And Use Of Moving Abutment Patents (Class 451/12)
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Patent number: 12068189Abstract: An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.Type: GrantFiled: July 9, 2021Date of Patent: August 20, 2024Assignee: EBARA CORPORATIONInventors: Satoru Yamaki, Makoto Fukushima, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Tomoko Owada, Yoshikazu Kato
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Patent number: 11123842Abstract: Disclosed is a process for making a grinding wheel for the squaring of ceramic, formed by a support body and an abrasive ring. The process does not involve costly workings on the body and on the ring and produces a light grinding wheel which, therefore, is more practical to be handled by the handling machine.Type: GrantFiled: July 25, 2018Date of Patent: September 21, 2021Assignee: DELLAS S.P.A.Inventor: Daniele Ferrari
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Patent number: 10998182Abstract: A semiconductor wafer has a base material. The semiconductor wafer may have an edge support ring. A grinding phase of a surface of the semiconductor wafer removes a portion of the base material. The grinder is removed from or lifted off the surface of the semiconductor wafer during a separation phase. The surface of the semiconductor wafer and under the grinder is rinsed during the grinding phase and separation phase to remove particles. A rinsing solution is dispensed from a rinsing solution source to rinse the surface of the semiconductor wafer. The rinsing solution source can move in position while dispensing the rinsing solution to rinse the surface of the semiconductor wafer. The grinding phase and separation phase are repeated during the entire grinding operation, when grinding conductive TSVs, or during the final grinding stages, until the final thickness of the semiconductor wafer is achieved.Type: GrantFiled: September 10, 2018Date of Patent: May 4, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Michael J. Seddon
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Patent number: 8459578Abstract: A prescription label identity peeler includes a box-shaped housing. A lid extends over the box-shaped housing. A sanding member is adjustably carried within the box-shaped housing. A pair of linkage arms is pivotally extend between the lid and the sanding member. The motorized linkage arms will move the sanding member simultaneously and horizontally against the empty pill bottle in an inverted position, while the wheel on the swing arm assembly will contact a bottom end of the empty pill bottle via compression of the springs, thereby removing the label from the empty pill bottle when the inverted empty pill bottle rotates.Type: GrantFiled: March 1, 2012Date of Patent: June 11, 2013Inventor: Troy Fischer
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Patent number: 8251776Abstract: The present invention relates to a method and apparatus for conditioning a polishing pad used in chemical mechanical polishing in which a consistent pressing force can be provided between an abrasive conditioning member and the polishing pad. Specifically, a moveable weight member is provided that can be selectively moved along a length of a support arm in the conditioning apparatus. The position of the weight member relative to the position at which the abrasive conditioning member is mounted alters the resultant pressing force in view of the change in moment created. In a particular example, the positioning of the weight member can be automatically controlled using a drive mechanism controlled by a control unit, such as a computer.Type: GrantFiled: January 23, 2006Date of Patent: August 28, 2012Assignee: Freescale Semiconductor, Inc.Inventor: Brad Smith
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Patent number: 8079895Abstract: A glass-plate working apparatus (1) includes a grinding means (7) for grinding a peripheral edge (6) of a glass plate (2); and a grinding supporting means (9) for supporting the glass plate (2) whose peripheral edge (6) is to be ground by the grinding means (7), wherein the grinding supporting means (9) includes a grinding supporting table (101), a plurality of suction cups (102) which are held on the grinding supporting table (101) by being attached by suction to the grinding supporting table (101) and suck and hold the glass plate (2) by sucking the glass plate (2) whose peripheral edge (6) is to be ground, and an arranging means (103) for disposing the plurality of suction cups (102), respectively, at positions corresponding to the shape of the glass plate (2) to be ground.Type: GrantFiled: October 11, 2002Date of Patent: December 20, 2011Assignee: Bando Kiko Co., Ltd.Inventor: Kazuaki Bando
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Patent number: 7169020Abstract: A grinding jig set comprising a combination of several jig units and a method for grinding a number of objects are provided. The method comprises a series of steps from arranging the objects to be ground on a grinding jig (a master plate) through removing the ground objects from the grinding jig after completion of grinding process, smoothly and precisely without damaging a number of the objects to be ground and without altering the arrangement pattern of the objects to be ground from the start through the end of the series of steps. The jig set for grinding comprises a set of jig units used for a series of processing from allocation of objects to be ground on a grinding jig through removing the ground objects from the grinding jig after the grinding operation.Type: GrantFiled: November 2, 2005Date of Patent: January 30, 2007Assignee: NGK Insulators, Ltd.Inventors: Kazumasa Kitamura, Katsuyuki Tsuneoka, Tomoki Nagae
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Patent number: 7140947Abstract: Barrel polishing is effected while causing a mass (M) consisting of work and media (polishing material) to rotation-flow by rotating a rotary disk installed in the bottom of a polishing tank by a drive motor. A load on the drive motor for the rotary disk is preset as by a load current value, and the flow of the mass (M) in the polishing tank is controlled, thereby effecting polishing while maintaining the load on the drive motor within the preset range.Type: GrantFiled: May 23, 2005Date of Patent: November 28, 2006Assignee: Sintobrator, Ltd.Inventors: Kazutoshi Nishimura, Takao Ishida, Yoshihiro Masuda
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Patent number: 7059938Abstract: An apparatus (1) for working a glass plate includes: a glass-plate working section (4) for working a glass plate (2) whose upper surface (3) is coated; and transporting means (6) for carrying into the glass-plate working section (4) the glass plate (2) to be worked and carrying it out from the glass-plate working section (4) after working, by imparting to a lower surface (5) thereof a moving force in an X direction parallel to the upper surface (3) and the lower surface (5) of the glass plate (2).Type: GrantFiled: March 30, 2001Date of Patent: June 13, 2006Assignee: Bando Kiko Co., Ltd.Inventor: Kazuaki Bando
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Patent number: 7025053Abstract: A cutting table for large stone work-pieces, such as marble includes an axel fixed to a base, and a spinning drum attached to the axel. A brake cooperates with the axel and the drum, either stopping or allowing the drum to rotate around the stationary axel. A mounting-plate attaches to the drum, and the mounting-plate attaches and supports a rectangular frame. On top of the frame, a surface-scaffold attaches by at least one hinge. The hinge, with the assistance of a lifting means, allows the scaffold to move from a position flat upon the frame to a position perpendicular to the frame. A work-surface for cutting large stone pieces attaches to and is supported by the scaffold. To manipulate a large stone work-piece, such as one of marble, a user positions the work-surface perpendicular to the frame and rests the work piece flush next to it. The user then lowers the lifting means, thereby rotating the work-surface and its juxtaposed work piece approximately ninety degrees to a position flat upon the frame.Type: GrantFiled: January 11, 2005Date of Patent: April 11, 2006Inventor: Silvano Altamirano
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Patent number: 6845766Abstract: The present invention relates to a cutting block for a sawing machine for sawing stone blocks into slabs which has a pair of opposed yokes for tensioning a plurality of blades by means of tie-bars with spurs, wherein the tie-bars which hold the blades have a single spur between two blades placed side by side.Type: GrantFiled: November 13, 2001Date of Patent: January 25, 2005Assignee: Calvasina S.p.A.Inventors: Alessandro Pozzi, Emilio Brusadelli
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Publication number: 20040173198Abstract: The present invention is a steering guide for surface cutting machines. The steering guide is made up of two sighting means that are connected to a surface cutting machine by a guide arm and are configured to align with the cutting edge portion of the saw blade. The first and second sighting means are visible by the sawyer while operating the device. Since the first and second sighting means are configured to align with the saw blade along a straight line, aligning the first and second sighting means with the guide line also aligns the cutting portion of the saw blade with the guideline. This enables the saw blade to be kept in alignment with the guideline while moving along a surface to be cut.Type: ApplicationFiled: March 5, 2003Publication date: September 9, 2004Applicant: Multiquip, Inc.Inventor: J. Brandal Glenn
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Publication number: 20040121705Abstract: The superfinishing apparatus according to the present invention includes a frame 51 for holding the entirety of the apparatus, a cam shaft 52 attached to the frame 51 so as to rotate freely, first and second eccentric cams 53, 54 which are attached to the cam shaft 52 and rotate with a phase difference of 180 degrees therebetween, a first vibrator 55 having a polygonal shape in its section which moves in a sliding manner in accordance with the rotation of the first eccentric cam 53, a second vibrator 57 having a polygonal shape in its section which is disposed so as to oppose to the first vibrator 55 through the cam shaft 52 and moves in a sliding manner in accordance with the rotation of the second eccentric cam 54, air bearings 59, 60 for supporting the first vibrator 55 and the second vibrator 57, and a superfinishing stone 61 attached to the first vibrator 55 or the second vibrator 57.Type: ApplicationFiled: December 9, 2003Publication date: June 24, 2004Applicant: NSK LTD.Inventors: Kazumi Matsuzaki, Etsuo Kanakubo
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Patent number: 6659843Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.Type: GrantFiled: February 13, 2002Date of Patent: December 9, 2003Inventors: John N. Boucher, David E. Bajune
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Publication number: 20020193049Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.Type: ApplicationFiled: February 13, 2002Publication date: December 19, 2002Inventors: John N. Boucher, David E. Bajune
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Patent number: 6461223Abstract: A glass plate working machine comprises a cutting unit(1) for forming a cutting line on an unshaped glass plate(22) to break the unshaped glass plate(22), a grinding unit(2) for grinding an edge of the glass plate broken along the cutting line, a glass plate conveyer unit(4) for conveying the glass plate sequentially through the cutting unit(1) and the grinding unit(2), and control mean(CNT), connected to the cutting unit(1) and the grinding unit(2) for controlling the cutting unit(1) and the grinding unit(2), respectively.Type: GrantFiled: November 9, 2000Date of Patent: October 8, 2002Assignee: Bando Kiko Co., Ltd.Inventor: Kazuaki Bando
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Patent number: 6413150Abstract: A dicing saw blade assembly with parallel blades separated by a spacer and attached to a single spindle on an automated dicing saw, is applicable to precisely separating CSP or MCM devices which have been fabricated on a polymeric substrate. Two parallel cuts are made simultaneously in the scribe streets of the substrate to separate the flip chip devices. The substrates are diced from the bottom side, thereby allowing use of thin blades for separating devices having relatively thick chips, as well as chips with attached heat spreaders.Type: GrantFiled: May 19, 2000Date of Patent: July 2, 2002Assignee: Texas Instruments IncorporatedInventor: David B. Blair
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Patent number: 6354909Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.Type: GrantFiled: August 25, 2000Date of Patent: March 12, 2002Inventors: John N. Boucher, David E. Bajune
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Publication number: 20010036794Abstract: There are provided a lens periphery processing method for an eyeglasses lens, a lens periphery processing machine and lens for eyeglass, in which a V shaped portion that fits strongly in a lens frame of eyeglasses frame, can be processed in such a manner that V shaped portion contact with inside of the V shaped groove of the lens frame so that a contact element does not interfere with a holding means for fixing and holding a lens frame, and even if the V shaped groove shape is measured in a state in which the lens frame is tilted, a difference in size due to holding position between the lens frame and a processed eyeglasses lens does not arise.Type: ApplicationFiled: April 27, 2001Publication date: November 1, 2001Inventor: Yoshiyuki Hatano
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Patent number: 6234871Abstract: An apparatus for removing a thin film of material from a portion (23) of a sheet of fabric (22) and its method of operation, includes a grinder wheel (19) spaced from a nip roller (29) which is carried by an arm (32). The initial spacing between the grinder wheel (19) and the nip roller (29) is established by an adjusting mechanism (37) which pivots the arm (32), that spacing being determined by the expected thickness of the fabric (22). Pinch rollers (27) move the fabric (22) through the space, and a thickness-sensing wheel (44) rides on the fabric (22) upstream of the nip roller (29). Upon a change in the thickness of the fabric (22), a sensing arm (45) which carries the sensing wheel (44) pivots which, through a link arm (54), pivots a regulator arm (61) which carries a follower roller (70) that rides on the arm (32). Such allows the nip roller (29) to move toward or away from the grinder wheel (19) dependent on the thickness of the fabric (22) sensed by the movement of the sensing wheel (44).Type: GrantFiled: October 26, 1999Date of Patent: May 22, 2001Assignee: Seaman CorporationInventors: Kenneth W. Chaloupek, Allen F. Simon, Harold P. Sponseller
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Patent number: 6152803Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.Type: GrantFiled: July 21, 1999Date of Patent: November 28, 2000Inventors: John N. Boucher, David E. Bajune
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Patent number: 5891206Abstract: Light weight metal bonded abrasive tools consisting of an annular rim of metal bonded superabrasive joined to a central core or hub made from a dissimilar metal, such as aluminum powder, are manufactured in a single sintering step that yields a near net shape abrasive tool. The abrasive tools are useful for the grinding of optical components made of plastic or glass.Type: GrantFiled: May 8, 1997Date of Patent: April 6, 1999Assignee: Norton CompanyInventor: Thomas Ellingson
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Patent number: 5738572Abstract: A grinding machine has a machine frame and a grinding spindle support positioned on the machine frame. At least one grinding spindle is arranged with upwardly slanted axis at the grinding spindle support. A grinding wheel is connected to the grinding spindle. A workpiece holder is connected to the machine frame so as to extend parallel to the axis of the grinding spindle. The workpiece holder is displaceable in the axial direction of the grinding spindle and perpendicular to the axial direction of the grinding spindle. A housing is positioned at a slant parallel to the axis of the grinding spindle and encloses the workpiece holder and the grinding wheel. The housing has an outlet opening for a cooling liquid at the lowermost point of the housing. Drive devices for effecting a linear movement of the workpiece holder and a rotational movement of the grinding wheel and the workpiece are positioned exterior to the housing.Type: GrantFiled: April 19, 1996Date of Patent: April 14, 1998Inventor: Karl-Heinz Giebmanns
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Patent number: 5628673Abstract: A dicing machine comprises a work table having a surface for supporting a workpiece and a processing element for processing the workpiece. A gap detection device detects a preselected gap between the processing element and the surface of the work table. A control device moves the processing element and the gap detection device and detects their positions. A non-contact detection device detects a non-contact condition of the gap detection device and a processing portion of the processing element. A calculating device calculates a processing position of the workpiece in accordance with the positions of the processing element and the gap detection device detected by the control device when the preselected gap between the processing element and the surface of the work table is detected by the gap detection device, and when the non-contact condition of the gap detection device and the processing portion of the processing element is detected by the non-contact detection device.Type: GrantFiled: November 17, 1994Date of Patent: May 13, 1997Assignee: Seiko Seiki Kabushiki KaishaInventor: Masaya Morooka
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Patent number: 5476409Abstract: A grinding machine has a driving mechanism for rotating a drive shaft, a sander supported on the drive shaft, a bracket provided swingably on a housing for supporting the drive shaft, a drive shaft moving mechanism for moving the drive shaft in the axial direction, a hollow member supported on the bracket for ratably support the drive shaft, a drive shaft position switching mechanism for moving the hollow cylinder in its axial direction to take selectably two positions whereby the drive shaft can take smoothly two positions in one of which the drive shaft is not moved in its axial direction, and in the other of which the drive shaft is moved it its axial direction.Type: GrantFiled: December 23, 1993Date of Patent: December 19, 1995Assignee: Ryobi LimitedInventors: Tatsuya Wada, Kouichi Miyamoto, Takeshi Shiotani, Shoji Takahashi
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Patent number: 5377454Abstract: Disclosed herein is a method of truing and angling the blades of a form-relieved face mill cutter during the blade sharpening process thus eliminating a separate time-consuming procedure for truing and angling. The position of the cutting edge of each blade is determined and a reference blade is selected. The sharpening plane of each remaining cutting blade is repositioned, if needed, such that after removing stock material from the blades in accordance with the newly repositioned sharpening plane, the cutting edge of each blade will follow essentially the same path when the cutter is rotated about its axis.Type: GrantFiled: May 1, 1992Date of Patent: January 3, 1995Assignee: The Gleason WorksInventors: Harry Pedersen, Richard L. Kitchen