Abstract: According to one embodiment, the method of manufacturing a semiconductor device includes contacting a film formed on a semiconductor substrate with a rotating polishing pad which is supported on a turntable, and feeding polishing foam to a region of the polishing pad with which the film is contacted, thereby polishing the film. The polishing foam is obtained by turning the aqueous dispersion into a foamy body. The aqueous dispersion includes 0.01-20% by mass of abrasive grain and 0.01-1% by mass of foam forming and retaining agent, all based on a total mass of the aqueous dispersion.

Abstract: A game ball surface treatment apparatus for abrading, cleaning or polishing game balls includes an outer housing having a base portion and a side wall portion, an inner housing arranged within the outer housing and having a bottom portion and a circumferential wall portion extending upwards from the bottom portion, a damper arranged to interconnect the outer housing and the inner housing, an electric motor fixed to the bottom portion of the inner housing and having an output shaft extending upwards, a rotary disc fixed to the output shaft of the electric motor to support the game balls and provided with an abrading fabric making contact with the game balls, an impeller arranged above the rotary disc to accommodate the game balls in a mutually isolated state, and a lining attached to the circumferential wall portion of the inner housing to make contact with the game balls.

Abstract: According to one embodiment, there is provided a polishing pad having a surface for the polishing processing of a polishing workpiece. Here, the polishing pad is made of a plate-shaped thermal shrinking material, and it has a half-cut portion cut to a particular depth from one principal surface.

Abstract: A particle cleaning module includes a housing, a substrate holder, a pad holder, an actuator and a pad conditioner. The substrate holder is disposed in the housing, is configured to retain a substrate in a substantially vertical orientation, and is rotatable on a first axis. The pad holder is disposed in the housing, has a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, and is rotatable on a second axis parallel to the first axis. The actuator is operable to move the pad holder relative to the substrate holder to change a distance defined between the pad retaining surface and the substrate. The pad conditioner is disposed in the housing and has a conditioning surface oriented parallel to the pad retaining surface.

Abstract: The present invention is a finishing plate and method of fabricating a finishing plate. The finishing plate can be fabricated to various shapes, and can be used with various surfacing machines. In a preferred mode, the present invention is a disc cutting plate which can be used with a random orbital sander, and can be used to replace traditional abrasive sheets such as sandpaper. The present invention can be used in smoothing various materials including wood, painted wood, plastic, and various metals.

Abstract: Method and device for processing a surface (5) of a diamond (1) with a mechanical part (3) which is moved in relation to the surface (5) of the diamond (1), whereby unbound diamond grains (2) are provided in between the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) subjects the diamond grains (2) to a rolling motion over the surface (5) of the diamond (1), such that the diamond grains (2) move in relation to the mechanical part (3) and the surface (5) of the diamond (1), whereby the mechanical part (3) makes a mechanical contact with the surface (5) of the diamond (1) via the diamond grains (2), whereby this mechanical contact represents a contact length (8) over which the diamond grains (2) roll on the surface (5) of the diamond (1), mainly according to the direction of the relative motion of the mechanical part (3) in relation to the surface (5) of the diamond (1) and, whereby the diamond grains (2), with the support of the mechanical part (3), press themselves

Abstract: A lapping system including: (a) a workpiece having a metal working surface; (b) a lapping tool having a contact surface for disposing generally opposite the working surface, the contact surface including an organic, polymeric material; (c) a plurality of abrasive particles for disposing between the contact surface and the working surface, and (d) a mechanism, associated with the working and contact surfaces, for applying a relative motion between the surfaces, and for exerting a load on the contact surface and the working surface, the contact surface for providing an at least partially elastic interaction with the plurality of abrasive particles, and wherein the contact surface and the mechanism are designed and configured, and the plurality of particles is selected, such that upon activation of the mechanism, the relative motion under the load effects lapping of the metal working surface to produce a tribological surface.

Abstract: The present invention is a finishing plate and method of fabricating a finishing plate. The finishing plate can be fabricated to various shapes, and can be used with various surfacing machines. In a preferred mode, the present invention is a disc cutting plate which can be used with a random orbital sander, and can be used to replace traditional abrasive sheets such as sandpaper. The present invention can be used in smoothing various materials including wood, painted wood, plastic, and various metals.

Abstract: A coin cleaning and grinding apparatus includes a conveyor for conveying coins, two drive rollers of urethane sponge having a urethane hardness between 70 and 90 degrees, and a pair of primary grinding rollers and a pair of secondary grinding rollers of urethane sponge. The primary grinding rollers are supported rotatably and downstream from the conveyor. One of the primary grinding rollers is positioned lower than the other. The lower primary grinding roller is in compressive contact with the higher primary grinding roller and one of the drive rollers. The secondary grinding rollers are supported rotatably and downstream from the primary grinding rollers. One of the secondary grinding rollers is positioned lower than the other. The lower secondary grinding roller is in compressive contact with the higher secondary grinding roller and the other drive roller. A sprinkling plate is positioned at an angle above the grinding rollers.

Abstract: An electrically driven grinder for ceramic cutlery 1 has a rough machining diamond abrasive wheel 2 comprising a disc-shaped member provided with a grinding surface on its periphery and a finishing machining diamond abrasive wheel comprising a substantially disc-shaped member provided with grinding surfaces forming a V-shaped groove on its periphery, both of which are attached onto a rotary shaft coupled to a motor, as well as has a cover member provided with guide slots for directing an edge of ceramic cutlery to the grinding surfaces of the respective diamond abrasive wheels, wherein an angle &agr; defined between the grinding surfaces 32 forming the V-shaped groove of the finishing abrasive wheel and a plane orthogonal to the rotary shaft 4 is set to 10 to 20 degrees, and an angle defined between at least the guide slot 10 of the cover member 8 and a plane orthogonal to the rotary shaft s set to 12 to 18 degrees.

Abstract: A semiconductor wafer for use in the fabrication of semiconductor devices which includes a circular wafer (13) of semiconductor material having a perimeter and a notch (11) having a wall disposed in the wafer and extending to the perimeter which includes a preferably rounded apex (5) interior of the perimeter and a pair of rounded intersections (7, 9) between the wall and the perimeter. The notch is formed with a tool (23) for forming rounded corners in the semiconductor wafer which includes a body of a material having a hardness greater than the semiconductor wafer which has a generally rounded or paraboloidally shaped front portion having a forwardmost tip (25) portion and a wing portion (27) extending outwardly from the body and having a taper narrowing in the direction of the forwardmost tip portion. The wing portion can be one or more spaced apart wing members or the wing portion can be a single member which extends completely around the tool axis.

Abstract: The present invention is directed to polishing the surface of an airplane part to an improved specularity by adding the additional step of sanding prior to the polishing step.

Abstract: An apparatus to remove adhering material from the surfaces of sand to recycle the sand is disclosed. The apparatus includes a container (13) to hold sand (S) to be processed, the container having a bottom opening; pressing means (17-20) to press the sand in the container downwards; a rotor (10) disposed under the bottom opening of the container (13), the rotor (10) having a surface (11) that contacts the sand in the container; means (2) for driving the rotor (10); and a gap (G) disposed near a place between the container and the rotor. The sand contacts and is abraded by the rotary surface (11 ) of the rotor (10), and the processed sand is discharged by the centrifugal force of the rotor (10) from the gap (G) onto a chute (21).

Abstract: A non-contact polishing tool that combines two orthogonal slurry flow geometries to provide flexibility in altering the shape of the removal footprint. By varying the relative contributions of the two flow geometries, the footprint shape can be varied between the characteristic shapes corresponding to the two independent flow regimes. In addition, the tool can include a pressure activated means by which the shape of the brim of the tool can be varied. The tool can be utilized in various applications, such as x-ray optical surfaces, x-ray lithography, lenses, etc., where stringent shape and finish tolerances are required.

Abstract: A glass plate washing machine has transferring apparatus for transferring glass plates and a plurality of electric motors disposed above the transferring apparatus. The motors are disposed in rows across the transferring apparatus. The motors which belong to any one of the rows are staggered relative to the motors which belong to the next row. Each of the motors is provided with a buff grinder at the lower end of the output shaft thereof. The glass plate washing machine further has first positioning apparatus for positioning each of the motors in the vertical direction independently of the other motors and second positioning apparatus for positioning each of the motors around an axis parallel to the transferring direction of the transferring apparatus independently of the other motors.