Abstract: A clad wire for producing test needles or sliding contacts is provided herein, the clad wire having a wire core made of rhodium or a rhodium-based alloy, an inner cladding made of copper or silver or aluminum or a copper-based alloy or a silver-based alloy or an aluminum-based alloy, wherein the inner cladding covers or completely encloses the wire core on at least two opposite sides, an adhesion-promoting layer made of gold or a gold-based alloy, which is arranged between the wire core and the inner cladding, and an outer cladding made of a metal or a metal alloy having a greater hardness than the inner cladding, wherein the outer cladding encloses the inner cladding. A method for producing a clad wire and to a test needle having at least one clad wire or produced from a clad wire and a test needle array is also provided herein.

Abstract: A construction site status monitoring device is provided including processing circuitry configured to receive sensor data associated with a construction site from a scout device and generate a site map based on the sensor data for deployment of the construction device.

Abstract: An apparatus and method for transporting a plurality of articles is disclosed. The apparatus includes a wheeled chassis, and a platform disposed on the wheeled chassis. The apparatus also includes a manipulator coupled to the wheeled chassis and operably configured to load a first article of the plurality of articles at a first position on the platform, or unload the first article of the plurality of articles from the first position on the platform. The apparatus further includes at least one actuator operably configured to cause successive relative rotational movements between the manipulator and the platform to provide access to successive rotationally spaced apart positions on the platform for loading or unloading each subsequent article in the plurality of articles.

Abstract: The invention relates to a method for the material-removing processing of an adjustable camshaft which has a shaft body, wherein at least a first component of the camshaft can move axially and/or in the circumferential direction with respect to the shaft body, wherein a gap which permits the movement is provided between the shaft body and the first component, and wherein in order to protect the first moveable component during the material-removing processing a protection apparatus which has at least one fluid duct is placed on the shaft body and fluid is applied to it. According to the invention, the protection apparatus is arranged laterally with respect to the first moveable component in such a way that at least some of the fluid is directed laterally onto the first component and into an intermediate space between the protection apparatus and the first component, and wherein the first component is exposed in the radial direction.

Abstract: The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.

Abstract: Among other things, one or more techniques or systems for particle removal from a semiconductor wafer are provided. Particles, contaminating a semiconductor wafer, have the potential to cause defects, such as scratches into a surface of the semiconductor wafer during chemical mechanical polishing or defocusing during a subsequent lithography stage, for the semiconductor wafer. Accordingly, a mechanic particle cleaner component, such as at least one of a sliver brush roller, a pencil brush, a tape polish, a sonic jet, or a liquid spray component, is configured to apply a mechanical force to an edge region of the semiconductor wafer to detach particles. A chemical particle cleaner component is configured to apply a chemical force to the edge region to detach particles. In this way, particles are removed from the semiconductor wafer before or after chemical mechanical polishing.

Abstract: Manufacturing methods are provided. A component may be polished to remove defects thereon. An identifier may be added to the polishing material employed to polish the component. A detector may detect the identifier. For example, the identifier may be a fluroescing material that may illuminate in the presence of a fluorescent light. A determining apparatus may determine a status of the component based on the presence or absence of the identifier. For example, the determining apparatus may determine that the component needs to be re-cleaned based on presence of the identifier. Related systems and computer program products are also provided.

Abstract: The present invention provides a surface processing system for a work piece in the mechanical technical field. The system comprises at least one group of polishing units. A manipulator and several polishers with different polishing precisions are provided on the polishing units. The polishers are arranged around the manipulator in turn. The work piece could be moved by the manipulator between the processing center and the polishing units. The machined work piece is loaded by the manipulator for one time when the manipulator is located at the processing center. When the manipulator is located at the polishing units, the manipulator keeps holding the work piece and transfers the work piece in a preset sequence to each polisher corresponding to the polishing unit where the manipulator is located. The surface of work pieces having different wall thicknesses and complex surfaces could be processed in a large batch with a high efficiency.

Abstract: A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.

Abstract: A method of generating a library of reference spectra includes storing an optical model for a layer stack having at a plurality of layers, receiving user input identifying a set of one or more refractive index functions and a set of one or more extinction coefficient functions a first layer from the plurality of layers, wherein the set of one or more refractive index functions includes a plurality of different refractive index functions or the set of one or more extinction coefficient functions includes a plurality of different extinction coefficient functions, and for each combination of a refractive index function from the set of refractive index functions and an extinction coefficient function from the set of extinction coefficient functions, calculating a reference spectrum using the optical model based on the refractive index function, the extinction coefficient function and a first thickness of the first layer.

Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.

Abstract: One or more slider bars are attached to at least one component of a multi-component carrier device. The multi-component carrier device is attached to a lapping arm of a lapping machine and the one or more slider bars attached to the carrier device are lapped. The at least one component of the multi-component carrier device is attached to a grinding/cutting machine. At least one of a grinding operation or a cutting operation is performed on the one or more slider bars.

Abstract: A printing form is for use in relief printing, in particular flexographic printing. The printing form is configured as a single or multilayered cylindrical layer structure having at least a first layer having a vulcanizate based on at least one elastomer. The first layer is extruded.

Abstract: A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.

Abstract: A polishing mechanism includes a support base, a pair of magnetic valves, a first polishing assembly and a second polishing assembly. The pair of magnetic valves are mounted in the support base. The first polishing assembly and the second polishing assembly are mounted on the support base and connected to the pair of magnetic valves respectively. The second polishing assembly is arranged perpendicular to the first polishing assembly. The first and the second polishing assemblies are respectively controlled by the pair of magnetic valves to polish one or more workpieces. The present disclosure further discloses a manipulator using the polishing mechanism.

Abstract: Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing.

Abstract: A system according to one embodiment includes a substrate having one or more sacrificial row bars and one or more additional row bars, wherein the one or more sacrificial row bars comprise a wear resistant material and are adapted to be used in a lapping process to prepare a lapping plate, wherein the one or more additional row bars comprise a material that has less wear resistance than the wear resistant material and are adapted to be used for magnetic head slider production, and wherein the lapping plate is adapted to be used in a lapping process to polish the one or more additional row bars.

Abstract: A pressure module and two polishing fixture modules are herein disclosed for fiber optic polisher, or polishing machine. Said pressure module further includes an adjustable spring between a top turntable and a bottom turntable, which are kinematically connected and driven by at least three pair of drive-pins and drive-bushes. Said pressure module is able to apply an adjustable pressure from bottom of the polishing fixture module. So the Fixture Module could not be floating in the pressure direction and maintain stationary when polishing machine is working. Two different quick-release mechanisms for a flexure polishing fixture module were invented for holding and releasing fiber ferrules or connectors during the polishing process controlled by sets of magnets. It's easy to work, and to protect the fixture flexure from the un-proper torque applied by different operators. The current invention is an improvement over our previous invention.

Abstract: A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.

Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

Abstract: A method for finish-machining a workpiece surface includes moving the workpiece surface relative to an active area of the finishing tool in a rotation direction about a workpiece axis, and superimposing on the relative movement of the workpiece surface and the active area an additional oscillatory movement with an oscillation frequency lower than 20 kHz in a direction perpendicular to the workpiece surface.

Abstract: A glass-plate working apparatus includes a glass-plate supporting portion 20a of a feed conveyor 7, a glass-plate supporting portion 20b of a cutting section 2, a glass-plate supporting portion 20c of a bend-breaking section 4, a glass-plate supporting portion 20d of a grinding section 3, and a glass-plate supporting portion 20e of a discharge conveyor 8; a cutting head 9, a bend-breaking device 66, and a grinding head 10 for processing glass plates 5 which are respectively supported by the supporting portions 20b, 20c, and 20d; and a transporting device 89 for transporting the glass plate 5 on the supporting portion 20a onto the supporting portion 20b, the glass plate 5 on the supporting portion 20b onto the supporting portion 20c, the glass plate 5 on the supporting portion 20c onto the supporting portion 20d, and the glass plate 5 on the supporting portion 20d onto the supporting portion 20e, respectively.

Abstract: An ultrasonic tooth making machine comprises: a tooth making machine, a work table, and a vibration device. The tooth making machine has a machine tool to perform machining operation. The work table is mounted on the tooth making machine to hold a rough blank tooth, and the work table and the machine tool are able to move with respect to each other. The vibration device is located between the work table and the rough blank tooth to put the rough blank tooth in an ultrasonic vibration environment. When the machine tool is controlled to move with respect to the work tale while the vibration device is powered on, the rough blank tooth, in the ultrasonic vibration environment, is capable of being machined into at least one artificial tooth at one time.

Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.

Abstract: An apparatus for grinding a continuously cast slab having a longitudinal axis and a rectangular cross-sectional shape with two opposite wide faces and two opposite narrow faces apparatus has a frame, two transversely spaced grinders carried on the frame, and a holder having two transversely spaced grippers engageable with the opposite faces of the slab in a vertical position with the wide faces of the slab vertical for grinding of the wide faces of the slab by the grinders and in a horizontal position offset by 90° to the vertical position with the wide faces of the slab horizontal for grinding of the narrow faces of the slab.

Abstract: An abrasive cutting machine includes a housing and a cutting arm on which a cutting tool is accommodated on the end side. The cutting tool is driven via a belt by an engine of the abrasive cutting machine, and the housing encompasses a fan chamber for accommodating a fan wheel by which an air flow is provided. A belt chamber for accommodating the belt is embodied in the cutting arm, with improved durability of a belt, in particular the dust exposure of the belt for power transfer from the engine to the cutting tool. Provision is made between the fan chamber and the belt chamber for an air duct, through which at least a part of the air flow, which is created by the fan wheel, reaches from the fan chamber into the belt chamber, so as to apply a sealing air flow to the belt chamber.

Abstract: A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

Abstract: Implementations of the metal polishing processes of the present disclosure machine polish patterns onto metal using various abrasive disks. The abrasive disks can be machine controlled using programmed commands. In some implementations, the programmed commands are derived based on the desired pattern using computer-aided manufacturing (CAM) technology. The programmed commands automatically operate a machine to polish a pattern onto metal using the abrasive disks.

Abstract: A manipulator includes a controlling seat, a robot arm assembly and a polishing mechanism. The robot arm assembly is rotatably connected to the controlling seat; and the polishing mechanism is mounted on the robot arm assembly. The polishing mechanism includes a housing with a first mounting portion and a second mounting portion, a pair of magnetic valves mounted in the housing and electrically connected to the controlling seat, a first polishing assembly partially received in the first mounting portion, and a second polishing assembly partially received in the second mounting portion. The first polishing assembly and the second polishing assembly define an angle therebetween and are respectively connected to the pair of magnetic valves, such that the pair of magnetic valves controls the first and the second polishing assembly respectively to polish one or more workpiece. The present invention further discloses a polishing mechanism of the manipulator.

Abstract: A polishing mechanism includes a support base, a pair of magnetic valves, a first polishing assembly and a second polishing assembly. The pair of magnetic valves are mounted in the support base. The first polishing assembly and the second polishing assembly are mounted on the support base and connected to the pair of magnetic valves respectively. The second polishing assembly is arranged perpendicular to the first polishing assembly. The first and the second polishing assemblies are respectively controlled by the pair of magnetic valves to polish one or more workpieces. The present disclosure further discloses a manipulator using the polishing mechanism.

Abstract: Abrasive articles including a body having a first abrasive layer, a second abrasive layer and one or more reinforcing layers for use with cordless tools have a reduced thickness with respect to conventional counterparts. Techniques for producing and using such abrasive articles are described. In one embodiment, the first abrasive layer and the second abrasive layer comprise abrasive particles in a bond material. In an embodiment, a reinforcing layer is disposed between the first abrasive layer and the second abrasive layer. In a particular embodiment, the body comprises an average thickness of not greater than about 5 mm. In another particular embodiment, the abrasive particles can comprise silicon carbide.

Abstract: A wine-glass polisher includes a base unit having a frustoconical cleaning chamber removably fastened thereto. A steam generator, an air heater and a vacuum pump are each in fluid communication with the cleaning chamber. A portion of the steam and hot air is directed to a channel formed in the chamber outer wall. An annular, U-shaped baffle surrounding the open top is in fluid communication with the channel for projecting the steam and hot air downwardly toward a wine glass below. A remaining portion of the heated air and steam is delivered directly to the upper surface of the base unit to clean and dry the interior surface of the glass. A controller first initiates a polishing cycle by activating the vacuum pump and steam generator. Upon expiration of the predetermined duration, the controller activates the blower to dry the exterior and interior surfaces of the glass.

Abstract: An ELID honing device includes a honing tool 10 positioned above a workpiece 1 having a hollow cylindrical inner surface, and vertically movable and rotationally drivable about a vertical rotation axis while being rockably suspended from an upper end, and a honing guide 20 positioned in proximity to an upper portion of the workpiece to guide the honing tool to the hollow cylindrical inner surface. The honing tool 10 has a fixed guide 12 having a predetermined radius R from the rotation axis to its outer peripheral surface, and honing stones 14a and 14b having outer peripheral surfaces movable in parallel from a diameter-increased position outside the radius R to a diameter-reduced position inside the radius R and capable of being electrolytically dressed. Further, the honing guide 20 has a hollow cylindrical ELID electrode 22 having an inner surface 22a for guiding an outer peripheral surface of the fixed guide of the honing tool and capable of being subjected to a negative voltage.

Abstract: A polishing head that can be disassembled and comprises a polishing cloth 1, sponge 2 and plastic base 3. The polishing cloth 1 is tightly pressed on the plastic base 3 by a sponge 2. The plastic base 3 is divided into one part with male threads and the other part with female threads. The two parts coordinate with each other to achieve dismantling or locking of the cloth and sponge to the base. When the polishing cloth is damaged, the plastic base can be unscrewed to change the damaged polishing cloth, while the base can be reused so as to reduce waste.

Abstract: An electrically powered knife sharpener for ceramic (or other brittle, crystalline or amorphous media which could be used for blades) knives includes at least one pre-sharpening stage with a sharpening member(s) and includes a final stage with a sharpening member(s). There are one or more motor driven shafts on which the abrasive surfaced sharpening members, such as disks, are mounted. Guide structure is provided to guide the knife for aligning and positioning the knife facet precisely at a defined location on the abrasive surface of each rotating sharpening member. The pre-sharpening stage sharpening member(s) moves in a first direction. The final stage sharpening member(s) moves in a second direction which differs from the first direction.

Abstract: Disclosed is a blade grinder comprising a blade holder that is mounted so as to be rotatable about a horizontal shaft which is mounted so as to be rotatable about a vertical axis, thus allowing the blade to be optimally adjusted relative to a grinding disk. The grinding disk can preferably be vertically and horizontally moved using spindles. This creates a simple design allowing a lawnmower blade to be ground in a fully automatic manner.

Abstract: To provide improved planarization, techniques in accordance with this disclosure include a CMP station that utilizes localized planarization on a wafer. This localized planarization, which is often carried out in a localized planarization station downstream of a CMP station, applies localized planarization to less than the entire face of the wafer to correct localized non-planar features. Other systems and methods are also disclosed.

Abstract: Embodiments of the invention provide polishing systems for increasing production efficiency, maximizing substrate throughput, and reducing production costs. The polishing systems generally include one or more polishing stations for performing a CMP process and one or more cleaning stations at which post-polishing cleaning is performed. The number of cleaning stations and polishing heads present may be increased depending on the desired substrate throughput or processing time at each polishing station. The number of polishing stations or cleaning stations can also be reduced in order to reduce the footprint of the polishing system. The polishing pads at each polishing station can be adjusted in size to accommodate one or more polishing heads simultaneously depending on substrate throughput and system footprint. Additionally, the polishing pads may be replaced with a fixed abrasive pad, or adapted to polish 450 millimeter substrates.

Abstract: A polishing fixture assembly for an optical element includes a first composite panel, a second composite panel, and a core member sandwiched between the first composite panel and the second composite panel and coupling the first composite panel to the second composite panel. At least one mirror mounting insert is coupled to each of the first and second composite panels.

Abstract: The present disclosure relates to apparatus for grinding rotary blades, in particular scythe-like blades or circular blades, in particular for machines for slicing food products. The apparatus includes at least one mount for a rotary blade to which the rotary blade can be attached and at least one grinding tool. The grinding tool and the rotary blade attached in the mount are movable relative to one another such that a blade edge extending at the periphery of the rotary blade can be ground by the grinding tool. The apparatus includes a measuring device for determining the extent of the blade edge and a control which is designed to use the determined blade edge extent for controlling the relative movement between the grinding tool and the rotary blade.

Abstract: A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.

Abstract: A chemical mechanical polishing (CMP) system includes a wafer polishing unit comprising a waste liquid sink for receiving a used slurry and a waste slurry drain piping for draining the used slurry; and a post-CMP cleaning unit coupled to the wafer polishing unit such that a used base chemical such as tetramethyl ammonium hydroxide (TMAH) produced from the post-CMP cleaning unit flows toward the wafer polishing unit to frequently wash at least the waste slurry drain piping in a real time fashion on a wafer by wafer basis.

Abstract: An apparatus for grinding a continuously cast slab having a longitudinal axis and a rectangular cross-sectional shape with two opposite wide faces and two opposite narrow faces apparatus has a frame, two transversely spaced grinders carried on the frame, and a holder having two transversely spaced grippers engageable with the opposite faces of the slab in a vertical position with the wide faces of the slab vertical for grinding of the wide faces of the slab by the grinders and in a horizontal position offset by 90° to the vertical position with the wide faces of the slab horizontal for grinding of the narrow faces of the slab.

Abstract: A method for providing an edge preparation on a cutting edge of a tool by means of an edge processing operation includes clamping the tool in a processing machine for providing the edge preparation, recording as a reference value the position of the cutting edge to be processed by means of a sensor arranged on the processing machine, carrying out an edge processing operation by means of a preparation tool, recording the position of the cutting edge again by means of the sensor arranged on the processing machine and storing the position as an actual value, monitoring the edge processing operation on the basis of a comparison between the reference value and the actual value, and comparing the actual value with a desired value for material removed on the cutting edge.

Abstract: A displaceable carriage (10) and a linear guide for guiding the carriage, which includes a first guide path slideway (13, 31) and a second guide path slideway (32). To form the first slideway (13, 31), the carriage (10) includes at least one pocket (13), which slides along the first guide path part (31) and can hold lubricant under pressure to create a relieving force on the carriage (10). The second guide path part (32) includes an island-shaped surface to create a frictional force on the carriage (10). A pressure medium held in the at least one pocket (13, 14, 15) creates the relieving force, whereby the first slideway (13, 31) relieves the load on the second slideway (11a, 12a, 12b, 32).

Abstract: A method and apparatus for removing residue from an edge of an item are disclosed. The method and apparatus are well-suited to assist in reconditioning used shelving units or deck units for store displays. In various embodiments, ticket holders are removed from the ticket edges of the units. Each unit is then placed on a conveyor and aligned with a guide edge. Optionally, magnets may hold each unit in place on the conveyor. The conveyor moves the units along at least one residue removing machine, and ideally, two residue removing or buffing machines in succession. The residue removing machines ideally include a rotating buffing wheel which strips residue such as glue from the ticket edge of the units. A vacuum can be used to collect debris produced from this process. Sensors may be positioned to sense the front edge of each unit and slide each residue removing machine into operating position at the right time once the front edge of each unit is in residue removing position.

Abstract: A system for magnetorheological finishing of a substrate. An integrated fluid management module (IFMM) provides dynamic control of the rheological fluid properties of the MR fluid on a conventional MR finishing apparatus, and dispensing of the fluid to the wheel. A magnetically shielded chamber charged with MR fluid is in contact with the carrier wheel. A transverse line removes the spent MR fluid from the wheel as the ribbon leaves the work zone. Replenishment fluid is added to the chamber via a dripper, and preferably an electric mixer agitates MR fluid in the chamber. A grooved magnetically-shielded insert at the exit of the chamber forms a polishing ribbon on the carrier wheel as the wheel is turned. A sensor sensitive to concentration of magnetic particles provides a signal for control of MR fluid properties, particularly, water content in the MR fluid. Means is provided for cooling fluid within the chamber.

Abstract: A grinding device for the surface treatment of rolls, for example of rolls for machines producing, finishing and/or processing webs, such as paper, cardboard or tissue machines, includes stationary components and mobile components which can be separated from each other. The stationary components include guide rails, which extend substantially in parallel to a roll axis of the roll to be treated and which are connected to a substructure. Thus, the stationary components, such as the guide rails, can remain at the place of use of the rolls, while the components that are mobile or can be transported can be easily separated from the stationary components and can be transported to other locations.

Abstract: The invention relates to a grinding head for a grinding machine. The grinding head comprises a tool holder, which in use is moved in a plane, in particular rotated or translated back and forth, by the grinding machine. The grinding head furthermore comprises at least two tools which are connectable to the tool holder by a releasable sticking connection. One of the tools or the tool holder is provided with at least one protrusion and the other one is provided with an associated cavity to lock which extend transverse to said plane of movement of the tool with respect to the tool holder in a direction parallel to said plane when the tool is connected to the tool holder.

Abstract: The invention provides a blade sharpening device designed for sharpening a blade for a uniform sharpening of the edge thereof. Generally, the blade sharpening device includes a base, a guide, a carriage, and a blade holder. The blade holder secures the blade while being sharpened. The blade holder is connected to the guide which is movable relative to the base. The base includes a material that receives an impression of a blade to define a blade contour and a grinding medium which provides an abrasive surface. The carriage interacts with the guide to define a sharpening path substantially aligning with the blade contour. The carriage and the guide direct the movement of the abrasive surface along the contour of the blade for a uniform sharpening of the edge thereof.