For Mounting On Pcb Patents (Class 439/607.07)
  • Patent number: 7811129
    Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: October 12, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Douglas W. Glover, Evan C. Wickes
  • Patent number: 7809461
    Abstract: In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.
    Type: Grant
    Filed: November 24, 2006
    Date of Patent: October 5, 2010
    Assignee: Panasonic Corporation
    Inventors: Takahiro Noda, Tadashi Endo, Osamu Okuda, Kazuhide Nagao
  • Patent number: 7798851
    Abstract: A connector with a filter function includes a first substrate having a first surface and a second surface opposite to each other; a plurality of first terminal lines formed on the first surface of the first substrate, each of the first terminal lines being further arranged periodically and repeatedly with a predetermined periodic unit pattern; a case connected to one side end of the first substrate; a second substrate having a first surface and a second surface opposite to each other and disposed in the case; and a plurality of second terminal lines having a periodic unit pattern, formed on the first surface of the second substrate, and electrically connected to the first terminal lines on the first substrate.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: September 21, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Shin-Way Lin, Hsin-Hsien Li, Ben-Hwa Jang
  • Patent number: 7789705
    Abstract: A contact module is provided for an electrical connector. The contact module includes a lead frame. The lead frame includes first and second differential pairs of terminals. Each of the terminals extends between a mating edge portion and a mounting edge portion. A first dielectric body surrounds at least a portion of the first differential pair of terminals. The first dielectric body includes a first dielectric constant. A second dielectric body surrounds at least a portion of the second differential pair of terminals. The second dielectric body includes a second dielectric constant that is different than the first dielectric constant of the first dielectric body.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: September 7, 2010
    Assignee: Tyco Electronics Corporation
    Inventor: Chad William Morgan
  • Patent number: 7789716
    Abstract: An electrical terminal of the type to be inserted into an aperture of an electrical panel member is provided. The electrical terminal may include a base, an insertion portion extending from the base to a first end, a slit formed through the insertion portion and defining a compliant portion having a first leg and a second leg. A segment of the first leg may be deformed in one direction, while a segment of the second leg may deformed in the opposite direction. Midpoints of each or both legs may be offset from the midpoint of the slit to achieve improved mechanical and electrical performance within a connector. Also provided is an electrical terminal having a tip that facilitates alignment with a panel member aperture and provides tactile feedback to a user, as well as an electrical terminal having a mounting end that is substantially smaller than its mating end, and connectors containing such terminals. Methods of routing electrical traces between adjacent electrical terminals are also provided.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: September 7, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: James L. Fedder, Douglas W. Glover, David W. Helster, Chad W. Morgan, Brent Rothermel, Alex M. Sharf, Attalee S. Taylor, David A. Trout
  • Patent number: 7758357
    Abstract: The electrical connector (100) includes a front housing (20) and a number of stacked wafers 40 assembled to the front housing (20). The front housing (20) defines a number of passageways (202) arranged in rows and columns. Each of the wafers includes a lead frame (34) and nine contacts (41-49) molded in the lead frame (34). Each of the contacts (41-49) further includes a fastening portion (404) molded in the lead frame (34), a mating portion (408) extending from an end of the fastening portion (404) for mating with a complementary mating connector (600) and a terminal portion (406) extending from an opposite end of the fastening portion (404) to be mounted in said PCB. The nine conductive contacts (41-49) are arranged on a coplanar surface. Adjacent rows of passageways (202) are arranged with a slight offset. Corresponding adjacent wafers 40 are arranged with the contacts of adjacent wafers (40) aligned in a direction perpendicular to the coplanar surface.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: July 20, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Feng Pan, Chih-Ming Chien
  • Patent number: 7753731
    Abstract: An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: July 13, 2010
    Assignee: Amphenol TCS
    Inventors: Thomas S. Cohen, Brian Kirk, Marc B. Cartier, Jr.
  • Patent number: 7744415
    Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: June 29, 2010
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Marc B. Cartier, Jr., Mark W. Gailus
  • Patent number: 7736182
    Abstract: An electrical connector (1) includes a housing (10) and a number of wafers (20). Each wafer has a number of contacts (30) each having a contacting portion (31). The housing includes an insulative base (11) having a number of chambers (115) and a number of spacers (13) mounted on the insulative base. Each spacer includes a main portion (131), and a number of finger-shaped portions (132) formed on the main portion. Each finger-shaped portion has a floor (133) and a number of projecting walls (134,135) projecting laterally from the floor to form a plurality of passageways. The finger-shaped portion inserted in the chamber of the insulative base. Each passageway has an open front end (137) and an open rear end (138), the contacting portion of the contact inserted into the passageway from the open rear end toward the open front end.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: June 15, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Feng Pan
  • Patent number: 7737808
    Abstract: A connector has data signal conductors for communicating data signals and voltage reference (power and ground) conductors for the signals' return currents. Voltage reference conductors carrying the same voltage level are coupled together at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals. Decoupling capacitors may alternatively or additionally be inserted between pairs of voltage reference conductors carrying high and low voltage levels at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: June 15, 2010
    Assignee: Hirose Electric
    Inventors: Ching-Chao Huang, Gong-Jong Yeh, Clement Kam Lam Luk, Tatsuya Arai
  • Publication number: 20100144203
    Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
    Type: Application
    Filed: May 29, 2009
    Publication date: June 10, 2010
    Inventors: Douglas W. Glover, Evan C. Wickes
  • Publication number: 20100144204
    Abstract: An electrical connector system may include a plurality wafer assemblies that engage with a substrate. Each wafer assembly includes a housing that defines a plurality of projections extending from an edge of the housing at a mounting end of the wafer assembly. At least a portion of a projection of the plurality of projections of the housing is dimensioned to fit into a corresponding hole in a substrate when the housing is engaged with the substrate. In some implementations, the projection is positioned on the housing to block a line-of-sight between a first signal substrate engagement element of an array of electrical contacts associated with the housing and a second signal substrate engagement element of the array of electrical contacts.
    Type: Application
    Filed: December 29, 2009
    Publication date: June 10, 2010
    Inventors: John Edward Knaub, Robert Paul Nichols
  • Publication number: 20100144201
    Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
    Type: Application
    Filed: May 29, 2009
    Publication date: June 10, 2010
    Inventors: George R. Defibaugh, James L. Fedder, Douglas W. Glover, David W. Helster, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Alex M. Sharf, Lynn R. Sipe, Evan C. Wickes
  • Patent number: 7722401
    Abstract: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers each containing a column of conductive elements, some of which form differential pairs. A housing for the wafer is formed with regions of higher and lower dielectric constant material. The regions of lower dielectric constant material are selectively positioned adjacent longer signal conductors of the differential pairs. The material may be preferentially placed along curved segments of the differential pair to reduce crosstalk in the connector while reducing skew.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: May 25, 2010
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Thomas S. Cohen
  • Patent number: 7722400
    Abstract: A differential pair connector includes a housing having receptacles for receiving differential pair conductors and electrically conductive shielding tabs extending away from the housing between the receptacles for reducing crosstalk between the differential pairs. The tabs insert into a mated connector when an interconnect is formed. By inserting into the second connector, the shield tabs extend a larger ground plane around each differential pair, thus significantly reducing crosstalk within the connector. The connector can be a high density GbX® style daughter card connector mated to a GbX® style backplane connector.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: May 25, 2010
    Assignee: Molex Incorporated
    Inventors: Craig A. Bixler, John C. Laurx, Neil A. Martin, Tom Carlson
  • Patent number: 7704081
    Abstract: An electrical connector includes a dielectric housing having a tongue including an upper surface, a lower surface, and opposite side surfaces. A plurality of signal contacts are held by the housing and are exposed along the upper surface. At least one power contact is held by the housing and is exposed along one of the opposite side surfaces. Optionally, the tongue and signal contacts define an eSATA mating interface configured for mating with a plug of a serial cable defining an eSATA plug interface.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: April 27, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Nathan William Swanger, Justin Shane McClellan, Daniel L. Gorenc, Richard Elof Hamner, Jason M'Cheyne Reisinger
  • Patent number: 7690946
    Abstract: A connector system includes a connector assembly and a contact organizer. The connector assembly includes a mounting end and a plurality of contacts protruding from the mounting end. The contact organizer includes a top side, a bottom side and a plurality of channels extending between the top and bottom sides. The contact organizer is movable with respect to the connector assembly between a supporting position and a seated position. When the contact organizer is in the supporting position, the contacts at least partially extend through the channels. When the contact organizer is moved to the supporting position, the contact organizer is moved toward the mounting end of the connector assembly until the top side of the contact organizer engages the mounting end.
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: April 6, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: John E. Knaub, Richard Elof Hamner, James Lee Fedder
  • Patent number: 7682193
    Abstract: An electrical connector may include a connector housing, a first leadframe assembly received in the connector housing, a second leadframe assembly received in the connector housing and a retention member. Each leadframe assembly may include a leadframe housing, and a plurality of electrically conductive contacts extending therethrough. Each leadframe housing may include a recess. The retention member may include a first body portion, a first member extending from the first body portion and a second member extending from the first body portion such that a face of the first member opposes a face of the second member. The first member may apply a first force against a first surface of each respective recess and the second member may apply a second force against a second surface of each respective recess.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: March 23, 2010
    Assignee: FCI Americas Technology, Inc.
    Inventor: Stuart C. Stoner
  • Patent number: 7682192
    Abstract: An electrical coupler includes a connector receptacle having multiple modules. The modules each include a pair of signal conductors and a ground plane or shield, held together by a dielectric module body. The shields are between the pairs of conductors in adjacent modules, and provide electrical shielding between the pairs of signal contacts of different modules. The signal conductors and the shields may be coupled to a board, such as a circuit board. The receptacle may be an angled receptacle, such as a right angle receptacle. The signal conductors of each pair in the receptacle may have a predetermined amount of skew, having different effective electrical lengths. This may allow signal paths through the receptacle and the board to have a combined electrical path that is substantially the same for the signal conductor pair of one of the modules.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: March 23, 2010
    Assignee: Ohio Associated Enterprises, LLC
    Inventors: John F. Sawdy, Larry M. Crofoot, John T. Venaleck
  • Patent number: 7674133
    Abstract: A connector assembly includes a housing and a contact module assembly including first and second contact modules loaded into the housing. The first contact module has a plurality of ground leads extending between mating contacts and mounting contacts. The ground leads extend along separate paths within a first plane. The second contact module has a plurality of signal leads extending between mating contacts and mounting contacts. The signal leads extend along separate paths within a second plane. The ground leads are aligned with the signal leads in a direction transverse to the first plane, and the ground leads have a width and a thickness defining a cross-sectional area that is larger than a cross sectional area of the signal leads.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: March 9, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Michael Warren Fogg, Michael Frank Cina
  • Patent number: 7667985
    Abstract: One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: February 23, 2010
    Assignee: QLogic, Corporation
    Inventors: Vladimir Tamarkin, Mark W. Wessel
  • Patent number: 7625234
    Abstract: An electrical connector includes a plurality of terminals, and a module member having a front end face, a rear end face and a bottom side interconnecting the front and rear end faces. The bottom side is dented inwardly to form an assembling chamber. The front end is dented inwardly to form a front opening in spatial communication with the assembling chamber. An insulated main body includes a base portion inserted into the assembling chamber in the module member, and a tongue plate projecting frontward from the base portion. Each terminal has a contact section embedded in the tongue plate via an insert-molding process and an inclined section extending from the contact section. A metal shell encloses the module member from an exterior thereof.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: December 1, 2009
    Assignee: Dragonstate Technology Co., Ltd.
    Inventors: Kuo-Chi Lee, Chin-Huang Lin
  • Patent number: 7621779
    Abstract: A high speed connector includes a plurality of terminal assemblies in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The terminals are further aligned with each other in each row so that horizontal faces of the terminals in the two rows face each other to thereby promote broadside coupling between horizontal pairs of terminals.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: November 24, 2009
    Assignee: Molex Incorporated
    Inventors: John C. Laurx, David E. Dunham, Timothy S. Elo, Gary Humbert
  • Patent number: 7618289
    Abstract: A contact module assembly is provided for an electrical connector. The contact module assembly includes a lead frame having a plurality of terminals and a commoning member at least partially including an electrically conductive material. The commoning member has a plurality of tabs that are electrically connected to selected ones of the terminals, thereby electrically commoning the selected ones of the terminals. The commoning member can be configured with different patterns of the tabs to selectively configure the lead frame with different patterns of commoned terminals.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: November 17, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Brent Ryan Rothermel, Robert Neil Whiteman, Jr., Wayne Samuel Davis, Dennis Leroy Kemmick
  • Patent number: 7594826
    Abstract: A connector includes a housing and a plurality of contact module assemblies in the housing, wherein each contact module assembly includes a first signal contact module where a first signal contact body is inserted in a first resin molded part, a second signal contact module where a second signal contact body is inserted in a second resin molded part, and a ground plate, wherein the ground plate is sandwiched between the first signal contact module and the second signal contact module, so that a microstrip line structure is formed, and wherein, in the microstrip line structure, the first signal contact body and the second signal contact body form a stripline conductor, the first resin molded part and the second resin molded part form a dielectric board, and the ground plate forms a common ground conductor.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: September 29, 2009
    Assignee: Fujitsu Component Limited
    Inventors: Mitsuru Kobayashi, Yasuyuki Miki, Hideo Miyazawa, Junichi Akama
  • Patent number: 7553190
    Abstract: A high speed connector includes a plurality of wafer-style components in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The terminals are further aligned with each other in each row so that horizontal faces of the terminals in the two rows face each other to thereby promote broadside coupling between horizontal pairs of terminals. A dielectric insert is provided between the columns of terminals to thereby influence the broadside coupling between pairs of terminals.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: June 30, 2009
    Assignee: Molex Incorporated
    Inventors: John C. Laurx, David E. Dunham, Peerouz Amleshi