Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. Patents (Class 439/55)
  • Patent number: 10361498
    Abstract: A board-to-board connector includes a first circuit board and a second circuit board. The first circuit board has at least one cut. The second circuit board includes a tongue assembly disposed corresponding to the cut, a plurality of connection portions disposed on two opposite surfaces of the tongue assembly, and a plurality of conductive portions electrically connected to the first circuit board. Therefore, the board-to-board connector can effectively reduce the distance between the first circuit board and the second circuit board, which is applicable to the increasingly lightweight and compact electronic devices.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 23, 2019
    Assignees: NICECONN TECHNOLOGY CO., LTD.
    Inventors: Yi-Fang Chuang, Nai-Chien Chang
  • Patent number: 10355415
    Abstract: An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 16, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Joon Kim, Min-Seok Kim, Sigwan Kim, Jung-Woo Kim
  • Patent number: 10346333
    Abstract: A system and method for performing an intelligent power dongle operation for information handling systems having a serial bus power connection such as a USB type-C power connection. In certain embodiments, the intelligent power dongle includes hardware and firmware to read a legacy adapter PSID information and convert the information to serial information such as USB Type-C baseboard management controller BMC compliant data. In certain embodiments the intelligent power dongle includes power management circuitry the allow selection and proper switching between a low voltage power mode (e.g., a 5V power mode) and a higher voltage power mode (e.g., a 19.5V power mode) depending on a device attached to the intelligent power dongle. In certain embodiments, the intelligent power dongle may be used to power low voltage devices (e.g., devices powered by 5V).
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: July 9, 2019
    Assignee: Dell Products L.P.
    Inventors: Merle J. Wood, III, Wei-Cheng Yu, Sean P. O'Neal, Thomas E. Voor, Tsung-Cheng Liao, Tun-Chieh Liang
  • Patent number: 10349549
    Abstract: A shielded direct current link (“DC link”) busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: July 9, 2019
    Assignee: General Electric Company
    Inventors: Tobias Schuetz, Xiaoting Dong, Philipp Leuner
  • Patent number: 10249924
    Abstract: Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 2, 2019
    Assignee: INTEL CORPORATION
    Inventors: Kai Xiao, Raul Enriquez Shibayama, Gong Ouyang, Jose Diego Guillen Gonzalez, Beom-Taek Lee
  • Patent number: 10224648
    Abstract: The teachings relate to the improvement of the connection between a stranded conductor and a substrate by using a sleeve for holding the end of the stranded conductor, wherein the end can be crimped to the sleeve and the sleeve can be welded to the substrate via ultrasonic welding or connected thereto by crimping.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: March 5, 2019
    Assignee: GENTHERM GMBH
    Inventor: Markus Ißler
  • Patent number: 10109966
    Abstract: A reversible dual-position electric connector comprises: an insulated seat having a base seat and a docking part fitting together, wherein the docking part has two opposite connection plates to form a fitting frame body, opposite surfaces of the two connection plates have connection surfaces between which a connection slot is formed, and one connection plate has one row of elastic movement spaces much more depressed than the connection surface; one terminal set disposed in the insulated seat and has one row of terminals each having a fixing portion and an extension, which extends to the elastic movement space and is provided with a vertically elastically movable contact; and a metal housing covering the insulated seat and having a four-sided primary housing, which shields the docking part to form a docking structure. A shape of the docking structure can be positioned at a docking electric connector in a reversible dual-position manner.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: October 23, 2018
    Inventor: Chou Hsien Tsai
  • Patent number: 10084254
    Abstract: An electrical connector includes an insulative housing an insulative housing enclosing two row of conductive terminals. Each of the terminals includes a front contacting section, a front spring section behind the front contacting section, a middle retaining section and a rear tail section along the front-to-back direction. In each row, the terminals include a pair of outer grounding terminals, a pair inner power terminals respectively beside the pair of outer grounding terminals, and a plurality of other terminals between the pair of power terminals in the transverse direction wherein for each of the pair of outer grounding terminals and the pair of inner power terminals, the front contacting section, the middle retaining section and the rear tails section are wider than the front contacting section in the transverse direction.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: September 25, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Ming-Qi Ge
  • Patent number: 9972565
    Abstract: The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 15, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: David P. Adams, Kira L. Fishgrab, Karl Douglas Greth, Michael David Henry, Jeffrey Stevens, V. Carter Hodges, Randy J. Shul, Ronald S. Goeke, Robert K. Grubbs
  • Patent number: 9859658
    Abstract: An electrical connector includes a housing and a plurality of ground wafers and signal wafers. A front side is configured to mate with a mating connector. The ground wafers and signal wafers are stacked next to one another along a stack axis. The ground wafers are interleaved between adjacent pairs of the signal wafers. Each signal wafer includes at least one signal conductor held by a signal holder that is composed of a first material. Each ground wafer includes at least one ground conductor held by a ground holder that is composed of second material. The second material is a lossy material and the first material is a low loss dielectric material that has a loss tangent that is lower than a loss tangent of the lossy material. The signal conductors and the ground conductors are configured to engage and electrically connect to the mating connector.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: January 2, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Bruce Allen Champion, Chad William Morgan
  • Patent number: 9826670
    Abstract: A vehicle includes a power receiving portion that is mounted below a floor panel and that receives electric power in a contactless manner from a power transmitting portion provided outside the vehicle, an electromagnetic shield that prevents an electromagnetic field from passing through, a power receiving portion cover that allows the electromagnetic field to pass through and covers the power receiving portion, and an undercover that allows the electromagnetic field to pass through and covers the power receiving portion cover.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: November 21, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toru Nakamura, Shinji Ichikawa, Arinori Higashiyama, Takahisa Yamamoto
  • Patent number: 9812827
    Abstract: An electrical connector includes an insulative housing, a plurality of contacts disposed in the housing, and a metallic shield enclosing the housing. The contacts includes a row of first contacts and another row of second contacts. The insulative housing includes a main base and a tongue portion extending forwardly from the body. The metallic shield includes a main body, a tubular section extending forwardly from the main body, an inner part forwardly extending from the main body and inside said tubular section. The inner part forms a receiving space in which the tongue portion is received.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 7, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jing-Jie Guo, Jun Zhao, Cai-Yun Zhang
  • Patent number: 9762009
    Abstract: A plug connector includes an insulative housing with mating slot, contacts disposed in the housing by two sides of the mating slot, and a pair of side arms located by two opposite ends of the mating slot in a horizontal transverse direction. a receptacle connector includes an insulative housing defining a horizontal mating tongue; contacts disposed in the housing with contacting sections exposed upon two opposite surfaces of the mating tongue; and a monolithic horizontal metallic shielding plate disposed and extending substantially fully the mating tongue. The shielding plate defines side protruding edge sections exposed outside of corresponding side edges of the mating tongue and a notch structure on each side protruding edge section, the pair of side arms each defines a hook structure to engagement with the notch structure.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: September 12, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Chih-Pi Cheng, Chih-Kai Yang
  • Patent number: 9750130
    Abstract: A printed wiring board includes a differential transmission line having a first wiring and a second wiring. The first wiring has a plurality of first linear portions formed of linear wiring and extending in a first direction, and a first bypass portion that is connected to the plurality of first linear portions and includes a linear wiring. The second wiring has a plurality of second linear portions formed of linear wirings and extending in a second direction substantially parallel to the first direction, and a second bypass portion that is connected to the plurality of second linear portions and includes a curved wiring. The first bypass portion and the second bypass portion protrude on the same side. A region in which the first bypass portion is provided and a region in which the second bypass portion is provided are at least partially overlapped in the first direction.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: August 29, 2017
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Masaaki Ito
  • Patent number: 9740248
    Abstract: A component mount for a data storage device (DSD). The component mount includes a flexible member or printed circuit board assembly (PCBA) including a pad for electrically connecting to a printed circuit board (PCB) of the DSD. At least one capacitor is mounted on the flexible member or PCBA, and is electrically connected with the pad.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: August 22, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Mohammad Sarraf, Billy Hung Vu, John P. Myers
  • Patent number: 9726691
    Abstract: The embodiments of the present invention relate to semiconductor device manufacturing, and more particularly to structures and methods of directly testing semiconductor wafers having micro-solder connections. According to one embodiment of the present invention, a method of forming a pattern of micro-solder connections coupled with a through substrate via (TSV) that can be directly tested by electrical probing, without the use of a testing interposer, is disclosed. According to another embodiment, a method of testing the pattern of micro-solder connections is disclosed. According to another embodiment, a novel electrical probe tip structure, having contacts on the same pitch as the pattern of micro-solder connections is disclosed.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: August 8, 2017
    Assignee: International Business Machines Corporation
    Inventors: Victor A. Garibay, Chetan Mehta, Doorlabh Panjwani, Tingdong Zhou
  • Patent number: 9711894
    Abstract: An electrical connector comprises a printed circuit board module including a printed circuit board (PCB) and a plurality of electrical elements disposed on the PCB, the PCB includes a mating end for mating with a mating connector and a plurality of conductive paths electrically connecting with the electrical elements; wherein the PCB includes a fracture surface, and the plurality of conductive paths are exposed to the fracture surface.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: July 18, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Ru-Yang Guo, Hai-Li Wang, Shuai-Hui Huang, Jian-Fang Li, Qing-Man Zhu, Jerry Wu
  • Patent number: 9693457
    Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: June 27, 2017
    Assignee: International Business Machines Corporation
    Inventor: Brian Samuel Beaman
  • Patent number: 9660358
    Abstract: A contact element for an electrical plug connecting device, having a molded first end section and a molded elongated receiving section which defines a longitudinal axis for mechanical and electrical coupling and/or receiving a mating contact element designed to be complementary to the contact element of a plug connecting device to be paired with the electrical plug connecting device, both of which are manufactured of an electrically conductive material. The elongated receiving section extends essentially cylindrically from the first end section. This end section as well as the elongated cylindrical receiving section are molded to be free of seams and butt joints by shaping the electrically conducting material by means of a force acting at least predominantly parallel to the longitudinal axis, and at least the receiving section molded by shaping the electrically conducting material forms a cylindrical interior sheathed by the molded electrically conducting material along the longitudinal axis.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: May 23, 2017
    Assignee: Bals Elektrotechnik GmbH & Co. KG
    Inventors: Andreas Ramm, Mareike Bankstahl
  • Patent number: 9620875
    Abstract: A memory card, comprising: a top surface; a bottom surface on an opposite side of the memory card from the top surface; and a first alignment structure formed on the top surface or the bottom surface and configured to interface with a corresponding second alignment structure of a memory card socket when the memory card is correctly inserted into the memory card socket and configured to substantially prevent full insertion of the memory card when the memory card is incorrectly inserted into the memory card socket.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yu-Sung Kim, Jin-Hyuk Lee, Il-Mok Kang, Seok-Jae Han
  • Patent number: 9614330
    Abstract: A relay connector (1) includes: a first input/output unit (11) to which a cable connector (92) connected to one end of a cable (91) is detachably connected; a second input/output unit (12) that is detachably connected to a board connector (93) provided in a board (94) to which the cable connector (92) can be detachably connected, and that is electrically connected to the first input/output unit (11); and a core (13) that suppress noise radiated by a signal flowing between the first input/output unit (11) and the second input/output unit (12).
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: April 4, 2017
    Assignee: KYOCERA Document Solutions Inc.
    Inventor: Masami Mashiki
  • Patent number: 9529762
    Abstract: The cable for a medical device is an optically isolated serial transmission cable, used to connect a base device with a serial port, or the like, to a medical device. In an alternate embodiment of the invention, the invention enables auto detection of the cable. The base device is used to power the cable electronics. In another embodiment of the present invention, the interface cable is also supported by graphical and text message display that assists users in connecting the cable to both the medical device and a base device.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: December 27, 2016
    Assignee: Becton, Dickinson and Company
    Inventors: Scott Gisler, Dave Arndt
  • Patent number: 9502799
    Abstract: A connector (200) provides improved robustness and strength with a header (202) configured to retain and expose a plurality of receptacles (204). The exposed portion of each receptacle provides a surface mount solderable element as part of the overall connector. Another embodiment further provides a lead (208) extending from the exposed portion of the receptacle to provide an additional leaded solderable element to the connector. Thus, the connector can provide both surface mount capability and/or a combination of surface mount and lead mount capability. The exposed portions of the receptacles may be soldered flush to a board (302), thus minimizing z-height of the connector to the board and allowing for a larger sized diameter receptacle.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: November 22, 2016
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Jorge L. Garcia, Richard K. Schmid, Anthony J. Suppelsa
  • Patent number: 9488853
    Abstract: A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: November 8, 2016
    Assignee: Verily Life Sciences LLC
    Inventor: James Etzkorn
  • Patent number: 9437584
    Abstract: An electronic apparatus includes a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked, penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, an MEMS chip mounted on the multilayered structure and provided with an MEMS device, wherein pads connecting to the penetrating electrodes are provided on the MEMS chip.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: September 6, 2016
    Assignee: Seiko Epson Corporation
    Inventor: Kenya Watanabe
  • Patent number: 9431783
    Abstract: A system includes a backplane and an auxiliary connector mounted to the backplane. The auxiliary connector is configured to mate with a corresponding mating auxiliary connector of an electrical power supply. A power connector is mounted directly to the backplane. The power connector is configured to mate with a corresponding mating power connector of the electrical power supply. A power bus bar is mounted to the backplane. The power bus bar is engaged in electrical contact with the power connector.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: August 30, 2016
    Assignee: Tyco Electronics Corporation
    Inventor: Brian Patrick Costello
  • Patent number: 9419364
    Abstract: The disclosure relates to a flat contact for insertion in a receiving member of a connector in an insertion direction (E), a receiving block for inserting the flat contact, and a connector comprising a receiving block and/or a flat contact. A solution is provided in which the positioning of a flat contact relative to the receiving block is simple and precise. This is achieved by a flat contact for insertion in a receiving member of a connector in an insertion direction (E) comprising a clamping portion having clamping projections which protrude in a width direction (B) and a positioning portion which has at the narrow sides thereof guiding faces which extend parallel with the insertion direction (E), the guiding faces projecting beyond the clamping projections in the width direction (B).
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: August 16, 2016
    Assignee: Tyco Electronics Belgium EC BVBA
    Inventors: Peter Devos, Rik Danneels, Thomas Ryckx, Lieven Dossche
  • Patent number: 9406920
    Abstract: A connector includes a housing for holding connector terminals and a side fitting slot located at a side of the housing. The side fitting slot is defined by an arm provided on the housing and receives a mating part to which the connector terminals are connected when the mating part is inserted in the side fitting slot.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: August 2, 2016
    Assignees: Toyota Jidosha Kabushiki Kaisha, Tyco Electronics Japan G.K.
    Inventors: Sumiyoshi Furuya, Norishige Konno, Sogo Goto
  • Patent number: 9390764
    Abstract: A storage apparatus including a storage element and a fitting member is provided. The storage element includes a body, a first pad set and a second pad set. The first and the second pad sets are exposed out of the body and located at opposite sides of the body. The fitting member comprises a first terminal set and a second terminal set electrically connected to each other. The storage element is detachably assembled to the fitting member. The first terminal set electrically connected to the first pad set and the second terminal set located between the first pad set and the second pad set, the second terminal set and the second pad set form a connecting interface of the storage apparatus that the storage apparatus is used for being electrically connected to an external apparatus. A production method of the storage apparatus is further provided.
    Type: Grant
    Filed: September 2, 2013
    Date of Patent: July 12, 2016
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Hung-I Chung, Chang-Chih Chen
  • Patent number: 9386201
    Abstract: The present disclosure relates to a camera device and an electronic device. The camera device comprises a rigid circuit board, an image sensor, and a heat dissipation member. The rigid circuit board comprises an extension portion extending laterally and a plurality of electrical contact pads. The extension portion comprises a board edge. The plurality of electrical contact pads are provided on the board edge. The image sensor comprises an image capture chip. The image capture chip may be directly fixed on the rigid circuit board, a heat dissipation space is left at a position which is below the rigid circuit board and corresponds to the image sensor when the board edge of the rigid circuit board is mated to a board edge connector of laterally connected type provided at one side of a main circuit board. The heat dissipation member may be provided in the heat dissipation space.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: July 5, 2016
    Assignee: Molex, LLC
    Inventors: Chun Guang Li, Tong Lye Ng
  • Patent number: 9368885
    Abstract: A cable connector includes a circuit board, having a predetermined width in a manner passable through an elongated tube of an endoscope apparatus, disposed to extend in an axial direction. A terminal group is formed on the circuit board, for electrically contacting a socket connector. First and second land patterns are formed on the circuit board, arranged in the axial direction so that the terminal group is disposed therebetween, wherein a front end of a first electric line group having lines among electric lines of a cable structure is electrically coupled to the first land pattern, and a front end of a second electric line group having lines among the electric lines is coupled to the second land pattern. A wiring pattern is formed on the circuit board, for electrically coupling the first land pattern to the terminal group and coupling the second land pattern to the terminal group.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: June 14, 2016
    Assignee: FUJIFILM CORPORATION
    Inventor: Toshio Sakamoto
  • Patent number: 9288898
    Abstract: Systems and methods are disclosed that include electrically connecting multiple electrical components via an electrical connection that extends through a common conductor substrate. The electrical components are bonded or otherwise secured to the common conductor substrate and the electrical connection extends between the multiple electrical components. The multiple electrical components may be components fabricated by different methods, such as photolithography and printed circuitry, and may be of different heights. The common conductor substrate is stretchable and may be a mesh configuration is some examples.
    Type: Grant
    Filed: September 18, 2012
    Date of Patent: March 15, 2016
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Leah Lavery, Tse Nga Ng
  • Patent number: 9282632
    Abstract: A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: March 8, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9281629
    Abstract: A receptacle connector mounted to the printed circuit board, includes an insulative housing defining a mating tongue and a metallic shell enclosing the housing to form a mating cavity in which said mating tongue forwardly extends. A complementary plug connector includes a shell with a bull-nose tip. A metallic piece is mounted around a root of the mating tongue and equipped with a plurality of spring tangs to contact the relatively rigid bull-nose tip of the shell of the complementary connector for EMI/RFI protection.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: March 8, 2016
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Stephen Sedio, Chih-Pi Cheng, Yuan Zhang, De-Cheng Zou, An-Jen Yang
  • Patent number: 9263815
    Abstract: A rechargeable battery socket and the manufacturing method of making the same is disclosed. The rechargeable battery socket includes an insulating housing defining a number of terminal channels, a number of terminals received in the insulating housing, and a shell assembled to one side of the insulating housing. Each terminal includes a contacting portion received in corresponding terminal channel and a tail extending out of the insulating housing. Each terminal channel provides a pair of ribs on two opposite inside faces thereof. The contacting portion of the terminal cooperates with the rib to thereby secure the terminal in the insulating housing.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: February 16, 2016
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Wang-I Yu, Hung-Chi Tai, An-Yu Yu, Yung-Chih Hung, Jie-Jun Zeng, Kuo-Cheng Liu
  • Patent number: 9253880
    Abstract: Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: February 2, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Jin Park, Romero Christian, Seung Wook Park
  • Patent number: 9190748
    Abstract: A connector structure includes a circuit body, a fork terminal, a housing and an insertion member. The circuit body includes a conductor including a two-pronged part having two extended portions, and plated leads arranged at the extended portions respectively. The fork terminal includes a first terminal part and a second terminal part which project from a terminal base so that an insertion space is formed between the first and second terminal parts. The housing includes a fitting part accommodating the fork terminal. The insertion member is inserted into the insertion space through the fitting part in a state where the circuit body is fixed. The circuit body is electrically connected with one of the first and second terminal parts with the insertion of the insertion member.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: November 17, 2015
    Assignee: YAZAKI CORPORATION
    Inventor: Naoki Ito
  • Patent number: 9159616
    Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: October 13, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Harvey Hamel, John Ulrich Knickerbocker, Samuel McKnight, Chirag S. Patel
  • Patent number: 9113845
    Abstract: A sleeve for simple assembly of in-vivo devices, such as endoscopy capsules, is provided. The sleeve comprises grippers and leaf springs at either end to hold the rigid portions of a rigid-flex PCB (printed circuit board) in a folded configuration before the PCB is inserted into an in-vivo device's housing. A method of assembly of the rigid-flex PCB into the sleeve is provided.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: August 25, 2015
    Assignee: GIVEN IMAGING LTD.
    Inventors: Zvika Gilad, Chen Mann, Semion Khait
  • Patent number: 8998619
    Abstract: A cable connector includes a circuit board, having a predetermined width in a manner passable through an elongated tube of an endoscope apparatus, disposed to extend in an axial direction. A terminal group is formed on the circuit board, for electrically contacting a socket connector. First and second land patterns are formed on the circuit board, arranged in the axial direction so that the terminal group is disposed therebetween, wherein a front end of a first electric line group having lines among electric lines of a cable structure is electrically coupled to the first land pattern, and a front end of a second electric line group having lines among the electric lines is coupled to the second land pattern. A wiring pattern is formed on the circuit board, for electrically coupling the first land pattern to the terminal group and coupling the second land pattern to the terminal group.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: April 7, 2015
    Assignee: FUJIFILM Corporation
    Inventor: Toshio Sakamoto
  • Patent number: 8998620
    Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads, and several extended purpose contact springs disposed on an upper side of a PCB. A single-shot molding process is used to form a molded housing over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The EUSB device is optionally used as a modular insert that is mounted onto a metal or plastic case to provide a EUSB assembly having a plug shell similar to a standard USB male connector.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: April 7, 2015
    Assignee: Super Talent Technology, Corp.
    Inventors: Jim Chin-Nan Ni, Nan Nan, Abraham C. Ma
  • Publication number: 20150079814
    Abstract: An intermediate electrical connector is to be connected to a mating connecting member. The intermediate electrical connector includes an intermediate connecting member; a blade disposed in the intermediate connecting member; and a supporting member for supporting the intermediate connecting member. The intermediate connecting member includes a supported portion disposed on a side surface portion thereof and supported on the supporting member. The supporting member is formed of a plate member facing the side surface portion of the intermediate connecting member. The supporting member includes a supporting portion accommodated in the supported portion or receiving the supported portion with a space in between.
    Type: Application
    Filed: September 16, 2014
    Publication date: March 19, 2015
    Inventor: Nobuhiro TAMAI
  • Publication number: 20150079813
    Abstract: An electronics module that includes a printed circuit board (PCB), a connector, a housing with a shroud, and an interposer. The PCB defines a plane of the PCB. The connector is coupled to the PCB to form a circuit board assembly (CBA). The connector includes a plurality of header pins oriented perpendicular to the plane. The housing is configured to receive the CBA. The housing is configured to define an opening in a wall of the housing proximate to the connector when the CBA is installed. The wall is characterized as perpendicular to the plane. The interposer is configured to couple to the housing. The interposer includes a plurality of mating pins oriented parallel to the plane. Each of the mating pins defines a forked end configured to make electrical contact with each of the header pins when the interposer is inserted into the opening.
    Type: Application
    Filed: September 18, 2013
    Publication date: March 19, 2015
    Inventor: ROBERT C. BEER
  • Publication number: 20150064937
    Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.
    Type: Application
    Filed: March 31, 2014
    Publication date: March 5, 2015
    Applicant: Apple Inc.
    Inventors: Gregory N. Stephens, Matthew D. Hill, Scott A. Myers
  • Publication number: 20150056824
    Abstract: Embodiments of the present invention are generally related to communication connectors, and more specifically, to communication connectors such as jacks which are compatible with more than one style of a plug. In one embodiment, the electrical and mechanical design of a jack in accordance with the present invention may extend the usable bandwidth beyond the IEC 60603-7-71 requirement of 1000 MHz to support potential future applications such as, but not limited to, 40GBASE-T. In addition, the jack may be backwards compatible with lower speed BASE-T applications (e.g., 10GBASE-T and/or below) when an RJ45 plug is mated to the jack.
    Type: Application
    Filed: August 19, 2014
    Publication date: February 26, 2015
    Applicant: Panduit Corp.
    Inventors: Masud Bolouri-Saransar, Surendra Chitti Babu
  • Patent number: 8957355
    Abstract: Inertial measurement unit apparatus for use with guidance systems are disclosed herein. An example guidance system includes an inertial measurement unit removably coupled in a cavity of a guidance wafer via an access port of the guidance wafer defining a port axis that is non-parallel relative to a longitudinal axis of the guidance wafer.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: February 17, 2015
    Assignee: The Boeing Company
    Inventors: Angelo Truncale, James K. Gingrich, Stephen T. Butscher, Joseph E. Justin
  • Publication number: 20150044886
    Abstract: A plug connector includes a mating tongue defining top and bottom surfaces thereon. Each surface is provided with a plurality of conductors in one row wherein the characters/categories of the conductors on the top surface are sequentially arranged to be same with those on the bottom surface with a pair of power conductors in two notches at two lateral side edges. The corresponding receptacle connector mounted upon a printed circuit board, defines a receiving cavity to receive the mating tongue therein. Opposite top and bottom rows of contacts are respectively located by upper and bottom sides of the receiving cavity and categorized essentially in a same sequence with the conductors of the plug connector for respectively connecting to the corresponding conductive pads, respectively. A pair of power contacts are located by two lateral sides of the receiving cavity to couple to the corresponding power conductor portions in the notches.
    Type: Application
    Filed: August 8, 2014
    Publication date: February 12, 2015
    Inventors: TERRANCE F. LITTLE, CHIH-PI CHENG, STEPHEN SEDIO, CHUN-YI CHANG, PEI TSAO, WEI-HAO SU
  • Publication number: 20150024612
    Abstract: A plug connector includes a connector tab connected to and extending longitudinally away from a rear body, the tab includes opposite first and second major surfaces. A first plurality of contacts is carried by the tab on the first major surface and a second plurality of contacts is carried by the tab on the second major surface. The contacts include differential signal pairs. Each pair of the differential signal pairs is consisting of two individual contacts and said two contacts are located adjacent to each other but at the first and second main surface respectively.
    Type: Application
    Filed: July 21, 2014
    Publication date: January 22, 2015
    Inventors: TERRANCE F. LITTLE, STEPHEN SEDIO, CHUN-YI CHANG, CHIH-PI CHENG
  • Patent number: 8934258
    Abstract: A motor controller comprising multiple types of interfaces assigned automatically, including a mother circuit board and a daughter circuit board. The daughter circuit board is plugged into the mother circuit board to form electric connection. The mother circuit board has a power circuit, a microprocessor unit of the mother circuit board, a rotor position sensing unit, a power inverter unit, and an analog sensing unit. The daughter circuit board includes a signal interface circuit. The mother circuit board further has a serial digital communication unit. The signal interface circuit includes a microprocessor of the daughter circuit board, and a serial digital communication unit of the daughter circuit board. The microprocessor unit of the mother circuit board communicates with the microprocessor of the daughter circuit board via the serial digital communication unit of the mother circuit board and the serial digital communication unit of the daughter circuit board.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: January 13, 2015
    Assignee: Zhongshan Broad-Ocean Motor Co., Ltd.
    Inventor: Yong Zhao
  • Publication number: 20150011101
    Abstract: A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where one of the connectors has multiple rows of pins which are in communication with the rest of the connectors, facilitating the communication between the connector and various devices.
    Type: Application
    Filed: September 26, 2014
    Publication date: January 8, 2015
    Inventors: Donald J. Zito, Valentin M. Stefaniu, Gabriel Tirlea