Abstract: The present invention relates to a dual GPON Small Form-Factor Pluggable optical module, projected to provide connection to two SC optical fiber connectors, and to be incorporated in any state of the art SFP transceiver host to allow double GPON-OLT channels. The module comprises a case housing a specific set of technical elements such as bidirectional optical subassemblies, high-speed electrical interface, and all the necessary electronic circuits, printed circuit board and flex-printed circuit board to ensure proper assembly and electronic performance of all elements.

Abstract: According to one embodiment, a flexible substrate includes a first protective member including a first surface, a line portion including a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base and a second protective member covering the line portion, and the first protective member includes a valley portion and a peak portion in the first surface, and the line portion is formed in a wavy shape and located on the valley portion and the peak portion.

Abstract: A connector assembly includes a first connector and a second connector mated with each other. The first connector includes a first insulating body, a number of first conductive terminals, and an adapter circuit board. The adapter circuit board includes an input end and an output end. The input end includes an input portion electrically connected to the first conductive terminals. The output end includes an insertion portion protruding beyond the first insulating body. The second connector includes a second insulating body and a number of second conductive terminals. The first connector and the second connector further include locking structures to prevent the first connector from being separated from the second connector.

Abstract: A multi-layered structure interface between a ball grid array (BGA) device and a printed circuit board (PCB), including a ball guide layer comprising a through hole; a first elastomeric portion of a first layer in superimposition with at least a portion of the through hole, the first elastomeric portion having a first width; and a second elastomeric portion of a second layer having a second width; wherein first elastomeric portion is positioned between the through hole of the ball guide layer and the second elastomeric portion, wherein the first width of the first elastomeric portion is greater than the second width of the second elastomeric portion.

Abstract: Various embodiments may provide an augmented reality display having an improved FOV, and a waveguide device and diffractive optical structures thereof. The augmented reality display may comprise: a light source configured to generate light related to an image; and the waveguide device for outputting at least a part of the light. The waveguide device may comprise: a waveguide for guiding light therein; and the diffractive optical structures arranged on a first surface and a second surface of the waveguide.

Abstract: In a display panel, a first slit is formed between a first terminal portion and a second terminal portion that are two of a plurality of terminal portions, and the first slit separates the first terminal portion and the second terminal portion between the first terminal portion and the second terminal portion.

Abstract: The present disclosure provides a gas sensor. The gas sensor includes a substrate, a conductor layer over the substrate, wherein the conductor layer includes a conductive pattern including a plurality of openings, the openings being arranged in a repeating pattern, an insulating layer in the plurality of openings and over a top surface of the conductive pattern, wherein the conductive pattern is embedded in the insulating layer, and a gas sensing film over a portion of the insulating layer.

Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.

Abstract: A wearable device is described. The wearable device may be constructed of one or more flexible materials, and may be referred to as a flexible wearable device. The flexible wearable device may include a flexible housing that is made of a material that is elastically deformable, where the flexible housing at least partially surrounds components of the flexible wearable device. The flexible housing may include apertures disposed within the surface of the flexible housing to enable light to be transmitted and received through the flexible housing. The flexible wearable device may also include a printed circuit board (PCB) disposed within the flexible housing (e.g., within a cavity formed by the flexible housing). The PCB may include sensors configured to acquire physiological data from a user by transmitting light and receiving light through the apertures. The PCB may be constructed of flexible regions that are elastically deformable.

Abstract: The present disclosure relates to a circuit board structure, display panel, display device and manufacturing method. The circuit board structure includes a circuit board body, a first connection part, a second connection part and a connection circuit board. An accommodating hole is disposed on the circuit board body. The first connection part is disposed on the circuit board body and located at a side of the accommodating hole. The second connection part is disposed on the circuit board body and located at a side of the accommodating hole away from the first connection part. The connection circuit board is provided with a plurality of connection wires thereon, and the connection wires conductively connect the first and second connection parts. An orthographic projection of the connection circuit board on the circuit board body is not overlapped with that of the accommodating hole on the circuit board body.

Abstract: Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.

Abstract: A seal for an angled connector includes a rim wall enclosing a central opening and a sealing passage extending from outside the seal through the rim wall into the central opening. The seal has a planar plate-shaped configuration.

Abstract: Electric device with electric connection means suitable for connecting it to an electric power source, comprising a supporting surface for a textile electrically conductive band and retention means for retaining the textile electrically conductive band on supporting surface. Electric connection means comprise piercing means for piercing the textile electrically conductive band which are suitable for conducting an electric current. Textile electrically conductive band is made of double weaving and comprises two mutually parallel electrically conductive guides extending along the band. Each of the electrically conductive guides is located between two layers of textile material of said double weaving.

Abstract: A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.

Abstract: A plurality of package units is on a surface of a substrate, and a driving circuit is on the surface of the substrate. Each package unit includes at least one pixel, and each pixel is provided with a plurality of light-emitting elements. The driving circuit electrically connects to the light-emitting elements and is configured to transmit a plurality of gate driving signals and a plurality of data signals to drive the plurality of light-emitting elements to emit light to display images. The driving circuit is partially in the package units and is partially between adjacent package units. The substrate and a portion of the driving circuit between adjacent package units are made to be stretchable, while the package units are not stretchable.

Abstract: A display device includes a display panel including a pixel part to display an image, and a pad part connected to the pixel part; a first flexible circuit film coupled to the pad part and including a first alignment mark; and a second flexible circuit film coupled to the pad part, overlapping the first flexible circuit film, and including a second alignment mark aligned with the first alignment mark. The first and second alignment marks are located in an area where the first flexible circuit film overlaps the second flexible circuit film.

Abstract: A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.

Abstract: A width of each of a first signal terminal and a reference potential terminal formed in a first connection region of a core insulating layer constituting a flexible substrate is larger than a width of each of a first backside signal terminal and a backside reference potential terminal formed in a second connection region of the core insulating layer. In addition, a first separation distance between the first signal terminal and the reference potential terminal arranged adjacent to the first signal terminal is smaller than a second separation distance between the first backside signal terminal and the backside reference potential terminal arranged adjacent to the first backside signal terminal. An insulating film formed on a first surface of the core insulating layer at a position overlapping each of the first connection region and the second connection region covers the first connection region such that the second connection region is exposed.

Abstract: This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15°. Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.

Abstract: An electrocardiography device is described that can include a main body, an adjustable cap, and a power switch. The main body can include an electrode of a plurality of electrodes configured to acquire electrical signal from a patient. The adjustable cap can include two electrodes of the plurality of electrodes. The adjustable cap can be rotatable around an axis on the main body to orient the plurality of electrodes on different locations on a body of the patient. The power switch can activate the plurality of electrodes to acquire the electrical signal from the patient. Related apparatuses, systems, methods, techniques and articles are also described.

Abstract: A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.

Abstract: An electrical connection assembly including two complementary connectors, each including a mutually parallel electrically insulating plates each comprising one face carrying signal transport contacts and an opposite face carrying at least one shielding sheet in such a manner that, when the connectors are connected together, the plates are interleaved between one another so that the contacts are pressed against one another and the shielding sheets are pressed against each other.

Abstract: A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area.

Abstract: An LED lamp having a metal PCB bent polyhedrally and a method for manufacturing the LED lamp is provided, where a base constituting the metal PCB has a rectangular or geometric shape and is configured to have a plurality of base stepped grooves formed spaced apart from each other on the underside thereof in such a manner as to be bent upward or downward from the base to form reflection surfaces continuously, so that at the time when both ends of the base come into contact with the plane, the base has a geometric shape in which the base is located in space through the reflection surfaces continuously arranged.

Abstract: The present disclosure illustrates a signal transmission apparatus and a display apparatus using the same. The signal transmission apparatus comprises a first flexible printed circuit board electrically connected to a display module and a system, and comprising a port; and a second flexible printed circuit board electrically connected to the display module, and comprising a port connection member, and the port connection member corresponding to the port. The second flexible printed circuit board is electrically connected to the first flexible printed circuit board through the port connection member and the port, and is further electrically connected to the system. The signal transmission apparatus is used to replace the conventional manner of soldering multiple circuit boards for connection, so as to prevent the variation during the soldering process, and reduce errors of the manufacturing process, and improve yield rate of the display product.

Abstract: A flexible circuit board assembly and a flexible display device include a first flexible circuit board, a T-shaped flexible circuit board, and a second flexible circuit board. The first flexible circuit board and the second flexible circuit board are located on a top of the T-shaped flexible circuit board and are coplanar with the T-shaped flexible circuit board. Two ends of a top of the T-shaped flexible circuit board are connected respectively to the first flexible circuit board and the second flexible circuit board perpendicularly.

Abstract: A Chip-On-Film structure, a displaying base plate and a displaying device, wherein the Chip-On-Film structure includes a first substrate; a plurality of driving chips provided on one side of the first substrate, and a plurality of first leads that are connected to the plurality of driving chips; and the plurality of first leads are for binding a displaying base plate, and a quantity of the first leads is greater than or equal to a sum of quantities of channels of the plurality of driving chips.

Abstract: A high-density connecting device is provided. The high-density connecting device includes a first connecting module and a second connecting module. The first connecting module includes a first casing assembly, a first circuit board, and a first socket connector. The second connecting module includes a second casing assembly, a second circuit board, and a second socket connector. When the first connecting module is mated with the second connecting module, a junction end of the first circuit board and a junction end of the second circuit board are inserted into the first socket connector and the second socket connector, respectively, so that the junction end of the first circuit board and the junction end of the second circuit board are electrically connected to the first socket connector and the second socket connector, respectively.

Abstract: A method of removing an insulating coating layer of coil wiring includes: a fragmentation step in which a line-shaped region of the insulating coating layer, which separates a removal-planned portion and a remain-planned portion of the insulating coating layer, is removed; a laser irradiation step in which laser light which transmits through the insulating coating layer but which is absorbed by a coil wiring is irradiated from a side of an outer surface of the removal-planned portion toward a boundary of the coil wiring with the insulating coating layer, to carbonize a boundary portion between the insulating coating layer and the coil wiring of the removal-planned portion by generation of heat of the coil wiring; and a coating turn-over step in which air is blown onto the removal-planned portion to turn over and blow off the removal-planned portion.

Abstract: Systems, apparatus, methods for manufacturing and techniques for interconnecting integrated circuit devices are disclosed. A flexible printed circuit (FPC) provides EMI shielding with reduced insertion loss. The FPC includes a first signal layer fabricated from a planar conductive material and having traces configured to carry signals between a circuit boards. The FPC may include a first non-conductive layer disposed in a plane above the first signal layer, a second non-conductive layer disposed in a plane below the first signal layer, a first copper ground plane disposed in a plane above the first non-conductive layer, a second copper ground plane disposed in a plane below the second non-conductive layer, and a second signal layer provided in a plane above the first copper ground plane or below the second copper ground plane. Signals carried in the first signal layer may have a higher frequency than signals carried in the second signal layer.

Abstract: A Dual In-Line Memory Module (DIMM) includes a plurality of memory devices mounted on a circuit board of the DIMM. The memory devices are arranged to be accessed via at least two memory channels. The DIMM further includes an array of surface contact connections. Each surface contact connection is configured to be engaged with an associated contact element of a z-axis compression connector. The array of surface contact connections are arranged to conduct signals for the memory channels. The memory devices are placed upon the memory circuit board in an array of X rows of memory devices and Y columns of memory devices, where X and Y are integers. When the DIMM has a first number of the memory devices A=X1×Y1 that is less than when the DIMM has a second number of memory devices B=X2×Y2, then either X1 is less than X2, or Y1 is less than Y2.

Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

Abstract: A connector assembly includes an inner housing, a substrate inserted into the inner housing, and a terminal position assurance (TPA) member supporting the substrate for the substrate not to be separated from the inner housing. The TPA member having a hot staking protrusion penetrating through the substrate and the inner housing.

Abstract: A display apparatus includes a flexible circuit board including a plurality of first substrate pads and a plurality of second substrate pads, a main circuit board connected to the flexible circuit board, and a display panel including a plurality of first display pads and a plurality of second display pads, where the plurality of first display pads is connected to the main circuit board through the flexible circuit board and each of the plurality of first display pads at least partially overlaps corresponding substrate pad of the plurality of first substrate pads, respectively, and each of the plurality of second display pads at least partially overlaps corresponding substrate pad of the plurality of second substrate pads, respectively.

Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Abstract: The set for the electrical stimulation of a patient, comprises a backing, at least one electrically active zone and a wire connected to said electrically active zone for connection to a stimulator. Said backing has the shape of a bandage or of a plaster.

Abstract: An adaptor includes a substrate, a first housing, and a flat cable. The substrate comprises a terminal hole. The first housing includes a first insertion hole and a second insertion hole. The substrate is inserted into the first insertion hole. The flat cable includes a plurality of conductors. Each of the conductors includes a conductor terminal. The flat cable passes through the second insertion hole. The conductor terminal is connected to the terminal hole. A direction in which the substrate is inserted into the first insertion hole is perpendicular to a direction in which the flat cable passes through the second insertion hole.

Abstract: Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.

Abstract: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to third connectors that are connected to the chip package.

Abstract: A system-in-package apparatus includes a square wave lead frame that provides a recess for a first semiconductive device as well as a feature for a second device. The system-in-package apparatus includes a printed wiling board that is wrapped onto the lead frame after a manner to enclose the first semiconductive device into the recess.

Abstract: The present invention provides a display panel, including a display area, a binding area and a pad area located between the display area and the binding area. The display area is provided with a function layer, the binding area is provided with a driving unit, and the pad area provided with a plurality of pads arranged in multiple rows and multiple columns. One end of each of the pads is connected to the function layer, and the other end of each of the pads is connected to the driving unit, wherein the plurality of the pads are disposed asymmetrically with respect to the centerline, and the centerline is a centerline of the display panel running through the display area, the pad area, and the binding area.

Abstract: An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.

Abstract: The display device includes a flexible base layer including a first region and a second region located around the first; a display unit on one surface of the first region and including a light emitting element; a driving circuit on the second region and including a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, the driving circuit includes a third bump in the first row and disposed outward relative to the plurality of first bumps, a first and second reference bump each disposed at a center of the plurality of first and second bumps that are disposed along a reference line defined in a column direction vertically intersecting a row direction, the remaining first and second bumps excluding the first reference bump and the second reference bump arranged to have a preset slope with respect to the reference line.

Abstract: A narrow-bezel display device. A bezel in outer peripheral portions of the display device is reduced. A plurality of circuit films, a printed circuit board, and the like, connected to a display panel, are protected. Heat dissipation performance is improved.

Abstract: The present disclosure provides a stretchable display device, comprising: a lower substrate made of a stretchable insulating material and having an active area and a non-active area adjacent to the active area; a plurality of individual substrates spaced apart from each other and disposed in the active area of the lower substrate; pixels disposed on the plurality of individual substrates respectively; and a plurality of connecting lines disposed between the plurality of individual substrates on the lower substrate, and electrically connecting corresponding pads disposed within the plurality of individual substrates respectively. The modulus of the plurality of individual substrates is higher than the lower substrate.

Abstract: A display panel, a flexible circuit board and a display device are provided. The display panel includes a substrate, and at least one row of a plurality of input pads including at least one first-input pad disposed in the middle of the input pads and a plurality of second-input pads disposed on both sides of the first input pad. Each input pad includes a first end and a second end that are oppositely disposed, and a spacing between any adjacent two input pads includes a first spacing between adjacent two first ends and a second spacing between adjacent two second ends. The first spacing and the second spacing between any adjacent two second-input pads are not equal. Along a direction from the first-input pad to the second-input pad, starting from adjacent first-input and second-input pads, the first spacing and the second spacing successively and gradually increases, respectively.

Abstract: A cable to board interconnect device that is used to interconnect wires to a printed circuit board (PCB) that has conductive traces on its essentially flat surface, where the wires are essentially parallel to the face of the PCB. The device includes an alignment member that overlies the wires, and an elastomeric conductor between the wires and the PCB traces.

Abstract: An electrical connector assembly used in an interior of an electronic device which includes an internal printed circuit board, a chip mounted on internal printed circuit board, internal conductive pads disposed close to the chip and electrically connected to the chip, and an interface connector away from the chip and electrically connected to the external electrical connector comprises a first connector electrically connected to the internal conductive pads and a cable connecting with the first connector, the cable being able to electrically connect to the interface connector, wherein the first connector includes first elastic terminals elastically contacting the internal conductive pads.

Abstract: An electric contact terminal configured to be forcibly inserted into an accommodation recess formed in a surface of an electrically conductive object and thus be reliably mounted on the electrically conductive object. The electric contact terminal includes: a metal body having a flat surface on at least an upper side thereof; and at least two projections protruding from a lateral side of the body, wherein the projections are sized such that the projections are placed on an edge of the accommodation recess.