Conductive Coating Patents (Class 439/931)
  • Patent number: 5527189
    Abstract: A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: June 18, 1996
    Assignee: Berg Technology, Inc.
    Inventors: Richard J. Middlehurst, Michael K. Knight
  • Patent number: 5525075
    Abstract: A coaxial microstripline transducer, having an inner conductor with a center conductor portion arranged in a recess portion of a resin case and a terminal portion which is integral with the center conductor portion and formed so as to lead to a lower surface of the resin case. An outer conductor has a first conductor portion arranged along at least a part of an inner peripheral surface of the recess portion and a second conductor portion which is integral with the first conductor portion and extended to the lower surface across an upper surface and across a pair of side surfaces opposed to each other of the resin case. The inner and outer conductors are fixed to the resin case. The outer conductor is preferably made of sheet metal material so as to enjoy low high-frequency losses. The first conductor portion advantageously is resilient and projects into the recess portion of the resin case to grip and engage a plug inserted into the transducer.
    Type: Grant
    Filed: June 13, 1994
    Date of Patent: June 11, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenshi Michisita, Tomoyoshi Ohnishi, Yuichi Maruyama, Shigeki Takahashi
  • Patent number: 5509823
    Abstract: An electrical mating connector has a basic body of an insulating material with a collar surrounding the plug-in region of the contact elements, the basic body being provided with a conductive coating for the purpose of shielding and that an interposed, elastic, conductive seal is provided for connecting the coating to a printed circuit board.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: April 23, 1996
    Assignee: Harting Elektronik GmbH
    Inventors: Dietmar Harting, Karin Foerster, Guenter Pape
  • Patent number: 5435753
    Abstract: A plug and socket connector, particularly with filtering and/or shielding, is composed of two connector halves, for examples, a female or male multi-point connector and a printed circuit board or the like. The base member of one connector half has pin-like connecting elements and the base member of the other connector has corresponding receiving openings or spring contacts. Between always two receiving openings for contacts, a metal-coated cutout is provided. In an electric plug-type connection, the receiving openings of the base member receiving the pin-like connecting elements are provided with a suitable metal contact.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: July 25, 1995
    Assignee: ELCO Europe GmbH
    Inventor: Klaus Werner
  • Patent number: 5427532
    Abstract: A twist-in socket for insertion into a printed circuit assembly has a molded plastic body, conductive paths deposited or plated onto the surface, and an LED and a resistor connected to the paths for energization by the printed circuit. The sockets are molded in arrays, plated to form the conductive paths, the components inserted by automatic machines and flow soldered to the paths, and then individual sockets are snapped off the array. In one embodiment, the LED and resistor have leads extending through holes in the socket to reach the conductive paths. In another embodiment, surface mount components are used, and plated-through holes in the socket couple the path to the surface mount components.
    Type: Grant
    Filed: September 26, 1994
    Date of Patent: June 27, 1995
    Assignee: Delco Electronics Corporation
    Inventors: Marvin L. Owen, Mark J. Miller
  • Patent number: 5399104
    Abstract: A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path member includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: March 21, 1995
    Assignee: McKenzie Socket Technology, Inc.
    Inventors: Richard J. Middlehurst, Michael K. Knight
  • Patent number: 5398156
    Abstract: A printed circuit board is mounted on the inner side of a conductively coated plastic computer housing wall using a screwless retention and grounding system molded integrally with the housing wall and including a spaced series of upstanding hook plate portions extendable through a series of elongated slots in the circuit board body and positioned in spaced, facing relationships with corresponding contact tab portions. The board is releasably mounted by pressing it inwardly against the tabs in a manner causing the hook plates to extend through the board slots, and causing the board to depress a resilient latch member formed on the housing wall. The board is then slid along the tabs until the latch pops up and releasably locks the board to the contact tabs with the outer ends of the hook plates overlying the board.
    Type: Grant
    Filed: March 22, 1993
    Date of Patent: March 14, 1995
    Assignee: Dell USA, L.P.
    Inventors: Karl M. Steffes, Jerry D. Gandre
  • Patent number: 5388999
    Abstract: A connection system comprising a terminal strip of insulating material and a metal rail connected to ground, said terminal strip having two substantially rectangular and generally planar sides extending perpendicularly to the longitudinal direction of the rail, two lateral faces, a front face provided with electrical contacts, and a back face fixed to the rail, each of the sides having an outside surface, wherein the outside surfaces of said sides of the strip are formed with respective electrically conductive layers in electrical contact with the rail.
    Type: Grant
    Filed: November 16, 1993
    Date of Patent: February 14, 1995
    Inventor: Jacques Nozick
  • Patent number: 5378158
    Abstract: A twist-in socket for insertion into a printed circuit assembly has a molded plastic body, conductive paths deposited or plated onto the surface, and an LED and a resistor connected to the paths for energization by the printed circuit. The sockets are molded in arrays, plated to form the conductive paths, the components inserted by automatic machines and flow soldered to the paths, and then individual sockets are snapped off the array. In one embodiment, the LED and resistor have leads extending through holes in the socket to reach the conductive paths. In another embodiment, surface mount components are used, and plated-through holes in the socket couple the path to the surface mount components.
    Type: Grant
    Filed: January 21, 1994
    Date of Patent: January 3, 1995
    Assignee: Delco Electronics Corporation
    Inventors: Marvin L. Owen, Mark J. Miller
  • Patent number: 5364292
    Abstract: A cable harness assembly is provided, which has a low profile, is shielded, and can be constructed at low cost. The assembly is of the type that includes a board (12, FIG. 2) coupled to a connector frame (14) that holds multiple contacts (52) and coupled to a cable (16), wherein insulated wires (24) of the cable run along the board and have bared front ends (50) connected at joints (74) to tails at the rear of the contacts. An underlayer (72) of electrically insulative material lies over the wire-to-tail joints and any other exposed areas of the wires and tails lying on the board, the underlayer having undulations (78, FIG. 3) that follow the contours under it. An overlayer (80, FIG. 2) of electrically conductive plastic material lies over the underlayer and the rest of the board, wires, and cable front portion.
    Type: Grant
    Filed: December 15, 1993
    Date of Patent: November 15, 1994
    Assignee: ITT Corporation
    Inventor: Gary C. Bethurum
  • Patent number: 5362247
    Abstract: A rotary retainer system for holding a board (14) with active electrical components in an electrical connector assembly includes a boss (50) secured to the housing (48) of the connector assembly, with the boss having an elongated slot (52) open toward the other end of the housing. The slot is sized so that one end of the board is receivable therein with sufficient clearance to allow pivoting motion of the board about that one end within the slot. At the other end of the connector assembly housing are several rotary retainers (68) each having a post (70) disposed in a cavity (54) of the housing. The post and the cavity are so configured that the post can only be inserted and removed from the cavity when in a predetermined angular orientation, with all other allowable angular orientations of the post preventing removal of the post from the cavity. The retainer also has a head (72) which, when the post is in the predetermined angular orientation, allows the board to pass thereby.
    Type: Grant
    Filed: October 21, 1993
    Date of Patent: November 8, 1994
    Assignee: The Whitaker Corporation
    Inventor: Charles J. Rodriguez
  • Patent number: 5350323
    Abstract: The invention relates to a contact for an electrical contactor protected by a polymer film and to its production process.This contact (3 or 7) has a contact resistance of at the most 10 ohms and incorporates a base metal coated by a 5 to 500 nm, homogeneous, adhesive organic polymer film. The polymer film can be deposited by the electropolymerization of a monomer such as acrylonitrile, followed by a heat treatment or irradiation to improve its electrical conductivity, so that a contact resistance not exceeding 10 ohms is obtained.
    Type: Grant
    Filed: June 3, 1993
    Date of Patent: September 27, 1994
    Assignees: Commissariat a l'Energie Atomique, Souriau et Cie
    Inventors: Jacques Boissel, Joseph Delhalle, Gerard LeCayon, Pascal Viel
  • Patent number: 5344341
    Abstract: A connector includes first and second connector halves 100 and 200 in which contact pins 1 and 4 are respectively held by projections 3a and 6a protruding from insulation plates 3 and 6. The insulation plates are housed within an insulation housing (2, 5) whose internal and external surfaces are coated with a conductive film, so that crosstalk between the neighboring contact pins is prevented, and all elements can be constructed by molding.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: September 6, 1994
    Assignee: NEC Corporation
    Inventor: Toshinori Yoshino
  • Patent number: 5246386
    Abstract: A structure for a terminal plug includes a thermoplastic resin base having a key boss and a plurality of protruding shafts formed integrally on a front side thereof. Terminal pins are formed on the plurality of protruding shafts by a chemical plating process. Connection patterns are disposed on the front side of the thermoplastic resin base and connected to said terminal pins, and circuit patterns are disposed on the back side of the thermoplastic resin base. A plurality of through-holes are formed in the thermoplastic resin base which electrically connect the connection patterns and the circuit patterns.
    Type: Grant
    Filed: March 25, 1992
    Date of Patent: September 21, 1993
    Assignee: Omron Corporation
    Inventor: Hideo Nanjo
  • Patent number: 5246385
    Abstract: A connector comprises a socket portion which is subjected to surface treatment and a base portion which is not subjected to the surface treatment, or comprises a socket portion and a base portion subjected to different kinds of surface treatments. The socket and base portions are each provided with a coupling mechanism. The socket and base portions may be easily surface treated independently, after which they are coupled together, thereby forming a connector capable of preventing short circuit arising from surface treatments.
    Type: Grant
    Filed: February 27, 1992
    Date of Patent: September 21, 1993
    Assignee: NEC Corporation
    Inventors: Yoshifumi Chida, Mituaki Hayashi, Atsushi Kikuchi, Kenichi Hatakeyama
  • Patent number: 5228871
    Abstract: An electrical connector (10) of a type adapted to connect signal and ground circuits between a mating connector (60) and a further circuit, board, or cable (50) includes a housing (12) having an interior cavity (20a) defined by side, top, and bottom walls (13, 14, 17, and 18) and a rear wall (16) with the surfaces of the housing being conductive to shield signal contacts (24, 26) therein extended through the rear wall (16) via insulating portions (22); the housing including longitudinal slots (30) containing grounding contacts (32) having spring driven edge portions (34) engaging the grounding and shielding surfaces of a mating connector (60) and post portions (38) extending out of the housing to interconnect to the grounding circuit of a further circuit, board, or cable. One embodiment features a plastic housing (12) with a metallic coating defining surface (M) and another embodiment includes a solid metallic housing (40) and a plastic insert (46).
    Type: Grant
    Filed: June 17, 1992
    Date of Patent: July 20, 1993
    Assignee: AMP Incorporated
    Inventor: Joseph R. Goodman
  • Patent number: 5183412
    Abstract: A cylindrical insulator (1) is provided in which inner and outer surfaces are covered with electroconductive plated layers (2, 2a). The layers (2, 2a) are directly electrically connected to the shielding wire (4) and core wire (3), respectively, of a coaxial cable (6) while a groove (14) for engagement with outer contacts (7, 7a) is formed in the outer surface of the insulator (1) and a projection having the same shape as the groove (14) is provided on the inner surface of the insulator (1) to keep its thickness uniform over its entire length. The shielding wires (4) are connected to the outer surface of the insulator by clamping the wires to the outer plated layer of the insulator by means of a clamping ring.
    Type: Grant
    Filed: March 16, 1992
    Date of Patent: February 2, 1993
    Assignee: NEC Corporation
    Inventor: Toshiaki Nagafuji
  • Patent number: 5158465
    Abstract: An electrical audio jack connector. An insulative substrate is provided in the shape of an audio jack connector. A shield plating is applied to the outer surface of the substrate. A passage through the substrate is plated to provide the signal conductor for the connector. A plurality of relief recesses are formed in the bottom of the connector to provide spring action to firmly grasp a male pin inserted into the connector.
    Type: Grant
    Filed: February 23, 1990
    Date of Patent: October 27, 1992
    Assignee: General Electric Company
    Inventors: Victor V. Zaderej, James E. Betters
  • Patent number: 5158470
    Abstract: A molded plastic circuit element such as connector (50) includes a housing (52) molded of plastic to be nonresilient and have a plurality of cavities (68) into which are inserted compliant spring portions (44) of compliant pin contacts (42), for self-retention therein by strong interference fit. The side walls of the cavities (68) are plated to a substantial thickness (70) of copper or the like equivalent to about one ounce. An assured electrical connection is formed by the compliant pin (42) with the plating material (70) without solder, the plating material remaining assuredly integral to define a gastight connection over long-term in-service use. The contacts (42) of the array can enable mating with a corresponding connector (18) while circuit paths (74) extend from the plated cavities (68) to another array of pads (90) to connect to a circuit element (20) and interconnect it with connector (18).
    Type: Grant
    Filed: May 23, 1991
    Date of Patent: October 27, 1992
    Assignee: AMP Incorporated
    Inventor: Mansour Zarreii
  • Patent number: 5152696
    Abstract: Z-axis connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the connector to frictionally engage the through-plated holes on at least two boards.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: October 6, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, David J. Johnson, Arthur O. Kunstmann
  • Patent number: 5147209
    Abstract: An adapter is interposed between a device having a pattern of pins projecting therefrom and a PCB having contacts connected to various components. The body of the adapter is made of platable dielectric material and is formed with holes corresponding to the pattern of pins of the device and also along one or more edges with pads corresponding in number to the holes. The holes are plated with conductive material which may be used to establish electrical contact with the pins; however, preferably clips are installed in each hole and in electrical contact therewith, the clips having converging fingers which frictionally engage the pins and also electrically contact the same. Electrically conductive traces are located on the body, each having a first end connected to the plating of a hole and a second end leading to one of the pads. The traces may be formed by a plate and etch process similar to that used in PCB fabrication.
    Type: Grant
    Filed: November 20, 1991
    Date of Patent: September 15, 1992
    Assignee: McKenzie Socket Technology, Inc.
    Inventors: Stanley M. Litwin, Jeffrey L. Davis, Michael S. Scott
  • Patent number: 5145382
    Abstract: An electrical socket (10) for interconnecting a printed circuit surface (11) and a coaxial connector (12), comprising a molded plateable dielectric body (10'). The body (10') has a plated center contact portion (20) for selectively receiving the coaxial connector (12) and surface mounting with the printed circuit surface (11). Similarly, the body (10') also has a plated ground contact portion (21) for selectively receiving the coaxial connector (12) and surface mounting with the printed circuit surface (11), wherein the portions are integrally formed as a single piece (10').
    Type: Grant
    Filed: November 29, 1991
    Date of Patent: September 8, 1992
    Assignee: Motorola, Inc.
    Inventor: David M. Dickirson
  • Patent number: 5141454
    Abstract: A filtered electrical connector comprises a selectively plated insulator housing having a plurality of pin terminals and a like plurality of small electrical components. The insulator housing is made of a platable thermoplastic part and a non-platable thermoplasitc part is a two shot molding process. The platable thermoplastic part provides a row of terminal cavities and a predominate portion of the insulator housing surfaces. The non-platable thermoplastic part lines surfaces of the platable thermoplastic part that are adjacent exposed portions of the pin terminals and also partitions portions of the platable thermoplastic part to provide individual mounting sites for the small electrical component associated with each of the terminal cavities.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: August 25, 1992
    Assignee: General Motors Corporation
    Inventors: Roger L. Garrett, Mark J. Vanden Wymelenberg, Joseph H. Gladd
  • Patent number: 5127838
    Abstract: A molded and plated or etched connector pair for mating together two printed wiring boards or the like. The female connector includes a column molded as a part of one PWB having a tapered passage therethrough. At least the inside of the tapered passage is plated with a conductive material which is connected to the bottom of the PWB through a plated through hole. The male connector member includes a block molded as a part of its PWB. The block includes a channel which mates with the column of the female connector. A plastic pin is disposed in the middle of the channel and mates with the tapered passage of the female member. The pin is plated with a conductive material and is coupled to the bottom of the male member's PWB via a plated through hole. The pin itself is tapered and has a tapered aperture passing all the way through it terminating in the plated through hole.
    Type: Grant
    Filed: February 23, 1990
    Date of Patent: July 7, 1992
    Assignee: General Electric Company
    Inventors: Victor V. Zaderej, James E. Betters
  • Patent number: 5118300
    Abstract: An active connector (110,160) including a first dielectric body (112,162) having an L shape and having two arrays of pin contacts having pin portions extending outwardly from mounting surfaces which intersect at a right angle for the connector to be disposed in the corner of circuit elements (12,20) also at right angles, with the pins connected to circuits of the circuit elements. The first dielectric body (112,162) includes conductive paths extending to aligned arrays of pads along the two edge surfaces (122,124) remote from the inside corner, the edge surfaces being coplanar defining a plane traversing the L shape.
    Type: Grant
    Filed: May 23, 1991
    Date of Patent: June 2, 1992
    Assignee: AMP Incorporated
    Inventor: Mansour Zarreii
  • Patent number: 5106310
    Abstract: Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards. Formation of pin connectors from a resilient thermoplastic material coated with a conductive layer is also disclosed.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: April 21, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, David J. Johnson, Arthur O. Kunstmann
  • Patent number: 5088009
    Abstract: A surface-mounting connector includes a repeater pin block and connector pins. The repeater pin block includes a main body consisting of a resin and having regularly arranged through holes, and a continuously extended resin spring contact portion integrally and continuously extending from the main body to be brought into contact with a surface of a printed board. The main body and the continuously extended resin spring contact portion have contact portions to be brought into contact with conductive pads of the printed board and conductive paths to be connected to the regularly arranged through holes. Each connector pin has a first pin portion on its one end. The first pin portion has a press-fit structure and is forcibly inserted in a corresponding through hole. Each connector pin also has a second pin portion on its other end. The second pin portion is used for electrical connection with an external unit.
    Type: Grant
    Filed: December 13, 1990
    Date of Patent: February 11, 1992
    Assignees: NEC Corporation, Nippon Telegraph and Telephone Corporation
    Inventors: Katsumi Harada, Toshiaki Nagafuji, Wataru Takahashi, Kenichi Nakano, Kei-ichi Yasuda
  • Patent number: 5078079
    Abstract: A gauge for a vehicle has a spontaneous light-emission type pointer with a built-in light-emitting device. The pointer is fixed to a pointer shaft rotatably driven in accordance with a measured value. A solid circuit member for supporting a light-emitting device and for coupling the light-emitting device to the pointer shaft is fixed to the pointer. The solid circuit member has a first plated conductive layer for electrically connecting one of the terminals of the light-emitting device to the pointer shaft, and a second plated conductive layer for electrically connecting the other of the terminals to a spring abutment fixed to the pointer shaft in an insulating fashion. The solid circuit member is connected to a power source for lighting the light-emitting device. Consequently, a number of parts required for supplying power to the light-emitting diode can be reduced.
    Type: Grant
    Filed: March 21, 1991
    Date of Patent: January 7, 1992
    Assignee: Yazaki Corporation
    Inventors: Noriaki Ohta, Minoru Iwazaki, Hiroyasu Shiratori
  • Patent number: 5070605
    Abstract: A connector system for use in coupling an implantable electrical lead to an implantable pulse generator, or other implantable electrical apparatus. The connector system includes a connector pin assembly, typically mounted to the implantable lead and a connector block, typically mounted to the electrical stimulator. The connector block is provided with a lumen, in which a plurality of resilient, elastomeric rings are linearly arranged. The rings are so sized as to frictionally engage a connector pin which is provided with a plurality of conductive pads, each coupled to a conductor within the implantable lead. Certain ones of the elastomeric rings are conductive, and engage with the conductive pads on the connector pin. Others of the rings are nonconductive and act as insulators and fluid seals. The connector pin assembly is also provided with a circumferential groove, which interlocks with the deflectable beam members of a retainer mounted to the connector block.
    Type: Grant
    Filed: January 24, 1990
    Date of Patent: December 10, 1991
    Assignee: Medtronic, Inc.
    Inventors: Terry D. Daglow, Richard D. Sandstrom
  • Patent number: 5046967
    Abstract: A method for joining metal and plastic parts, in particular in electrical connector shells, includes the steps of insert-molding a first metal part into a plastic part and subsequently joining the first metal part to a second metal part at a metal-to-metal interface by conventional metal joining techniques. In an electrical connector made by the above method, a composite metal and plastic backshell includes a metal portion insert-molded into a plastic portion. A metal frontshell can then be connected to the backshell by attaching it to the metal backshell portion using simple metal joining techniques such as crimping or riveting.
    Type: Grant
    Filed: March 5, 1990
    Date of Patent: September 10, 1991
    Assignee: Amphenol Interconnect Products Corporation
    Inventors: Joseph Majernik, Lonnie Fisher
  • Patent number: 5044984
    Abstract: A one piece bracket (2) for use in stacking, in superposed relationship, first (56) and second (58) shielded multi contact electrical connectors, comprises elongate body, having at one end thereof a top mounting face providing a seat for a grounding flange of the top connector (56) and at the other end thereof a bottom mounting face providing a seat for a flange of the bottom connector (58). A tail part (18) projects from the body (4) and carries a fastening lug in the form of a block (46) having a central bore (52) for receiving a boardlock (100) for securing the bracket (2) to a circuit board (CB). The block (46) projects below the seat for the flange of the bottom connector, so that the lower surface of the block can engage the circuit board when the bracket (2) has been mounted thereon. The elongate body (4) has a through central bore (24) through which one or more fasteners can be passed to secure the flanges to their respective seats.
    Type: Grant
    Filed: June 22, 1990
    Date of Patent: September 3, 1991
    Assignee: AMP Incorporated
    Inventors: Bruce T. Mosser, Dale F. Pells, James R. Weaver
  • Patent number: 5044992
    Abstract: A connector protected against current pulses resulting from secondary emission from connector pins by a conductive layer surrounding each pin set. The conductive layer is intimately bonded to the connector insulation and is connected to the connector pin set. The connector is formed in a housing block of a liquid crystal thermoplastic that retains the crystal structure at elevated temperatures preventing deformation during high temperature soldering. The connector back and sides are patterned with plated conductors that provide interconnection between selected pins directly on the connector outer surfaces. The back surface of the connector is sealed by a heat setting acrylic that prevents contaminants from the environment at the back of the connector getting into the pin recesses.
    Type: Grant
    Filed: October 20, 1989
    Date of Patent: September 3, 1991
    Assignees: The Charles Stark Draper Laboratory, Raytheon Company
    Inventors: Luke Dzwonczyk, Richard Sullivan, William E. Wesolowski, James W. Malloy
  • Patent number: 5037332
    Abstract: An electrical coupling is provided which has a dielectric body with numerous contact-holding holes, which provides electromagnetic shielding between contacts in a simple and low cost construction. The body (20, FIG. 3) has through holes extending between its opposite faces, and has a metal plating (34) which covers the walls of the holes as well as at least a portion of a face to interconnect all of the hole platings. A plurality of dielectric bushings (54, 56) lie in many of the holes to prevent contacts (36) in the holes from touching the plating on the walls of the holes. At least one of the holes not occupied by one of the bushings, holds a metal grounding device (60) securely connected to the plating on the hole wall and forming a contact for connecting to a grounded terminal (16G).
    Type: Grant
    Filed: August 7, 1990
    Date of Patent: August 6, 1991
    Assignee: ITT Corporation
    Inventor: Albert H. Wilson
  • Patent number: 5030113
    Abstract: A circuit apparatus connector is described, of the type which includes a body holding rows of contacts (92, FIG. 2) and a flexible circuit for connecting the contacts to terminal pads (144, 146) on a circuit board device (140), to allow the circuit board device to be shifted slightly relative to the contacts. An insulator (84) is provided which includes a body (86) with holes for holding the contacts and with an integral elongated arm (100) whose end can bear against a side of the circuit board device. Conducting plating regions are formed on the insulator, each region plating the walls of a contact-receiving hole (90) and forming a trace (120) on one side of the arm that ends in a contact pad (122) that engages a terminal pad on the circuit board device.
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: July 9, 1991
    Assignee: ITT Corporation
    Inventor: Albert H. Wilson
  • Patent number: 5028492
    Abstract: A composite coating for electrical connectors is provided. The coating contains a ductile metal matrix and an uniformly dispersed polymer component. The polymer component is present in a concentration effective to reduce frictional forces generated when inserting an insertion component into a socket. The composite coating has lower friction and improved fretting corrosion resistance as compared to an electrodeposited tin coating. One preferred coating contains 0.5 weight percent polytetrafluoroethylene in a tin matrix.
    Type: Grant
    Filed: March 13, 1990
    Date of Patent: July 2, 1991
    Assignee: Olin Corporation
    Inventor: Bruce M. Guenin
  • Patent number: 5015207
    Abstract: A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facilitates sealing thereof in the apertures of microcircuit packages to provide increased conductive path density. The multi-path feed-thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively. A plurality of discrete metalized conductive pathways are formed on the intermediate portion ad first and second end portions of the insulative substrate.
    Type: Grant
    Filed: December 28, 1989
    Date of Patent: May 14, 1991
    Assignee: Isotronics, Inc.
    Inventor: Richard A. Koepke
  • Patent number: 5002493
    Abstract: An electronic assembly is disclosed comprising a molded dielectric connector means including an electronic package mounted therewithin, the connector means 80 being adapted to be secured to a framework. The connector means includes first and second molded member 82,110 securable together at an interface. The first molded member has outwardly facing surface portion including an interconnection region 94, and includes compliant spring portions 90 integral therewith portions and extending outwardly therefrom at the interface. The compliant spring portions 90 are adapted to be deflected by the second molded member 110 upon assembly of the molded members. Circuit means 92 are included on the first molded member 82 and are defined along the outside surface portions and extending along outwardly facing surface portions of the compliant spring portions 90 and further extending to interconnection region 94.
    Type: Grant
    Filed: September 19, 1989
    Date of Patent: March 26, 1991
    Assignee: AMP Incorporated
    Inventors: Thomas E. Brown, Thomas F. Davis
  • Patent number: 4986779
    Abstract: A local area network interface assembly includes an outlet box for receiving at least one connector assembly therein. The outlet box is profiled to receive from the rear thereof, an edge card connector, which is snap latachable into the outlet box. The connector assembly is mounted to an edge card which is profiled for receipt within the edge card connector. The outlet box is formed of a dielectric material which is plated over with a metallic plating. The outlet box includes two latch members along the sides which are bow shaped and have grounding surfaces thereon, which latch the outlet box in place to a panel, and simultaneously ground the box to the panel.
    Type: Grant
    Filed: February 6, 1990
    Date of Patent: January 22, 1991
    Assignee: AMP Incorporated
    Inventors: Jess B. Ferrill, Randy G. Simmons
  • Patent number: 4921430
    Abstract: A connector for electronic parts has a plurality of electronic contacting pieces arranged on a connector body at very narrow spaces and in parallel relation with respect to one another. Each of the electric contacting pieces is provided with an insulation material attached on its outer surface facing an adjacent electric contacting piece, so that the insulation material will act to isolate adjacent electric contacting pieces. The electric contacting pieces are thus planted in the connector body without any other insulating substance than the insulation material disposed between the adjacent electric contacting pieces.
    Type: Grant
    Filed: September 13, 1989
    Date of Patent: May 1, 1990
    Assignee: Yamaichi Electric Mfg. Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 4902235
    Abstract: A socket for mounting an integrated circuit unit on a printed circuit board comprises a plurality of inserts of a platable electrically insulating material each having an opening and an exterior surface portion. The inserts are mounted in rows in a support body so the openings are accessible from one side of the body and the exterior surface portions are exposed at an opposite side of the body. Electrically conductive layers are provided on the inner surfaces of the insert openings, preferably by electroless plating techniques using the body as a plating mask, to extend to the exterior surface portions of the inserts to be soldered to circuit paths on the printed circuit board at prescribed circuit locations. Contacts are disposed in the insert openings in electrical engagement with the electrically conductive layers therein for resiliently and detachably electrically engaging terminals of integrated circuit units or the like inserted into the openings.
    Type: Grant
    Filed: July 20, 1988
    Date of Patent: February 20, 1990
    Assignee: Texas Instruments Incorporated
    Inventor: Takashi Tonooka
  • Patent number: 4838799
    Abstract: An IC socket which has contacts positioned corresponding to each pin position of an IC to be inserted and a body portion holding the contacts, characterized in that at least a part of the contact is formed of conductive resin.
    Type: Grant
    Filed: July 16, 1987
    Date of Patent: June 13, 1989
    Assignee: Texas Instruments Incorporated
    Inventor: Takashi Tonooka
  • Patent number: 4806111
    Abstract: A connector structure comprising an electrically conductive plate having a plurality of through holes formed therein, an electrically insulated film formed on the inner wall of at least one of the through holes, an electrically conductive film formed on the inner wall of at least one other through hole, and an electrically conductive material of a low melting point provided within the through holes. The low melting point material provided in the through holes whose inner walls are coated with an electrically insulating film is insulated from the electrically conductive plate and such through holes may serve to receive signal propagating pins.
    Type: Grant
    Filed: November 3, 1986
    Date of Patent: February 21, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Masaaki Nishi, Moritoshi Yasunaga, Ryotaro Kamikawai
  • Patent number: 4734045
    Abstract: A high density connector for connecting multiple circuits between printed circuit boards or the like is formed of inter-engaging mating, first and second connector halves formed of an electrical insulating material with said connector halves including opposed connection faces having uniform width and height undulations forming alternating flattened peaks and valleys of limited width with the peaks and valleys having an electrically conductive coating thereon to form longitudinally spaced transversely offset contacts at the peaks and valleys. The connection faces of the respective connector halves bear mirror image undulations. The center to center distance between longitudinally adjacent contacts is less than the peak to valley distance between those contacts to increase the electrical creapage path between longitudinally adjacent contacts of the mating first and second connector halves.
    Type: Grant
    Filed: March 27, 1987
    Date of Patent: March 29, 1988
    Assignee: Masterite Industries, Inc.
    Inventor: John L. Hawkins