Of Particular Metal Or Alloy Patents (Class 439/887)
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Patent number: 10693257Abstract: An implantable electromechanical plug connector is described with a plug part and a socket part, of which the plug part has at least one joining portion which can be inserted completely into a unilaterally open insertion opening within the socket part and has at least one electrically insulating surface having at least one electrode body (6) with a freely accessible electrode surface, and of which the socket part has, inside the unilaterally open insertion opening, an electrically insulating wall portion which laterally delimits the insertion opening at least in part and whose surface makes available at least one counterelectrode body with a freely accessible counterelectrode surface, wherein the electrically insulating wall portion of the electrically insulating surface of the joining portion of the plug part, in the state of complete insertion of the plug part's joining portion in the insertion opening, is oriented in such a way that the counterelectrode surface touches the electrode surface, wherein the atType: GrantFiled: July 6, 2017Date of Patent: June 23, 2020Assignee: Neuroloop GmbHInventors: Fabian Kimmig, Tim Boretius
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Patent number: 9118069Abstract: A battery cell has a main body including active material configured to generate power from an electrochemical reaction. A first terminal is disposed on the main body and includes an integrated busbar. The integrated busbar is configured to place the battery cell in electrical communication with a second terminal of an adjacent battery cell.Type: GrantFiled: May 10, 2011Date of Patent: August 25, 2015Assignee: GM Global Technology Operations LLCInventors: Barton W. McLaughlin, Robert J. Heydel
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Patent number: 9088120Abstract: An electrical connection includes an electrically conductive first contact member, an electrically conductive second contact member, an interface, and an attachment. The first contact member includes a first contact surface for passing current. The second contact member includes a second contact surface for passing current that directly contacts the first contact surface. The interface includes one of a cold weld and a fused section that physically joins the first contact member and the second contact member, and that forms a primary conductive path between the first contact member and the second contact member. The interface is formed by ultrasonic vibration of the first contact surface relative to the second contact surface. The attachment is separate from the interface and mechanically joins the first contact member and the second contact member. A method for forming the electrical method is also provided.Type: GrantFiled: January 18, 2012Date of Patent: July 21, 2015Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Leonid C. Lev, Nikolay Kondratyev
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Publication number: 20150147924Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.Type: ApplicationFiled: June 27, 2013Publication date: May 28, 2015Applicant: JX Nippon Mining & Metals CorporationInventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
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Publication number: 20150133005Abstract: The present invention aims to provide a plated terminal for connector which requires a smaller insertion force by reducing a friction coefficient and a terminal pair formed using such a plated terminal for connector. An alloy containing layer (1) made of tin and palladium and containing a tin-palladium alloy is formed on a surface of a terminal base material (2) made of copper or copper alloy. Here, the alloy containing layer (1) is preferably such that domain structures of a first metal phase (11) made of an alloy of tin and palladium are formed in a second metal phase (12) made of pure tin or an alloy having a higher ratio of tin to palladium than in the first metal phase (11).Type: ApplicationFiled: May 9, 2013Publication date: May 14, 2015Inventors: Yoshifumi Saka, Hajime Watanabe, Mikio Satou, Masayuki Ookubo
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Publication number: 20150126081Abstract: An electric contact for preventing a terminal of an electric part and the electric contact from sticking to each other after a continuity test to improve the durability of the electric contact; and a socket for electric parts using the electric contact. The electric contact of this invention includes a first layer made from a material into which Sn melts and diffuses upon application of heat; and a second layer formed on the outer side of the first layer and made from a material lower in the rate at which Sn melts and diffuses upon application of heat than the first layer.Type: ApplicationFiled: May 28, 2013Publication date: May 7, 2015Applicant: ENPLAS CORPORATIONInventor: Takahiro Oda
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Patent number: 9022821Abstract: In a structure of a crimping connection part of an aluminum electric wire and a metal terminal, the aluminum electric wire includes a core wire and an insulating sheath covering the core wire, an exposed core wire in which the core wire is exposed from the insulating sheath at an end portion of the aluminum electric wire is crimped by a core wire crimping part of the metal terminal to form the crimping connection part, and the exposed core wire and the metal terminal of the crimping connection part are covered by a vapor deposited film comprised of an electrically conductive powder.Type: GrantFiled: September 11, 2013Date of Patent: May 5, 2015Assignee: Yazaki CorporationInventor: Kouichiro Matsushita
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Patent number: 9004960Abstract: An improved outer layer of plating comprising a binary metal alloy of gold and palladium is employed on connector contacts. The binary metal alloy is plated on at least the contact surface of the contacts. Intermediate plating layers can be applied between the outer layer of gold and palladium and the conductive base of the contacts. The binary metal alloy of gold and palladium may be configured to have a mostly gold or a mostly silver appearance, depending upon the relative concentration of gold and palladium in the binary metal alloy.Type: GrantFiled: February 21, 2013Date of Patent: April 14, 2015Assignee: Apple Inc.Inventors: Douglas J. Weber, Naoto Matsuyuki, Eric S. Jol
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Publication number: 20150086867Abstract: A battery terminal includes an overlay clad plate material including at least a first metal layer made of Al or Al alloy and a second metal layer made of Cu or Cu alloy, formed by bonding at least the first metal layer and the second metal layer to each other in the thickness direction. Either the first metal layer or the second metal layer of the clad plate material is partially removed to form an exposure surface on which either the second metal layer or the first metal layer is exposed in the clad plate material.Type: ApplicationFiled: September 10, 2014Publication date: March 26, 2015Applicants: NEOMAX MATERIALS CO., LTD., HITACHI METALS, LTD.Inventors: Yoshimitsu Oda, Masaharu Yamamoto, Masaaki Ishio
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Publication number: 20150079854Abstract: An adaptor (44, 70) mating a non-plug-in type circuit breaker (42) to a bus structure (14, 64) of a plug-in breaker panel (40, 62) includes a first portion (48, 72) coupled to a terminal (46) of the non-plug-in type circuit breaker (42) and an opposite second portion (50, 74) engaging a portion (24, 66) of the bus structure (14, 64). The first portion is formed from a first conductive material and the opposite second portion is formed from a second conductive material. The firs portion and the second portion form a conductive pathway between the terminal (46) of the non-plug-in type circuit breaker (42) and the portion (24, 66) of the bus structure (14).Type: ApplicationFiled: March 15, 2013Publication date: March 19, 2015Inventors: Patrick Wellington Mills, Richard George Benshoff, James Michael McCormick
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Patent number: 8969734Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.Type: GrantFiled: February 16, 2012Date of Patent: March 3, 2015Assignee: Advanced Interconnections Corp.Inventors: James V. Murphy, Michael J. Murphy
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Patent number: 8951369Abstract: What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni satisfies 0.002?Fe/Ni<1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P satisfies 3<(Ni+Fe)/P<15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<5, an average crystal grain diameter of ? phase containing Cu, Zn, and Sn is in a range of 0.1 to 50 ?m, and the copper alloy includes a precipitate containing P and one or more elements selected from Fe and Ni.Type: GrantFiled: January 4, 2013Date of Patent: February 10, 2015Assignees: Mitsubishi Materials Corporation, Mitsubishi Shindoh Co., Ltd.Inventors: Kazunari Maki, Hiroyuki Mori
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Patent number: 8940404Abstract: Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.Type: GrantFiled: January 22, 2013Date of Patent: January 27, 2015Assignee: Mitsubishi Materials CorporationInventors: Yuki Taninouchi, Naoki Kato, Kenji Kubota
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Publication number: 20150024643Abstract: In one aspect, a conversion terminal device for electrically coupling dissimilar metal components is provided. The device includes a body having a first layer coupled to a second layer. The first layer is formed from a first metal and the second layer is formed from a second metal different from the first metal. The body includes a first connector portion and a second connector portion.Type: ApplicationFiled: July 18, 2013Publication date: January 22, 2015Inventor: David R. Petrucci
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Patent number: 8936857Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.Type: GrantFiled: May 20, 2013Date of Patent: January 20, 2015Assignee: Xtalic CorporationInventors: Nazila Dadvand, Christopher A. Schuh, Alan C. Lund, Jonathan C. Trenkle, John Cahalen
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Publication number: 20150011132Abstract: There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance.Type: ApplicationFiled: January 30, 2013Publication date: January 8, 2015Applicant: JX Nippon Mining & Metals CorporationInventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
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Publication number: 20150004853Abstract: In an electrical plug type connector having an electrically conductive contact element having a contact surface, the contact surface has a microstructure.Type: ApplicationFiled: December 5, 2012Publication date: January 1, 2015Inventors: Rudi Blumenschein, Helge Schmidt
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Patent number: 8915761Abstract: A connector terminal which can achieve high mechanical connection strength and stabilized low electrical connection resistance when it is crimped to an aluminum electric wire, and in addition, can suppress electrical contact resistance low when it is fitted to a mating connector terminal is provided. In a connector terminal (1A) having an electrical contact section (10) which is brought into contact and conducted with a mating connector terminal by fitting to the mating connector terminal, and a conductor crimping section (12) which is crimped to the conductor of an electric wire, a metal material which constitutes the terminal uses aluminum or an aluminum alloy as a base material (100), a Zn layer (101) having a thickness in the range from 0.1 ?m to 2.0 ?m by electroless plating and a Cu layer (102) having a thickness in the range from 0.5 ?m to 1.0 ?m by electrolytic plating are formed in sequence on the surface of the base material (100), and an Sn layer (105) having a thickness in the range from 0.Type: GrantFiled: March 24, 2010Date of Patent: December 23, 2014Assignee: Yazaki CorporationInventor: Naoki Kakuta
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Publication number: 20140370763Abstract: The invention relates to a connection between a first metal component and a second metal component covered by a sheath. The first and the second metal component are connected to one another by means of a welded connection. In each case, a partial region of the first metal component and a partial region of the second metal component that comprises at least one section of the sheath are enclosed by a layer of insulating material that is applied.Type: ApplicationFiled: February 6, 2013Publication date: December 18, 2014Applicant: KROMBERG & SCHUBERT KGInventor: Daniel Bechstein
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Patent number: 8911270Abstract: A clamping body for an electric conductor, comprising a clamping body pocket that forms a receiving space for receiving the electric conductor. A threaded bore is formed in a lateral wall of the clamping body pocket in order to receive a screw. The aim of the invention is to devise a solution in which the clamping body substantially has the properties of a clamping body that is made of art alloy containing brass and simultaneously complies with the EU guidelines and regulations prohibiting certain materials. This is achieved in that the clamping body pocket is formed from an alloy containing aluminium, said alloy having a tensile strength of 380 N/mm2 to 480 N/mm2.Type: GrantFiled: July 8, 2011Date of Patent: December 16, 2014Assignee: Phoenix Contact GmbH & Co. KGInventors: Uwe Ambrosy, Michael Schaefer
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Patent number: 8865319Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.Type: GrantFiled: October 26, 2010Date of Patent: October 21, 2014Assignee: JX Nippon Mining & Metals CorporationInventor: Naofumi Maeda
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Publication number: 20140295070Abstract: An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and an average thickness of 0.2 to 3.0 ?m. The Sn coating layer has an average thickness of 0.2 to 5.0 ?m. A surface of the electroconductive material has an arithmetic average roughness Ra of at least 0.15 ?m in at least one direction along the surface and 3.0 ?m or less in all directions along the surface. The Cu—Sn alloy coating layer is partially exposed at the surface of the electroconductive material. An area ratio of the Cu—Sn alloy coating layer exposed at the surface of the electroconductive material is 3 to 75%. An average crystal grain size on a surface of the Cu—Sn alloy coating layer is less than 2 ?m.Type: ApplicationFiled: March 14, 2014Publication date: October 2, 2014Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel Ltd.)Inventor: Masahiro TSURU
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Patent number: 8830025Abstract: A circuit breaker can minimize a change in a structure of a case when a material forming a stud is changed. A stud includes a base portion provided in the case and a protruding portion protruding from the case. A cross-sectional area of the protruding portion is more than that of the base portion; thereby a thermal conductivity of the protruding portion increases and the thermal conductivity from the protruding portion to an external conductor connected to the stud increases. In addition, since a surface area of the protruding portion increases, an amount of heat dissipated from the protruding portion increases. In the invention, since dimensions of the base portion inserted into a stud insertion hole of the case are not changed, it is not necessary to change the dimensions of the insertion hole of the case.Type: GrantFiled: June 1, 2010Date of Patent: September 9, 2014Assignee: Fuji Electronic Fa Components & Systems Co., Ltd.Inventors: Masaaki Nakano, Kentaro Toyama, Makoto Osawa
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Patent number: 8801444Abstract: A bus bar, which is used with batteries wherein the positive terminal and the negative terminal are each formed from a different metal, and which has excellent mechanical strength and can suppress electrical resistance while preventing galvanic corrosion. The bus bar is bonded in one piece by metallically bonding: a cathode connector that is formed from the same metal as the positive terminal of a battery cell, and that can connect to the positive terminal; and an anode connector that is formed from the same metal as the negative terminal of the battery cell, and that can connect to the negative terminal.Type: GrantFiled: March 24, 2011Date of Patent: August 12, 2014Assignee: Kobe Steel, Ltd.Inventors: Akira Sakae, Kotaro Toyotake
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Publication number: 20140213080Abstract: A tip end and a base end therebetween define an opening located between a first conductive portion and a second conductive portion. The opening includes a pair of first linear portions, a pair of second linear portions, and a pair of third linear portions, which are located between the first conductive portion and the second conductive portion. The pair of first linear portions is in straight liner shapes and distant from both the tip end and the base end. The second linear portions are in straight liner shapes and located on the side of the tip end to have therebetween a distance decreasing toward the tip end. The third linear portions are in straight liner shapes and located on the side of the base end to have therebetween a distance decreasing toward the base end.Type: ApplicationFiled: September 25, 2013Publication date: July 31, 2014Inventor: Toshihiro Miyake
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Patent number: 8787028Abstract: The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.Type: GrantFiled: November 15, 2012Date of Patent: July 22, 2014Assignee: TDK CorporationInventors: Yuhei Horikawa, Shin Fujita, Kenichi Yoshida, Hisayuki Abe, Makoto Orikasa, Hideyuki Seike
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Publication number: 20140170913Abstract: A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90°.Type: ApplicationFiled: April 17, 2012Publication date: June 19, 2014Inventors: Christoph Degen, Bernhard Reul, Mitja Rateiczak, Andreas Schlarb, Lothar Lesmeister
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Publication number: 20140162505Abstract: Provided is a terminal, including: a ground metal part made of a first metallic material; an intermediate layer made of a second metallic material having a smaller value of standard electrode potential than that of the first metallic material, and plated thin on at least a part of a surface of the ground metal part; and a surface layer made of a third metallic material having a smaller value of standard electrode potential than that of the second metallic material, and plated thin on at least a part of a surface of the intermediate layer.Type: ApplicationFiled: July 31, 2012Publication date: June 12, 2014Applicant: YAZAKI CORPORATIONInventor: Kentaro Ohnuma
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Publication number: 20140151117Abstract: An electrical connector for connecting electrical power transmission lines is provided. The electrical connector is capable of conducting 1×106 to 2.5×106 siemens per meter squared (S/m2), and includes a base metal having a surface layer doped with a conductive material dopant. The conductive dopant material improves the reliability and performance of the electrical connector. An electrical power transmission system including electrical power transmission lines connected by the electrical connector, and a method of joining power transmission lines with the electrical connector are also disclosed.Type: ApplicationFiled: November 22, 2013Publication date: June 5, 2014Applicant: Electric Power Research Institute, Inc.Inventors: John K. CHAN, Gary Charles SIBILANT, Jy-An WANG, Fei REN
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Patent number: 8728629Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.Type: GrantFiled: September 17, 2010Date of Patent: May 20, 2014Assignee: The Furukawa Electric Co., Ltd.Inventors: Shuichi Kitagawa, Kengo Mitose, Yoshiaki Kobayashi
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Publication number: 20140134473Abstract: An electrical interconnect is disclosed that includes an inner conductive material having a top surface and a bottom surface; and an outer conductive material different from the inner conductive material, wherein the outer conductive material is clad on the top and bottom surfaces of the inner conductive material, wherein the electrical interconnect is configured to be secured to a first terminal of a first electrochemical cell and a second terminal of a second electrochemical cell. A method of manufacturing an electrical interconnect is also disclosed.Type: ApplicationFiled: November 14, 2012Publication date: May 15, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Kristopher John FRUTSCHY, Bhat Radhakrishna BADEKILA, Alec Roger TILLEY, Thomas R. RABER, William H. SCHANK
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Patent number: 8697247Abstract: The invention discloses a semi-finished product for making plug-in contacts in plug-in connectors for electric DC power systems in motor vehicles which are operated at a nominal voltage at which electric arcing may occur, having an electrically conductive main body made of a non-precious metallic material that carries, at least in part, a contact-making coating of a material more precious than the material of the main body. It is provided according to the invention that the coating has thickness of at least 0.3 ?m and consists of silver or of a silver-based alloy with an addition that will not form an alloy with silver or with the silver-based alloy, or will at best form a precipitation alloy, and which has a higher melting point than silver.Type: GrantFiled: April 17, 2004Date of Patent: April 15, 2014Assignee: Doduco GmbHInventors: Franz Kaspar, Joachim Ganz, Isabell Buresch
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Publication number: 20140099844Abstract: A direct-attach orthogonal electrical connection system with improved high frequency performance is provided. A conductive member is provided between first and second components, each having signal and ground conductors. The conductive member is electrically coupled to ground conductors of both the first and second components and may also have openings through which signal conductors of the first and second components may connect. As such, signal conductors may be positioned relative to the conductive member such that a uniform impedance is maintained along a signal path throughout the interconnection, reducing noise and reflections. The first-type conductive elements may be formed with multiple beams of different lengths to create multiple points of contact distributed along an elongated dimension. For example, a third beam may be fused to a mating portion to allow a tolerance for deviations in alignment between two directly attached connectors.Type: ApplicationFiled: October 9, 2013Publication date: April 10, 2014Applicant: Amphenol CorporationInventor: John Robert Dunham
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Publication number: 20140094072Abstract: An electrical contact component includes a contact point part configured to provide an electrical connection by contact, and a mounting part configured to provide an external electrical connection by solder joining. A plating layer containing carbon nanotubes or carbon blacks is selectively formed on the surface of the contact point part. A plating layer having higher solder wettability than that of the plating layer containing the carbon nanotubes or carbon blacks is formed on the mounting part.Type: ApplicationFiled: March 8, 2012Publication date: April 3, 2014Applicant: PANASONIC CORPORATIONInventors: Naoki Seki, Katsunobu Yamada, Yuichi Uchida, Susumu Arai
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Publication number: 20140087606Abstract: What is provided is a copper alloy for electronic/electric device comprising: in mass %, more than 2% and 36.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.10% of Fe; 0.005% or more and 0.10% or less of P; and the balance Cu and inevitable impurities, wherein a content ratio of Fe to Ni, Fe/Ni satisfies 0.002?Fe/Ni<1.5, a content ratio of a sum of Ni and Fe, (Ni+Fe), to P satisfies 3<(Ni+Fe)/P<15, a content ratio of Sn to a sum of Ni and Fe, (Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<5, an average crystal grain diameter of ? phase containing Cu, Zn, and Sn is in a range of 0.1 to 50 ?m, and the copper alloy includes a precipitate containing P and one or more elements selected from Fe and Ni.Type: ApplicationFiled: January 4, 2013Publication date: March 27, 2014Applicants: MITSUBISHI SHINDOH CO., LTD., MITSUBISHI MATERIALS CORPORATIONInventors: Kazunari Maki, Hiroyuki Mori
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Publication number: 20140073206Abstract: An improved electronic contact assembly for electrical connectors is disclosed. A plurality of elongated metallic contacts may be formed, each having one or more protrusions that enable precision alignment within a connector. A plurality of the contacts may be insert-molded in a dielectric frame which may have alignment tabs, resilient alignment bosses, alignment posts and crushable combs, all enabling precise alignment of contacts within a connector.Type: ApplicationFiled: September 7, 2012Publication date: March 13, 2014Applicant: Apple Inc.Inventors: Albert J. Golko, Eric S. Jol, Miguel A. Lara-Pena, Makiko K. Brzezinski, Edward Siahaan
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Publication number: 20140045392Abstract: A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 ?m to 4.0 ?m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 ?m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 ?m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.Type: ApplicationFiled: August 9, 2013Publication date: February 13, 2014Applicants: Shinko Leadmikk Co., Ltd., Kabushiki Kaisha Kobe Seiko ShoInventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
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Patent number: 8637165Abstract: A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment.Type: GrantFiled: September 30, 2011Date of Patent: January 28, 2014Assignee: Apple Inc.Inventors: Edward Siahaan, John B. Ardisana, II, Mathias Schmidt, Jason Sloey, Albert J. Golko, Eric Jol
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Publication number: 20140024270Abstract: A connecting device using a shape memory alloy (SMA). The connecting device uses an SMA, which firmly connects female member with male member inserted into the female member, in which a wire member formed of an SMA material is wound a plurality of times in a spiral shape, a hollow into which the female member is inserted is formed in a center portion of the spiral shape, and when the male member being inserted into the female member, the wire member presses against an outer circumferential surface of the female member to prevent the male member from being separated from the female member. According to the present invention, a connection is possible in a high-temperature phase corresponding to room temperature as well as in a low-temperature phase, and an allowable tolerance, which is a difference between a diameter of a hollow and an outer diameter of a female member, increases.Type: ApplicationFiled: November 21, 2012Publication date: January 23, 2014Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventor: Kwang Koo JEE
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Publication number: 20130344753Abstract: A current-source contacting device, a current source and a current-source contacting system are described. To increase the mechanical stability, corrosion resistance and temperature stability of current-transferring members of the current-source contacting device, the current source and the current-source contacting system, these current-transferring members are made of a metal-infiltrated ceramic. A method for producing metal-infiltrated ceramic bodies, metal-infiltrated ceramic bodies produced in this manner, as well as their use, are also described.Type: ApplicationFiled: April 15, 2011Publication date: December 26, 2013Inventor: Jan Goehler
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Patent number: 8524376Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.Type: GrantFiled: April 26, 2007Date of Patent: September 3, 2013Assignee: JX Nippon Mining & Metals CorporationInventor: Takaaki Hatano
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Publication number: 20130225017Abstract: A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate.Type: ApplicationFiled: April 12, 2013Publication date: August 29, 2013Applicants: Dowa Metaltech Co., LTD., Yazaki CorporationInventors: Yazaki Corporation, Down Metaltech Co., LTD.
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Publication number: 20130171868Abstract: A ground spring for receiving a ground end of a high-frequency test probe is described. The ground spring includes a generally annular base portion, and a number of elongated spring fingers extending from the base portion. The fingers extend generally radially inwardly from the base portion and have inner end faces that together define a substantially circular opening in a center portion of the ground spring. Each of the fingers have a tapered shape including a wider base portion end and a narrower inner end portion Each of the fingers has a longitudinal axis that is aslant relative to a reference line extending from the center of the ground spring to a center of the base portion of each finger. BMA connectors including the ground spring and test and measurement devices are also described.Type: ApplicationFiled: August 24, 2012Publication date: July 4, 2013Applicant: TEKTRONIX, INC.Inventors: Marc A. GESSFORD, Lawrence M. LeMON, Jerry R. SHANE
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Publication number: 20130135834Abstract: The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.Type: ApplicationFiled: November 15, 2012Publication date: May 30, 2013Applicant: TDK CORPORATIONInventor: TDK CORPORATION
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Publication number: 20130109254Abstract: Various embodiments of this disclosure concern a lead end having an inner support. Such a lead can include a first end, a second end, a main body, and a plurality of exposed electrical elements on each of the lead ends. A metal support can be contained within the first end, the metal support comprising a plurality of longitudinal members and a plurality of cross members between the longitudinal members, the metal support having an interior space. The first lead end can further include polymer fill within the interior space of the metal support and encapsulating at least a substantial portion of the metal support, the polymer fill defining at least some of the exterior surface of the first end between the exposed electrical elements of the first end.Type: ApplicationFiled: October 29, 2012Publication date: May 2, 2013Applicant: Medtronic, Inc.Inventor: Medtronic, Inc.
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Publication number: 20130084760Abstract: A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment.Type: ApplicationFiled: September 30, 2011Publication date: April 4, 2013Applicant: APPLE INC.Inventors: Edward Siahaan, John B. Ardisana, II, Mathias Schmidt, Jason Sloey, Albert J. Golko, Eric Jol
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Publication number: 20130072075Abstract: Provided are a conductive member that is connectable to aluminum metal and can suppress a decrease in electrical conductivity, and a method of manufacturing the same. The conductive member is formed of aluminum or an alloy containing aluminum, and includes an electrical wire connection unit and a fastening unit, which are a base provided with a connection surface to be connected to another member, and a connection layer formed on the base by accelerating a powder of a metal or alloy, which has a lower ionization tendency than the base and has electrical conductivity equal to that of the base or higher, together with gas, and spraying and depositing the powder in the solid state on the connection surface.Type: ApplicationFiled: April 19, 2011Publication date: March 21, 2013Applicant: NHK SPRING CO., LTD.Inventor: Takashi Kayamoto
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Patent number: 8342895Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.Type: GrantFiled: March 31, 2008Date of Patent: January 1, 2013Assignee: Furukawa Electric Co., Ltd.Inventors: Kazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa
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Publication number: 20120315807Abstract: The disclosed electrode terminal, which is used with batteries of which a positive output terminal and a negative output terminal are formed from metals dissimilar to each other, has excellent mechanical strength and can suppress electrical resistance while preventing galvanic corrosion. The electrode terminal (1) for power output is used with batteries (2) of which a pair of output terminals are each formed from a different metal, and has: a solid cylindrical shaft (10) that attaches to one output terminal and that is formed from the same metal as the one output terminal; and an outer cylinder (11) that connects with the cylindrical shaft (10) and that is formed from the same metal as the other output terminal. The shaft (10) and the outer cylinder (11) are unified by means of metallic bonding.Type: ApplicationFiled: March 24, 2011Publication date: December 13, 2012Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)Inventor: Akira Sakae
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Publication number: 20120302111Abstract: A contact piece of a gold finger comprises: a first main body segment; a second main body segment; and a transition segment connected to the first main body segment and the second main body segment, respectively, in a vertical direction, in which an upper edge and a lower edge of the transition segment are inclined with respect to a lateral direction respectively. A gold finger and a connector comprising the same are also provided.Type: ApplicationFiled: January 17, 2011Publication date: November 29, 2012Inventors: Bingbin Xie, Daocheng Pang