss dielectric material that has a loss tangent that is lower than a loss tangent of the lossy material. The signal conductors and the ground conductors are configured to engage and electrically connect to the mating connector.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: January 2, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Bruce Allen Champion, Chad William Morgan
  • Patent number: 9826670
    Abstract: A vehicle includes a power receiving portion that is mounted below a floor panel and that receives electric power in a contactless manner from a power transmitting portion provided outside the vehicle, an electromagnetic shield that prevents an electromagnetic field from passing through, a power receiving portion cover that allows the electromagnetic field to pass through and covers the power receiving portion, and an undercover that allows the electromagnetic field to pass through and covers the power receiving portion cover.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: November 21, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toru Nakamura, Shinji Ichikawa, Arinori Higashiyama, Takahisa Yamamoto
  • Patent number: 9812827
    Abstract: An electrical connector includes an insulative housing, a plurality of contacts disposed in the housing, and a metallic shield enclosing the housing. The contacts includes a row of first contacts and another row of second contacts. The insulative housing includes a main base and a tongue portion extending forwardly from the body. The metallic shield includes a main body, a tubular section extending forwardly from the main body, an inner part forwardly extending from the main body and inside said tubular section. The inner part forms a receiving space in which the tongue portion is received.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 7, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jing-Jie Guo, Jun Zhao, Cai-Yun Zhang
  • Patent number: 9762009
    Abstract: A plug connector includes an insulative housing with mating slot, contacts disposed in the housing by two sides of the mating slot, and a pair of side arms located by two opposite ends of the mating slot in a horizontal transverse direction. a receptacle connector includes an insulative housing defining a horizontal mating tongue; contacts disposed in the housing with contacting sections exposed upon two opposite surfaces of the mating tongue; and a monolithic horizontal metallic shielding plate disposed and extending substantially fully the mating tongue. The shielding plate defines side protruding edge sections exposed outside of corresponding side edges of the mating tongue and a notch structure on each side protruding edge section, the pair of side arms each defines a hook structure to engagement with the notch structure.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: September 12, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Chih-Pi Cheng, Chih-Kai Yang
  • Patent number: 9750130
    Abstract: A printed wiring board includes a differential transmission line having a first wiring and a second wiring. The first wiring has a plurality of first linear portions formed of linear wiring and extending in a first direction, and a first bypass portion that is connected to the plurality of first linear portions and includes a linear wiring. The second wiring has a plurality of second linear portions formed of linear wirings and extending in a second direction substantially parallel to the first direction, and a second bypass portion that is connected to the plurality of second linear portions and includes a curved wiring. The first bypass portion and the second bypass portion protrude on the same side. A region in which the first bypass portion is provided and a region in which the second bypass portion is provided are at least partially overlapped in the first direction.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: August 29, 2017
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Masaaki Ito
  • Patent number: 9740248
    Abstract: A component mount for a data storage device (DSD). The component mount includes a flexible member or printed circuit board assembly (PCBA) including a pad for electrically connecting to a printed circuit board (PCB) of the DSD. At least one capacitor is mounted on the flexible member or PCBA, and is electrically connected with the pad.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: August 22, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Mohammad Sarraf, Billy Hung Vu, John P. Myers
  • Patent number: 9726691
    Abstract: The embodiments of the present invention relate to semiconductor device manufacturing, and more particularly to structures and methods of directly testing semiconductor wafers having micro-solder connections. According to one embodiment of the present invention, a method of forming a pattern of micro-solder connections coupled with a through substrate via (TSV) that can be directly tested by electrical probing, without the use of a testing interposer, is disclosed. According to another embodiment, a method of testing the pattern of micro-solder connections is disclosed. According to another embodiment, a novel electrical probe tip structure, having contacts on the same pitch as the pattern of micro-solder connections is disclosed.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: August 8, 2017
    Assignee: International Business Machines Corporation
    Inventors: Victor A. Garibay, Chetan Mehta, Doorlabh Panjwani, Tingdong Zhou
  • Patent number: 9711894
    Abstract: An electrical connector comprises a printed circuit board module including a printed circuit board (PCB) and a plurality of electrical elements disposed on the PCB, the PCB includes a mating end for mating with a mating connector and a plurality of conductive paths electrically connecting with the electrical elements; wherein the PCB includes a fracture surface, and the plurality of conductive paths are exposed to the fracture surface.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: July 18, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Ru-Yang Guo, Hai-Li Wang, Shuai-Hui Huang, Jian-Fang Li, Qing-Man Zhu, Jerry Wu
  • Patent number: 9693457
    Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: June 27, 2017
    Assignee: International Business Machines Corporation
    Inventor: Brian Samuel Beaman
  • Patent number: 9660358
    Abstract: A contact element for an electrical plug connecting device, having a molded first end section and a molded elongated receiving section which defines a longitudinal axis for mechanical and electrical coupling and/or receiving a mating contact element designed to be complementary to the contact element of a plug connecting device to be paired with the electrical plug connecting device, both of which are manufactured of an electrically conductive material. The elongated receiving section extends essentially cylindrically from the first end section. This end section as well as the elongated cylindrical receiving section are molded to be free of seams and butt joints by shaping the electrically conducting material by means of a force acting at least predominantly parallel to the longitudinal axis, and at least the receiving section molded by shaping the electrically conducting material forms a cylindrical interior sheathed by the molded electrically conducting material along the longitudinal axis.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: May 23, 2017
    Assignee: Bals Elektrotechnik GmbH & Co. KG
    Inventors: Andreas Ramm, Mareike Bankstahl
  • Patent number: 9620875
    Abstract: A memory card, comprising: a top surface; a bottom surface on an opposite side of the memory card from the top surface; and a first alignment structure formed on the top surface or the bottom surface and configured to interface with a corresponding second alignment structure of a memory card socket when the memory card is correctly inserted into the memory card socket and configured to substantially prevent full insertion of the memory card when the memory card is incorrectly inserted into the memory card socket.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yu-Sung Kim, Jin-Hyuk Lee, Il-Mok Kang, Seok-Jae Han
  • Patent number: 9614330
    Abstract: A relay connector (1) includes: a first input/output unit (11) to which a cable connector (92) connected to one end of a cable (91) is detachably connected; a second input/output unit (12) that is detachably connected to a board connector (93) provided in a board (94) to which the cable connector (92) can be detachably connected, and that is electrically connected to the first input/output unit (11); and a core (13) that suppress noise radiated by a signal flowing between the first input/output unit (11) and the second input/output unit (12).
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: April 4, 2017
    Assignee: KYOCERA Document Solutions Inc.
    Inventor: Masami Mashiki
  • Patent number: 9529762
    Abstract: The cable for a medical device is an optically isolated serial transmission cable, used to connect a base device with a serial port, or the like, to a medical device. In an alternate embodiment of the invention, the invention enables auto detection of the cable. The base device is used to power the cable electronics. In another embodiment of the present invention, the interface cable is also supported by graphical and text message display that assists users in connecting the cable to both the medical device and a base device.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: December 27, 2016
    Assignee: Becton, Dickinson and Company
    Inventors: Scott Gisler, Dave Arndt
  • Patent number: 9502799
    Abstract: A connector (200) provides improved robustness and strength with a header (202) configured to retain and expose a plurality of receptacles (204). The exposed portion of each receptacle provides a surface mount solderable element as part of the overall connector. Another embodiment further provides a lead (208) extending from the exposed portion of the receptacle to provide an additional leaded solderable element to the connector. Thus, the connector can provide both surface mount capability and/or a combination of surface mount and lead mount capability. The exposed portions of the receptacles may be soldered flush to a board (302), thus minimizing z-height of the connector to the board and allowing for a larger sized diameter receptacle.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: November 22, 2016
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Jorge L. Garcia, Richard K. Schmid, Anthony J. Suppelsa
  • Patent number: 9488853
    Abstract: A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: November 8, 2016
    Assignee: Verily Life Sciences LLC
    Inventor: James Etzkorn
  • Patent number: 9437584
    Abstract: An electronic apparatus includes a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked, penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, an MEMS chip mounted on the multilayered structure and provided with an MEMS device, wherein pads connecting to the penetrating electrodes are provided on the MEMS chip.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: September 6, 2016
    Assignee: Seiko Epson Corporation
    Inventor: Kenya Watanabe
  • Patent number: 9431783
    Abstract: A system includes a backplane and an auxiliary connector mounted to the backplane. The auxiliary connector is configured to mate with a corresponding mating auxiliary connector of an electrical power supply. A power connector is mounted directly to the backplane. The power connector is configured to mate with a corresponding mating power connector of the electrical power supply. A power bus bar is mounted to the backplane. The power bus bar is engaged in electrical contact with the power connector.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: August 30, 2016
    Assignee: Tyco Electronics Corporation
    Inventor: Brian Patrick Costello
  • Patent number: 9419364
    Abstract: The disclosure relates to a flat contact for insertion in a receiving member of a connector in an insertion direction (E), a receiving block for inserting the flat contact, and a connector comprising a receiving block and/or a flat contact. A solution is provided in which the positioning of a flat contact relative to the receiving block is simple and precise. This is achieved by a flat contact for insertion in a receiving member of a connector in an insertion direction (E) comprising a clamping portion having clamping projections which protrude in a width direction (B) and a positioning portion which has at the narrow sides thereof guiding faces which extend parallel with the insertion direction (E), the guiding faces projecting beyond the clamping projections in the width direction (B).
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: August 16, 2016
    Assignee: Tyco Electronics Belgium EC BVBA
    Inventors: Peter Devos, Rik Danneels, Thomas Ryckx, Lieven Dossche
  • Patent number: 9406920
    Abstract: A connector includes a housing for holding connector terminals and a side fitting slot located at a side of the housing. The side fitting slot is defined by an arm provided on the housing and receives a mating part to which the connector terminals are connected when the mating part is inserted in the side fitting slot.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: August 2, 2016
    Assignees: Toyota Jidosha Kabushiki Kaisha, Tyco Electronics Japan G.K.
    Inventors: Sumiyoshi Furuya, Norishige Konno, Sogo Goto
  • Patent number: 9390764
    Abstract: A storage apparatus including a storage element and a fitting member is provided. The storage element includes a body, a first pad set and a second pad set. The first and the second pad sets are exposed out of the body and located at opposite sides of the body. The fitting member comprises a first terminal set and a second terminal set electrically connected to each other. The storage element is detachably assembled to the fitting member. The first terminal set electrically connected to the first pad set and the second terminal set located between the first pad set and the second pad set, the second terminal set and the second pad set form a connecting interface of the storage apparatus that the storage apparatus is used for being electrically connected to an external apparatus. A production method of the storage apparatus is further provided.
    Type: Grant
    Filed: September 2, 2013
    Date of Patent: July 12, 2016
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Hung-I Chung, Chang-Chih Chen
  • Patent number: 9386201
    Abstract: The present disclosure relates to a camera device and an electronic device. The camera device comprises a rigid circuit board, an image sensor, and a heat dissipation member. The rigid circuit board comprises an extension portion extending laterally and a plurality of electrical contact pads. The extension portion comprises a board edge. The plurality of electrical contact pads are provided on the board edge. The image sensor comprises an image capture chip. The image capture chip may be directly fixed on the rigid circuit board, a heat dissipation space is left at a position which is below the rigid circuit board and corresponds to the image sensor when the board edge of the rigid circuit board is mated to a board edge connector of laterally connected type provided at one side of a main circuit board. The heat dissipation member may be provided in the heat dissipation space.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: July 5, 2016
    Assignee: Molex, LLC
    Inventors: Chun Guang Li, Tong Lye Ng
  • Patent number: 9368885
    Abstract: A cable connector includes a circuit board, having a predetermined width in a manner passable through an elongated tube of an endoscope apparatus, disposed to extend in an axial direction. A terminal group is formed on the circuit board, for electrically contacting a socket connector. First and second land patterns are formed on the circuit board, arranged in the axial direction so that the terminal group is disposed therebetween, wherein a front end of a first electric line group having lines among electric lines of a cable structure is electrically coupled to the first land pattern, and a front end of a second electric line group having lines among the electric lines is coupled to the second land pattern. A wiring pattern is formed on the circuit board, for electrically coupling the first land pattern to the terminal group and coupling the second land pattern to the terminal group.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: June 14, 2016
    Assignee: FUJIFILM CORPORATION
    Inventor: Toshio Sakamoto
  • Patent number: 9288898
    Abstract: Systems and methods are disclosed that include electrically connecting multiple electrical components via an electrical connection that extends through a common conductor substrate. The electrical components are bonded or otherwise secured to the common conductor substrate and the electrical connection extends between the multiple electrical components. The multiple electrical components may be components fabricated by different methods, such as photolithography and printed circuitry, and may be of different heights. The common conductor substrate is stretchable and may be a mesh configuration is some examples.
    Type: Grant
    Filed: September 18, 2012
    Date of Patent: March 15, 2016
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Leah Lavery, Tse Nga Ng
  • Patent number: 9282632
    Abstract: A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: March 8, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9281629
    Abstract: A receptacle connector mounted to the printed circuit board, includes an insulative housing defining a mating tongue and a metallic shell enclosing the housing to form a mating cavity in which said mating tongue forwardly extends. A complementary plug connector includes a shell with a bull-nose tip. A metallic piece is mounted around a root of the mating tongue and equipped with a plurality of spring tangs to contact the relatively rigid bull-nose tip of the shell of the complementary connector for EMI/RFI protection.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: March 8, 2016
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Stephen Sedio, Chih-Pi Cheng, Yuan Zhang, De-Cheng Zou, An-Jen Yang
  • Patent number: 9263815
    Abstract: A rechargeable battery socket and the manufacturing method of making the same is disclosed. The rechargeable battery socket includes an insulating housing defining a number of terminal channels, a number of terminals received in the insulating housing, and a shell assembled to one side of the insulating housing. Each terminal includes a contacting portion received in corresponding terminal channel and a tail extending out of the insulating housing. Each terminal channel provides a pair of ribs on two opposite inside faces thereof. The contacting portion of the terminal cooperates with the rib to thereby secure the terminal in the insulating housing.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: February 16, 2016
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Wang-I Yu, Hung-Chi Tai, An-Yu Yu, Yung-Chih Hung, Jie-Jun Zeng, Kuo-Cheng Liu
  • Patent number: 9253880
    Abstract: Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: February 2, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Jin Park, Romero Christian, Seung Wook Park
  • Patent number: 9190748
    Abstract: A connector structure includes a circuit body, a fork terminal, a housing and an insertion member. The circuit body includes a conductor including a two-pronged part having two extended portions, and plated leads arranged at the extended portions respectively. The fork terminal includes a first terminal part and a second terminal part which project from a terminal base so that an insertion space is formed between the first and second terminal parts. The housing includes a fitting part accommodating the fork terminal. The insertion member is inserted into the insertion space through the fitting part in a state where the circuit body is fixed. The circuit body is electrically connected with one of the first and second terminal parts with the insertion of the insertion member.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: November 17, 2015
    Assignee: YAZAKI CORPORATION
    Inventor: Naoki Ito
  • Patent number: 9159616
    Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: October 13, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Harvey Hamel, John Ulrich Knickerbocker, Samuel McKnight, Chirag S. Patel
  • Patent number: 9113845
    Abstract: A sleeve for simple assembly of in-vivo devices, such as endoscopy capsules, is provided. The sleeve comprises grippers and leaf springs at either end to hold the rigid portions of a rigid-flex PCB (printed circuit board) in a folded configuration before the PCB is inserted into an in-vivo device's housing. A method of assembly of the rigid-flex PCB into the sleeve is provided.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: August 25, 2015
    Assignee: GIVEN IMAGING LTD.
    Inventors: Zvika Gilad, Chen Mann, Semion Khait
  • Patent number: 8998619
    Abstract: A cable connector includes a circuit board, having a predetermined width in a manner passable through an elongated tube of an endoscope apparatus, disposed to extend in an axial direction. A terminal group is formed on the circuit board, for electrically contacting a socket connector. First and second land patterns are formed on the circuit board, arranged in the axial direction so that the terminal group is disposed therebetween, wherein a front end of a first electric line group having lines among electric lines of a cable structure is electrically coupled to the first land pattern, and a front end of a second electric line group having lines among the electric lines is coupled to the second land pattern. A wiring pattern is formed on the circuit board, for electrically coupling the first land pattern to the terminal group and coupling the second land pattern to the terminal group.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: April 7, 2015
    Assignee: FUJIFILM Corporation
    Inventor: Toshio Sakamoto
  • Patent number: 8998620
    Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads, and several extended purpose contact springs disposed on an upper side of a PCB. A single-shot molding process is used to form a molded housing over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The EUSB device is optionally used as a modular insert that is mounted onto a metal or plastic case to provide a EUSB assembly having a plug shell similar to a standard USB male connector.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: April 7, 2015
    Assignee: Super Talent Technology, Corp.
    Inventors: Jim Chin-Nan Ni, Nan Nan, Abraham C. Ma