For Mounting On Pcb Patents (Class 439/607.07)
  • Patent number: 8662924
    Abstract: An electrical connector system includes a receptacle connector having a receptacle housing holding a plurality of receptacle signal contacts arranged in pairs carrying differential signals. The receptacle housing has a front face. The system includes a header connector coupled to the receptacle connector. The header connector includes a header housing holding a plurality of header signal contacts arranged in pairs carrying differential signals and mated with corresponding receptacle signal contacts. The header housing has a front face that opposes the front face of the receptacle housing when coupled thereto with a gap being defined between the front faces. Gap fillers are provided within the gap. The gap fillers are conductive and include deflectable spring fingers. The gap fillers provide impedance control for the header signal contacts along the gap.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: March 4, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne Samuel Davis, Robert Neil Whiteman, Jr.
  • Patent number: 8647151
    Abstract: A ground contact plate in a contact unit includes fixing pieces provided at predetermined equal intervals in a longitudinal direction. The fixing pieces are respectively fitted in opposed slits in ground contact terminals via a transmission blade.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: February 11, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Fumihito Ikegami, Hiroaki Kukita
  • Patent number: 8636543
    Abstract: A footprint of an electronic assembly formed from conductive pads on a surface of a printed circuit board. One or more vias may connect each pad to a conductive structure within the printed circuit board. The footprint may be such that the vias for the pads are aligned along columns, leaving wide routing channels between the columns. The pads may have different shapes. For example, some of the pads may each have two solder attachment regions that are electrically connected to a ground plane, while other pads may each have one solder attachment region that is electrically connected to a signal trace. The solder attachment regions may be arranged in such a pattern that they align with respective contact tails of a connector assembly. A signal path may be formed between a solder attachment region and a corresponding contact tail through a solder ball attached to the contact tail.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: January 28, 2014
    Assignee: Amphenol Corporation
    Inventor: David M. McNamara
  • Patent number: 8632361
    Abstract: An electrical connector is provided in the present invention, including a plurality of electrical terminal groups, a metal housing, a metal positioning seat and a fixing member. The metal housing has a plurality of terminal-receiving grooves, each of which can accommodate two electrical terminal groups. A contact end of the electrical terminal group extends forward within the metal housing, and a connection end of the electrical terminal group extends downward out of the metal housing. The fixing member has a first bending sheet and a second bending sheet, which are perpendicular to each other and respectively connected to the metal housing and the metal positioning seat for fixing the metal positioning seat to the metal housing. The electrical connector of the present invention uses the metal housing to enhance the electromagnetic shielding effect, have a better heat dissipation efficacy and improve the stability of the connection structure.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: January 21, 2014
    Assignee: Oupiin Electronic (Kunshan) Co., Ltd.
    Inventor: Hsin-chih Chen
  • Patent number: 8616919
    Abstract: An electrical connector includes at least one leadframe assembly, including a leadframe housing that carries a plurality of electrical contacts, and an external component, such as an electrically conductive plate, configured to be attached to the leadframe housing. The leadframe assembly includes an attachment system that includes an alignment assembly configured to align the electrically conductive plate with the leadframe housing as the plate is attached to the housing, and an attachment assembly that can be mated to attach the plate to the leadframe housing. The attachment assembly can be provided without creating any openings in the plate.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: December 31, 2013
    Assignee: FCI Americas Technology LLC
    Inventor: Stuart C. Stoner
  • Patent number: 8608510
    Abstract: An electrical power connector comprises a housing having a mounting interface and a mating interface. The mating interface defines a plurality of receptacles spaced apart in more than one direction. A plurality of electrical contacts is supported by the housing. These electrical contacts define respective mounting ends that are configured to electrically connect with an electrical component at the mounting interface, and opposed mating ends. At least one of the electrical contacts defines a common contact beam disposed within at least a select one of the receptacles. This common contact beam is configured to be electrically connected to a pair of adjacent electrical contacts of a mated electrical connector.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: December 17, 2013
    Assignee: FCI Americas Technology LLC
    Inventors: Jonathan E. Buck, Stephen B. Smith
  • Patent number: 8591257
    Abstract: An electrical wafer for electrically connecting to a printed circuit board. The electrical wafer includes an insulative housing and at least one signal conductor disposed in the insulative housing. The at least one signal conductor includes an intermediate portion having a connection point. The connection point includes first and second ends, at least one of which has a width greater than a portion of the at least one signal conductor outside the connection point. The insulative housing has at least one aperture exposing at least a portion of the connection point. A portion of the connection point may be punched out, and a passive circuit element may be placed within the at least one aperture and mounted to the connection point. Multiple electrical wafers may be coupled together by a stiffener and connected to a backplane connector.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: November 26, 2013
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Mark W. Gailus, Jerry Proulx, Edward Gerald Marvin
  • Patent number: 8556657
    Abstract: An electrical connector includes contact modules each holding a plurality of contacts with dielectric frames surrounding corresponding contacts. The contacts are arranged as differential pairs each having a positive contact and a negative contact. The contacts are arranged along rows and columns with the positive and negative contacts of each pair being in the same row. The contacts are divided into a first group of contacts and a second group of contacts. The contacts within the first group of contacts have a first row pitch and the contacts within the second group of contacts have a second row pitch. A void is provided between the first group of contacts and the second group of contacts having a width at least twice the first row pitch and at least twice the second row pitch.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: October 15, 2013
    Assignee: Tyco Electronics Corporation
    Inventor: Robert Paul Nichols
  • Patent number: 8550861
    Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that generates contact force as it is compressed against a wall of the connector housing. The mating contact portion has multiple segments, each with a contact region extending from the wall, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Additionally, each signal path through the mating interface portions of the connectors can be narrow and has a relatively uniform cross section to provide a uniform impedance. Additional size reduction may be achieved by mounting a ground contact on an exterior surface of a connector housing in alternating rows. Additionally, embodiments in which a wavy contact is used in a cantilevered configuration are also described.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: October 8, 2013
    Assignee: Amphenol TCS
    Inventors: Thomas S. Cohen, Trent K. Do, Brian Kirk
  • Patent number: 8523613
    Abstract: An electrical connector (100) includes a housing (1) and a number of contacts (2) mounted on the housing. The housing includes a mounting portion (11), and a receiving room (10) on one side of the mounting portion. Each of the contacts (2) includes a body portion (21) mounted on the mounting portion, and a mating portion (22) extending form the body portion and projecting into the receiving room. The mounting portion includes a number of mounting slot (14) each including a first slot (15) and a second slot (16) crossed with the first slot. The contacts are selectively mounted on either the first slots or the second slots.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: September 3, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Feng Pan
  • Publication number: 20130217263
    Abstract: An electrical connector assembly includes plural wafers that are stacked. Each wafer includes a conductive board defining plural slots therein, and plural contact modules each received in one of the slots. The conductive board is made from plastic coated with metal plating to improve shielding performance. Each of the contact modules includes a pair of contacts and an insulating holder fixing the contact pair to the conductive board. The insulating holder is differently void along the contact pairs to improve impedance.
    Type: Application
    Filed: February 20, 2013
    Publication date: August 22, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Hon Hai Precision Industry Co., Ltd.
  • Patent number: 8506330
    Abstract: A male connector includes male connector modules placed in tiers and having respective first and second surfaces facing away from each other. The male connector modules each includes interconnection parts for electrical signal transmission on the first surface; a male connector ground part formed on the second surface so as to substantially cover the second surface; male connector contact parts provided at respective first ends of the interconnection parts on the first surface; male connector terminal parts joined to respective second ends of the interconnection parts on the first surface; and a male connector shield part provided on the side on which the male connector is configured to be connected to a female connector to be connected to the male connector ground and project relative to ends of the male connector contact parts in a direction in which the male connector is configured to be connected to the female connector.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: August 13, 2013
    Assignee: Fujitsu Component Limited
    Inventors: Kazuhiro Mizukami, Toshihiro Kusagaya
  • Patent number: 8485831
    Abstract: A tall mezzanine connector which connects the substantial middle half of each of a pair of circuit cards positioned normal thereto in such a way that there is compliance when the two halves of the circuit cards are not in alignment. The mezzanine connector comprises a header and a receptacle that includes wafers having electrical contact means at each end thereof for contacting contacts in the respective circuit cards, the wafers being held in place by an upper base member and a lower base member.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: July 16, 2013
    Assignee: International Business Machines Corporation
    Inventors: Thomas M. Cipolla, Todd Takken, Paul W. Coteus
  • Patent number: 8475209
    Abstract: A receptacle assembly includes a front housing having a mating end and a loading end. The front housing has pockets at the loading end separated by separating walls having slots therethrough open at rears thereof. The front housing receives contact modules in corresponding pockets each having a holder holding a plurality of contacts between first and second side walls. The holders have embossments extending from the first side walls proximate to the fronts of the holders. The embossments are loaded into corresponding slots through the rears of the separating walls to control positions of the contact modules with respect to the front housing.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: July 2, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Robert Neil Whiteman, Jr., Wayne Samuel Davis
  • Patent number: 8469745
    Abstract: An electrical connector system may include a plurality of wafer assemblies. Each wafer assembly may include a first overmolded array of electrical contacts defining a plurality of apertures; a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, the second overmolded array of electrical contacts defining a plurality of apertures; and a conductive ground bracket positioned in the wafer assembly between the first overmolded array of electrical contacts and the second array of electrical contacts. The conductive ground bracket defines a first array of ridges, each ridge of the first array of ridges positioned in an aperture of the first overmolded array of electrical contacts. The conductive ground bracket defines a second array of ridges, each ridge of the second array of ridges positioned in an aperture of the second overmolded array of electrical contacts.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: June 25, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne Samuel Davis, Robert Neil Whiteman, Jr.
  • Patent number: 8465323
    Abstract: An electrical connector that includes a connector body having a conductive surface configured to oppose an engagement side of a mating connector. The electrical connector also includes electrical terminals that are held by the connector body and located in an array along the conductive surface. Adjacent terminals are separated by gaps that collectively form an interwoven reception region along the conductive surface between the electrical terminals. The electrical connector also includes ground contacts that are coupled to the conductive surface and are located in corresponding gaps. The ground contacts include flex portions that are configured to be compressed between the conductive surface and the engagement side of the mating connector when the mating connector is coupled to the electrical connector during a mating operation. The ground contacts are configured to electrically couple the conductive surface and the mating connector.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: June 18, 2013
    Assignee: Tyco Electronics Corporation
    Inventor: Myoungsoo Jeon
  • Patent number: 8460032
    Abstract: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers each containing a column of conductive elements, some of which form differential pairs. Skew control is provided for at least some of the pairs by providing a profile on an edge of the shorter signal conductor of the pair. The profile may contain multiple curved segments that effectively lengthen the signal conductor without significantly impacting its impedance. For connectors in which ground conductors are included between adjacent pairs of signal conductors, patterned segments of varying parameters may be included on edges of the signal conductors and ground conductors to equalize electrical lengths of all edges in a set of edges for which there is common mode or differential mode coupling as a signal propagates along each pair.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: June 11, 2013
    Assignee: Amphenol Corporation
    Inventor: Brian Kirk
  • Patent number: 8444434
    Abstract: A receptacle assembly includes a front housing configured for mating with a header assembly. A contact module is coupled to the front housing. The contact module includes a conductive holder that has a first side and an opposite second side. The conductive holder has a front coupled to the front housing. The conductive holder holds a frame assembly. The frame assembly includes a plurality of contacts and a dielectric frame supporting the contacts. The dielectric frame is received in the conductive holder. The contacts extend from the conductive holder for electrical termination. A ground shield is coupled to the first side. The ground shield is electrically connected to the conductive holder. The ground shield has grounding beams that extend therefrom. The grounding beams extend forward of the front of the conductive holder for electrical connection to a corresponding header shield of the header assembly. First and second side shields are coupled to the first and second sides, respectively.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: May 21, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne Samuel Davis, Robert Neil Whiteman, Jr.
  • Patent number: 8444435
    Abstract: A male connector has an insulating housing, multiple signal terminals, and multiple grounding modules. The signal terminals are mounted through the insulating housing. The grounding terminal modules are mounted through the insulating housing. Each grounding terminal module is integrally formed into one piece and has multiple grounding terminals. Adjacent grounding terminals are connected integrally to each other so that the grounding terminals of each grounding terminal module are arranged in a line. The integrally formed ground terminal modules reduce a total tolerance of the grounding terminals and increase the production rate of the male connector.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: May 21, 2013
    Assignee: Advanced Connectek Inc.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Jian-Li Guan
  • Patent number: 8439704
    Abstract: A connector has a plurality of mating blades in the form of circuit cards, arranged horizontally in a vertical stack. The circuit cards are supported in a vertical array in mating portions of the connector and are enclosed by sidewalls of the mating portions. In order to support the circuit cards, the sidewalls of each mating portion are slotted and the circuit cards are provided with mounting wings that extend outwardly therefrom and which are received in the slots. Reentrant notches are provided in the circuit cards adjacent where the wings extend out from the bodies of the circuit cards.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: May 14, 2013
    Assignee: Molex Incorporated
    Inventor: Bruce Reed
  • Publication number: 20130109232
    Abstract: An electrical connector with reduced cross talk and controlled impedance. The connector comprises hybrid shields with lossy portions and conductive portions. The synergistic effect of the lossy portions and the conductive portions allows the hybrid shields to be relatively thin such that they can be incorporated into the mating interface regions or other mechanically constrained regions of the connector to provide adequate crosstalk suppression without undesirably impacting impedance. The conductive portions may be shaped to preferentially position the conductive regions adjacent signal conductors susceptible to cross talk to further contribute to the synergy. The conductive regions may include holes to contribute to desired electrical properties for the connector.
    Type: Application
    Filed: October 17, 2012
    Publication date: May 2, 2013
    Applicant: Amphenol Corporation
    Inventor: Jose Ricardo Paniaqua
  • Publication number: 20130102192
    Abstract: A receptacle assembly includes a front housing having a mating end and a loading end. A contact module is coupled to the loading end and includes a frame assembly having a plurality of contacts and a dielectric frame supporting the contacts. The dielectric frame has first and second sides and channels between the contacts that extend at least partially through the dielectric frame between the first and second sides. The contacts extend from the dielectric frame for electrical termination. Ground conductors are received in corresponding channels and provide electrical shielding between corresponding contacts. A ground shield is coupled to the first side. The ground shield has side shields that extend along sides of the contacts to provide electrical shielding along sides of the contacts. The ground shield has shield tabs that engage corresponding ground conductors to electrically connect the ground shield to the ground conductors.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 25, 2013
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventor: WAYNE SAMUEL DAVIS
  • Patent number: 8419472
    Abstract: A receptacle assembly includes a contact module that includes a conductive holder and a frame assembly received in the conductive holder. The frame assembly includes a plurality of contacts and a dielectric frame supporting the contacts and disposed between the conductive holder and the contacts. The contacts extend from the conductive holder for electrical termination. A front housing receives the contact module therein. The front housing has a plurality of clip supports at a rear of the front housing. A rib clip is held by the clip supports. The rib clip has a plurality of grounding fingers that extend therefrom that are configured to engage corresponding header shields of a header assembly. The rib clip includes a plurality of mounting tabs that extend therefrom for engaging the conductive holder to electrically connect the rib clip to the conductive holder.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: April 16, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Nathan William Swanger, Charles S. Pickles, Timothy Robert Minnick, Justin Shane McClellan, Jeffrey Byron McClinton, James Lee Fedder
  • Patent number: 8398432
    Abstract: A receptacle assembly includes a contact module having a conductive holder has a first side and an opposite second side. The conductive holder has a chamber between the first and second sides. A frame assembly is received in the chamber of the conductive holder. The frame assembly includes a plurality of contacts and a dielectric frame supporting the contacts. The contacts extend from the conductive holder for electrical termination. A ground lead frame is received in the chamber between the frame assembly and the conductive holder. The ground leadframe has grounding members that extend from the conductive holder for electrical termination to header shields of the header assembly.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: March 19, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Justin Shane McClellan, Jeffrey Byron McClinton, James Lee Fedder, Nathan William Swanger, Charles S. Pickles, Timothy Robert Minnick, Chad W. Morgan, Dharmendra Saraswat
  • Patent number: 8371876
    Abstract: A connector system is provided for electrically connecting a receptacle printed circuit to a header printed circuit. The connector system includes a header assembly configured to be mounted on the header printed circuit. The header assembly includes header contacts. A receptacle assembly is configured to be mounted on the receptacle printed circuit and mated with the header assembly. The receptacle assembly includes a housing and a contact module held within the housing. The contact module has separate first and second chicklets that are coupled together to define the contact module. First and second receptacle contacts are held by the contact module and arranged in a differential pair. The first and second receptacle contacts are engaged with the header contacts of the header assembly. The first receptacle contact of the differential pair is held by the first chicklet and the second receptacle contact of the differential pair is held by the second chicklet.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: February 12, 2013
    Assignee: Tyco Electronics Corporation
    Inventor: Wayne Samuel Davis
  • Patent number: 8366485
    Abstract: An electrical connector includes a dielectric housing, a plurality of electrical signal contacts carried by the dielectric housing, and a ground plate carried by the dielectric housing. The electrical signal contacts are arranged along a first plane, wherein the signal contacts define signal pairs such that a respective gap is disposed between adjacent signal pairs. The signal contacts further define respective mating and mounting ends. The ground plate includes a ground plate body oriented in a second plane that is substantially parallel to the first plane and offset from the first plane. The ground plate body defines first and second opposed surfaces. The ground plate includes at least one rib that defines first and second opposed surfaces, wherein the first surface of the rib projects from the first surface of the ground plate body in a direction toward the gap, and the second surface is recessed into the second surface of the ground plate body.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: February 5, 2013
    Assignee: FCI Americas Technology LLC
    Inventors: Douglas M. Johnescu, Jonathan E. Buck
  • Patent number: 8369513
    Abstract: The present invention relates to methods and systems for minimizing alien crosstalk between connectors. Specifically, the methods and systems relate to isolation and compensation techniques for minimizing alien crosstalk between connectors for use with high-speed data cabling. A frame can be configured to receive a number of connectors. Shield structures may be positioned to isolate at least a subset of the connectors from one another. The connectors can be positioned to move at least a subset of the connectors away from alignment with a common plane. A signal compensator may be configured to adjust a data signal to compensate for alien crosstalk. The connectors are configured to efficiently and accurately propagate high-speed data signals by, among other functions, minimizing alien crosstalk.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: February 5, 2013
    Assignee: ADC Telecommunications, Inc.
    Inventor: Bernard Hammond, Jr.
  • Patent number: 8313347
    Abstract: A Universal Serial Bus (USB) modem is provided. The USB modem includes a USB plug (1), a Printed Circuit Board (PCB) (2), and a signal input apparatus (3) that connects the USB plug (1) and the PCB (2). The signal input apparatus includes: a support (4) that is disposed on the PCB (2), in which the USB plug is disposed on the support (4); and a connector (5) that is disposed on the PCB and capable of being connected to the USB plug (5). The USB modem implements signal input by adopting the connector (5), thereby extending the service life of the USB modem and greatly reducing the cost.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: November 20, 2012
    Assignee: Huawei Device Co., Ltd.
    Inventors: Jinjun He, Bin Zhang, Yaming Jiang, Qing Kang
  • Patent number: 8182289
    Abstract: An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: May 22, 2012
    Assignee: Amphenol Corporation
    Inventors: Philip T. Stokoe, Mark W. Gailus, Donald A. Girard, Jr., Huilin Ren
  • Patent number: 8172614
    Abstract: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers each containing a column of conductive elements, some of which form differential pairs. Skew control is provided for at least some of the pairs by providing a profile on an edge of the shorter signal conductor of the pair. The profile may contain multiple curved segments that effectively lengthen the signal conductor without significantly impacting its impedance. For connectors in which ground conductors are included between adjacent pairs of signal conductors, patterned segments of varying parameters may be included on edges of the signal conductors and ground conductors to equalize electrical lengths of all edges in a set of edges for which there is common mode or differential mode coupling as a signal propagates along each pair. Such features for skew control may be used in combination with other skew control features.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: May 8, 2012
    Assignee: Amphenol Corporation
    Inventor: Brian Kirk
  • Publication number: 20120100754
    Abstract: A Universal Serial Bus (USB) modem is provided. The USB modem includes a USB plug (1), a Printed Circuit Board (PCB) (2), and a signal input apparatus (3) that connects the USB plug (1) and the PCB (2). The signal input apparatus includes: a support (4) that is disposed on the PCB (2), in which the USB plug is disposed on the support (4); and a connector (5) that is disposed on the PCB and capable of being connected to the USB plug (5). The USB modem implements signal input by adopting the connector (5), thereby extending the service life of the USB modem and greatly reducing the cost.
    Type: Application
    Filed: December 28, 2011
    Publication date: April 26, 2012
    Applicant: Huawei Device Co., Ltd.
    Inventors: Jinjun He, Bin Zhang, Yaming Jiang, Qing Kang
  • Patent number: 8157592
    Abstract: A connector includes a first connector member configured to arrange a plurality of plane first boards with gaps in a thickness direction of the first boards, the first board including a conductive layer and an insulation layer, the insulation layer having a surface where a first signal pattern is formed; and a second connector member configured to arrange a plurality of plane second boards with gaps in a thickness direction of the second boards, the second board including a conductive layer and an insulation layer, the insulation layer having a surface where a second signal pattern is formed.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: April 17, 2012
    Assignee: Fujitsu Component Limited
    Inventors: Kazuhiro Mizukami, Toshihiro Kusagaya
  • Patent number: 8157591
    Abstract: An electrical connector system may include a center housing that defines a plurality of first electrical contact channels on a first side face of the center housing and a plurality of second electrical contact channels on a second side face of the center housing. A first array of electrical contacts is positioned substantially within the plurality of first electrical contact channels on the first side face of the center housing. A second array of electrical contacts is positioned substantially within the plurality of second electrical contact channels on the second side face of the center housing. The first array of electrical contacts is paired with a third array of electrical contacts to form a first plurality of differential pairs of electrical contacts. The second array of electrical contacts is paired with a fourth array of electrical contacts to form a second plurality of differential pairs of electrical contacts.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: April 17, 2012
    Assignee: Tyco Electronics Corporation
    Inventors: James Lee Fedder, John Edward Knaub, E. Scott Martin, Lynn Robert Sipe
  • Patent number: 8147274
    Abstract: A connector to be connected to a counterpart connector includes a circuit board having a ground layer, an insulating layer, and a first conductive layer successively stacked, the first conductive layer including a signal circuit and a ground circuit; and a second conductive layer electrically connecting the ground circuit and the ground layer, the second conductive layer being provided on a side of the counterpart connector in the ground circuit.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: April 3, 2012
    Assignee: Fujitsu Component Limited
    Inventor: Kazuhiro Mizukami
  • Patent number: 8137137
    Abstract: A connector with a detachable module includes a main body and a detachable module. The main body has an insulation base and a plurality of pin header slots. The rear surface of the insulation base is provided with a plurality of troughs. The pin header slots are provided in the troughs. Each pin header slot extends toward the top surface of the insulation base. One side of the top surface of the insulation base is provided with a plurality of supporting grooves in communication with the troughs. The pin header slots are bent vertically and provided in the supporting grooves. The detachable module includes a circuit board, an integrated circuit and a plurality of pin headers both electrically connected to the circuit board. When the detachable module is assembled with the main body in such a manner that the pin headers are electrically connected to the pin header slots, a mother board connected to the main body can perform the functions of the integrated circuit of the detachable module.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: March 20, 2012
    Inventor: Nai-Chien Chang
  • Patent number: 8123563
    Abstract: An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: February 28, 2012
    Assignee: Amphenol Corporation
    Inventors: William A. Kenny, Thomas S. Cohen, Robert A. Richard
  • Patent number: 8062065
    Abstract: A connector assembly includes a housing extending along a housing axis between a front and a rear and contact modules loaded into the housing along the housing axis through the rear. The contact modules have a body holding contacts arranged along contact planes. A stabilizer is coupled to the housing and is coupled to the contact modules to hold the contact modules such that the contact planes are parallel to the housing axis.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: November 22, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Robert Neil Whiteman, Jr., Christopher David Ritter
  • Patent number: 7976340
    Abstract: A connector system includes a header connector, a mating connector, and a conductive grounding bridge. The header connector includes a conductive shell that defines an interior chamber and a contact disposed in the interior chamber. The mating connector includes a conductive member and an electromagnetic shield joined to a housing. The shield has an elongated protrusion extending from the shield to an outer end. The header connector and the mating connector couple with each other such that the contact engages the conductive member and the protrusion engages the shell. The grounding bridge is joined to one of the header connector and the mating connector and engages another of the header connector and the mating connector when the protrusion engages the shell. The protrusion is electrically coupled with the shell at the outer end of the protrusion and by the grounding bridge.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: July 12, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Dharmendra Saraswat, Timothy Robert Minnick, Lynn Robert Sipe
  • Patent number: 7967638
    Abstract: A mezzanine connector for connecting first and second circuit boards includes a number of wafers side-by-side arranged with each other and an organizer for unifying the wafers. Each wafer includes an insulative housing, a number of contacts fixed in the insulative housing and a shielding plate assembled to a first side of the insulative housing in order to shield the contacts of the adjacent wafers. Each contact includes a retaining portion fixed in the insulative housing, a first tail extending from a first end of the retaining portion for being mounted to the first circuit board, and a second tail extending from a second end of the retaining portion for being mounted to the second circuit board.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: June 28, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Richard Scott Kline, Howard Wallace Andrews, Robert William Brown
  • Patent number: 7950963
    Abstract: A connector includes a wiring board; a lead connecting the wiring board electrically to an external board; and a conductive layer connecting the lead to the wiring board so as to allow the lead to move when the conductive layer is melted. The lead includes first through third regions. The first region, in contact with the conductive layer, is sandwiched between the second and third regions lower in wettability with respect to the liquid melt of the conductive layer than the first region. The wiring board includes a first region and second regions. The first region, in contact with the conductive layer, is sandwiched between the second regions lower in wettability with respect to the liquid melt than the first region. The center of the first region of the lead is offset and away from the external board relative to the center of the first region of the wiring board.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: May 31, 2011
    Assignee: Fujitsu Component Limited
    Inventors: Kazuhiro Mizukami, Toshihiro Kusagaya
  • Patent number: 7931474
    Abstract: A high speed connector includes a plurality of wafer-style components, the wafers including two columns of conductive terminals that are supported in an insulative support body by a plurality of channels. Ribs may be provided to help secure one of the terminals in one of the plurality of channels. The two columns of terminals are configured to form broadside coupled terminal pairs and an air channel is at least partially disposed in the wafer between two adjacent broadside coupled terminal pairs.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: April 26, 2011
    Assignee: Molex Incorporated
    Inventors: John C. Laurx, Peerouz Amleshi, David E. Dunham
  • Patent number: 7931500
    Abstract: An electrical connector system may include a plurality wafer assemblies that engage with a substrate. Each wafer assembly includes a housing that defines a plurality of projections extending from an edge of the housing at a mounting end of the wafer assembly. At least a portion of a projection of the plurality of projections of the housing is dimensioned to fit into a corresponding hole in a substrate when the housing is engaged with the substrate. In some implementations, the projection is positioned on the housing to block a line-of-sight between a first signal substrate engagement element of an array of electrical contacts associated with the housing and a second signal substrate engagement element of the array of electrical contacts.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: April 26, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: John Edward Knaub, Robert Paul Nichols
  • Patent number: 7887371
    Abstract: An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: February 15, 2011
    Assignee: Amphenol Corporation
    Inventors: William A. Kenny, Thomas S. Cohen, Robert A. Richard
  • Patent number: 7862344
    Abstract: A contact module is provided for an electrical connector. The contact module includes a body having a mating edge portion and a mounting edge portion. A lead frame is held by the body. The lead frame includes a differential pair of terminals extending between the mating edge portion and the mounting edge portion. The differential pair includes a positive terminal and a negative terminal having positive and negative mating contacts, respectively, and positive and negative mounting contacts, respectively. The positive and negative mating contacts extend from the mating edge portion in a first orientation. The positive and negative mounting contacts extend from the mounting edge portion in a second orientation. The first orientation at the mating edge portion is inverted relative to the second orientation at the mounting edge portion.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: January 4, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Chad William Morgan, David Wayne Helster
  • Patent number: 7862376
    Abstract: A compliant pin is configured to be press-fit into a cavity of at least one of a connector assembly and a substrate to retain the pin in the cavity. The pin includes a neck, a plurality of compliant beams, and an insertion tip. The neck interconnects the pin with the connector assembly. The beams are configured to engage an inner surface of the cavity to retain the pin in the cavity. The beams are arranged side-to-side and project along a longitudinal plane in a loading direction. The beams have arcuate portions that are arched in different directions transverse to the longitudinal plane. The arcuate portions are shaped to deflect toward the longitudinal plane without substantially engaging one another. The insertion tip interconnects the ends of the beams.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: January 4, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Matthew Sypolt, James Lee Fedder
  • Patent number: 7852636
    Abstract: An electronic device includes a shell, a printed circuit board, and a dummy connector. The shell defines a through hole and accommodates the printed circuit board. The dummy connector includes a main body and a grounded portion. The main body includes a projection engaging the through hole. The grounded portion extends from the main body and is electrically fixed to the printed circuit board to be grounded.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: December 14, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiao-Feng Ma, Zheng-Heng Sun
  • Patent number: 7841900
    Abstract: An electrical connector (300) includes a number of wafers (30) and each wafer including an insulative housing (31) and a number of contacts (32). The housing defines a mating surface (311) and a mounting surface (312), and a plurality of passages (313) concaved from the mounting surface. The housing has a platform (314) formed in each passage and two cavities (315) defined on opposite sides of the platform. The platform has a pair of protruding portions (316) disposed above the cavities respectively. Each cavity has an opening (317) defined in the mounting surface. The contacts are received in the passages of the insulative housing. Each contact includes a receptacle (321) formed with a pair of legs (324). Each leg has a preloaded portion (325). The preloaded portion is insertable into the cavity via the opening along a mounting direction perpendicular to the mounting surface while spreading out the legs.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: November 30, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hong-Tao Liu, Chih-Ming Chien
  • Patent number: 7824197
    Abstract: A connector assembly includes a contact module, signal contacts, and a ground contact. The contact module includes a dielectric body with mating and mounting edges and corresponding opposite back edges. The signal contacts are held within the contact module. The signal contacts include mating and mounting ends that protrude from the mating and mounting edges of the contact module, respectively. The signal contacts are arranged in a differential pair to convey differential signals. The ground contact is coupled to the contact module and includes mating and mounting ends that protrude from the mating and mounting edges of the contact module, respectively. The ground contact runs alongside the back edges of the contact module from the mounting edge to the mating edge.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: November 2, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: John Eugene Westman, Brian Keith McMaster, Jr., Michael W. Fogg
  • Patent number: 7819697
    Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: October 26, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Douglas W. Glover, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Lynn R. Sipe
  • Patent number: 7811128
    Abstract: An electrical connector (1) has an insulative housing (10) including a number of receiving passages (100), a number of terminal modules (20) mounted to the insulative housing and located adjacent to another and shielding plates (3). The terminal module has a base (22) including a first side (223), a plurality of terminals (21) secured to the base and a spacer (23) received to the insluative housing. The shielding plates have at least a first shielding plate (30) assembled to the first side (223) of the terminal module and including a number of tines (31) connected to a printed circuit board, and a second shielding plate (40) assembled to the first side of neighboring terminal module and having a connecting section (41) connected to the first shielding plate.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: October 12, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Feng Pan