Flexible Panel Patents (Class 439/67)
  • Patent number: 10992042
    Abstract: An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: April 27, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Sasaki
  • Patent number: 10964680
    Abstract: The display device includes a flexible base layer including a first region and a second region located around the first; a display unit on one surface of the first region and including a light emitting element; a driving circuit on the second region and including a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, the driving circuit includes a third bump in the first row and disposed outward relative to the plurality of first bumps, a first and second reference bump each disposed at a center of the plurality of first and second bumps that are disposed along a reference line defined in a column direction vertically intersecting a row direction, the remaining first and second bumps excluding the first reference bump and the second reference bump arranged to have a preset slope with respect to the reference line.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: March 30, 2021
    Inventors: Dae Geun Lee, Kyung Mok Lee, Suk Ho Choi
  • Patent number: 10952351
    Abstract: A narrow-bezel display device. A bezel in outer peripheral portions of the display device is reduced. A plurality of circuit films, a printed circuit board, and the like, connected to a display panel, are protected. Heat dissipation performance is improved.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: March 16, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: JongYoung Park, JinYoung Bang, Jikwang Jang
  • Patent number: 10943893
    Abstract: The present disclosure provides a stretchable display device, comprising: a lower substrate made of a stretchable insulating material and having an active area and a non-active area adjacent to the active area; a plurality of individual substrates spaced apart from each other and disposed in the active area of the lower substrate; pixels disposed on the plurality of individual substrates respectively; and a plurality of connecting lines disposed between the plurality of individual substrates on the lower substrate, and electrically connecting corresponding pads disposed within the plurality of individual substrates respectively. The modulus of the plurality of individual substrates is higher than the lower substrate.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: March 9, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Hyunju Jung, Eunah Kim
  • Patent number: 10897819
    Abstract: A display panel, a flexible circuit board and a display device are provided. The display panel includes a substrate, and at least one row of a plurality of input pads including at least one first-input pad disposed in the middle of the input pads and a plurality of second-input pads disposed on both sides of the first input pad. Each input pad includes a first end and a second end that are oppositely disposed, and a spacing between any adjacent two input pads includes a first spacing between adjacent two first ends and a second spacing between adjacent two second ends. The first spacing and the second spacing between any adjacent two second-input pads are not equal. Along a direction from the first-input pad to the second-input pad, starting from adjacent first-input and second-input pads, the first spacing and the second spacing successively and gradually increases, respectively.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: January 19, 2021
    Assignee: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Huangyao Wu, Shumao Wu, Guochang Lai
  • Patent number: 10892574
    Abstract: A cable to board interconnect device that is used to interconnect wires to a printed circuit board (PCB) that has conductive traces on its essentially flat surface, where the wires are essentially parallel to the face of the PCB. The device includes an alignment member that overlies the wires, and an elastomeric conductor between the wires and the PCB traces.
    Type: Grant
    Filed: October 21, 2017
    Date of Patent: January 12, 2021
    Assignee: Paricon Technologies Corporation
    Inventors: Roger Weiss, Everett Simons, William Petrocelli, Ethan Berkowitz
  • Patent number: 10886651
    Abstract: An electrical connector assembly used in an interior of an electronic device which includes an internal printed circuit board, a chip mounted on internal printed circuit board, internal conductive pads disposed close to the chip and electrically connected to the chip, and an interface connector away from the chip and electrically connected to the external electrical connector comprises a first connector electrically connected to the internal conductive pads and a cable connecting with the first connector, the cable being able to electrically connect to the interface connector, wherein the first connector includes first elastic terminals elastically contacting the internal conductive pads.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: January 5, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Kuei-Chung Tsai
  • Patent number: 10879662
    Abstract: An electric contact terminal configured to be forcibly inserted into an accommodation recess formed in a surface of an electrically conductive object and thus be reliably mounted on the electrically conductive object. The electric contact terminal includes: a metal body having a flat surface on at least an upper side thereof; and at least two projections protruding from a lateral side of the body, wherein the projections are sized such that the projections are placed on an edge of the accommodation recess.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: December 29, 2020
    Inventors: Kee-Han Park, Tae-Man Kang, Byung-Sun Jung, Sun-Ki Kim, Gyu-Seop Kim, Eung-Won Kim, Se-Deok Oh
  • Patent number: 10852784
    Abstract: An information handling system comprising a chassis supporting a motherboard, a graphics board, and an flexible compression jumper connector having a first compression jumper pad with a first array of compressible communication contacts operatively coupled to a first connector pad interface area on the motherboard and first clamping mechanism to compress the first array of compressible communication contacts to the motherboard. The flexible compression jumper connector having a second compression jumper pad with a second array of compressible communication contacts operatively coupled to a second connector pad interface area on the graphics board, and a second clamping mechanism to compress the second array of compressible communication contacts to the graphics board, where the flexible compression jumper connector has an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: December 1, 2020
    Assignee: Dell Products, LP
    Inventors: Arnold Thomas Schnell, Ivan Guerra, Gurpreet Sahota
  • Patent number: 10829603
    Abstract: There is provided a cured product of an epoxy resin composition, in which the compounding composition and the phase-separated structure of the epoxy resin composition are controlled so that the balance between rigidity and toughness of the cured product is superior compared with those of cured products of conventional epoxy resin compositions. A cured product of an epoxy resin composition, which has both superior rigidity and superior toughness compared with conventional materials can be produced by curing an epoxy resin composition comprising an epoxy resin, a polyrotaxane having graft-chain-modified cyclic molecules and a curing agent for the epoxy resin.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: November 10, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Keiichiro Nomura, Nobuhiro Morioka, Kentaro Sano, Noriyuki Hirano, Sadayuki Kobayashi
  • Patent number: 10756467
    Abstract: A communication system includes a first circuit card assembly having a first PCB including a first slot and a first electrical connector mounted to the first PCB along the first slot and having a first mating end. The communication system includes a second circuit card assembly having a second PCB and a second electrical connector mounted to the second PCB and having a second mating end. The first and second circuit card assemblies are mated along a board mating axis parallel to the first slot with the first PCB oriented perpendicular to the second PCB. The first and second mating ends are oriented parallel to the board mating axis. The second PCB is received in the first slot to align the second mating end with the first mating end.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: August 25, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: John Joseph Consoli, Chad William Morgan
  • Patent number: 10700459
    Abstract: A circuit board flex cable system includes a flex cable extending from a circuit board. A data transmission stack extends through the flex cable and the circuit board, and includes a first ground layer extending along its length and including a first grounding element, and a second ground layer extending along its length, spaced part from the first ground layer, and including a second grounding element. A signal layer in the data transmission stack extends along the length of the data transmission stack, is located between the first ground layer and the second ground layer, and includes a signal element that transmits signals. A third grounding element in the signal layer of the data transmission stack is provided adjacent the signal element and extends along a length of the data transmission stack adjacent to a termination of the flex cable in the circuit board.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: June 30, 2020
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Patent number: 10693247
    Abstract: A fixation structure includes an electrical wire, a board, and a stapler. The electrical wire includes a core wire and a cover member. The electrical wire includes a core-wire covered part covered by the cover member, and a core-wire exposed part exposed from the core-wire covered part. The board includes a junction part electrically connected with the core-wire exposed part. The stapler includes a contact part and a fixation part. The contact part has a plate shape, and is positioned at a boundary between the core-wire exposed part and the core-wire covered part while contacting the core-wire exposed part and the core-wire covered part from a side opposite to the board when the core-wire exposed part is connected with the junction part. A pair of the fixation parts are provided on both sides of the contact part and fix the contact part and the board.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: June 23, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Yuki Chiyajo, Hidehiko Shimizu, Haruhiko Yoshida, Keitaro Nozawa
  • Patent number: 10649496
    Abstract: A stretchable display device includes a substrate having a plurality of islands spaced apart from each other, and a plurality of bridges connecting each of the plurality of islands. A plurality of display units is disposed above the plurality of islands, respectively. A plurality of metal wirings are electrically connected to each of the plurality of display units. The plurality of metal wirings are disposed above the plurality of bridges. Each of the plurality of bridges includes a first region curved convexly in a first direction on a plane, and a second region curved concavely in the first direction. The second region is connected to the first region. Each of the plurality of metal wirings has a first width, and each of the plurality of bridges have a second width that is greater than the first width.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: May 12, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinwoo Choi, Youngse Jang, Haeyun Choi, Sungkook Park, Jaeik Lim
  • Patent number: 10601182
    Abstract: Provided is a connector that has a reduced profile and is capable of bringing shielding structures of two connectors coupled together into contact with each other. A connector (10) according to the present disclosure includes a first connector (20) and a second connector (70). The first connector (20) is equipped with a first insulator (30) that includes a pair of outer peripheral walls (32) opposing each other and a fitting projection (33) formed between the pair of outer peripheral walls (32), and a first shielding member (60) supported by the first insulator (30). The second connector (70) includes a second insulator (80) equipped with a fitting recess (83) fit to the fitting projection (33), and a second shielding member (110) supported by the second insulator (80). When the first connector (20) and the second connector (70) are fitted to each other, the first shielding member (60) and the second shielding member (110) are fitted to each other.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: March 24, 2020
    Assignee: KYOCERA CORPORATION
    Inventors: Shintaro Horino, Genta Yamazaki
  • Patent number: 10362670
    Abstract: An electronic device such as a cover for a portable device may be provided with a body having hinge portions. The hinge portions may allow the body to bend about one or more bend axes. The cover may have electrical components such as a keyboard. A keyboard may be mounted at one end of the cover and a connector may be mounted at an opposing end of the cover. A flexible fabric signal path structure may be formed from metal traces on a flexible fabric substrate. At one end of the cover, the flexible fabric signal path structure may be coupled to a printed circuit in the keyboard using conductive adhesive. At the opposing end of the cover, the metal traces on the flexible fabric substrate may be coupled to the connector.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: July 23, 2019
    Assignee: Apple Inc.
    Inventors: Benjamin A. Cousins, Kurt R. Stiehl, Samuel G. Smith, Kirk M. Mayer, Siddhartha Hegde, Melody Kuna
  • Patent number: 10310560
    Abstract: A stretchable display device includes a substrate having a plurality of islands spaced apart from each other, and a plurality of bridges connecting each of the plurality of islands. A plurality of display units is disposed above the plurality of islands, respectively. A plurality of metal wirings are electrically connected to each of the plurality of display units. The plurality of metal wirings are disposed above the plurality of bridges. Each of the plurality of bridges includes a first region curved convexly in a first direction on a plane, and a second region curved concavely in the first direction. The second region is connected to the first region. Each of the plurality of metal wirings has a first width, and each of the plurality of bridges have a second width that is greater than the first width.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinwoo Choi, Youngse Jang, Haeyun Choi, Sungkook Park, Jaeik Lim
  • Patent number: 10225932
    Abstract: Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: March 5, 2019
    Assignee: TACTOTEK OY
    Inventors: Tomi Simula, Vinski Bräysy, Mikko Heikkinen, Juha-Matti Hintikka, Minna Pirkonen, Pasi Raappana, Tuomas Heikkilä, Jarmo Sääski, Juhani Harvela
  • Patent number: 10211557
    Abstract: A connector assembly having two ends respectively connected to a case and a main circuit board comprises a bracket, a bottom plate assembled on the bottom of the bracket and a flexible circuit board located between the bracket and the bottom plate. The bracket includes a mating surface attached to the case, a mounting surface opposite the mating surface, and a receiving cavity recessed inwardly from the mounting surface. The bracket includes a pair of openings extending through the mating surface thereof and communicating with the receiving cavity. A pair of chip modules are disposed on the flexible circuit board corresponding to the openings. One side of the flexible circuit board, which is farther away from the bracket, includes an electrical connector for mating with the main circuit board.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: February 19, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 10112311
    Abstract: Disclosed is a wiring unit having a main portion of a flexible printed circuit (FPC) board therein. Said rotary joint further comprises a protective unit fixed to said wiring unit, in which an end portion of said FPC board is connected to a group of cables. Also disclosed is a robot comprising said rotary joint. Compared with the existing prior arts, the proposed solutions prevent the damage of FPC during assembly and/or disassembly of robots, while not losing compactness.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: October 30, 2018
    Assignee: ABB Schweiz AG
    Inventors: Tao Feng, Kaiyuan Cao, Yun Ha
  • Patent number: 10034377
    Abstract: A display device includes a flexible insulating substrate, an insulating layer on the insulating substrate, and a plurality of terminals made of a conductive material on the insulating layer. The insulating layer is disposed outside the area located between the terminals. The insulating substrate has a groove between the terminals.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: July 24, 2018
    Assignee: Japan Display Inc.
    Inventors: Kazuto Tsuruoka, Norio Oku, Takuya Nakagawa
  • Patent number: 9935227
    Abstract: A solar cell module includes: solar cells, each of which includes first and second principal surfaces, on which a first and second bus bar electrodes are provided respectively; a wiring member connecting the first bus bar electrode of one of adjacent solar cells and the second bus bar electrode of the other adjacent solar cell; a first resin adhesive layer connecting the wiring member and the first bus bar electrode; and a second resin adhesive layer connecting the wiring member and the second bus bar electrode. The wiring member includes a first bent section bent toward the second principal surface at an end of the first bus bar electrode or the first resin adhesive layer on the adjacent side, and a second bent section bent toward the first principal surface at an end of the second bus bar electrode or the second resin adhesive layer on the adjacent side.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: April 3, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Yukihiro Yoshimine
  • Patent number: 9929483
    Abstract: An electrical connection piece including: a flexible circuit board having: a central section penetrated by contact openings arranged mirror-symmetrically; a first and second arm, each of the first and second arms extending in different directions away from the central section, the end of the first arm having a first end surface, the end of the second arm having a second end surface, the end of the first arm having a third end surface opposing the first end surface and end of the second arm having a fourth end surface opposing the second end surface; first strip conductors extending between the contact openings and first electrical contacting surfaces; and second strip conductors extending between the contact openings and second electrical contacting surfaces; wherein the first electrical contacting surfaces have a contact configuration different from a contact configuration of the second electrical contacting surfaces.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: March 27, 2018
    Assignee: OLYMPUS WINTER & IBE GMBH
    Inventors: Martin Wieters, Jens Schnitger
  • Patent number: 9876299
    Abstract: The electrical connector assembly includes an insulative housing and a plurality of contacts retained in the housing. The stand includes a support and a spring supporting the support. The electrical connector is seated upon the support and moveable along with the support in the vertical direction due to deformation of the spring. Each of the contacts includes an upper contacting section and a lower contacting section. An electronic component located upon the housing and downwardly pressing and mechanically and electrically connected to the upper contacting sections. An FPC is sandwiched between the support and the electrical connector and mechanically and electrically connected to the lower contacting sections.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: January 23, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Fang-Jwu Liao, Po-Yuan Su
  • Patent number: 9755334
    Abstract: A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: September 5, 2017
    Assignee: INTEL CORPORATION
    Inventors: Xiang Li, Yun Ling, Chung-Hao J. Chen, Hao-Han Hsu, Shyamjith Mohan, Kuan-Yu Chen
  • Patent number: 9746886
    Abstract: The invention provides a storage system comprising a solid state storage carrier sized to correspond to a defined storage form factor and to include a support printed circuit board (PCB) having arranged thereon a plurality of solid state storage devices. The storage system can include a storage enclosure including a midplane and at least one slot on an end of the storage enclosure, sized to receive a solid state storage carrier for connection with the midplane in the storage enclosure. The storage system can also include at least one midplane connector located on the midplane, wherein the at least one midplane connector is configured to mate with at least one form factor connector on an end of the solid state storage carrier.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: August 29, 2017
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: David Michael Davis, Alexander Carl Worrall, Alan John Westbury
  • Patent number: 9713851
    Abstract: A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: July 25, 2017
    Assignee: Apple Inc.
    Inventors: Nicholas G. Merz, Shayan Malek, Sawyer I. Cohen, Timothy Lui
  • Patent number: 9648744
    Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 9, 2017
    Assignee: APPLE INC.
    Inventors: Michael B. Wittenberg, Miguel C. Christophy, Shayan Malek
  • Patent number: 9583855
    Abstract: A circuit board device is provided, including: a first circuit board having a first predetermined connection section; a second circuit board arranged opposite to the first circuit board and having a second predetermined connection section directly facing the first predetermined connection section; and a connector including a first portion and a second portion. The connecter has: a first state where the first portion is arranged at a side of the first circuit board away from the second circuit board, the second portion is arranged at a side of the second circuit board away from the first circuit board, and the first portion and the second portion cooperate with each other to press the first circuit board against the second circuit board; and a second state where the first circuit board is separated from the second circuit board.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: February 28, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Rubo Ying, Shounian Chen, Jinmoo Park
  • Patent number: 9578753
    Abstract: A method for manufacturing a display device includes: connecting a first printed circuit board and a second printed circuit board with a first connecting film, the first printed circuit board and the second printed circuit board configured to apply a driving signal to a display panel; attaching a fixing member to the first printed circuit board and the second printed circuit board, such that the first connecting film extends away from the display panel and the first printed circuit board is spaced apart from the display panel; attaching the second printed circuit board to the display panel with second connecting films; removing the fixing member; and attaching the first printed circuit board to the display panel.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: February 21, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sung-Dae Bae, Myoung-Soo Kim
  • Patent number: 9515039
    Abstract: A substrate structure is provided, which includes a substrate body having a plurality of conductive pads, and a plurality of first conductive bumps and a plurality of second conductive bumps disposed on the conductive pads. Each of the second conductive bumps is less in width than each of the first conductive bumps, and is of a height with respect to the substrate body greater than a height of each of the first conductive bumps with respect to the substrate body. Therefore, the height difference between the first pre-solder layer and the second pre-solder layer after a reflow process can be compensated, and the first conductive bumps and the second conductive bumps thus have a uniform height.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: December 6, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chieh-Lung Lai, Lu-Yi Chen, Yu-Chuan Chen, Chang-Lun Lu
  • Patent number: 9478885
    Abstract: An electronic module package including an electronic module configured to receive input signals and process the input signals to provide output signals. The electronic module package also includes an interposer that has a substrate with opposite board and module surfaces. The electronic module is mounted to the module surface. The interposer includes electrical contacts along the module surface that are communicatively coupled to the electronic module through the substrate. The electronic module package also includes a connector receptacle having a receptacle housing coupled to the interposer. The receptacle housing defines a reception space that is located over and permits access to the electrical contacts. The connector receptacle is configured to receive an electrical connector within the reception space to electrically couple the electrical contacts and the electrical connector. The connector receptacle holds the electrical connector therein in a mated position.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: October 25, 2016
    Assignee: Tyco Electronics Corporation
    Inventor: Alan R. MacDougall
  • Patent number: 9474154
    Abstract: A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: October 18, 2016
    Assignee: Starkey Laboratories, Inc.
    Inventors: Susie Johansson, Andy Lambert
  • Patent number: 9456534
    Abstract: A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can. The portable terminal also includes at least one socket unit mounted to an upper side of the first assembly. The socket unit is mounted to an upper side of the flexible circuit board while the first assembly is positioned on a jig.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: September 27, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Hui Lee, Jung-Je Bang, Joon Heo
  • Patent number: 9433086
    Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: August 30, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Chih-Heng Chuo, Gwun-Jin Lin
  • Patent number: 9397014
    Abstract: An electrode includes an extending portion extending such that both ends thereof get into a first recessed portion and a second recessed portion provided in a first inner wall and a second inner wall, respectively, facing each other in a lateral direction of a case. The extent to which both the ends of the extending portion get into is set such that positions of both the ends thereof in a case where both the ends are narrowed toward a midpoint therebetween to reduce a length of the extending portion to 70% of the length of the extending portion exist between positions of the first and second inner walls in a case where the first and second inner walls are each narrowed toward a midpoint therebetween by 10% of the distance between the first and second inner walls.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: July 19, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masaomi Miyazawa, Mituharu Tabata, Takuya Takahashi
  • Patent number: 9334153
    Abstract: A MEMS assembly comprising a substrate and a MEMS device; wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of the substrate and the MEMS.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: May 10, 2016
    Assignee: HRL Laboratories, LLC
    Inventors: Raviv Perahia, Hung Nguyen, Richard J. Joyce
  • Patent number: 9263808
    Abstract: There is provided a pressure-bonding connection structural body and a female connector which can surely prevent the intrusion of moisture from an insulating cover side, and a method of manufacturing the connection structural body. In the connection structural body which is configured by connecting a crimp terminal and an insulated wire to each other, the crimp terminal having a barrel portion which is an integral body formed of; a cover pressure-bonding section which pressure-bonds by caulking the insulating cover; and a core wire pressure-bonding section which pressure-bonds an aluminum core wire by caulking, a water blocking projecting portion which prevents the intrusion of moisture in a longitudinal direction in a pressure-bonding state is formed, at the time of pressure-bonding the barrel portion, on an inner surface of the cover pressure-bonding section of the barrel portion where a cross-sectional shape in a width direction is formed into a closed cross-sectional shape.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 16, 2016
    Assignees: Furukawa Electric Co., Ltd., Furukawa Automotive Systems, Inc.
    Inventors: Yukihiro Kawamura, Takashi Tonoike, Satoshi Takamura
  • Patent number: 9247637
    Abstract: Intersection structures are provided to reduce a strain in a conformable electronic system that includes multi-level arrangements of stretchable interconnect structures. Bypass regions are formed in areas of the stretchable interconnect structures that may ordinarily cross or pass each other. The bypass regions of the stretchable interconnects are disposed relative to each other such that the intersection structure encompasses at least a portion of the bypass regions of each stretchable interconnect structure. The intersection structure has elastic properties that relieve a mechanical strain on the bypass regions during stretching at least one of the stretchable interconnect structures.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 26, 2016
    Assignee: MC10, Inc.
    Inventor: Yung-Yu Hsu
  • Patent number: 9240635
    Abstract: In a female crimp terminal having a pressure-bonding section which allows pressure-bonding and connection of a conductor tip in an insulated wire obtained by coating a conductor with an insulating cover and having the conductor tip in which the conductor is exposed by peeling off the insulating cover in a tip side, the pressure-bonding section is constructed by arranging a conductor pressure-bonding section and a cover pressure-bonding section from a tip side to a base end side in a long length direction in this order, the conductor pressure-bonding section pressure-bonding the conductor tip, and the cover pressure-bonding section pressure-bonding a conductor tip portion in the tip side of the insulating cover, the cover pressure-bonding section is formed into a hollow shape which can surround the conductor tip portion, and the conductor pressure-bonding section is formed to have a smaller diameter than the cover pressure-bonding section, and is formed into a hollow shape which can surround the conductor tip.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: January 19, 2016
    Assignees: Furukawa Electric Co., Ltd., Furukawa Automotive Systems, Inc.
    Inventors: Yukihiro Kawamura, Yasushi Kihara, Hiroshi Orito, Takashi Tonoike
  • Patent number: 9235092
    Abstract: In a region extending along a terminal region located near a substrate end and included in a frame region defined around a rectangular display region, a peripheral circuit section is provided between the display region and a mount region defined in part of the terminal region. The peripheral circuit section includes unit circuit sections that are monolithically provided and are aligned along one side of the display region. The arrangement pitch of outer ones of the unit circuit sections is larger than that of inner ones of the unit circuit sections.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 12, 2016
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Takahiro Yamaguchi, Shige Furuta, Makoto Yokoyama, Shuji Nishi, Yohsuke Fujikawa
  • Patent number: 9215360
    Abstract: There is provided a camera module including a housing having a lens part installed therein; a flexible circuit board having an extension part on which a lamp is installed, the extension part being coupled to the housing such that the lamp is disposed to be adjacent to the lens part; and a shield can having first and second through-holes formed therein such that the lens part and the lamp are exposed therethrough.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: December 15, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Jin Lee, Kyu Beom Cho, Woong Tae Jung
  • Patent number: 9209537
    Abstract: An electrical connector assembly for connecting a CPU with an FPC includes a first electrical connector having a first insulating housing and a plurality of first contacts retained in the first insulating housing, a second electrical connector electrically connecting the first electrical connector in a vertical direction having a second insulating housing and a plurality of second contacts retained in the second insulating housing, and a protecting cover assembled between the first electrical connector and the second electrical connector. The protecting cover includes a base and a plurality of through holes running through the base for receiving the second contacts to contact with the first contacts. The protecting cover includes a pair of buckling portions for locking the FPC and an acting portion extending upwardly from the buckling portion, the acting portion release the buckling portion off the FPC when a hand push the acting portion.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: December 8, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 9207261
    Abstract: A probe card for wafer level test includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes a first surface having a first pitch and a second surface having a second pitch substantially less than the first pitch, a printed circuit board configured approximate the first surface of the space transformer, a first power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line to the printed circuit board, and a second power plane disposed on a surface of the printed circuit board and patterned to couple the power line and the ground line of the space transformer to the printed circuit board, wherein the second power plane is in electrical connection with the first power plane.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: December 8, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Hsin Kuo, Wensen Hung
  • Patent number: 9166318
    Abstract: An electrical connector assembly combination includes a receptacle with a plurality of electrical contacts, and a connector device with housing configured to accept and retaining a terminal end of a flexible assembly comprising one or more flexible electrical conductors. The terminal end of the flexible assembly includes one or more electrical contacts. The connector device is capable of being reversibly coupled and interlocked with the receptacle such that each of the electrical contacts in the receptacle is electrically connected to a corresponding contact at the terminal end of the flexible assembly in a secure, removable and non-permanent manner.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: October 20, 2015
    Assignee: HI REL CONNECTORS, INC.
    Inventor: William E. Ritner
  • Patent number: 9161463
    Abstract: Disclosed is an electronic component which maintains good connection between a circuit board and connection terminals and provides size reduction. The electronic component includes a circuit board, a pair of connection terminals, and a housing with the pair of connection terminals mounted thereon. The circuit board is provided with a plurality of terminal sections connected to the connection terminals. Each connection terminal is provided with a spring member formed to be elastically deformable and which sandwich the terminal sections between them. A rib is provided in the housing, wherein the rib is provided between through-holes through which each of the pair of connection terminals pass, and whereby the rib is formed in convex shape, towards the circuit board and away from a bottom section of a substrate housing section in which the circuit board is housed, and the rib penetrates a plurality of terminal sections.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: October 13, 2015
    Assignee: Yazaki Corporation
    Inventors: Naoki Takamura, Tohru Kurosawa
  • Patent number: 9139144
    Abstract: A connector is provided for joining two electrical harnesses. Each harness is formed from a flexible printed circuit board which provides a plurality of conductive tracks, and each harness has a substantially planar terminating region at which the conductive tracks of the harness fan out. One or more receiving holes are formed in each terminating region to extend to respective conductive tracks. A connector includes a connection formation which is between respective terminating regions of the two electrical harnesses. The connector further includes a housing configured to hold the respective terminating regions of the two electrical harnesses in face-to-face relationship with the connection formation sandwiched therebetween.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: September 22, 2015
    Assignee: ROLLS-ROYCE plc
    Inventor: Paul Broughton
  • Patent number: 9128337
    Abstract: A display apparatus includes a display panel, and at least one flexible printed circuit board connected to the display panel. The display panel includes signal lines, pixels connected to the signal lines, and contact pads provided at one end of the signal lines. The flexible printed circuit board includes a fan-out part including a plurality of connection lines corresponding to the contact pads in a one-to-one correspondence, overlapping with the contact pads and connected to the contact pads, and a driving driver connected to the connection lines, the driving driver applying a driving signal to the pixels.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: September 8, 2015
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sang-Myoung Lee, Namseok Roh, Kyungtae Chae, Hyung-Il Jeon, Joo-Han Bae, Jihoon Yang
  • Patent number: 9121897
    Abstract: A thin heating device is provided. The thin heating device includes a first circuit board, a second circuit board, an elastic connector and a heating element. The first and second circuit boards are face-to-face arranged. The elastic connector connects the first and second circuit boards to apply a return force to hold an under-tested device. The heating element is mounted on the first or the second circuit board to heat the under-tested device.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: September 1, 2015
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventor: Mao-Yuan Lo
  • Patent number: 9077127
    Abstract: A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: July 7, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Iwano, Mitsuru Iida, Daisuke Sato, Hidetoshi Takeyama