Having Treated (e.g., Coated) Surface Or Distinct Contact Surface Layer Patents (Class 439/886)
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Publication number: 20130084758Abstract: A contact includes a contact portion to which a conductive portion of a connecting member is connected upon sliding in at least one sliding direction. The contact includes a first arm portion extending in parallel to the sliding direction. The arm portion includes a punched surface, a chevron portion provided on the punched surface and projecting in a direction intersecting the sliding direction, and a gold plating layer provided on the punched surface. The chevron portion has an apex portion making up the contact portion and one pair of inclined surface portions disposed at respective sides of the apex portion in regard to the sliding direction. The gold plating layer provided on the punched surface is disposed only on at least a portion of the inclined surface portion at an opposite direction side of the sliding direction and at least a portion of the apex portion.Type: ApplicationFiled: October 3, 2012Publication date: April 4, 2013Applicant: J.S.T. MFG. CO., LTD.Inventor: J.S.T. MFG. CO., LTD.
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Patent number: 8403714Abstract: It is aimed not to increase contact resistance between a wire and a wire crimping portion even upon being subjected to a thermal cycle. A gold plating layer is formed on a base metal (20) via a nickel plating layer (21) in a terminal contact portion (11) to be held in contact with a mating terminal. A tin plating layer (23) is formed on the base metal (20) without via the nickel plating layer (21) in a wire crimping portion (12) to be crimped and connected to a core (15) of an insulated wire (14).Type: GrantFiled: November 4, 2009Date of Patent: March 26, 2013Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Takehiro Nakata, Michiaki Okamoto, Takuya Inoue
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Publication number: 20130072074Abstract: A terminal structure of a wiring harness for automobile use having a profound anticorrosive effect. A terminal member is fixed to a terminal portion of a coated electric wire such that a crimping portion that the member includes at its one end is crimped around a coating portion of the wire in a terminal region of the wire. A resin member completely covers at least entire outer surfaces of an exposed region at an end portion of the crimping portion and its vicinal region, and is made from a material mainly containing a thermoplastic polyamide resin, and having a tensile lap-shear strength of lapped aluminums of 6 N/mm2 or more in accordance with the JIS K6850, an elongation of 100% or more in accordance with the ASTM D-1708, and a water absorption of 1.0% or less in accordance with the JIS K7209.Type: ApplicationFiled: July 4, 2011Publication date: March 21, 2013Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD.Inventors: Masato Inoue, Kazunari Sakura, Hiroshi Sudou, Yukiyasu Sakamoto, Hiroshi Yamaguchi, Hisahiro Yasuda, Tetsuya Nakamura, Shigeyuki Tanaka, Naoya Nishimura, Daisuke Hashimoto, Yukou Sato
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Publication number: 20130023166Abstract: A method for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil or other contaminants and exposing the electrical contact to at least one of an acid or base. The method also includes preparing a silver plating bath including a silver compound, a transition metal compound, and a supporting salt, wherein the transition metal is at least one of nickel or cobalt. The method further includes silver plating the electrical contact in the silver plating bath.Type: ApplicationFiled: July 20, 2011Publication date: January 24, 2013Applicant: TYCO ELECTRONICS CORPORATIONInventors: ZHENGWEI LIU, ROBERT DANIEL HILTY
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Patent number: 8342895Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.Type: GrantFiled: March 31, 2008Date of Patent: January 1, 2013Assignee: Furukawa Electric Co., Ltd.Inventors: Kazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa
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Patent number: 8298022Abstract: A male connector (10) has a male terminal fitting (20) mounted in a male housing (10A). The male housing (10A) has tube (11) surrounding the male terminal fitting (20). The tube (11) is spaced out from a conductive part (23) of the male terminal fitting (20) by a distance so that a finger cannot be inserted between the tube (11) and the male terminal fitting (20). A fit-on part (31) of a female connector (30) can be inserted between the tube (11) and the male terminal fitting (20) so that a female terminal fitting (34) can contact the conductive part (23) of the male terminal fitting (20). An insulating coating (26) is formed on a front end of the male terminal fitting (20) by molding a resin to prevent shocks.Type: GrantFiled: August 23, 2010Date of Patent: October 30, 2012Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Satoshi Tsuruta, Takeshi Ishibashi
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Patent number: 8216006Abstract: A composite assembly for an electrical connector includes a conductive substrate and an electrodeposited layer. The conductive substrate is configured to form a conductive path of the electrical connector. The electrodeposited layer is disposed on the conductive substrate and includes a dielectric material. A method of manufacturing a composite assembly for an electrical connector includes providing a fluid bath that includes a dielectric material and immersing at least part of a conductive substrate into the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate and electrodepositing a dielectric layer that includes the dielectric material on the conductive substrate.Type: GrantFiled: June 7, 2010Date of Patent: July 10, 2012Assignee: Tyco Electronics CorporationInventors: Mary Elizabeth Sullivan, Robert Daniel Hilty
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Patent number: 8202132Abstract: A pair of confronting and spaced contact surfaces of a predetermined conductive material are electrically interconnected by a spring-type contact that is between the surfaces. The contact has an anchored end secured to one of the surfaces, an opposite free end, and a plurality of blades unitary with and extending between the ends and each having a bowed section engaging a respective contact surface. These bowed sections of the contact extend in opposite directions toward the contact surfaces and form contact points engageable with the respective contact surfaces. A coating on each of the contact points is of a material matched to the conductive material of the contact surfaces.Type: GrantFiled: April 10, 2006Date of Patent: June 19, 2012Assignee: Hirschmann Car Communication GmbHInventors: David Silva, Helmut Häussler
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Publication number: 20120149257Abstract: A contact assembly includes a conductive substrate, a composite layer, and a conductive layer. The conductive substrate is configured to form a conductive path of the electrical connector. The composite layer is engaged to the conductive substrate and includes a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer. The conductive layer is engaged to the composite layer. The conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes.Type: ApplicationFiled: February 17, 2012Publication date: June 14, 2012Applicant: TYCO ELECTRONICS CORPORATIONInventor: Mary Elizabeth Sullivan Malervy
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Patent number: 8188392Abstract: A contactor has two contact elements (1, 2) each having a contact member (3, 4) adapted to bear with the contact side (5, 6) thereof against a said contact side of the other contact member for enabling an electric current to flow between said to contact elements. The contact sides of both contact members are provided with serration's (11, 12) extending so that elongated ridge-like peaks (13) of serration's of one said contact side intersect such peaks of the other said contact side while forming a plurality of spots of mutual contact of these contact sides distributed over the area of said contact sides.Type: GrantFiled: March 23, 2007Date of Patent: May 29, 2012Assignee: ABB ABInventors: Peter Isberg, Joachim Glatz-Reichenbach, Mats M Johansson, Krister Linnarud, Lars X Eriksson
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Patent number: 8172627Abstract: An electrical connector is disclosed. The electrical connector has a plug and a receptacle that are connectable in a mated position. At least one of the plug and the receptacle have a body and an electrically conductive layer applied directly to the body.Type: GrantFiled: December 3, 2008Date of Patent: May 8, 2012Assignee: Tyco Electronics CorporationInventors: Kenneth R. Gleason, Navin Kanjibhai Patel, Mark A. Hippert, Valentino Girolamo, Laurence A. Daane
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Patent number: 8174132Abstract: An in-line capacitor, having a pair of inner conductor segments, each of the inner conductor segments having a mating surface. A dielectric spacer positioned between the mating surfaces, each of the mating surfaces having corresponding folds formed thereon.Type: GrantFiled: January 17, 2007Date of Patent: May 8, 2012Assignee: Andrew LLCInventor: Kendrick Van Swearingen
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Patent number: 8142906Abstract: In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 ?m, an average thickness of the Cu—Sn alloy layer is 0.55 to 1.0 ?m, and an average thickness of the Sn layer is 0.2 to 1.0 ?m. The Cu—Sn alloy layer includes Cu—Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an ?-phase having an average thickness of 0.5 to 0.95 ?m, and a portion thereof in contact with the Sn layer is formed of a ?-phase having an average thickness of 0.05 to 0.2 ?m.Type: GrantFiled: February 25, 2010Date of Patent: March 27, 2012Assignee: Kobe Steel, Ltd.Inventors: Kouichi Taira, Yasushi Masago
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Patent number: 8133082Abstract: An electrical conductor, e.g., a terminal pin, includes a conductor body, a first layer at least partially applied to the conductor body, and a second layer at least partially applied to the first layer, the material of the second layer containing thiol, and the material of the first layer containing nickel.Type: GrantFiled: September 14, 2009Date of Patent: March 13, 2012Assignee: Robert Bosch GmbHInventor: Ronny Ludwig
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Publication number: 20120058692Abstract: A contact is included by an electrical connector and has a base layer and a plating layer. The base layer includes a contacting portion at one end thereof, a soldering portion at the other end thereof, and a connecting portion connecting the contacting portion and the soldering portion. The plating layer is plated on the base layer. The plating layer includes a nickel plating layer plated on the contacting portion, the soldering portion and the connecting portion of the base layer, a first gold plating layer and a second gold plating layer plated on two end portions of the nickel plating layer corresponding to the contacting portion and the soldering portion, respectively. A middle portion of the nickel plating layer corresponding to the connecting portion is exposed outside.Type: ApplicationFiled: September 2, 2010Publication date: March 8, 2012Applicant: Cheng Uei Precision Industry Co., LTDInventors: CHENG-QIANG HUANG, Bing-Tao Yang, Yin-Lung Wu, Ming-Chiang Chen
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Patent number: 8101285Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.Type: GrantFiled: September 29, 2010Date of Patent: January 24, 2012Assignee: The Furukawa Electric Co., Ltd.Inventors: Kengo Mitose, Shuichi Kitagawa, Yoshiaki Ogiwara
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Publication number: 20120009829Abstract: In a plasma processing apparatus, a member for propagating high frequency from a high frequency power supply and/or to which the high frequency is applied. A power feed rod is electromagnetically shielded between a matching unit and a bottom plate of a chamber by a coaxial cylindrical conductor connected to a ground potential. A surface potential system disposed in an appropriate distance from the power feed rod in radius direction is installed in the cylindrical conductor, and measures in a non-contact state the electrostatic surface potential of the power feed rod through electrostatic capacitance and provides a controller with a surface potential detection signal including surface potential measurement value information. The controller performs a required signal processing or operation processing on the basis of the surface potential detection signal from the surface potential system, thereby obtaining the measurement value of the DC potential on the power feed rod.Type: ApplicationFiled: September 20, 2011Publication date: January 12, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Satoshi MAEBASHI, Toshihiro Hayami, Naoyuki Umehara
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Patent number: 8092263Abstract: An object of the invention is to provide a process for providing a connector, which prevents component atoms constituting a material and a substrate layer from diffusing into a tin-containing material layer and suppressing an occurrence of external force-type whiskers upon the application of external force to a surface of the tin-containing material layer, and a connector produced by the same process. In a production process of a connector comprising a step of providing a substrate layer on a surface of the material to surface treat the material and a step of providing a tin-containing material layer on an upside of the substrate layer to surface treat the substrate layer, the object can be achieved by further comprising a step of providing a barrier intermediate layer before the provision of the tin-containing material layer.Type: GrantFiled: July 7, 2008Date of Patent: January 10, 2012Assignee: DDK Ltd.Inventors: Hiroyuki Moriuchi, Yoshihiro Tadokoro, Eiichi Mikogai, Yoshiichi Nakano
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Patent number: 8066517Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.Type: GrantFiled: February 3, 2011Date of Patent: November 29, 2011Inventor: James V. Russell
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Patent number: 8016624Abstract: A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.Type: GrantFiled: September 22, 2006Date of Patent: September 13, 2011Assignee: Enplas CorporationInventors: Takahiro Oda, Kentaro Hayakawa, Takashi Morinari
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Patent number: 8002595Abstract: An electrical contact material includes a surface layer formed of a noble metal or an alloy containing the noble metal as a major constituent. An organic film having heat resistance is formed on a surface of the surface layer, and the organic film is formed of an organic compound having an ether bonding group. Accordingly, the electrical contact material has good corrosion resistance and sliding resistance.Type: GrantFiled: January 11, 2008Date of Patent: August 23, 2011Assignee: Furukawa Electric Co., Ltd.Inventor: Yoshiaki Kobayashi
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Publication number: 20110162707Abstract: The invention relates to an electrical contact t comprising a strip substrate comprising a conductive layer of a metal or an alloy provided on the surface of the substrate and an oxide layer provided on the conductive layer. By means of the oxide layer the underlying metal or alloy layer is protected from reaction with elements such as oxide or sulphur in the ambient air. The invention also relates to products such as fuel cells and solar cells comprising the electrical contact.Type: ApplicationFiled: July 3, 2009Publication date: July 7, 2011Applicant: Sandvik Intellectual Property ABInventors: Mikael Schuisky, Sara Wiklund
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Patent number: 7946871Abstract: An electrical connector in accordance with the present invention includes an insulative housing defining a mating direction and at least one contact-receiving passage extending along a mating direction, at least one conductive contact received in the at least one contact-receiving passage for electrically connecting with a conductive contact of a complementary connector, and a protection element. The at least one conductive contact includes a retention section interferentially received in the at least one contact-receiving passage, and a mating section extending from the retention section for electrically connecting with corresponding conductive contact of the complementary connector, and a mounting section extending from the retention section. The mating section forms a tip end at a free end thereof. The protection element is integrally formed with the tip end of the mating section of the at least one conductive contact and wraps the tip end.Type: GrantFiled: July 8, 2010Date of Patent: May 24, 2011Assignee: Alltop Electronics (Suzhou) Co., LtdInventors: Wang-I Yu, Hung-Chi Tai, Yung-Chih Hung
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Patent number: 7934962Abstract: The present invention provides a contact probe pin having both electrical conductivity and durability and being capable of realizing low adhesion to the device under test (particularly, tin contained therein) and thereby stably maintaining electrical contact over a long period of time. The present invention relates to a contact probe pin comprising: a base material; and a carbon film comprising at least one of a metal and a carbide thereof, wherein the carbon film is continuously formed over the surface of from a tip part of the contact probe pin to a lateral part of the contact probe pin, and a content of the at least one of a metal and a carbide thereof in the carbon film is continuously or intermittently decreased from the tip part toward the lateral part.Type: GrantFiled: August 4, 2010Date of Patent: May 3, 2011Assignees: Kobe Steel, Ltd., Kobelco Research Institute, Inc.Inventors: Takayuki Hirano, Takashi Miyamoto
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Patent number: 7931476Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.Type: GrantFiled: April 30, 2010Date of Patent: April 26, 2011Inventor: James V. Russell
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Publication number: 20110086558Abstract: An electrical contact material includes a base material, a first number of plating layers forming a contact section and a second number of plating layers forming a soldering section, respectively. The second number of plating layers is provided on the base material and includes a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.Type: ApplicationFiled: October 14, 2010Publication date: April 14, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chih-Pi Cheng, Cheng-Ching Chien, Jia-Hau Liu, Been-Yang Liaw
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Patent number: 7905755Abstract: A corrosion resistant electrical connection structure has an electrically conductive cable with a core made from a first electrically conductive material and an insulative outer cover. A terminal is electrically connected to the core at a lead extending beyond the insulative outer cover. A conformal coating covers and seals the lead of the core not in direct contact with the terminal.Type: GrantFiled: October 8, 2009Date of Patent: March 15, 2011Assignee: Delphi Technologies, Inc.Inventor: Francis D. Martauz
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Patent number: 7871710Abstract: Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 ?m; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D1] of the minimum inscribed circle of the Sn covering layer is 0.2 ?m or less, the diameter [D2] of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 ?m, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 ?m or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 ?m or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.Type: GrantFiled: July 11, 2008Date of Patent: January 18, 2011Assignee: Kobe Steel, Ltd.Inventors: Yasushi Masago, Ryoichi Ozaki, Hiroshi Sakamoto, Yukio Sugishita
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Publication number: 20110009015Abstract: A fretting-resistant connector, having an organic coating that is formed of an organic compound which has an ether linkage group at least a part on a surface of an electrically conductive metal material.Type: ApplicationFiled: June 30, 2008Publication date: January 13, 2011Applicant: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Kazuo Yoshida, Yoshiaki Kobayashi
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Publication number: 20100311289Abstract: A composite assembly for an electrical connector includes a conductive substrate and an electrodeposited layer. The conductive substrate is configured to form a conductive path of the electrical connector. The electrodeposited layer is disposed on the conductive substrate and includes a dielectric material. A method of manufacturing a composite assembly for an electrical connector includes providing a fluid bath that includes a dielectric material and immersing at least part of a conductive substrate into the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate and electrodepositing a dielectric layer that includes the dielectric material on the conductive substrate.Type: ApplicationFiled: June 7, 2010Publication date: December 9, 2010Applicant: Tyco Electronics CorporationInventors: Mary Elizabeth Sullivan, Robert Daniel Hilty
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Publication number: 20100311288Abstract: The present invention relates to a method of producing a electrical contact element, in which a multilayer structure is formed by applying a diffusion barrier layer to a base material and at least one metallic layer made of a metal to the diffusion barrier layer, at least one layer formed of tin being applied as the metallic layer. The present invention further relates to an electrical contact element with an electrically conductive base material and a coating which is formed on at least one portion of the electrically conductive base material, the coating having a diffusion barrier layer formed on the base material and the outer layer containing tin.Type: ApplicationFiled: September 25, 2008Publication date: December 9, 2010Inventors: Jochen Horn, Walter Mueller, Helge Schmidt, Hannes Wendling
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Patent number: 7824776Abstract: A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.Type: GrantFiled: August 19, 2008Date of Patent: November 2, 2010Assignee: The Furukawa Electric Co., Ltd.Inventors: Kazuo Yoshida, Kyota Susai
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Patent number: 7820303Abstract: There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 ?m and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 ?m, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%.Type: GrantFiled: September 8, 2005Date of Patent: October 26, 2010Assignee: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)Inventors: Motohiko Suzuki, Hiroshi Sakamoto, Yukio Sugishita, Riichi Tsuno
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Patent number: 7815475Abstract: A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.Type: GrantFiled: December 19, 2008Date of Patent: October 19, 2010Assignee: Molex IncorporatedInventors: Kirk B. Peloza, Victor Zaderej, John Dolaz, Stephen Rushing
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Publication number: 20100255735Abstract: An object of the invention is to provide a process for providing a connector, which prevents component atoms constituting a material and a substrate layer from diffusing into a tin-containing material layer and suppressing an occurrence of external force-type whiskers upon the application of external force to a surface of the tin-containing material layer, and a connector produced by the same process. In a production process of a connector comprising a step of providing a substrate layer on a surface of the material to surface treat the material and a step of providing a tin-containing material layer on an upside of the substrate layer to surface treat the substrate layer, the object can be achieved by further comprising a step of providing a barrier intermediate layer before the provision of the tin-containing material layer.Type: ApplicationFiled: July 7, 2008Publication date: October 7, 2010Inventors: Hiroyuki Moriuchi, Yoshihiro Tadokoro, Eiichi Mikogai, Yoshiichi Nakano
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Patent number: 7766667Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.Type: GrantFiled: December 16, 2008Date of Patent: August 3, 2010Inventor: James V. Russell
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Patent number: 7766707Abstract: In accordance with various embodiments of the present disclosure, a pin for an electrical connector is provided. The pin includes a head that is fixedly mated with a shaft to form the pin.Type: GrantFiled: September 13, 2007Date of Patent: August 3, 2010Assignee: Astec International LimitedInventors: Fidel P. Vista, Jr., Qing Wen Liu
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Publication number: 20100190390Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.Type: ApplicationFiled: March 31, 2008Publication date: July 29, 2010Inventors: Kazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa
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Publication number: 20100184341Abstract: An electrical contact for a cadmium tellurium component, in particular a cadmium zinc tellurium component comprising a cadmium tellurium component, a first layer (21) formed onto the cadmium tellurium component (10), wherein the first layer (21) comprises indium and a contact agent (30) being bonded directly or indirectly to the first layer (21) to be in electrical contact with the first layer (21). The contact agent may be a stud bump or a conductive adhesive interconnect being bonded indirectly to the first layer via noble metal shielding layer.Type: ApplicationFiled: June 23, 2008Publication date: July 22, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Nicolaas Johannes Anthonius Van Veen, Rob Van Asselt, Gerard Kums
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Patent number: 7753744Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.Type: GrantFiled: March 24, 2009Date of Patent: July 13, 2010Assignee: Molex IncorporatedInventors: Victor Zaderej, David L. Brunker, Philip J. Dambach
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Publication number: 20100167600Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.Type: ApplicationFiled: November 30, 2009Publication date: July 1, 2010Applicant: Laird Technologies, Inc.Inventor: Philip van Haaster
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Publication number: 20100136856Abstract: An electrical connector is disclosed. The electrical connector has a plug and a receptacle that are connectable in a mated position. At least one of the plug and the receptacle have a body and an electrically conductive layer applied directly to the body.Type: ApplicationFiled: December 3, 2008Publication date: June 3, 2010Applicant: TYCO ELECTRONICS CORPORATIONInventors: Kenneth R. Gleason, Navin Kanjibhai Patel, Mark A. Hippert, Valentino Girolamo, Laurence A. Daane
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Patent number: 7709759Abstract: A contact element for making an electric contact to a contact member for enabling an electric current to flow between the contact element and the contact member includes a body having at least one contact surface thereof coated with a contact layer to be applied against the contact member. The contact layer includes a nanocomposite film having a matrix of amorphous carbon and crystallites of nano-size, i.e. with dimensions in the range of 1-100 nm, of at least one metal carbide embedded therein.Type: GrantFiled: June 22, 2006Date of Patent: May 4, 2010Assignees: ABB Research Ltd., Impact Coatings ABInventors: Erik Lewin, Ulf Jansson, Ola Wilhelmsson
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Patent number: 7699672Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.Type: GrantFiled: May 17, 2007Date of Patent: April 20, 2010Assignee: Molex IncorporatedInventors: Victor Zaderej, David L. Brunker, Phillip J. Dambach
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Publication number: 20100041284Abstract: The invention relates to a holder for an electric lamp (1, 1?) with contact pins (7, 8; 7?, 8?) extending to the outside for making electrical contact with the lamp (1, 1?), wherein the contact pins (7, 8; 7?, 8?) at least in some regions are coated with a layer (11) that is electrically conductive and/or that protects the contact pins (7, 8; 7?, 8?) from corrosion. The invention also relates to a method for the production of a holder for an electric lamp.Type: ApplicationFiled: January 11, 2008Publication date: February 18, 2010Inventors: Martin Beck, Robert Menzinger
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Patent number: 7651785Abstract: There is provided a tin-plated product which has a small deterioration of contact resistance with age, an excellent wear resistance and a low coefficient of friction. A coating of a composite material, which contains 0.1 to 1.0 wt % of carbon particles dispersed in a tin layer and which has a thickness of 0.5 to 10.0 ?m, preferably 1.0 to 5.0 ?m, is formed as the outermost layer of a substrate. Thus, the coefficient of dynamic friction between the tin-plated products of the same kind is 0.20 or less, and the coefficient of dynamic friction between the tin-plated product and a reflow tin-plated product is 0.20 or less, while the contact resistance is 1 m? or less.Type: GrantFiled: September 26, 2005Date of Patent: January 26, 2010Assignee: Dowa Mining Co., Ltd.Inventors: Hirofumi Takei, Hiroshi Miyazawa, Kentaro Asai
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Patent number: 7628616Abstract: A connecting unit for establishing a connection with external connecting portions of an electronic device includes a base and a plurality of spiral contactors having a conductive layer and an auxiliary resilient layer. The top face, the bottom face, and both side faces of the conductive layer are completely surrounded by the auxiliary resilient layer. The conductive layer is composed of a material having a specific resistance lower than the specific resistance of the auxiliary resilient layer. The auxiliary resilient layer is composed of a material having a yield point and an elastic modulus higher than the yield point and the elastic modulus of the conductive layer.Type: GrantFiled: June 14, 2004Date of Patent: December 8, 2009Assignee: ALPS Electric Co., Ltd.Inventors: Shin Yoshida, Shinichi Nagano, Koji Dono, Shuuichi Chiba
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Publication number: 20090227153Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.Type: ApplicationFiled: March 24, 2009Publication date: September 10, 2009Applicant: MOLEX INCORPORATEDInventors: Victor ZADEREJ, David L. BRUNKER, Phillip J. DAMBACH
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Publication number: 20090227127Abstract: Provided is a solderable elastic electric contact terminal. The solderable elastic electric contact terminal includes a tube-shaped insulating elastic core, an insulating non-foam rubber coating layer adhered to the insulating elastic core to surround the insulating elastic core, and a heat-resistant polymer film having one surface adhered to the insulating non-foam rubber coating layer to surround the insulating non-foam rubber coating layer, and another surface integrally provided with a metal layer.Type: ApplicationFiled: February 26, 2009Publication date: September 10, 2009Applicant: JOINSET CO., LTD.Inventors: Sun-Ki Kim, Sung-Ho Cho, Han-Jin Cheon, Hwan-Min Yeo
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Patent number: 7581994Abstract: A method for establishing a substantially continuous electrical interface between a first expanse of a first electrical part and a second expanse of a second electrical part includes the steps of: (a) in no particular order: (1) Adhering a first layer of substantially pure gold material to at least a portion of the first expanse; and (2) adhering a second layer of substantially pure gold material to at least a portion of the second expanse. (b) Urging the first expanse and the second expanse together.Type: GrantFiled: August 10, 2006Date of Patent: September 1, 2009Assignee: The Boeing CompanyInventors: David J. Nakamura, Man-Fai Yu, Bruce A. Igawa