Abstract: A multiple layer fiber reinforced material and method of constructing the same including the provision of a first layer of a roll lofted glass material. Optional variants include the pre-application of plywood, OSB or fiber reinforced cement board materials prior to the first glass layer. A layer of a rolled fiber reinforced material is applied over the rolled glass material, with or without backing board material, and at least a second layer of the roll lofted glass material is applied over the rolled fiber reinforced material. A layer of a second rolled glass material is applied over the subsequent layer of the first glass material and a urethane resin syrup is intermixed with said layers of glass material and the fiber reinforced material. An application of heat and pressure results in the formation of the reinforced material. A flexural, closed cell foam material may also be applied to provide acoustical insulating properties to the multi-layer fiber material.
Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Type:
Grant
Filed:
December 11, 2001
Date of Patent:
March 22, 2005
Assignee:
ThermalWorks, Inc.
Inventors:
Kalu K. Vasoya, Bharat M. Mangrolia, William E. Davis, Richard A. Bohner