Contacts At Different Distances From Lead Panel Circuit Edge Patents (Class 439/60)
  • Patent number: 6969270
    Abstract: According to one embodiment of the present invention, an integrated socket is disclosed. The socket includes a socket grid to receive one or more pins from a component, a frame coupled to the socket grid to provide structural support, and a cable receptacle integrated into the socket to receive a cable.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: November 29, 2005
    Assignee: Intel Corporation
    Inventors: Tim A. Renfro, Jiteender P. Manik, Michael Li
  • Patent number: 6945465
    Abstract: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: September 20, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Kouichi Kanemoto, Yousuke Yukawa
  • Patent number: 6932654
    Abstract: The present invention relates to, for example, a connector into which two kinds of memory cards with different thicknesses are insertable selectively. The connector includes: a housing which has a card insertion port; plural first contacts provided inside the housing; and plural second contacts provided between the first contacts and the card insertion port. The second contacts extend toward the first contacts and include: first contact portions provided at distal ends of the second contacts; and second contact portions provided further on proximal end sides of the second contacts than the first contacts. According to the invention, when the thick memory cards is inserted, the second contact portions come into abutment against the thick memory card, and when the thin memory cards is inserted, the first contact portions come into abutment against the thin memory card. Thus, durability of the connector can be improved.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: August 23, 2005
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventor: Kiyoshi Washino
  • Patent number: 6902407
    Abstract: There are provided for an improved card connector contacting structure featuring its compactness and simplicity in construction, higher reliability of contacting action and higher impact resistance. The contacting structure is designed as a card connector comprising a plurality of contact terminals which are arranged in parallel with one another; among the plurality of contact terminals, at least two are the terminals for connecting with the power source; at least two are the terminals for grounding; at least one is for detecting whether the IC card has been loaded securely into the card connector; among the plurality of contact terminals, one of the terminals for grounding comes into contact first with the corresponding external contact of the IC card, among the plurality of contact terminals, the terminal for detecting the card coming into contact last with the corresponding external contact of the IC card.
    Type: Grant
    Filed: September 2, 2003
    Date of Patent: June 7, 2005
    Assignees: Yamaichi Electronics Co., Ltd., Kabushiki Kaisha Toshiba
    Inventors: Toshiyasu Ito, Minoru Ohara
  • Patent number: 6899544
    Abstract: A semiconductor device has a plurality of first pads to a plurality of fourth pads laid out in a first direction, thereby forming first to fourth pad rows. The first to fourth pad rows are laid out in the named order in a second direction orthogonal to the first direction. First to fourth leads are respectively connected between the first to fourth pad rows and a semiconductor chip. A first slanted side inclined to the first direction is formed at each second pad at that corner which lies on that side of the third pad row. A second slanted side inclined to the second direction in such a way as to face the first slanted side is formed at each third pad. Each first lead has a first slanted portion provided between the first slanted side and the second slanted side and extending in a direction oblique to the first direction.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: May 31, 2005
    Assignee: NEC Electronics Corporation
    Inventors: Masaru Tanokura, Yukio Yanagita
  • Patent number: 6896523
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: May 24, 2005
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Patent number: 6897385
    Abstract: A semiconductor package test board for conveniently testing a fine ball pitch ball grid array package is provided. The provided semiconductor package test board includes a socket contact unit formed of a plurality of layers, to which a socket having the semiconductor package is connected, wherein the pitch between holes to which pins of the socket are connected increases from the upper surface to the lower surface in the socket contact unit. The holes in the socket contact unit are inclined toward the edges of the socket contact unit, and the angle of inclination of the holes increases from the center of the socket contact unit to the edges of the socket contact unit. Therefore, the holes are formed such that the ball pitch increases from the top layer to the bottom layer. As a result, the socket having the semiconductor package can be directly mounted on the test board without additionally mounting the sub test board (the socket board).
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: May 24, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-ryeul Kim, Woo-seong Choi
  • Publication number: 20040242027
    Abstract: A semiconductor device has a plurality of first pads to a plurality of fourth pads laid out in a first direction, thereby forming first to fourth pad rows. The first to fourth pad rows are laid out in the named order in a second direction orthogonal to the first direction. First to fourth leads are respectively connected between the first to fourth pad rows and a semiconductor chip. A first slanted side inclined to the first direction is formed at each second pad at that corner which lies on that side of the third pad row. A second slanted side inclined to the second direction in such a way as to face the first slanted side is formed at each third pad. Each first lead has a first slanted portion provided between the first slanted side and the second slanted side and extending in a direction oblique to the first direction.
    Type: Application
    Filed: May 26, 2004
    Publication date: December 2, 2004
    Applicant: NEC Electronics Corporation
    Inventors: Masaru Tanokura, Yukio Yanagita
  • Publication number: 20040242029
    Abstract: The card writer (101) detects whether the sliding member (1) constituting the slide switch of the SD memory card is in the first position or the second position. The device driver (60) of the host computer (100) sets the memory area within the SD memory card to the writable state when the sliding member is in the first position. On the other hand, when the sliding member is in the second position, the device driver sets the memory area to the non-writable state except a part of the memory area. This part is the protected area (25) that is writable even when the protected area (25) is set to the non-writable state.
    Type: Application
    Filed: June 29, 2004
    Publication date: December 2, 2004
    Inventors: Norio Nakamura, Shinichi Matsui, Shunji Harada, Kazuya Fujimura, Kaoru Murase, Naohiko Noguchi, Kiichi Hasegawa
  • Publication number: 20040185685
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level.
    Type: Application
    Filed: March 26, 2004
    Publication date: September 23, 2004
    Applicants: Renesas Technology Corp., Hitachi ULSI Systems Co., Inc.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Patent number: 6764313
    Abstract: A method of forming an electrical interconnection between a first electrical device and a second electrical device comprises the steps of providing contacts in an uncompressed state. The uncompressed contacts are then deformed to a compressed state and then the contacts are positioned in a device adapted to hold the contacts between the first and second electrical devices. Or alternatively, the uncompressed contacts are positioned in the device and then compressed to the compressed state. The contacts are then activated to substantially expand to the uncompressed state wherein each contact expands to substantially its uncompressed state for establishing the electrical interconnection between the first and second electrical devices.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: July 20, 2004
    Assignee: International Business Machines Corporation
    Inventor: Gareth Hougham
  • Publication number: 20040077189
    Abstract: The present invention is to provide a flexible interconnector that contains a cable having an adhesive on one terminal end and a ZIF connector at the other terminal end. In a preferred embodiment, the cable is a flat ribbon cable. When used to connect two electrical subassemblies, one end of the connector is connected to connecting terminals on a first electrical subassembly via an adhesive, while the other end is connected to a second electrical subassembly via a ZIF connector.
    Type: Application
    Filed: October 17, 2002
    Publication date: April 22, 2004
    Inventors: Frank St. John, Albert Chiappetta
  • Patent number: 6721185
    Abstract: A memory module having balanced data input/output contacts. A memory module includes a printed circuit board having an edge connector and a plurality of memory integrated circuits. The edge connector may be adapted for insertion into a socket of a motherboard of a computer system, for example. The edge connector includes a plurality of contact pads on both sides of the printed circuit board. The contact pads are configured to convey data signals, power and ground to and from the printed circuit board. The power and ground contact pads alternate along the edge connector. There are no more than four data signal contact pads without intervening power or ground contact pads.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: April 13, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: Lam S. Dong, Drew G. Doblar
  • Publication number: 20040063338
    Abstract: A connector block having an alarm-isolation circuit includes a first alarm input terminal, a second alarm input terminal, a first alarm output terminal, a second alarm output terminal, and at least one diode. The first and second alarm input terminals are operable for electrical connection with a two-wire alarm input. The first and second alarm output terminals are electrically connected respectively to the first and second alarm input terminals. The at least one diode is electrically connected between the first alarm input terminal and a first alarm output terminal, thereby forming a portion of the alarm-isolation circuit. The one alarm-isolation circuit is capable of forwarding an electrical signal to a remote location. In other embodiments, a diode is used between each alarm input terminal and alarm output terminal, thereby inhibiting feedback among the alarm output terminals and the associated alarm input terminal.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Inventors: Richard D. Morris, Janneth Badillo, William A. Holder
  • Patent number: 6700788
    Abstract: A pressing member is provided in an accommodating section of a housing to suppress first connector terminals to press down contacts towards a bottom of the accommodating section; when a first card is inserted, a pressing member is not displaced but brings the contacts of the first connector terminals into contact with a contact terminal section of a first card; when a second card is inserted, a bottom face of the second card and the pressing member come into contact with each other to displace the pressing member; and the contacts of the first connector terminals are pressed down by that displacement to a position in which they do not come into contact with the bottom face of the second card.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: March 2, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventors: Toshihisa Matsushita, Yoshimasa Kuroda
  • Patent number: 6669487
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: December 30, 2003
    Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Patent number: 6644979
    Abstract: A backplane structure is capable of being mounted with two interface cards for being used in an industrial computer. The backplane structure includes a backplane capable of being connected to a mother board of the industrial computer and having a first side, a second side and a height of 1U (1.75″). A first peripheral component interconnection (PCI) port is provided on an upper portion of said first side, an industry standard architecture (ISA) port having a plurality of terminals on two ends thereof is provided on the lower portion of the second side by soldering so as to form a terminal-less region on the first side. In addition, a second peripheral component interconnection (PCI) port is provided on the terminal-less region on the first side.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: November 11, 2003
    Inventor: Kuo-Chen Huang
  • Patent number: 6641413
    Abstract: A slide member is provided with a presser plate portion for restraining a first connector terminal from protruding into a storage portion at a card ejection position, first fastening portions not coming in contact with a second card but coming in contact with only a first card, and a second fastening portion coming in contact with only a front end portion of the second card, and at a time of insertion of the second card, after the second card passes the first fastening portions to come in contact with the second fastening portion, the slide member is moved from the card ejection position to the card installation position, and the first connector terminal comes away from restraint of the presser plate portion and protrudes into the storage portion.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: November 4, 2003
    Assignee: ALPS Electric Co., Ltd.
    Inventor: Yoshimasa Kuroda
  • Patent number: 6634889
    Abstract: A socket connector and a card-edge is provided for electrical busses. In one embodiment, a socket is provided for electrical busses that require each end of the bus to be terminated that does not require a termination card. In another embodiment, a socket connector is provided for electrical busses that flow through several aligned socket connectors. The design of the socket connector connects a bus to termination resistors located on a circuit board of the socket connector by cross-connecting the signal through the signal pins inside the socket connector.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: October 21, 2003
    Assignee: Dell Products L.P.
    Inventors: Kevin L. Miller, Arthur Lopez
  • Patent number: 6601292
    Abstract: A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: August 5, 2003
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Delin Li, Jay DeAvis Baker, Achyuta Achari, Brenda Joyce Nation, John Trublowski
  • Patent number: 6585525
    Abstract: Memory modules, and related memory module sockets, can include a plurality of connector pins adjacent to a first edge of the memory module that are configured to conduct a plurality of first signals to or from the memory module via the first edge and a plurality of first conductors adjacent to a second edge of the memory module that are configured to conduct a plurality of second signals to or from the memory module via the second edge.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: July 1, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-sung Jung, Won-ki Song
  • Patent number: 6572385
    Abstract: A low profile electrical connector (4) includes an insulative housing (5), a number of electrical contacts (6) and a pair of boardlocks (7) retained to the insulative housing. The insulative housing has a number of passageways (505) extending vertically through a longitudinal side (500) thereof and two slots (504). The passageways communicate with the slots through longer and shorter openings (508), (509). Each electrical contact has a retention portion (60), a transitional portion (62), and a curved contact section (64). The curved contact sections protruding through the longer openings into the slots are located vertically higher than the curved contact sections protruding through the shorter openings. Both the retention and the transitional portions of the electrical contacts corresponding to the longer openings engage with the insulative housing while only the retention portions of the electrical contacts corresponding to the shorter openings engage with the insulative housing.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: June 3, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Jerry Wu
  • Patent number: 6561850
    Abstract: A card edge connector includes an elongated longitudinally extending outer frame defining a reception region adapted to receive a plurality of chiclet modules including contact members and lying in parallel laterally extending planes which, as an assembly, are positioned to connectively engage with mating contacts. Each chiclet module includes an insulative housing having first and second spaced generally parallel elongated passages therein and a card receiving recess for reception therein between the first and second passages of a planar card having opposed surfaces with conductive contact members thereon. First and second contacts are received, respectively, in the first and second passages. Each has a first contact surface positioned, respectively, for engagement with first and second of the mating contacts. The card receiving recesses of the chiclet modules as a group define a longitudinally extending card receiving slot.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: May 13, 2003
    Assignee: Berg Technology, Inc.
    Inventors: Guy Louis Letourneau, Joseph Richard Salamone
  • Patent number: 6508657
    Abstract: A connector is electrically connected to a substrate in which a conductor pattern and electrodes at ends of the conductor pattern are provided on a surface of the substrate. The connector includes a plurality of contacts that are resiliently connectable to the electrodes of the substrate inserted in the connector. An insulator member contains the contacts arrayed therein. A slider unit is movably attached to the insulator member, the slider unit including a plurality of lugs that are connectable to respective edges of the contacts contained in the insulator member.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: January 21, 2003
    Assignee: Fujitsu Takamisawa Component Ltd.
    Inventors: Yutaka Fukumoto, Manabu Shimizu, Takahiro Kondou, Hideo Miyazawa, Junichi Akama, Moriyuki Ueno
  • Patent number: 6508675
    Abstract: An electrical system includes a first substrate (31) having a first contact portion (32, 33) thereon and a second substrates (35) having a second contact portion (36, 37) thereon. An electrical connector is arranged between the first and second substrates for establishing electrical connection therebetween. The electrical connector includes a number of wafers (10) stacked together and each wafer includes at least a passageway (13, 14) defined therein having ends facing the first and second substrates. Each passageway has a terminal (21, 22) moveably supported therein and has end contacting portions (21b, 21c; 22b, 22c) electrically contacting with first and second contact portions of said first and second substrates. The terminal includes an arm (21d, 22d) abutting against an inner side of the passageway.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: January 21, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Iosif Korsunsky, Wei-Chen Lee, Tod M. Harlan
  • Patent number: 6464537
    Abstract: A card edge connector includes an elongated longitudinally extending outer frame defining a reception region adapted to receive a plurality of chiclet modules including contact members and lying in parallel laterally extending planes which, as an assembly, are positioned to connectively engage with mating contacts. Each chiclet module includes an insulative housing having first and second spaced generally parallel elongated passages therein and a card receiving recess for reception therein between the first and second passages of a planar card having opposed surfaces with conductive contact members thereon. First and second contacts are received, respectively, in the first and second passages. Each has a first contact surface positioned, respectively, for engagement with first and second of the mating contacts. The card receiving recesses of the chiclet modules as a group define a longitudinally extending card receiving slot.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: October 15, 2002
    Assignee: Berg Technology, Inc.
    Inventors: Guy Louis Letourneau, Joseph Richard Salamone
  • Patent number: 6464540
    Abstract: In a connector unit having primary and secondary connectors (11 and 12) which have a plurality of primary contact leads (111) and a plurality of secondary contact leads (121) which correspond to the respective primary contact leads (111), the primary contact leads (111) have primary contact ends displaced from one another in a predetermined direction. The secondary contact leads (121) have secondary contact ends which are extended in an opposite direction to be contacted with the corresponding primary contact ends and which are displaced stepwise to compensate for the displacement of the primary contact ends and to thereby reduce a variation of sums of the primary and the secondary contact leads (111 and 121).
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: October 15, 2002
    Assignee: NEC Corporation
    Inventor: Nobuyuki Sato
  • Publication number: 20020146918
    Abstract: A mounting structure of a connector 6 for use with a circuit board 7 includes fixing parts 8 provided on one side of the connector 6 and fixed to the circuit board 7, terminals 25 contained in the connector and connected to the circuit board by soldering, a plurality of wiring boards 41 to 42 arranged adjacent to the circuit board,. and a pair of support walls 9 provided on the other side of the connector 6 and projected from the connector. The support walls 9 are abutted at their lower ends against the uppermost wiring board 41, enabling the connector to be supported by both the support walls 9 and the fixing parts 8. The fixing parts 8 and the support walls 9 are projected in directions intersecting at a right angle so that the support walls 9 may be abutted against the wiring board 41 in an engaging direction of a mating connector 37. The support walls 9 are projected longer than the terminals 25 toward the wiring board 41.
    Type: Application
    Filed: April 4, 2002
    Publication date: October 10, 2002
    Applicant: Yazaki Corporation
    Inventor: Hiroyuki Kondo
  • Patent number: 6461168
    Abstract: A plug socket (1) has a plug housing (2) with a baseplate (3). The baseplate (3) has a respective contact surface (9,10) on two opposite sides in order to seat it on a printed circuit board. A contact spring (6) has two support regions (7,8) which are curved in the shape of an arc in opposite directions and which together form the shape of an S lying on its side. The contact spring (6) permits conductor track contact both in the case of surface mounting and plug-in mounting for the plug socket (1).
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 8, 2002
    Assignee: Mannesmann VDO AG
    Inventors: Manfred Zeiss, Thomas Ritter
  • Patent number: 6439930
    Abstract: An electrical system includes a first substrate having a first contact portion thereon and a second substrate having a second contact portion thereon. An electrical connector is arranged between the first and second substrates for establishing electrical connection therebetween. The electrical connector includes a plurality of wafer stacked together and each wafer includes at least a passageway defined therein having ends facing the first and second substrates. Each passageway has a terminal moveably supported therein and has end contacting portions electrically contacting with first and second contact portions of said first and second substrates. The terminal includes an arm abutting against an inner side of the passageway.
    Type: Grant
    Filed: November 5, 2001
    Date of Patent: August 27, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Iosif Korsunsky, Wei-Chen Lee, Tod M. Harlan
  • Patent number: 6425766
    Abstract: A connector system including a circuit card and method of manufacturing same is provided. By way of example, the system includes a connector having an elongated housing with an elongated card-receiving slot. A plurality of signal terminals and ground terminals are mounted on the housing along the slot and have contact sections extending into the slot. A circuit card has an edge insertable into the slot, a ground plane facing a surface of the card at least near the edge and a plurality of signal contact pads and a plurality of ground contact pads along the edge for engaging the contact sections of the signal terminals and the ground terminals, respectively. The size or area of the signal contact pads is varied relative to the ground contact pads to vary the capacitance in the area of the terminal-to-circuit card interface and, thereby, vary the impedance of the system.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: July 30, 2002
    Assignee: Molex Incorporated
    Inventor: Augusto P. Panella
  • Patent number: 6402556
    Abstract: An improved flexible circuit connector that is particularly useful in connections for circuit boards has a housing and a circuit card engaging assembly mounted therein. The circuit card engaging assembly includes at least two contact spring members having a U-shaped portion adjoining a body portion thereof such that when the two contact spring members are brought together at their body portions, a U-shaped channel is formed that supports two lengths of flexible circuity close to the surface and edge of a circuit board inserted into the connector channel.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: June 11, 2002
    Assignee: Molex Incorporated
    Inventors: Harold Keith Lang, Martin Uche Ogbuokiri, Steve Anil Shah, Gregory D. Spanier, Irvin R. Triner
  • Patent number: 6394823
    Abstract: An edge card connector is provided for use with a circuit card having an edge and a plurality of contact pads near the edge. The connector includes a housing having an elongated slot for receiving the edge of the circuit card therein, along with terminal cavities adjacent to the slot. A plurality of terminals are inserted into the terminal cavities. At least some of the terminals each include a contact section extending into the slot for engaging a contact pad on the circuit card, along with an enlarged body section. A thin flexible contact arm extends between the body section and the contact section. A finger portion extends alongside the thin flexible contact arm to increase the capacitance of the terminal and, thereby, reduce the impedance of the circuit through the terminal.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: May 28, 2002
    Assignee: Molex Incorporated
    Inventors: David E. Dunham, Russell J. Leonard
  • Publication number: 20020061663
    Abstract: The present invention discloses power supply cable for providing DC power from a power supply to a microprocessor of a personal computer. The output cable includes a plate-cable includes a first and a second metal plates insulated with an insulation layer between the first and second metal plates. The output cable further includes a plurality of capacitors disposed on the plate cable. Each of the capacitors has a first and second electrical terminals and each of the first and second electrical terminals connected to one of the first and second metal layers provided for storing electrical charges therein for transmitting through the metal layers for supplying power to the microprocessor. In a preferred embodiment, the plurality of capacitors disposed on the first metal plate with the first electrical terminal for each of the capacitors connected to the first metal plate.
    Type: Application
    Filed: January 15, 2002
    Publication date: May 23, 2002
    Applicant: Delta Electronics, Inc.
    Inventors: Bruce C.H. Cheng, Timothy Chen-Yu Yu, Kelly Jui-Yuan Shyu, Szu-Lu Huang
  • Patent number: 6369336
    Abstract: A printed circuit board is disclosed which has conductive pads located near an edge of a board main body on its upper and lower surfaces to reduce the width in the direction of contact sliding and to provide for a smoother connection between electrical contacts of an electrical connector and the conductive pads despite a powdered substance produced as a result of friction between the conductive pads and the electrical contacts. The printed circuit board (1) has conductive pads (14a, 14b) on upper and lower surfaces of the board main body (2) near the edge (3) of the main body (2). Electrical contacts (20) slide over the conductive pads (14a, 14b) from the edge (3) of the board main body (2). The conductive pads (14a, 14b) are connected together by via holes (15a) that are located in the paths of the contacts (20).
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: April 9, 2002
    Assignee: The Whitaker Corporation
    Inventor: Hiroyuki Obata
  • Patent number: 6368129
    Abstract: The present invention provides a dust-proof electrical connector. This connector includes an outer sleeve and an inner sleeve as a receiving end for connecting a corresponding connector. The inner sleeve contacts a first contact terminal disposed on the corresponding connector. A second contact terminal is pierced through the outer sleeve and inner sleeve, for forcing and contacting the first contact terminal when the inner sleeve is moved to a specific position relative to the outer sleeve.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: April 9, 2002
    Assignee: Delta Electronics, Inc.
    Inventors: Ta-Wei David Wang, Yu Chen Yu, Bay Shao Ru Su
  • Patent number: 6368121
    Abstract: A connector assembly for balanced transmission includes a plug connector wherein a plurality of plug-type contact element arrays extend parallel to each other and a plug-type ground plate is disposed between neighboring plug-type contact element arrays, and a jack connector wherein a plurality of jack-type contact element arrays extend parallel to each other and a jack-type ground contact elements for the plug-type ground plate are disposed between neighboring jack-type contact element arrays.
    Type: Grant
    Filed: November 2, 2000
    Date of Patent: April 9, 2002
    Assignee: Fujitsu Takamisawa Component Limited
    Inventors: Moriyuki Ueno, Hirofumi Yanagisawa, Yasuyuki Miki, Akira Okada, Satoshi Katoh, Junichi Akama
  • Patent number: 6358061
    Abstract: A connector for high speed applications includes both signal and reference or power terminals arranged on opposite sides of a circuit-card receiving slot of the connector. The reference or power terminals have a pair of spring arms that extend up from a body portion and are spaced apart from each other. Insertion of a circuit card into the card slot deflects one of the two spring arm portions secondary into shorting contact with the other spring arm portion. The circuit paths are thus defined in the terminal, which increases the performance of the connector. The shorting contact is obtained by the two spring arm portions engaging each other along opposing sides to reduce the force needed to effect shorting contact.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: March 19, 2002
    Assignee: Molex Incorporated
    Inventor: Kent E. Regnier
  • Patent number: 6350144
    Abstract: A communications cable terminal block switching mechanism employs a terminal block housing with a number of chambers and a number of openings for service wires to be inserted into the chambers. A cable stub enters the terminal block and contains feed-in pairs and feed-out pairs. Based on the condition of the switching mechanism, a wire pair may be expressed through the terminal block unterminated, or, a wire pair may be terminated to a service wire at the block. Specifically, a number of sets of electrical contact elements, corresponding to the number of openings, is provided, and one of each of the sets of contact elements is configured in one of each of the chambers.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: February 26, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Martin G. Afflerbaugh, Philip M. Smith
  • Publication number: 20020022381
    Abstract: Each of the contacts comprises a plurality of stacked contact pieces. The contact portions of each of the stacked contact pieces are allocated in the direction of the length of the contact within a size of the corresponding pad. This arrangement can minimize a temperature rise in the contact.
    Type: Application
    Filed: August 7, 2001
    Publication date: February 21, 2002
    Inventors: Toshiyasu Ito, Yasuhiro Ono
  • Patent number: 6329607
    Abstract: A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or signal conductor for connection to a contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor. The potential reference conductor on the lead provides enhanced resistance to crosstalk.
    Type: Grant
    Filed: September 18, 1996
    Date of Patent: December 11, 2001
    Assignee: Tessera, Inc.
    Inventors: Joseph Fjelstad, John W. Smith
  • Patent number: 6315589
    Abstract: A combination DC/data connector for connecting electrical equipment stacked in a rack to a continuous vertical combined DC/data bus includes a data connector which cooperates with a slot in the DC/data bus assembly to align the DC/data connector with the bus assembly and make contact with data buses on the walls of the slot. The DC/data connector also includes a pair of DC connectors which slide into channels in the DC bus bars of the DC/data bus assembly after the DC/data connector has been aligned with the bus assembly by the data connector. The data contacts of the DC/data connector are mounted on both sides of a printed circuit card which can be slid into the data connector, and which provides the interconnections between the data contacts and the equipment data interface.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: November 13, 2001
    Assignee: Astec International Limited
    Inventors: Brian Inniss, Michael Hutchins
  • Patent number: 6309254
    Abstract: An electrical card edge connector comprising: (a) a housing defining a slot for receiving an edge of a circuit board and a plurality of cavities along the slot for receiving contacts; (b) a plurality of contacts in the cavities. The plurality of contacts has at least a first contact, a second contact, and a third contact, each of which comprises a body and at least one cantilevered arm extending from the body. At least one cantilevered arm of each contact extends into the slot so that when a circuit board is inserted in the slot, a portion of the cantilevered arm of each contact contacts the circuit board. From a viewpoint parallel to the slot, the profile of the body of the first contact overlaps substantially all of the profile of each body of the second and third contacts. Additionally, from this viewpoint, the profile of one or more cantilever arms of the first contact overlaps a substantial portion of the profile of each cantilever arm of the second and third contacts.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: October 30, 2001
    Assignee: Tyco Electronics Corportion
    Inventor: Iosif Korsunsky
  • Patent number: 6305946
    Abstract: A power connector including an insulative housing defining an elongate slot in a front face thereof for receiving a central processing unit (CPU) module therein and pairs of upper and lower passages in an opposite face thereof in communication with the slot for receiving power contact pairs that electrically engage the CPU module. Each pair of power contacts includes a ground terminal and a hot terminal respectively received in the upper and lower passages. Each pair of ground and hot terminals have tail sections extending beyond the rear face and offset toward each other for securely receiving and electrically engaging a capacitor board to supply electrical power to the CPU module. Each lower passage is elongated in a direction away from the corresponding upper passage for providing an additional space to receive and retain a signal contact. Each signal contact has a tail section extending beyond the rear face for being electrically connected to a flat cable for exchange of data and control signals.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: October 23, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Robert G. McHugh, Wen-Chun Pei
  • Publication number: 20010029117
    Abstract: A plug socket (1) has a plug housing (2) with a baseplate (3). The baseplate (3) has a respective contact surface (9,10) on two opposite sides in order to seat it on a printed circuit board. A contact spring (6) has two support regions (7,8) which are curved in the shape of an arc in opposite directions and which together form the shape of an S lying on its side. The contact spring (6) permits conductor track contact both in the case of surface mounting and plug-in mounting for the plug socket (1).
    Type: Application
    Filed: December 19, 2000
    Publication date: October 11, 2001
    Inventors: Manfred Zeiss, Thomas Ritter
  • Patent number: 6300575
    Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.
    Type: Grant
    Filed: August 25, 1997
    Date of Patent: October 9, 2001
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer, James R. Wilcox
  • Patent number: 6296491
    Abstract: An electrical card edge connector (1) includes an elongated insulative housing (10), a number of juxtaposed electrical engaging terminals (11) mounted in the housing and a pair of electrical hot plug switching modules (2) assembled in the insulative housing. The insulative housing comprises a card receiving slot (16) for receiving an electronic card. The card receiving slot defines a slot bottom face (160). The switching modules each includes a printed circuit board portion (22) and a number of switching terminals (13, 15) retained in the printed circuit board portion. A first distance H1 is defined between contact portions (116) of the engaging terminals 11 and the slot bottom face (160) and a second distance H2 is defined between contact portions (136, 156) of the switching terminals (13, 15) and the slot bottom face (160). The first distance H1 is relatively smaller than the second distance H2.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: October 2, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Charles Sands Pickles
  • Patent number: 6254435
    Abstract: An edge card electrical connector is adapted for receiving an edge of a printed circuit board having contact pads on at least one side of the board adjacent the edge. The connector includes an elongated dielectric housing having a board-receiving face with an elongated slot for receiving the edge of the printed circuit board. A plurality of terminal-receiving cavities are spaced longitudinally of the slot along at least one side thereof and separated by transverse walls. A plurality of first and second terminals are received in the cavities. The shapes of the terminals are such as to provide excellent capacitive coupling between the first and second terminals to improve electrical performance and reduce crosstalk of the connector.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: July 3, 2001
    Assignee: Molex Incorporated
    Inventors: Kai Mook Cheong, James L. McGrath, Richard A. Nelson, Augusto P. Panella, Javier Resendez, Timothy R. McClelland
  • Patent number: 6234807
    Abstract: A printed circuit board connector edge tab design has increased tab contact area with a large local capacitance at the connector interface. This serves to balance out the inductive effects of the connector and results in a lower overall channel impedance at the interface. The invention replaces the prior art plated pathway to the upper row of tabs with wider tabs on the lower row. The edges of the lower row tabs are spaced such that each of the connector pins destined for the upper row straddle two of the lower tabs as they travel upward. This design prevents the pins from contacting the fiberglass substrate of the board while it traverses the lower row of tabs. The absence of the prior art plated pathways allows each of the lower row tabs to be expanded into the space formerly occupied by the pathways. This design also allows the increased capacitive area of the edge tabs to be located in very close proximity to the connection area between the connector pins and the edge tabs.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: May 22, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kamran Amini, Joseph Curtis Diepenbrock, Robert J. Evans, Mike L. Scollard, Marcel B. Tran
  • Patent number: RE38736
    Abstract: A card edge connector for mounting on a circuit board and removeably receiving a circuit card includes an elongated housing defining a card receiving slot. Numerous terminal receiving cavities intersect and extend to both sides of the slot. Alternate cavities include stamped references (ground or power) terminals and signal terminals, all having downwardly extending board contacts and upwardly extending spring arms. There are numerous similar sets of face to face contacts, each including a reference contact parallel to and substantially overlying an opposed pair of signal contacts. The upwardly extending reference terminal spring arms include oversize pad portions for reducing crosstalk by increasing coupling between the reference and signal terminals. The circuit paths to the circuit board are in an array symmetrical about the centerline of the circuit card, with parallel inner lines of circuits containing only reference contacts and outer lines of circuits containing only signal contacts.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: May 17, 2005
    Assignee: Molex Incorporated
    Inventors: Alan S. Walse, Harold Keith Lang, Augusto P. Panella, Irvin R. Triner, Shyh-Lin Tung