Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. Patents (Class 439/55)
  • Patent number: 11375636
    Abstract: Systems, methods, and devices are provided in which cord storage cartridges are removably connected to a power distribution unit (PDU). The cord storage cartridge may include a cartridge housing having at least one aperture, a PDU interface associated with the cartridge housing and configured to removably connect the cord storage device to a mateable interface of the PDU, and a power output cord having a proximal end in electrical communication with the PDU interface and a distal end coupled with an output connector that is configured to connect to electronic equipment. The power output cord may be stowed at least partially within the cartridge housing in a retracted state and moveable through the at least one aperture to an extended state at least partially external to the cartridge housing.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: June 28, 2022
    Assignee: Server Technology, Inc.
    Inventors: Travis Irons, Vimal Bhakta, Jeff Macedo
  • Patent number: 11322429
    Abstract: A circuit module includes a circuit board including an insulating layer, first and second signal conductors, a ground conductor, and a ground conductor layer; and an electronic component including first and second signal terminals and a first ground terminal. The ground conductor includes a first strip portion parallel to the first and second signal conductors. When a portion of the first signal conductor parallel to the second signal conductor and the first signal terminal are set as a first signal wiring line and a portion of the second signal conductor parallel to the first signal conductor and the second signal terminal are set as a second signal wiring line, the circuit board includes a first strip portion connection via conductor that connects the first strip portion and the ground conductor layer in a region where the first and second signal wiring lines are parallel to each other.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: May 3, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshiro Maeda
  • Patent number: 11283204
    Abstract: Systems and methods for simultaneously coupling a plurality of high speed electrical connectors to a Printed Wiring Board (“PWB”). The methods comprise: obtaining a composite electrical connector comprising the plurality of high speed electrical connectors which are serially arranged in a side-by-side manner and coupled to each other; automatedly engaging a smooth surface of the composite electrical connector; placing the composite electrical connector on the PWB so that pins of the plurality of high speed electrical connectors are concurrently inserted into vias formed in the PWB; and coupling the composite electrical connector to the PWB by soldering the pins in the vias.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: March 22, 2022
    Assignee: Eagle Technology, LLC
    Inventors: Dale Loch, Michael T. DeRoy
  • Patent number: 11245215
    Abstract: A connector for a display device is capable of visually detecting defects when an FPCB is connected to a PCB in the display device, e.g., a tablet and a smart phone. The connector includes a first gaff-type connection portion disposed at one end portion of a flexible printed circuit board, and a second gaff-type connection portion disposed at one end portion of a printed circuit board and fitted to the first gaff-type connection portion.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinyoung You, Sangyoon Lee
  • Patent number: 11239586
    Abstract: A cable assembly module includes: a front mating member; a rear cable linked behind the mating member and including a pair of signal wires; a pair of signal contacts retained upon the front mating member, each of said signal contacts including a middle retaining section associated with the front mating member, a front mating section spaced from the front mating member in a deflectable manner, and a rear connecting section mechanically and electrically connected to the corresponding signal wires, respectively; and a pair of grounding contacts located by two sides of the pair of signal contacts; wherein the front mating sections are adapted for being directly mated with circuit pads of a printed circuit board disposed in a plane, and the rear cable extends along a direction inclined with the plane.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: February 1, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jie Zheng, Terrance F. Little
  • Patent number: 11211731
    Abstract: A connector is mateable with a mating connector along a predetermined direction. The mating connector comprises a mating lock portion. The connector comprises at least a connector main. The connector main comprises a holding member, a plurality of contacts and two lock portions. The contacts are held by the holding member. Each of the lock portions has a held portion and a spring portion. The held portion is held by the holding member. The spring portion is resiliently deformable. The spring portion has a locking protrusion and a resilient supporting portion. The locking protrusion and the mating lock portion lock a mated state where the connector and the mating connector are mated with each other. The connector main has a space which is positioned inward in a first direction beyond the spring portion. The space allows resilient deformation of the spring portion.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: December 28, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Junji Oosaka
  • Patent number: 11202380
    Abstract: An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: December 14, 2021
    Assignee: Cummins Inc.
    Inventors: Nikhil Pandey, Daniel R. Harshbarger, William D. Meyer, Mark Swain
  • Patent number: 11128068
    Abstract: A circuit board arrangement, and method for assembling at least one connection element, provides a first circuit board and a second circuit board arranged in a parallel orientation to one another in different planes, and at least one rigid connection element communicates between the first and the second circuit boards and the connection element has an exterior housing which encloses an internal conductor part, and the exterior housing constitutes a first electrical path between the first and second circuit boards, and the internal conductor part constitutes a second electrical path between the first and second circuit boards.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 21, 2021
    Assignee: ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
    Inventors: Andreas Gruber, Tobias-Lars Hoeher, Tobias Stadler
  • Patent number: 11056844
    Abstract: A connector has a main portion formed as a part of a multilayer wiring board and having a tongue shape. The multilayer wiring board is provided with a surface conductive layer and an inner conductive layer. The inner conductive layer is located apart from and inward of the surface conductive layer in an up-down direction. The main portion is provided with a grounding plate formed in the surface conductive layer and a plurality of contacts formed in the inner conductive layer. Each of the contacts is, at least in part, exposed and contactable in the up-down direction. Since the grounding plate and the contacts are formed in the conductive layers of the multilayer wiring board, the connector can possess desired electric characteristics in high accuracy.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: July 6, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Kentaro Toda
  • Patent number: 11038310
    Abstract: A bidirectional duplex electrical connector includes: two insulation seats; two rows of first terminals, wherein the first terminal has an elastically movable portion, a fixing portion and a pin, a front section of the elastically movable portion is curved to form a contact, and a rear section of the elastically movable portion and the fixing portion horizontally rest against the insulation seat, the insulation seat has a fixing structure fixing the fixing portions of the two rows of first terminals, and the rear sections still can elastically move; one row of second terminals, wherein the second terminal has two elastic arms each having a contact projecting toward a middle, and the second terminal has a vertical plate surface; and a metal housing covering the two insulation seats.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: June 15, 2021
    Assignee: KIWI INTELLECTUAL ASSETS CORPORATION
    Inventor: Chou Hsien Tsai
  • Patent number: 10993345
    Abstract: A storage card insertable into a host system is provided that includes a plurality of storage devices connectors. The storage card include slot offset features to offset a circuit board of the storage card from a host system slot alignment. This offset provides for storage device connector placement on both sides of the storage card. The storage card also can include a Peripheral Component Interconnect Express (PCIe) switch circuit configured to communicatively couple the PCIe signaling of the plurality of storage device connectors and PCIe signaling of a host connector of the storage card, where the PCIe switch circuit is configured to receive storage operations over the PCIe signaling of the host connector of the storage card and transfer the storage operations for delivery over the PCIe signaling of selected ones of the plurality of storage device connectors.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: April 27, 2021
    Assignee: Liqid Inc.
    Inventors: Bryan Schramm, Andrew Rudolph Heyd, Brenden Michael Rust, Christopher R. Long, Sumit Puri
  • Patent number: 10973137
    Abstract: An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10 and a resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes a housing body 22 and a cut-off receiving portion 27 projecting from the housing body 22. The cut-off receiving portion 27 includes a flange portion 28 projecting outward from the housing body 22 and a flexible wall 29 extending from the flange portion 28 and inclined to be closer to the housing body 22 toward a tip, and a part of the flexible wall 29 is embedded in the resin portion 50.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: April 6, 2021
    Inventors: Hirokazu Komori, Naomichi Kawashima, Hiroki Hirai, Makoto Higashikozono, Masanori Moriyasu
  • Patent number: 10957997
    Abstract: A connector assembly includes, a housing, a circuit board that includes a conductive front pad and a conductive rear pad electrically connected to the front pad, and a cable that includes an insulated conductor having a conductor surrounded by an insulating material. The conductor has a diameter not greater than 24 AWG. The uninsulated front end of the conductor is terminated at the rear pad and includes a preformed bend. The connector assembly also includes a recess formed in an external surface and on a lateral side of the housing. The recess is designed to receive and house a spring member of a pull tab that is assembled to the housing. The vertical separation between the recess and the circuit board is h, the average thickness of the cable is t, and h?3t. The preformed bend may include first and second portions connected by a substantially flattened joint.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: March 23, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: YunLong Qiao, Saujit Bandhu, Kok Hoe Lee, Vincent Tan
  • Patent number: 10949361
    Abstract: A solid state disk comprising includes a plurality of protected flash memory modules each having a plurality of flash memory devices, a flash memory controller, power protection circuitry and interconnect interface. Each of the protected flash memory modules is removably inserted into a socketed interconnect and coupled thereby to a circuit board having a multicore flash processor, host interface and program code store. The multicore flash processor executes program code stored in the program store to enable an external agent interacting with the solid state disk via the host interface to perceive the solid state disk as having a single flash controller instead of the multiple flash controllers disposed respectively on the protected flash memory modules.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 16, 2021
    Assignee: Nimbus Data, Inc.
    Inventor: Thomas Isakovich
  • Patent number: 10868101
    Abstract: A display apparatus includes a substrate, a wire having an inner edge including first and second portions, a first insulating layer covering a portion of the substrate, and a second insulating layer. The portion of the substrate covered by the first insulating layer is closer to a center of the substrate than the wire, the first insulating layer covers a part of the first portion of the wire and a part of the second portion of the wire, and a first end of the first insulating layer is disposed on the wire. The second insulating layer covers the first insulating layer and has a second end disposed on the wire. A distance between the first end and the second end covering the first portion of the wire is different from a distance between the first end and the second end covering the second portion of the wire.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: December 15, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kiwook Kim, Kwangmin Kim, Yangwan Kim, Jisu Na, Minwoo Byun
  • Patent number: 10862233
    Abstract: A power interface (100), a mobile terminal and a power adapter are provided. The power interface (100) includes a body portion (110), data pins (120) and power pins (130). The body portion (110) is configured to be coupled to a circuit board, and there are multiple spaced data pins (120) connected with the body portion (110). There may be multiple spaced power pins (130) connected with the body portion (110). The power pins (130) and the data pins (120) are arranged at intervals. At least one of the multiple power pins (120) includes a widened section (132), and a cross-sectional area of the widened section (132) is greater than a cross-sectional area of each of the data pins (120) to increase a current load capacity of the power pin (130).
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: December 8, 2020
    Assignee: Guangdong OPPO Mobile Telecommunications Corp., Ltd.
    Inventors: Guodong Gu, Feifei Li
  • Patent number: 10804650
    Abstract: Electrical connector technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly comprises a connector body having and a sub-assembly interface configured to electrically couple to an electronics sub-assembly. The connector has a circuit board interface configured to electrically couple to a circuit board of an electronics assembly. The connector has at least two rows of contacts configured to electrically couple the circuit board to the electronics sub-assembly. The at least two rows of contacts are aligned offset relative to each other such that any ground contact of one row avoids intersection of a plane in which any ground contact of the other row resides to at least partially cancel row-to-row crosstalk when the at least two rows of contacts are transmitting signals at a predetermined high-speed bit rate.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: October 13, 2020
    Assignee: Intel Corporation
    Inventors: Jeffrey Lee, Brent R. Rothermel, Kemal Aygun
  • Patent number: 10775427
    Abstract: A circuit board for transmitting a high speed signal and for the high speed signal to be detected comprises a substrate, an insulating layer and two metal printed wires. The insulating layer is disposed on the substrate, and comprises a first surface, a second surface and a test opening, with the first surface facing away from the substrate, the second surface facing the substrate, and the test opening passing through the first surface and formed above the second surface. Said two metal printed wires are configured to transmit the high speed signal and embedded in the insulating layer between the first surface and the second surface. At least one of the metal printed wires comprises a test section which is aligned to the test opening of the insulating layer and exposed by the test opening.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: September 15, 2020
    Assignee: WIWYNN CORPORATION
    Inventors: Yu-Nan Chu, Yung Jung Du, Yi Tang Chen
  • Patent number: 10716232
    Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: July 14, 2020
    Assignee: Raytheon Company
    Inventors: Derek B. Wells, Kenneth P. Walsh, Jr., Gregory S. Renaud, Dimitry Zarkh
  • Patent number: 10680366
    Abstract: A connector assembly and a jumper connector thereof are provided. The jumper connector includes a first jumper connector body case for being coupled to a first board edge connector, a second jumper connector body case for being coupled to a second board edge connector, and conductive terminals. The first and second jumper connector body cases are coupled to each other to form an internal receiving space for accommodating the conductive terminals, and the conductive terminals are movable to correspond in position to the first and second board edge connectors respectively. By such structural design, even if circuit boards incur problems like poor processing quality or position offset, the jumper connector according to the present invention can still effectively bridge and join the board edge connectors on the circuit boards, thereby desirably accomplishing electrical connection between multiple circuit boards on electronic equipment.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: June 9, 2020
    Assignee: TARNG YU ENTERPRISE CO., LTD.
    Inventors: Mu-Jung Huang, Ying-Chung Chen
  • Patent number: 10660228
    Abstract: A storage card insertable into a host system is provided that includes a plurality of storage devices connectors. The storage card include slot offset features to offset a circuit board of the storage card from a host system slot alignment. This offset provides for storage device connector placement on both sides of the storage card. The storage card also can include a Peripheral Component Interconnect Express (PCIe) switch circuit configured to communicatively couple the PCIe signaling of the plurality of storage device connectors and PCIe signaling of a host connector of the storage card, where the PCIe switch circuit is configured to receive storage operations over the PCIe signaling of the host connector of the storage card and transfer the storage operations for delivery over the PCIe signaling of selected ones of the plurality of storage device connectors.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 19, 2020
    Assignee: Liqid Inc.
    Inventors: Bryan Schramm, Andrew Rudolph Heyd, Brenden Michael Rust, Christopher R. Long, Sumit Puri
  • Patent number: 10530081
    Abstract: A dual connector assembly includes first and second electrical connectors. The first electrical connector has a first housing holding a first contact. The first housing has a mating end mated with a first mating connector and a mounting end mounted to a circuit board. The first housing has a first mounting block including a first mounting surface. The second electrical connector has a second housing holding a second contact. The second housing has a mating end mated with a second mating connector and a mounting end coupled to the mounting end of the first housing. The second housing has a second mounting block facing the first mounting block such that the second mounting surface engages the first mounting surface to locate the second housing relative to the circuit board. The mounting end of the second housing is held spaced apart from the circuit board by the first electrical connector.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: January 7, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Brian Patrick Costello, William Charles McGee, III
  • Patent number: 10490917
    Abstract: The present disclosure relates to a motor-driving device with an improved structure of a circuit module. According to the present disclosure, the boards are coupled to each other via a connector or a bolt. This removes wires use, and reduces an assembly tolerance, thereby to improve the device productivity.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: November 26, 2019
    Assignee: LSIS CO., LTD.
    Inventors: Hong-Seok Kim, Dong-Sik Kim, Chun-Suk Yang
  • Patent number: 10453383
    Abstract: An embodiment display panel may include a housing including a recess, a substrate disposed in the recess, and a plurality of light emitting diodes (LEDs) attached to a front side of the substrate, in which the plurality of LEDs form a front surface of the display panel. The display panel may further include a back cover enclosing the recess and a back side of the substrate. The back cover may form a back surface of the display panel, and the back cover may be configured to prevent ingress of water or dust through a thickness of the back cover. The display panel may further include a power supply disposed in the recess and physically attached to the back cover and not to the housing or substrate, in which the power supply is configured to power the plurality of LEDs.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: October 22, 2019
    Assignee: ULTRAVISION TECHNOLOGIES, LLC
    Inventors: Matthew Foster, William Y. Hall
  • Patent number: 10448505
    Abstract: A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: October 15, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventor: Kazushige Akita
  • Patent number: 10431947
    Abstract: An electrical component socket includes a socket body arranged on a circuit board and including a receiving portion configured to receive an electrical component. The socket body includes an arrangement portion in which a row of contact pins to be in contact with leads of an IC package is arranged. At least one of these contact pins and another one of the contact pins adjacent to the at least one of the contact pins have an arrangement pitch that is narrower than a pitch between the terminals of the electrical component, and the other one of the contact pins and still another one of the contact pins adjacent to the other one of the contact pins have an arrangement pitch that is substantially equal to the pitch between the terminals of the electrical component.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: October 1, 2019
    Assignee: ENPLAS CORPORATION
    Inventor: Yuta Sugawara
  • Patent number: 10361498
    Abstract: A board-to-board connector includes a first circuit board and a second circuit board. The first circuit board has at least one cut. The second circuit board includes a tongue assembly disposed corresponding to the cut, a plurality of connection portions disposed on two opposite surfaces of the tongue assembly, and a plurality of conductive portions electrically connected to the first circuit board. Therefore, the board-to-board connector can effectively reduce the distance between the first circuit board and the second circuit board, which is applicable to the increasingly lightweight and compact electronic devices.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 23, 2019
    Assignees: NICECONN TECHNOLOGY CO., LTD.
    Inventors: Yi-Fang Chuang, Nai-Chien Chang
  • Patent number: 10355415
    Abstract: An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 16, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Joon Kim, Min-Seok Kim, Sigwan Kim, Jung-Woo Kim
  • Patent number: 10346333
    Abstract: A system and method for performing an intelligent power dongle operation for information handling systems having a serial bus power connection such as a USB type-C power connection. In certain embodiments, the intelligent power dongle includes hardware and firmware to read a legacy adapter PSID information and convert the information to serial information such as USB Type-C baseboard management controller BMC compliant data. In certain embodiments the intelligent power dongle includes power management circuitry the allow selection and proper switching between a low voltage power mode (e.g., a 5V power mode) and a higher voltage power mode (e.g., a 19.5V power mode) depending on a device attached to the intelligent power dongle. In certain embodiments, the intelligent power dongle may be used to power low voltage devices (e.g., devices powered by 5V).
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: July 9, 2019
    Assignee: Dell Products L.P.
    Inventors: Merle J. Wood, III, Wei-Cheng Yu, Sean P. O'Neal, Thomas E. Voor, Tsung-Cheng Liao, Tun-Chieh Liang
  • Patent number: 10349549
    Abstract: A shielded direct current link (“DC link”) busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: July 9, 2019
    Assignee: General Electric Company
    Inventors: Tobias Schuetz, Xiaoting Dong, Philipp Leuner
  • Patent number: 10249924
    Abstract: Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 2, 2019
    Assignee: INTEL CORPORATION
    Inventors: Kai Xiao, Raul Enriquez Shibayama, Gong Ouyang, Jose Diego Guillen Gonzalez, Beom-Taek Lee
  • Patent number: 10224648
    Abstract: The teachings relate to the improvement of the connection between a stranded conductor and a substrate by using a sleeve for holding the end of the stranded conductor, wherein the end can be crimped to the sleeve and the sleeve can be welded to the substrate via ultrasonic welding or connected thereto by crimping.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: March 5, 2019
    Assignee: GENTHERM GMBH
    Inventor: Markus Ißler
  • Patent number: 10109966
    Abstract: A reversible dual-position electric connector comprises: an insulated seat having a base seat and a docking part fitting together, wherein the docking part has two opposite connection plates to form a fitting frame body, opposite surfaces of the two connection plates have connection surfaces between which a connection slot is formed, and one connection plate has one row of elastic movement spaces much more depressed than the connection surface; one terminal set disposed in the insulated seat and has one row of terminals each having a fixing portion and an extension, which extends to the elastic movement space and is provided with a vertically elastically movable contact; and a metal housing covering the insulated seat and having a four-sided primary housing, which shields the docking part to form a docking structure. A shape of the docking structure can be positioned at a docking electric connector in a reversible dual-position manner.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: October 23, 2018
    Inventor: Chou Hsien Tsai
  • Patent number: 10084254
    Abstract: An electrical connector includes an insulative housing an insulative housing enclosing two row of conductive terminals. Each of the terminals includes a front contacting section, a front spring section behind the front contacting section, a middle retaining section and a rear tail section along the front-to-back direction. In each row, the terminals include a pair of outer grounding terminals, a pair inner power terminals respectively beside the pair of outer grounding terminals, and a plurality of other terminals between the pair of power terminals in the transverse direction wherein for each of the pair of outer grounding terminals and the pair of inner power terminals, the front contacting section, the middle retaining section and the rear tails section are wider than the front contacting section in the transverse direction.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: September 25, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Ming-Qi Ge
  • Patent number: 9972565
    Abstract: The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 15, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: David P. Adams, Kira L. Fishgrab, Karl Douglas Greth, Michael David Henry, Jeffrey Stevens, V. Carter Hodges, Randy J. Shul, Ronald S. Goeke, Robert K. Grubbs
  • Patent number: 9859658
    Abstract: An electrical connector includes a housing and a plurality of ground wafers and signal wafers. A front side is configured to mate with a mating connector. The ground wafers and signal wafers are stacked next to one another along a stack axis. The ground wafers are interleaved between adjacent pairs of the signal wafers. Each signal wafer includes at least one signal conductor held by a signal holder that is composed of a first material. Each ground wafer includes at least one ground conductor held by a ground holder that is composed of second material. The second material is a lossy material and the first material is a low loss dielectric material that has a loss tangent that is lower than a loss tangent of the lossy material. The signal conductors and the ground conductors are configured to engage and electrically connect to the mating connector.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: January 2, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Bruce Allen Champion, Chad William Morgan
  • Patent number: 9826670
    Abstract: A vehicle includes a power receiving portion that is mounted below a floor panel and that receives electric power in a contactless manner from a power transmitting portion provided outside the vehicle, an electromagnetic shield that prevents an electromagnetic field from passing through, a power receiving portion cover that allows the electromagnetic field to pass through and covers the power receiving portion, and an undercover that allows the electromagnetic field to pass through and covers the power receiving portion cover.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: November 21, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toru Nakamura, Shinji Ichikawa, Arinori Higashiyama, Takahisa Yamamoto
  • Patent number: 9812827
    Abstract: An electrical connector includes an insulative housing, a plurality of contacts disposed in the housing, and a metallic shield enclosing the housing. The contacts includes a row of first contacts and another row of second contacts. The insulative housing includes a main base and a tongue portion extending forwardly from the body. The metallic shield includes a main body, a tubular section extending forwardly from the main body, an inner part forwardly extending from the main body and inside said tubular section. The inner part forms a receiving space in which the tongue portion is received.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 7, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jing-Jie Guo, Jun Zhao, Cai-Yun Zhang
  • Patent number: 9762009
    Abstract: A plug connector includes an insulative housing with mating slot, contacts disposed in the housing by two sides of the mating slot, and a pair of side arms located by two opposite ends of the mating slot in a horizontal transverse direction. a receptacle connector includes an insulative housing defining a horizontal mating tongue; contacts disposed in the housing with contacting sections exposed upon two opposite surfaces of the mating tongue; and a monolithic horizontal metallic shielding plate disposed and extending substantially fully the mating tongue. The shielding plate defines side protruding edge sections exposed outside of corresponding side edges of the mating tongue and a notch structure on each side protruding edge section, the pair of side arms each defines a hook structure to engagement with the notch structure.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: September 12, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Chih-Pi Cheng, Chih-Kai Yang
  • Patent number: 9750130
    Abstract: A printed wiring board includes a differential transmission line having a first wiring and a second wiring. The first wiring has a plurality of first linear portions formed of linear wiring and extending in a first direction, and a first bypass portion that is connected to the plurality of first linear portions and includes a linear wiring. The second wiring has a plurality of second linear portions formed of linear wirings and extending in a second direction substantially parallel to the first direction, and a second bypass portion that is connected to the plurality of second linear portions and includes a curved wiring. The first bypass portion and the second bypass portion protrude on the same side. A region in which the first bypass portion is provided and a region in which the second bypass portion is provided are at least partially overlapped in the first direction.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: August 29, 2017
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Masaaki Ito
  • Patent number: 9740248
    Abstract: A component mount for a data storage device (DSD). The component mount includes a flexible member or printed circuit board assembly (PCBA) including a pad for electrically connecting to a printed circuit board (PCB) of the DSD. At least one capacitor is mounted on the flexible member or PCBA, and is electrically connected with the pad.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: August 22, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Mohammad Sarraf, Billy Hung Vu, John P. Myers
  • Patent number: 9726691
    Abstract: The embodiments of the present invention relate to semiconductor device manufacturing, and more particularly to structures and methods of directly testing semiconductor wafers having micro-solder connections. According to one embodiment of the present invention, a method of forming a pattern of micro-solder connections coupled with a through substrate via (TSV) that can be directly tested by electrical probing, without the use of a testing interposer, is disclosed. According to another embodiment, a method of testing the pattern of micro-solder connections is disclosed. According to another embodiment, a novel electrical probe tip structure, having contacts on the same pitch as the pattern of micro-solder connections is disclosed.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: August 8, 2017
    Assignee: International Business Machines Corporation
    Inventors: Victor A. Garibay, Chetan Mehta, Doorlabh Panjwani, Tingdong Zhou
  • Patent number: 9711894
    Abstract: An electrical connector comprises a printed circuit board module including a printed circuit board (PCB) and a plurality of electrical elements disposed on the PCB, the PCB includes a mating end for mating with a mating connector and a plurality of conductive paths electrically connecting with the electrical elements; wherein the PCB includes a fracture surface, and the plurality of conductive paths are exposed to the fracture surface.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: July 18, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Ru-Yang Guo, Hai-Li Wang, Shuai-Hui Huang, Jian-Fang Li, Qing-Man Zhu, Jerry Wu
  • Patent number: 9693457
    Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: June 27, 2017
    Assignee: International Business Machines Corporation
    Inventor: Brian Samuel Beaman
  • Patent number: 9660358
    Abstract: A contact element for an electrical plug connecting device, having a molded first end section and a molded elongated receiving section which defines a longitudinal axis for mechanical and electrical coupling and/or receiving a mating contact element designed to be complementary to the contact element of a plug connecting device to be paired with the electrical plug connecting device, both of which are manufactured of an electrically conductive material. The elongated receiving section extends essentially cylindrically from the first end section. This end section as well as the elongated cylindrical receiving section are molded to be free of seams and butt joints by shaping the electrically conducting material by means of a force acting at least predominantly parallel to the longitudinal axis, and at least the receiving section molded by shaping the electrically conducting material forms a cylindrical interior sheathed by the molded electrically conducting material along the longitudinal axis.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: May 23, 2017
    Assignee: Bals Elektrotechnik GmbH & Co. KG
    Inventors: Andreas Ramm, Mareike Bankstahl
  • Patent number: 9620875
    Abstract: A memory card, comprising: a top surface; a bottom surface on an opposite side of the memory card from the top surface; and a first alignment structure formed on the top surface or the bottom surface and configured to interface with a corresponding second alignment structure of a memory card socket when the memory card is correctly inserted into the memory card socket and configured to substantially prevent full insertion of the memory card when the memory card is incorrectly inserted into the memory card socket.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yu-Sung Kim, Jin-Hyuk Lee, Il-Mok Kang, Seok-Jae Han
  • Patent number: 9614330
    Abstract: A relay connector (1) includes: a first input/output unit (11) to which a cable connector (92) connected to one end of a cable (91) is detachably connected; a second input/output unit (12) that is detachably connected to a board connector (93) provided in a board (94) to which the cable connector (92) can be detachably connected, and that is electrically connected to the first input/output unit (11); and a core (13) that suppress noise radiated by a signal flowing between the first input/output unit (11) and the second input/output unit (12).
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: April 4, 2017
    Assignee: KYOCERA Document Solutions Inc.
    Inventor: Masami Mashiki
  • Patent number: 9529762
    Abstract: The cable for a medical device is an optically isolated serial transmission cable, used to connect a base device with a serial port, or the like, to a medical device. In an alternate embodiment of the invention, the invention enables auto detection of the cable. The base device is used to power the cable electronics. In another embodiment of the present invention, the interface cable is also supported by graphical and text message display that assists users in connecting the cable to both the medical device and a base device.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: December 27, 2016
    Assignee: Becton, Dickinson and Company
    Inventors: Scott Gisler, Dave Arndt
  • Patent number: 9502799
    Abstract: A connector (200) provides improved robustness and strength with a header (202) configured to retain and expose a plurality of receptacles (204). The exposed portion of each receptacle provides a surface mount solderable element as part of the overall connector. Another embodiment further provides a lead (208) extending from the exposed portion of the receptacle to provide an additional leaded solderable element to the connector. Thus, the connector can provide both surface mount capability and/or a combination of surface mount and lead mount capability. The exposed portions of the receptacles may be soldered flush to a board (302), thus minimizing z-height of the connector to the board and allowing for a larger sized diameter receptacle.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: November 22, 2016
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Jorge L. Garcia, Richard K. Schmid, Anthony J. Suppelsa
  • Patent number: 9488853
    Abstract: A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: November 8, 2016
    Assignee: Verily Life Sciences LLC
    Inventor: James Etzkorn