Flexible Panel Patents (Class 439/67)
  • Patent number: 10362670
    Abstract: An electronic device such as a cover for a portable device may be provided with a body having hinge portions. The hinge portions may allow the body to bend about one or more bend axes. The cover may have electrical components such as a keyboard. A keyboard may be mounted at one end of the cover and a connector may be mounted at an opposing end of the cover. A flexible fabric signal path structure may be formed from metal traces on a flexible fabric substrate. At one end of the cover, the flexible fabric signal path structure may be coupled to a printed circuit in the keyboard using conductive adhesive. At the opposing end of the cover, the metal traces on the flexible fabric substrate may be coupled to the connector.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: July 23, 2019
    Assignee: Apple Inc.
    Inventors: Benjamin A. Cousins, Kurt R. Stiehl, Samuel G. Smith, Kirk M. Mayer, Siddhartha Hegde, Melody Kuna
  • Patent number: 10310560
    Abstract: A stretchable display device includes a substrate having a plurality of islands spaced apart from each other, and a plurality of bridges connecting each of the plurality of islands. A plurality of display units is disposed above the plurality of islands, respectively. A plurality of metal wirings are electrically connected to each of the plurality of display units. The plurality of metal wirings are disposed above the plurality of bridges. Each of the plurality of bridges includes a first region curved convexly in a first direction on a plane, and a second region curved concavely in the first direction. The second region is connected to the first region. Each of the plurality of metal wirings has a first width, and each of the plurality of bridges have a second width that is greater than the first width.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinwoo Choi, Youngse Jang, Haeyun Choi, Sungkook Park, Jaeik Lim
  • Patent number: 10225932
    Abstract: Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: March 5, 2019
    Assignee: TACTOTEK OY
    Inventors: Tomi Simula, Vinski Bräysy, Mikko Heikkinen, Juha-Matti Hintikka, Minna Pirkonen, Pasi Raappana, Tuomas Heikkilä, Jarmo Sääski, Juhani Harvela
  • Patent number: 10211557
    Abstract: A connector assembly having two ends respectively connected to a case and a main circuit board comprises a bracket, a bottom plate assembled on the bottom of the bracket and a flexible circuit board located between the bracket and the bottom plate. The bracket includes a mating surface attached to the case, a mounting surface opposite the mating surface, and a receiving cavity recessed inwardly from the mounting surface. The bracket includes a pair of openings extending through the mating surface thereof and communicating with the receiving cavity. A pair of chip modules are disposed on the flexible circuit board corresponding to the openings. One side of the flexible circuit board, which is farther away from the bracket, includes an electrical connector for mating with the main circuit board.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: February 19, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 10112311
    Abstract: Disclosed is a wiring unit having a main portion of a flexible printed circuit (FPC) board therein. Said rotary joint further comprises a protective unit fixed to said wiring unit, in which an end portion of said FPC board is connected to a group of cables. Also disclosed is a robot comprising said rotary joint. Compared with the existing prior arts, the proposed solutions prevent the damage of FPC during assembly and/or disassembly of robots, while not losing compactness.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: October 30, 2018
    Assignee: ABB Schweiz AG
    Inventors: Tao Feng, Kaiyuan Cao, Yun Ha
  • Patent number: 10034377
    Abstract: A display device includes a flexible insulating substrate, an insulating layer on the insulating substrate, and a plurality of terminals made of a conductive material on the insulating layer. The insulating layer is disposed outside the area located between the terminals. The insulating substrate has a groove between the terminals.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: July 24, 2018
    Assignee: Japan Display Inc.
    Inventors: Kazuto Tsuruoka, Norio Oku, Takuya Nakagawa
  • Patent number: 9935227
    Abstract: A solar cell module includes: solar cells, each of which includes first and second principal surfaces, on which a first and second bus bar electrodes are provided respectively; a wiring member connecting the first bus bar electrode of one of adjacent solar cells and the second bus bar electrode of the other adjacent solar cell; a first resin adhesive layer connecting the wiring member and the first bus bar electrode; and a second resin adhesive layer connecting the wiring member and the second bus bar electrode. The wiring member includes a first bent section bent toward the second principal surface at an end of the first bus bar electrode or the first resin adhesive layer on the adjacent side, and a second bent section bent toward the first principal surface at an end of the second bus bar electrode or the second resin adhesive layer on the adjacent side.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: April 3, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Yukihiro Yoshimine
  • Patent number: 9929483
    Abstract: An electrical connection piece including: a flexible circuit board having: a central section penetrated by contact openings arranged mirror-symmetrically; a first and second arm, each of the first and second arms extending in different directions away from the central section, the end of the first arm having a first end surface, the end of the second arm having a second end surface, the end of the first arm having a third end surface opposing the first end surface and end of the second arm having a fourth end surface opposing the second end surface; first strip conductors extending between the contact openings and first electrical contacting surfaces; and second strip conductors extending between the contact openings and second electrical contacting surfaces; wherein the first electrical contacting surfaces have a contact configuration different from a contact configuration of the second electrical contacting surfaces.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: March 27, 2018
    Assignee: OLYMPUS WINTER & IBE GMBH
    Inventors: Martin Wieters, Jens Schnitger
  • Patent number: 9876299
    Abstract: The electrical connector assembly includes an insulative housing and a plurality of contacts retained in the housing. The stand includes a support and a spring supporting the support. The electrical connector is seated upon the support and moveable along with the support in the vertical direction due to deformation of the spring. Each of the contacts includes an upper contacting section and a lower contacting section. An electronic component located upon the housing and downwardly pressing and mechanically and electrically connected to the upper contacting sections. An FPC is sandwiched between the support and the electrical connector and mechanically and electrically connected to the lower contacting sections.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: January 23, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Fang-Jwu Liao, Po-Yuan Su
  • Patent number: 9755334
    Abstract: A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: September 5, 2017
    Assignee: INTEL CORPORATION
    Inventors: Xiang Li, Yun Ling, Chung-Hao J. Chen, Hao-Han Hsu, Shyamjith Mohan, Kuan-Yu Chen
  • Patent number: 9746886
    Abstract: The invention provides a storage system comprising a solid state storage carrier sized to correspond to a defined storage form factor and to include a support printed circuit board (PCB) having arranged thereon a plurality of solid state storage devices. The storage system can include a storage enclosure including a midplane and at least one slot on an end of the storage enclosure, sized to receive a solid state storage carrier for connection with the midplane in the storage enclosure. The storage system can also include at least one midplane connector located on the midplane, wherein the at least one midplane connector is configured to mate with at least one form factor connector on an end of the solid state storage carrier.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: August 29, 2017
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: David Michael Davis, Alexander Carl Worrall, Alan John Westbury
  • Patent number: 9713851
    Abstract: A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: July 25, 2017
    Assignee: Apple Inc.
    Inventors: Nicholas G. Merz, Shayan Malek, Sawyer I. Cohen, Timothy Lui
  • Patent number: 9648744
    Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 9, 2017
    Assignee: APPLE INC.
    Inventors: Michael B. Wittenberg, Miguel C. Christophy, Shayan Malek
  • Patent number: 9583855
    Abstract: A circuit board device is provided, including: a first circuit board having a first predetermined connection section; a second circuit board arranged opposite to the first circuit board and having a second predetermined connection section directly facing the first predetermined connection section; and a connector including a first portion and a second portion. The connecter has: a first state where the first portion is arranged at a side of the first circuit board away from the second circuit board, the second portion is arranged at a side of the second circuit board away from the first circuit board, and the first portion and the second portion cooperate with each other to press the first circuit board against the second circuit board; and a second state where the first circuit board is separated from the second circuit board.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: February 28, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Rubo Ying, Shounian Chen, Jinmoo Park
  • Patent number: 9578753
    Abstract: A method for manufacturing a display device includes: connecting a first printed circuit board and a second printed circuit board with a first connecting film, the first printed circuit board and the second printed circuit board configured to apply a driving signal to a display panel; attaching a fixing member to the first printed circuit board and the second printed circuit board, such that the first connecting film extends away from the display panel and the first printed circuit board is spaced apart from the display panel; attaching the second printed circuit board to the display panel with second connecting films; removing the fixing member; and attaching the first printed circuit board to the display panel.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: February 21, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sung-Dae Bae, Myoung-Soo Kim
  • Patent number: 9515039
    Abstract: A substrate structure is provided, which includes a substrate body having a plurality of conductive pads, and a plurality of first conductive bumps and a plurality of second conductive bumps disposed on the conductive pads. Each of the second conductive bumps is less in width than each of the first conductive bumps, and is of a height with respect to the substrate body greater than a height of each of the first conductive bumps with respect to the substrate body. Therefore, the height difference between the first pre-solder layer and the second pre-solder layer after a reflow process can be compensated, and the first conductive bumps and the second conductive bumps thus have a uniform height.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: December 6, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chieh-Lung Lai, Lu-Yi Chen, Yu-Chuan Chen, Chang-Lun Lu
  • Patent number: 9478885
    Abstract: An electronic module package including an electronic module configured to receive input signals and process the input signals to provide output signals. The electronic module package also includes an interposer that has a substrate with opposite board and module surfaces. The electronic module is mounted to the module surface. The interposer includes electrical contacts along the module surface that are communicatively coupled to the electronic module through the substrate. The electronic module package also includes a connector receptacle having a receptacle housing coupled to the interposer. The receptacle housing defines a reception space that is located over and permits access to the electrical contacts. The connector receptacle is configured to receive an electrical connector within the reception space to electrically couple the electrical contacts and the electrical connector. The connector receptacle holds the electrical connector therein in a mated position.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: October 25, 2016
    Assignee: Tyco Electronics Corporation
    Inventor: Alan R. MacDougall
  • Patent number: 9474154
    Abstract: A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: October 18, 2016
    Assignee: Starkey Laboratories, Inc.
    Inventors: Susie Johansson, Andy Lambert
  • Patent number: 9456534
    Abstract: A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can. The portable terminal also includes at least one socket unit mounted to an upper side of the first assembly. The socket unit is mounted to an upper side of the flexible circuit board while the first assembly is positioned on a jig.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: September 27, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Hui Lee, Jung-Je Bang, Joon Heo
  • Patent number: 9433086
    Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: August 30, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Chih-Heng Chuo, Gwun-Jin Lin
  • Patent number: 9397014
    Abstract: An electrode includes an extending portion extending such that both ends thereof get into a first recessed portion and a second recessed portion provided in a first inner wall and a second inner wall, respectively, facing each other in a lateral direction of a case. The extent to which both the ends of the extending portion get into is set such that positions of both the ends thereof in a case where both the ends are narrowed toward a midpoint therebetween to reduce a length of the extending portion to 70% of the length of the extending portion exist between positions of the first and second inner walls in a case where the first and second inner walls are each narrowed toward a midpoint therebetween by 10% of the distance between the first and second inner walls.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: July 19, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masaomi Miyazawa, Mituharu Tabata, Takuya Takahashi
  • Patent number: 9334153
    Abstract: A MEMS assembly comprising a substrate and a MEMS device; wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of the substrate and the MEMS.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: May 10, 2016
    Assignee: HRL Laboratories, LLC
    Inventors: Raviv Perahia, Hung Nguyen, Richard J. Joyce
  • Patent number: 9263808
    Abstract: There is provided a pressure-bonding connection structural body and a female connector which can surely prevent the intrusion of moisture from an insulating cover side, and a method of manufacturing the connection structural body. In the connection structural body which is configured by connecting a crimp terminal and an insulated wire to each other, the crimp terminal having a barrel portion which is an integral body formed of; a cover pressure-bonding section which pressure-bonds by caulking the insulating cover; and a core wire pressure-bonding section which pressure-bonds an aluminum core wire by caulking, a water blocking projecting portion which prevents the intrusion of moisture in a longitudinal direction in a pressure-bonding state is formed, at the time of pressure-bonding the barrel portion, on an inner surface of the cover pressure-bonding section of the barrel portion where a cross-sectional shape in a width direction is formed into a closed cross-sectional shape.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 16, 2016
    Assignees: Furukawa Electric Co., Ltd., Furukawa Automotive Systems, Inc.
    Inventors: Yukihiro Kawamura, Takashi Tonoike, Satoshi Takamura
  • Patent number: 9247637
    Abstract: Intersection structures are provided to reduce a strain in a conformable electronic system that includes multi-level arrangements of stretchable interconnect structures. Bypass regions are formed in areas of the stretchable interconnect structures that may ordinarily cross or pass each other. The bypass regions of the stretchable interconnects are disposed relative to each other such that the intersection structure encompasses at least a portion of the bypass regions of each stretchable interconnect structure. The intersection structure has elastic properties that relieve a mechanical strain on the bypass regions during stretching at least one of the stretchable interconnect structures.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 26, 2016
    Assignee: MC10, Inc.
    Inventor: Yung-Yu Hsu
  • Patent number: 9240635
    Abstract: In a female crimp terminal having a pressure-bonding section which allows pressure-bonding and connection of a conductor tip in an insulated wire obtained by coating a conductor with an insulating cover and having the conductor tip in which the conductor is exposed by peeling off the insulating cover in a tip side, the pressure-bonding section is constructed by arranging a conductor pressure-bonding section and a cover pressure-bonding section from a tip side to a base end side in a long length direction in this order, the conductor pressure-bonding section pressure-bonding the conductor tip, and the cover pressure-bonding section pressure-bonding a conductor tip portion in the tip side of the insulating cover, the cover pressure-bonding section is formed into a hollow shape which can surround the conductor tip portion, and the conductor pressure-bonding section is formed to have a smaller diameter than the cover pressure-bonding section, and is formed into a hollow shape which can surround the conductor tip.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: January 19, 2016
    Assignees: Furukawa Electric Co., Ltd., Furukawa Automotive Systems, Inc.
    Inventors: Yukihiro Kawamura, Yasushi Kihara, Hiroshi Orito, Takashi Tonoike
  • Patent number: 9235092
    Abstract: In a region extending along a terminal region located near a substrate end and included in a frame region defined around a rectangular display region, a peripheral circuit section is provided between the display region and a mount region defined in part of the terminal region. The peripheral circuit section includes unit circuit sections that are monolithically provided and are aligned along one side of the display region. The arrangement pitch of outer ones of the unit circuit sections is larger than that of inner ones of the unit circuit sections.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 12, 2016
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Takahiro Yamaguchi, Shige Furuta, Makoto Yokoyama, Shuji Nishi, Yohsuke Fujikawa
  • Patent number: 9215360
    Abstract: There is provided a camera module including a housing having a lens part installed therein; a flexible circuit board having an extension part on which a lamp is installed, the extension part being coupled to the housing such that the lamp is disposed to be adjacent to the lens part; and a shield can having first and second through-holes formed therein such that the lens part and the lamp are exposed therethrough.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: December 15, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Jin Lee, Kyu Beom Cho, Woong Tae Jung
  • Patent number: 9209537
    Abstract: An electrical connector assembly for connecting a CPU with an FPC includes a first electrical connector having a first insulating housing and a plurality of first contacts retained in the first insulating housing, a second electrical connector electrically connecting the first electrical connector in a vertical direction having a second insulating housing and a plurality of second contacts retained in the second insulating housing, and a protecting cover assembled between the first electrical connector and the second electrical connector. The protecting cover includes a base and a plurality of through holes running through the base for receiving the second contacts to contact with the first contacts. The protecting cover includes a pair of buckling portions for locking the FPC and an acting portion extending upwardly from the buckling portion, the acting portion release the buckling portion off the FPC when a hand push the acting portion.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: December 8, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 9207261
    Abstract: A probe card for wafer level test includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes a first surface having a first pitch and a second surface having a second pitch substantially less than the first pitch, a printed circuit board configured approximate the first surface of the space transformer, a first power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line to the printed circuit board, and a second power plane disposed on a surface of the printed circuit board and patterned to couple the power line and the ground line of the space transformer to the printed circuit board, wherein the second power plane is in electrical connection with the first power plane.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: December 8, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Hsin Kuo, Wensen Hung
  • Patent number: 9166318
    Abstract: An electrical connector assembly combination includes a receptacle with a plurality of electrical contacts, and a connector device with housing configured to accept and retaining a terminal end of a flexible assembly comprising one or more flexible electrical conductors. The terminal end of the flexible assembly includes one or more electrical contacts. The connector device is capable of being reversibly coupled and interlocked with the receptacle such that each of the electrical contacts in the receptacle is electrically connected to a corresponding contact at the terminal end of the flexible assembly in a secure, removable and non-permanent manner.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: October 20, 2015
    Assignee: HI REL CONNECTORS, INC.
    Inventor: William E. Ritner
  • Patent number: 9161463
    Abstract: Disclosed is an electronic component which maintains good connection between a circuit board and connection terminals and provides size reduction. The electronic component includes a circuit board, a pair of connection terminals, and a housing with the pair of connection terminals mounted thereon. The circuit board is provided with a plurality of terminal sections connected to the connection terminals. Each connection terminal is provided with a spring member formed to be elastically deformable and which sandwich the terminal sections between them. A rib is provided in the housing, wherein the rib is provided between through-holes through which each of the pair of connection terminals pass, and whereby the rib is formed in convex shape, towards the circuit board and away from a bottom section of a substrate housing section in which the circuit board is housed, and the rib penetrates a plurality of terminal sections.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: October 13, 2015
    Assignee: Yazaki Corporation
    Inventors: Naoki Takamura, Tohru Kurosawa
  • Patent number: 9139144
    Abstract: A connector is provided for joining two electrical harnesses. Each harness is formed from a flexible printed circuit board which provides a plurality of conductive tracks, and each harness has a substantially planar terminating region at which the conductive tracks of the harness fan out. One or more receiving holes are formed in each terminating region to extend to respective conductive tracks. A connector includes a connection formation which is between respective terminating regions of the two electrical harnesses. The connector further includes a housing configured to hold the respective terminating regions of the two electrical harnesses in face-to-face relationship with the connection formation sandwiched therebetween.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: September 22, 2015
    Assignee: ROLLS-ROYCE plc
    Inventor: Paul Broughton
  • Patent number: 9128337
    Abstract: A display apparatus includes a display panel, and at least one flexible printed circuit board connected to the display panel. The display panel includes signal lines, pixels connected to the signal lines, and contact pads provided at one end of the signal lines. The flexible printed circuit board includes a fan-out part including a plurality of connection lines corresponding to the contact pads in a one-to-one correspondence, overlapping with the contact pads and connected to the contact pads, and a driving driver connected to the connection lines, the driving driver applying a driving signal to the pixels.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: September 8, 2015
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sang-Myoung Lee, Namseok Roh, Kyungtae Chae, Hyung-Il Jeon, Joo-Han Bae, Jihoon Yang
  • Patent number: 9121897
    Abstract: A thin heating device is provided. The thin heating device includes a first circuit board, a second circuit board, an elastic connector and a heating element. The first and second circuit boards are face-to-face arranged. The elastic connector connects the first and second circuit boards to apply a return force to hold an under-tested device. The heating element is mounted on the first or the second circuit board to heat the under-tested device.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: September 1, 2015
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventor: Mao-Yuan Lo
  • Patent number: 9077115
    Abstract: A terminal set of an electrical connector includes signal terminal duos and ground terminal duos. The signal terminal duos have two signal terminals. The signal terminals are spaced apart by a first distance and each have a first recess. The direction of the depth of the first recess equals the longitudinal direction of the signal terminals. The ground terminal duos have two ground terminals. The signal terminal duos are disposed between the ground terminals. The ground terminals each have a second recess. The direction of the depth of the second recess equals the longitudinal direction of the ground terminals. The ground terminal and the adjacent signal terminal are spaced apart by a second distance. The first distance is shorter than the second distance. The ground terminals each partially bulges out transversely to form at least a bulging portion. The terminal set features terminal electrical impedance and alleviated inter-terminal resonance.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: July 7, 2015
    Assignee: ALL BEST PRECISION TECHNOLOGY CO., LTD.
    Inventor: Haven Yang
  • Patent number: 9077127
    Abstract: A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: July 7, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Iwano, Mitsuru Iida, Daisuke Sato, Hidetoshi Takeyama
  • Patent number: 9076698
    Abstract: A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 7, 2015
    Assignee: Intel Corporation
    Inventors: Donald T. Tran, Zhichao Zhang
  • Patent number: 9060454
    Abstract: The invention relates to a printed circuit board arrangement (20) having at least two printed circuit boards (11; 12?), which are located alongside one another on a common, electrically conductive base plate (13?), have two mutually opposite edges, forming an intermediate space (14), and are connected to one another, bridging the intermediate space (14) by means of electrical connections (21), in order to transmit extremely high frequencies. In the case of a printed circuit board arrangement such as this, RF-compatible electrical connections are made between the printed circuit boards in a simple and space-saving manner when the printed circuit boards are fitted on the base plate and without any further necessary additional tasks or reworking, in that the electrical connections are each made via at least one contact-making element (21), via which the printed circuit boards make detachable electrical contact with one another when mounted on the base plate (13?).
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: June 16, 2015
    Assignee: Huber+Suhner AG
    Inventors: Martin Wagner, Josef Fuchs
  • Patent number: 9057506
    Abstract: A light module is disclosed. The light module includes a first printed circuit board, a second printed circuit board, a light source, and a fixing casing, wherein the first printed circuit board and the second printed circuit board each has a fixing part, and the fixing part of the second printed board is attached to the fixing part of the first printed board. The light source is disposed on the first printed circuit board to couple to the first printed board and the second printed board. The fixing casing has a contact surface. When the fixing casing is fixed onto the fixing parts of the second printed circuit board and the first printed circuit board, the contact surface contacts the fixing part so that the second printed circuit board is clamped between the contact surface and the first printed circuit board.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: June 16, 2015
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Tsai-Yi Chiu, Ping Lee, Cheng-Min Tsai
  • Patent number: 9048597
    Abstract: Printed circuit substrates may be formed from rigid printed circuit material or flexible sheets of polymer. Printed circuit substrates may have conductive traces. Integrated circuits, touch sensor electrode structure, sensors, and other components may be mounted to the conductive traces. Connectors such as board-to-board connectors may be used to couple printed circuit substrates together. To hold the connectors together and to provide electromagnetic shielding, printed circuits and connectors may be surrounded by printed circuit connector securing structures. The printed circuit connector securing structures may have one or more strips of conductive fabric tape wrapped around the connectors. Metal stiffening members may be attached to opposing ends of the strip of conductive tape to facilitate removal of the tape for rework or repair. An additional strip of tape may be used to help secure the wrapped conductive tape. The additional strip may have a tab to facilitate removal.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: June 2, 2015
    Assignee: Apple Inc.
    Inventors: Carl R. Peterson, Alex C. Yeung, Stephen R. McClure, Derek W. Wright
  • Patent number: 9032617
    Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: May 19, 2015
    Assignee: International Business Machines Corporation
    Inventors: David J. Braun, Mark G. Clark, John R. Dangler, Matthew S. Doyle, Thomas D. Kidd, Jason T. Stoll
  • Publication number: 20150126049
    Abstract: An electrical circuit including at least one electrical component, such as a power component, and an electrical flex circuit, and at least one electrical conductor part connecting the electrical component to the flex circuit, the electrical conductor part including at least a first contact portion configured to receive in contact a contact element of the electrical power component and a second contact portion configured to receive in contact a conductive layer of the electrical flex circuit, the extent of the width of the second contact portion corresponding to the width of the flex circuit, and the extent of the length of same being adjusted to provide a contact surface that one of transmitting a density of electrical current of between 4.5 and 5.5 A/mm2 and allowing the electrical circuit to support a current specific to the power component, i.e. between 30 and 80 A.
    Type: Application
    Filed: May 30, 2013
    Publication date: May 7, 2015
    Applicant: HISPANO SUIZA
    Inventors: Tony Lhommeau, Stephane Sorel
  • Publication number: 20150124352
    Abstract: A flexible printed circuit (FPC) may have reduced-tolerance electrical connection pads that comprise a connection portion and an adjacent window portion, where the position of a component that is mechanically and electrically connected to the FPC is limited by the geometry of the connection portion of the respective connection pads. The window portion includes an area void of conductive material and bounded by the connection portion on one side and may be bounded by peripheral portions on the other sides, where the peripheral portions are significantly narrower than the connection portion. A portion of the peripheral portions extending from the connection portion may be tucked under a portion of the FPC cover layer to prevent peeling of the peripheral portions.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Applicant: HGST Netherlands B.V.
    Inventors: Edgar Dennis Rothenberg, Yiduo Zhang
  • Patent number: 9018532
    Abstract: A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: April 28, 2015
    Assignee: Multi-Fineline Electronix, Inc.
    Inventors: Dale Wesselmann, Luis Chau, Chengkong Chris Wu
  • Patent number: 9013870
    Abstract: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided a portable electronic device, comprising an electrical assembly, comprising: a chassis made from a conductive material and forming a first ground plane; a first dielectric substrate layer overlaying the chassis; a first signal trace overlaying the first dielectric substrate layer; and a second dielectric layer overlaying the first signal trace.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 21, 2015
    Assignee: BlackBerry Limited
    Inventors: Eric Gary Malo, Cameron Russell Steeves, Hassan Daniel Hosseinpor
  • Patent number: 9004925
    Abstract: A connector assembly utilizes improved capacitive coupling for connecting together electrical circuits on two substrates (7, 8). The connector assembly includes first (2) and second (3) connectors respectively attached to first and second circuit substrates. The first connector includes a plurality of first conductors (25) connected to circuits (75) on the first circuit substrate and these conductors have exposed contact surfaces with a dielectric material (4) disposed thereon. The first conductors and associated dielectric material confront second, opposing conductors (35) supported by the second connector frame when the connector frames are engaged together. A liquid dielectric material (45) is interposed between the terminals and the dielectric portions that fills minute gaps which may occur in the dielectric portions to improve the capacitive coupling ability of the connector assembly.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: April 14, 2015
    Assignee: Molex Incorporated
    Inventors: Toshihiro Niitsu, Masako Nishikawa
  • Patent number: 8998622
    Abstract: Electronic devices may be provided with electronic components and electrical connectors coupled between the electronic components. A connector may be formed in a small gap between the electronic components. The connector may be a thin sheet of flexible conductive material with a conductive adhesive on one surface. The connector may be installed between the components using an applicator that is attached to the connector. The applicator may be a pull-tab liner having a first surface that is tacky and a second opposing surface that is non-stick. The applicator may have an extended portion that can be held by a technician while installing the connector. The connector may be installed by inserting the connector and applicator between the components, pinching the components against the connector and applicator, and removing the applicator by pulling the extended portion to peel the applicator from the connector.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: April 7, 2015
    Assignee: Apple Inc.
    Inventors: Taylor H. Gilbert, Sean S. Corbin
  • Publication number: 20150085452
    Abstract: A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.
    Type: Application
    Filed: August 12, 2014
    Publication date: March 26, 2015
    Applicant: NOVATEK MICROELECTRONICS CORP.
    Inventors: Chun-Yi CHOU, Yu-Chang PAI, Teng-Yang TAN, Shih-Wei TSENG
  • Patent number: 8970243
    Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: March 3, 2015
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Takashi Fujisaki, Kiyoto Nakamura
  • Patent number: 8956181
    Abstract: Disclosed herein is a connection structure between a substrate and a flexible printed circuit board (FPCB) for a touch panel, including: a substrate; first sensing electrodes; second sensing electrodes; first electrode wirings; second electrode wirings; and a flexible printed circuit board connected to the substrate so as to be electrically connected to the first and second electrode wirings, wherein a first connection portion of the first electrode wiring and a second connection portion of the second electrode wiring to which the flexible printed circuit board is electrically connected are formed on the upper and lower surfaces of the substrate, respectively, so as to face each other in a vertical direction. Therefore, the flexible printed circuit substrate may be connected to the substrate by a single assembling process.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: February 17, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Min Lee, Young Jae Kim, Ha Yoon Song, Ho Joon Park