Conductive Coating Patents (Class 439/931)
  • Patent number: 11936127
    Abstract: A connector body includes mating guide parts having mating recesses into which counterpart mating guide parts are inserted, the reinforcing bracket includes a body part attached to end wall parts of the mating guide parts, and a pair of left and right connection arms connected to both ends of the body part, the connection arms extending to the longitudinal center of the connector body and being attached to side wall parts of the mating guide parts, the connection arm includes a side plate part and a side wall upper cover part connected to an upper end of the side plate part, at least a part of the outside of the side plate part is covered with an outside part of the side wall part, and the side wall upper cover part is curved such that a tip faces the mating recess and covers at least a part of the upper surface of the inside part of the side wall part.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: March 19, 2024
    Assignee: Molex, LLC
    Inventors: Daiki Tanaka, Naoto Sasayama
  • Patent number: 11929566
    Abstract: An assembly, comprising: a circuit board; a electrical connector mounted to a circuit board; and a counterweight mounted to the circuit board, wherein the counterweight contacts a first major surface of the circuit board, a center of gravity of the electrical connector is not situated in a plane that perpendicularly intersects the first major surface, a combined center of gravity of the electrical connector and the counterweight is situated in a plane that perpendicularly intersects the first major surface, the counterweight arches over an outer circumference of the electrical connector.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: March 12, 2024
    Assignee: ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
    Inventors: Martin Zebhauser, Stefan Löffelholz, Georg Christoph Lochner
  • Patent number: 11855372
    Abstract: A connector body includes mating guide parts having mating recesses into which counterpart mating guide parts are inserted, the reinforcing bracket includes a body part attached to end wall parts of the mating guide parts, and a pair of left and right connection arms connected to both ends of the body part, the connection arms extending to the longitudinal center of the connector body and being attached to side wall parts of the mating guide parts, the connection arm includes a side plate part and a side wall upper cover part connected to an upper end of the side plate part, at least a part of the outside of the side plate part is covered with an outside part of the side wall part, and the side wall upper cover part is curved such that a tip faces the mating recess and covers at least a part of the upper surface of the inside part of the side wall part.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: December 26, 2023
    Assignee: Molex, LLC
    Inventors: Daiki Tanaka, Naoto Sasayama
  • Patent number: 11387588
    Abstract: A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: July 12, 2022
    Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Ingo Bogen, Alexander Wehner
  • Patent number: 11362456
    Abstract: Wiring arrangement at wall edges and corners with decorative effect, having at least two elongated wire guiding strips; each wire guiding strip is positioned at a wall edge between a wall and a floor or a wall edge between two adjacent walls; each wall edge between the wall and the floor or each wall edge between two adjacent walls is provided with only one of the wire guiding strips; a corner connector is provided between two ends of two adjacent wire guiding strips to achieve electrical connection and a change in direction of the wiring arrangement; the corner connector has two legs electrically connected to two ends of the two adjacent wire guiding strips respectively; each of the wire guiding strips has a soft PVC wrapping layer and wires wrapped inside. The wiring arrangement has a reasonable structure and is safe and aesthetically pleasing.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 14, 2022
    Inventors: Yong Liu, Fangming Cao, Robert Lee
  • Patent number: 8961229
    Abstract: An electrical connector assembly includes plural wafers that are stacked. Each wafer includes a conductive board defining plural slots therein, and plural contact modules each received in one of the slots. The conductive board is made from plastic coated with metal plating to improve shielding performance. Each of the contact modules includes a pair of contacts and an insulating holder fixing the contact pair to the conductive board. The insulating holder is differently void along the contact pairs to improve impedance.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: February 24, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Feng Pan
  • Patent number: 8905785
    Abstract: An electrical connector includes a conductive connector housing that supports a plurality of contact modules that includes electrical ground contacts and electrical signal contacts electrically isolated from each other in the respective contact modules. The electrical ground contacts are in electrical communication with the connector housing so as to electrically common the ground contacts together.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: December 9, 2014
    Assignee: FCI Americas Technology LLC
    Inventors: Douglas M. Johnescu, Jonathan E. Buck
  • Patent number: 8834183
    Abstract: A board-to-board connector includes a receptacle connector and a plug connector. The receptacle connector includes a plurality of beam parts having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the plurality of beam parts. The plug connector includes a beam contact part having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the beam contact part. A beam projection is formed between the adjacent conductive patterns of the plug connector, and the beam projection is inserted between the adjacent beam parts of the receptacle connector when the receptacle connector and the plug connector are mated.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: September 16, 2014
    Assignee: Japan Aviation Eletronics Industry, Ltd.
    Inventors: Tetsuya Komoto, Yu Tatebe, Takuya Yakahashi, Ryuzo Shimeno
  • Patent number: 8758067
    Abstract: A electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB. The electrical interconnect includes a multi-layered substrate with a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of spring probe contact members are located in the center openings. The contact members include first contact tips extending through the first opening and above the first surface, second contact tips extending through the second openings and above the second surface, and center portions located in the center openings. The center portions include a shape adapted to bias the first and second contact tips toward the IC device and PCB, respectively.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: June 24, 2014
    Assignee: Hsio Technologies, LLC
    Inventor: James Rathburn
  • Patent number: 8715007
    Abstract: An improved electronic receptacle connector with portions thereof formed from an electrically conductive polymer is disclosed. A conductive polymer front face enables improved device aesthetics and can discharge electrostatic energy from a plug before it is mated with the connector. A conductive polymer housing with internal ground structures may provide electromagnetic interference shielding and improved data transfer speed.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: May 6, 2014
    Assignee: Apple Inc.
    Inventor: Trent K. Do
  • Patent number: 8708723
    Abstract: A method of forming an electrically conductive connection between two or more electrically conductive elements (2, 6) is provided, as is the resulting connection. Wherein the two or more electrically conductive elements (2, 6) are coated with a non-conductive coating (7), wherein an at least partially electrically conductive pasty medium (8) is located in a region (12) between the electrically conductive elements (2, 6) at regions of the electrically conductive elements (2, 6) which are substantially free from any non-conductive coating (7).
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: April 29, 2014
    Assignee: Pfaudler-Werke GmbH
    Inventors: Bruno Stoltz, Jochen Endress, Michael Theilig, Matthias Heinzmann
  • Patent number: 8678854
    Abstract: The invention relates to an electrical connector for accommodating an electrical conductor or mating connector, having a first plastic section having a first degree of hardness or elasticity, and a second plastic section having a second degree of hardness or elasticity, wherein the first degree of hardness or elasticity and the second degree of hardness or elasticity are different, and the first plastic section cooperates with the second plastic section in order to accommodate the electrical conductor.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: March 25, 2014
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventor: Johannes Kalhoff
  • Patent number: 8668525
    Abstract: A method of forming a colored appearance suitable for forming a colored appearance for a conductive casing of a connector is provided. The conductive casing has a body and at least one lead. The lead extends from the body. The method of forming a colored appearance includes the following steps. A surface of the conductive casing is roughened. A conductive metal layer is formed on the roughened surface of the conductive casing. A shielding layer is formed on a part of the conductive metal layer located on the lead. A colorful conductive layer is formed on the conductive casing. The shielding layer and a part of the colorful conductive layer located on the shielding layer are removed to expose the part of the conductive metal layer on the lead. Therefore, the conductive casing has a colored appearance.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: March 11, 2014
    Assignee: HTC Corporation
    Inventors: Chih-Wei Tu, I-Cheng Chuang
  • Patent number: 8647129
    Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: February 11, 2014
    Assignee: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takuya Takahashi, Ryuzo Shimeno, Tetsuya Komoto, Osamu Hashiguchi
  • Patent number: 8556638
    Abstract: To provide an electronic device socket able to shorten conductive paths between terminals of an electronic device and contacts of a circuit board. An electronic device socket (1) wherein a socket part 10 electrically connecting a plurality of terminals of an electronic device to corresponding contacts of a circuit board has a plurality of through holes 105 arranged corresponding to the positions of the terminals.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: October 15, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Yuichi Tsubaki, Masahiko Kobayashi
  • Patent number: 8393918
    Abstract: Improved miniaturized interconnect connector apparatus and methods for their manufacture. These miniaturized interconnect connectors minimize overall size, while at the same time offering acceptable and even improved electrical performance over prior art interconnect connector designs. In one exemplary embodiment, the interconnect connector comprises a plug and corresponding receptacle manufactured from a laser direct structuring (LDS) polymer material. In another embodiment, the interconnect connector comprises a composite structure which takes advantages of the properties of multiple selected materials. In yet another embodiment of the invention, precisely plated polymers such as the aforementioned LDS polymer are utilized in conjunction with known technologies such as flexible printed circuits (FPC) to produce miniaturized interconnect connectors.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: March 12, 2013
    Assignee: Pulse Electronics, Inc.
    Inventors: Keh-Chang Cheng, Pen-Yuan Tsai, Cheng-Jung Tsou
  • Patent number: 8215969
    Abstract: A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: July 10, 2012
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Displays Corp.
    Inventors: Sheng-Shu Yang, Shyh-Ming Chang
  • Patent number: 8172627
    Abstract: An electrical connector is disclosed. The electrical connector has a plug and a receptacle that are connectable in a mated position. At least one of the plug and the receptacle have a body and an electrically conductive layer applied directly to the body.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: May 8, 2012
    Assignee: Tyco Electronics Corporation
    Inventors: Kenneth R. Gleason, Navin Kanjibhai Patel, Mark A. Hippert, Valentino Girolamo, Laurence A. Daane
  • Patent number: 8044150
    Abstract: A method of preparing an electrostatic dissipative composition that includes combining a conductive polymer; a crosslinkable polymer, and a crosslinking agent to form a fluidized dispersion, and providing the fluidized dispersion with a pH of about 7 to 9 to form the electrostatic discharge composition.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: October 25, 2011
    Assignee: Goex Corporation
    Inventor: Jean P. Ibar
  • Patent number: 8043095
    Abstract: An electrical connector (10) having a contact element (50) retained in a hollow body (12.) The body (12) has an internal socket structure (44) for receiving an end of the contact element (50) so that insulation displacement contacts (54) of this engage and make electrical connection to wires (70) of an incoming cable (16) to which the connector is connected. Fingers (56) of the connector element (50) extend externally of the connector body and carry electrical contacts (82).
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: October 25, 2011
    Assignee: ADC GmbH
    Inventors: Wayne Dennes, Michael Sielaff
  • Patent number: 8002595
    Abstract: An electrical contact material includes a surface layer formed of a noble metal or an alloy containing the noble metal as a major constituent. An organic film having heat resistance is formed on a surface of the surface layer, and the organic film is formed of an organic compound having an ether bonding group. Accordingly, the electrical contact material has good corrosion resistance and sliding resistance.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: August 23, 2011
    Assignee: Furukawa Electric Co., Ltd.
    Inventor: Yoshiaki Kobayashi
  • Patent number: 7914351
    Abstract: Electrical connectors are generally discussed herein having a housing having a bore and a groove having a canted coil spring positioned therein. A pin is inserted through the bore and is electrically connected with the canted coil spring. The canted coil spring may be coated with a noble metal and the housing and the pin may be made from non-noble metals.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: March 29, 2011
    Assignee: Bal Seal Engineering
    Inventors: Peter J. Balsells, Robbie J. Sjostedt, Farshid Dilmaghanian
  • Patent number: 7892026
    Abstract: The invention relates to an electrical plug-type connector (1) having a socket-like contact element (6), which is arranged in a contact chamber (2), which comprises at least two chamber parts (3, 4), which bear against one another with in each case at least one abutting face (24, 25), is made from plastic and has a plug-in opening (8). The invention provides for the outer face (5) of the contact chamber (2) to be completely coated with a conductive layer and for the abutting faces (24, 25) to be overlapped laterally by an overlapping wall section (27) on the outside of the contact chambers (2), and for that side of the overlapping wall section (27) which faces the abutting faces (24, 25) to likewise be coated with a conductive layer.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: February 22, 2011
    Assignee: Amphenol-Tuchel Electronics GmbH
    Inventors: Wolfgang Langhoff, Michael Knödler
  • Patent number: 7815475
    Abstract: A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: October 19, 2010
    Assignee: Molex Incorporated
    Inventors: Kirk B. Peloza, Victor Zaderej, John Dolaz, Stephen Rushing
  • Patent number: 7789674
    Abstract: An edge connector suitable for attachment with a printed circuit board. The edge connector comprises a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device and a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: September 7, 2010
    Assignee: Finisar Corporation
    Inventors: Stephen T. Nelson, Donald A. Ice, Darin James Douma
  • Patent number: 7771208
    Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: August 10, 2010
    Assignee: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Patent number: 7753744
    Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: July 13, 2010
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, David L. Brunker, Philip J. Dambach
  • Patent number: 7749566
    Abstract: Disclosed is a system and method for providing an effective means for making it easy to identify which holes in an interface plate are to be populated with probes and which are to be left empty. This identification of holes or apertures in a plate is used most commonly an electrical probe testing plates where a probe array is set up and inserted though the plate. The problem is that it is very difficult to double check to see if all probes are installed. With a two-tone color identifier (or other techniques disclosed herein) it is easy to visually or machine read the probe plate for probe installation errors. The method employs coating the plate with a colorant and ablating colorant adjacent holes, which are either populated or empty, the difference being easy to spot.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: July 6, 2010
    Assignee: Circuit Check
    Inventor: Scott Staggert
  • Patent number: 7736152
    Abstract: Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: June 15, 2010
    Assignee: International Business Machines Corporation
    Inventors: Gareth G. Hougham, Keith E. Fogel, Paul A. Lauro, Joseph Zinter, Jr.
  • Patent number: 7699672
    Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: April 20, 2010
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, David L. Brunker, Phillip J. Dambach
  • Patent number: 7695766
    Abstract: A circuit board tester that uses a dual-stage translation to bring a unit under test (UUT) into physical and electric contact first with a series of tall probes, then with a series of short probes. Initially, the UUT is mounted on a support plate, and spaced apart from both the tall and short probes. First, in order to perform a functional test on the UUT, a first vacuum stage is engaged, and atmospheric pressure translates the UUT longitudinally until contact is made with a first hard stop, defining a first position. At this first position, the UUT is in contact with a series of tall probes, and is spaced apart from a series of short probes. After a function test is performed, a second vacuum stage is engaged in addition to, and independent of, the first vacuum stage. Atmospheric pressure translates the UUT longitudinally until contact is made with a second hard stop, defining a second position.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: April 13, 2010
    Assignee: Circuit Check
    Inventors: Neil Adams, Stuart Eickhoff, Jon Hample
  • Patent number: 7604503
    Abstract: The present invention relates to methods and systems for minimizing alien crosstalk between connectors. Specifically, the methods and systems relate to isolation and compensation techniques for minimizing alien crosstalk between connectors for use with high-speed data cabling. A frame can be configured to receive a number of connectors. Shield structures may be positioned to isolate at least a subset of the connectors from one another. The connectors can be positioned to move at least a subset of the connectors away from alignment with a common plane. A signal compensator may be configured to adjust a data signal to compensate for alien crosstalk. The connectors are configured to efficiently and accurately propagate high-speed data signals by, among other functions, minimizing alien crosstalk.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: October 20, 2009
    Assignee: ADC Telecommunications, Inc.
    Inventors: Bernard Hammond, Jr., Robert Kenny, David Yanish, Damon Debenedictis, Lyle Stahle, Timothy Takala, Terrence Ward
  • Patent number: 7581994
    Abstract: A method for establishing a substantially continuous electrical interface between a first expanse of a first electrical part and a second expanse of a second electrical part includes the steps of: (a) in no particular order: (1) Adhering a first layer of substantially pure gold material to at least a portion of the first expanse; and (2) adhering a second layer of substantially pure gold material to at least a portion of the second expanse. (b) Urging the first expanse and the second expanse together.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: September 1, 2009
    Assignee: The Boeing Company
    Inventors: David J. Nakamura, Man-Fai Yu, Bruce A. Igawa
  • Patent number: 7568949
    Abstract: The invention relates to a connecting socket (1) for a data network, comprising a housing (2) and at least one female connector (53), the housing (2) being made of plastic, and the inner surfaces of the housing (2) being at least partially metallized.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: August 4, 2009
    Assignee: ADC GmbH
    Inventors: Ulrich Hetzer, Frank Mossner, Ferenc Nad, Sabine Zimmer
  • Patent number: 7557445
    Abstract: A multilayer substrate, comprising a first substrate, a connector and a second substrate, is disclosed. The first substrate has a circuit pattern. The connector, coupling onto the first substrate, has a ring structure, in which a plurality of holes are separated a predetermined distance from one another. The second substrate, coupling onto the second substrate by inserting the connector, has a circuit pattern, which is electrically connected to a circuit pattern formed on the first substrate using the plurality of holes formed on the connector. A multilayer substrate and a method for producing it in accordance with the present invention can shield the EMI generated by a high-speed switching element.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: July 7, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Don C. Choi, Dong-Hwan Lee, Hee-Soo Yoon
  • Patent number: 7510439
    Abstract: A jack assembly for use with a modular electrical plug includes a jack housing. The jack housing includes an electrically non-conductive substrate metalized with a metal shield layer. The jack housing defines a socket adapted to receive the plug. At least one electrical contact is positioned in the socket to engage the plug when the plug is inserted in the socket. An electrically conductive jumper member including a drain wire connector may be mounted on the jack housing. The drain wire connector includes a pair of connector tabs defining a slot therebetween to receive and hold the drain wire.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: March 31, 2009
    Assignee: CommScope, Inc. of North Carolina
    Inventors: W. Andrew Gordon, Michael Walter Canning, Robert R. Goodrich
  • Patent number: 7448883
    Abstract: A socket connector includes an insulator having a plurality of apertures. A plurality of contacts are held by the insulator and arranged in groups. Each group includes plural contacts disposed around a periphery of a respective aperture. Each contact includes a polymer contact body having first and second opposite contact tips. A conductive coating extends on the contact body from the first contact tip to the second contact tip.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: November 11, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne Stewart Alden, III, Jeffery W. Mason, Peter Wapenski
  • Patent number: 7427215
    Abstract: A plug connection for guiding a cable through an opening of a partition, comprising a device socket having a plug receiving portion, and a plug with an insertion body with a locking ring that cooperates with locking elements of the plug receiving portion. At least one cable adapter is connectable to the device socket or plug. A cadmium-free electrically conductive surface coating is provided on at least an inner or outer continuous surface of the electrically conductive components of the plug connection. The contact points between base bodies of the socket device and plug on the one hand, and base bodies of the respective cable adapter on the other hand, are embodied as interengaging teeth. The contact point between the base bodies of the device socket and the plug is produced by a ground ring on one of them and has resilient tongues that rest on the other one.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: September 23, 2008
    Assignee: Krauss-Maffei Wegmann GmbH & Co.
    Inventors: Andreas Heckmann, Peter Fiedler, Roland Bühler
  • Patent number: 7416449
    Abstract: An electrical connector assembly includes a first connector unit comprising a first insulative housing and a first metal shielding covering the first housing, a second connector unit comprising a second insulative housing and a second metal shielding covering the second housing, a PCB respectively connect with the first and second connector units, and an insulative casing covering said first and second connector units and consisting of an upper cover and a lower cover engaged with each other. The casing forms a number of slices extending along the up-to-lower direction and a number of slots adapted for receiving said slices to joint the upper and lower covers together. Inner surfaces of the upper and lower covers are gilt with a thin layer, and the inner gilt surfaces of the upper and lower covers and the first and second metal shieldings define a shielded and generally close space to cover the first and second housings.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: August 26, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Peter Kuo, Hou-Yu Shi
  • Patent number: 7387533
    Abstract: The invention relates to a connecting socket for a data network, comprising a housing and at least one female connector, the housing being made of plastic, and the inner surfaces of the housing being at least partially metallized.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: June 17, 2008
    Assignee: ADC GmbH
    Inventors: Ulrich Hetzer, Frank Mossner, Ferenc Nad, Sabine Zimmer
  • Patent number: 7381105
    Abstract: Electrical contacting surfaces are disclosed having numerous electrically conductive substantially spherical protrusions. These contacting surfaces may be used repeatedly in low voltage applications. The numerous electrically conductive substantially spherical protrusions provide points of high pressure thereby forming multiple parallel electrically conductive pathways across the contacting surfaces to establish good electrical continuity.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: June 3, 2008
    Assignee: Sierra Madre Marketing Group
    Inventor: Fred Miekka
  • Patent number: 7364458
    Abstract: An electrical connector includes an insulated body and a plurality of conductive terminals. A plurality of terminals accommodating holes disposed inside the insulated body for receiving the conductive terminals therein. There is a metal shielding layer arranged on the surface of the insulated body. Compared with technology available now, the electrical connector according to the present invention includes the metal shielding layer disposed on the insulated body so as to avoid electromagnetic interference and static interference, and such shielding layer having a simpler structure, smaller volume at lower cost.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: April 29, 2008
    Assignee: Lotes Co., Ltd.
    Inventor: Ted Ju
  • Patent number: 7361063
    Abstract: A patch panel includes a first outlet having a first connecting block; a second outlet having a second connecting block, the second connecting block positioned adjacent to the first connecting block; a conductive shield positioned between the first connecting block and the second connecting block to reduce alien crosstalk.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: April 22, 2008
    Assignee: The Siemon Company
    Inventors: Daniel J. Mullin, Brian Celella, Vito Pagliarulo, Mark Navarra, Olindo Savi, Vinicio Crudele, Douglas Bond, Michael Weed
  • Patent number: 7361038
    Abstract: The invention relates to a Microswitch connector (11), having an insulating housing (13) with a contact chamber (31) with an insertion opening (15) and a contact switch spring (25) arranged in the contact chamber (31). The housing (13) has an electrically conductive stop (59) on a side of the contact chamber (31) remote from the insertion opening (15) for making a first external electrical connection. The contact switch spring (25) has a spring bend connecting a fixed leg (37) to a switch leg (39). The fixed leg (37) is fixed in the housing (13) outside the insertion path of the plug-in contact with a connection end (45) for making a second external electrical connection, and the switch leg (39) extends obliquely into the insertion path in the direction of the stop (59) and pivotal resiliently relative to the fixed leg (37) with a free end (57) pre-tensioned to rest against the stop (59).
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: April 22, 2008
    Assignee: Tyco Electronics AMP GmbH
    Inventors: Patrick Marcel Duquerroy, Sébastien Kempter, Blaise Rithener
  • Patent number: 7341462
    Abstract: An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board attachment portion, whole peripheral surfaces of which have been subjected to a plating treatment beforehand, are employed. End portions of the first wire member and the second wire member are mutually superposed, and the first wire member and the second wire member are joined. Thus, the fitting portion is formed and the board attachment portion is formed. Hence, a surface of the upper tier terminal is structured by a plating layer at the peripheral surface of the first wire member and a plating layer at the peripheral surface of the second wire member. Consequently, a post-plating treatment can be rendered unnecessary.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: March 11, 2008
    Assignee: Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
    Inventors: Katsumasa Matsuoka, Yoshiaki Kato, Harehide Sasaki
  • Patent number: 7329150
    Abstract: An electrical connector, includes an insulating housing having a plurality of terminal receiving holes, and a plurality of conductive terminals received in the receiving holes respectively. The insulating housing has a metal layer for shielding the conductive terminals from electromagnetic interference, and the metal layer is formed on the insulating housing via physical vapor deposition (PVD). In contrast to traditional methods, the electrical connector of the present invention connects to a mating electrical component effectively.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: February 12, 2008
    Assignee: Lotes Co., Ltd.
    Inventor: Ted Ju
  • Patent number: 7297005
    Abstract: A connector pedestal has a body which includes interior and exterior surfaces, upper and lower edges, and interface portion, and first and second sets of traces. The interface portion is provided proximate to the upper edge and is configured to be connected to a connector. The first set of traces extends along the interior surface from the upper edge to the lower edge and around the lower edge onto the exterior surface. The second set of traces extends along the exterior surface from the upper edge to the lower edge and around the lower edge onto the interior surface. The traces of the first and second sets proximate to the lower edge are configured to be connected to a circuit board.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: November 20, 2007
    Assignee: Molex Incorporated
    Inventor: Victor Zaderej
  • Patent number: 7273401
    Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: September 25, 2007
    Assignee: Molex Incorporated
    Inventors: Victor Zaderej, David L. Brunker, Phillip J. Dambach
  • Patent number: 7249974
    Abstract: A jack assembly for use with a modular electrical plug includes a jack housing. The jack housing includes an electrically non-conductive substrate metallized with a metal shield layer. The jack housing defines a socket adapted to receive the plug. At least one electrical contact is positioned in the socket to engage the plug when the plug is inserted in the socket. An electrically conductive jumper member including a drain wire connector may be mounted on the jack housing. The drain wire connector includes a pair of connector tabs defining a slot therebetween to receive and hold the drain wire.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: July 31, 2007
    Assignee: CommScope, Inc. of North Carolina
    Inventors: W. Andrew Gordon, Michael Walter Canning, Robert R. Goodrich
  • Patent number: 7232331
    Abstract: An electrical connector (10) having a contact element (50) retained in a hollow body (12). The body (12) has an internal socket structure (44) for receiving an end of the contact element (50) so that insulation displacement contacts (54) of this engage and make electrical connection to wires (70) of an incoming cable (16) to which the connector is connected. Fingers (56) of the connector element (50) extend externally of the connector body and carry electrical contacts (82).
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: June 19, 2007
    Assignee: ADC GmbH
    Inventors: Wayne Dennes, Michael Sielaff