Precision Device Or Process - Or With Condition Responsive Control Patents (Class 451/1)
  • Patent number: 10247640
    Abstract: Methods and systems for improving the uniformity of a tire are provided. More particularly, one or more parameters of a measurement process harmonic contributing to uniformity measurements performed for a tire can be identified. The measurement process harmonic can be a process harmonic effect associated with the acquisition of uniformity measurements of a tire, such as a process harmonic effect associated out-of-roundness of a road wheel used to load a tire during uniformity measurement in a uniformity measurement machine. The measurement process harmonic can result solely from the acquisition of uniformity measurements and may not contribute to actual tire non-uniformity. Once identified, the one or more parameters associated with the measurement process harmonic can be used to correct the uniformity measurements of the tire to account for the measurement process harmonic. Tire manufacture can then be modified to improve tire uniformity based on the corrected measurements.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: April 2, 2019
    Assignee: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN
    Inventor: William David Mawby
  • Patent number: 10180377
    Abstract: A test bed for electric wheel comprehensive performance is characterized in that the test bed comprises a foundation, a portal frame set on the foundation and including a cross beam and two columns supporting both ends of the cross beam individually, a main pin arm movably connected to the portal frame, and a main rotation shaft revolvably and perpendicularly mounted on the top of the main pin arm, wherein the electric wheel is mounted on the main pin arm and is located inside of the portal frame and right below the main rotation shaft. The test bed further comprises at least one of a road simulation mechanism, an inertia simulation mechanism, a driving power mechanism, a perpendicular loading mechanism, and a steering mechanism which take the simulation test on the electric wheel.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: January 15, 2019
    Assignee: SHENZHEN POLYTECHNIC
    Inventors: Ping He, Chengwei Han, Zhurong Dong, Songhua Hu
  • Patent number: 10137542
    Abstract: An apparatus is disclosed for storing, tapering, cutting and dispensing preform layers of material includes a device for storing coiled lengths of the preform layers of material and a device for receiving coiled lengths of the preform layers of material. The device includes a grinding device to grind portions of the preform layers of material and a cutter to cut the grinded portions of material. A programmable controller is configured to control the operations of at least one of the device and mechanism.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: November 27, 2018
    Assignee: SENVION GMBH
    Inventors: Daniel E. Upton, Joel D. Gruhn
  • Patent number: 10130996
    Abstract: A frictional drive railway wheel truing system comprising a master lift and drive arm spaced from a slave lift and drive arm extending from within a railway pit for lifting a pair of opposed railway wheels off railway rails. Each master and slave drive assembly comprising frictional drums to turn a railway wheel from a wheel flange. A master and slave lathe assembly moveable along an axis parallel to a rotational axis of the frictional drums; each master and slave lathe assembly having a cutting bit positioned to engage a tread and a flange of a railway wheel in a cut mode at a location superior to the contact area of said frictional drums and railway wheel; and a hold down device fixing rotation of a railway wheel to a predetermined axis during a wheel truing operation.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: November 20, 2018
    Assignee: HJR EQUIPMENT RENTAL INC.
    Inventor: Harold F. Ross
  • Patent number: 10076817
    Abstract: A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: September 18, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Paul D. Butterfield, Jay Gurusamy, Jason Garcheung Fung, Shou-Sung Chang, Jimin Zhang, Eric Lau
  • Patent number: 9984905
    Abstract: An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: May 29, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Masahiro Nakaharada, Yoji Sakata, Akira Miyata, Shinichi Hayashi, Suguru Enokida, Tsunenaga Nakashima
  • Patent number: 9899047
    Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: February 20, 2018
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Jason Bryce Gadbois, Declan Macken, Karsten Klarqvist
  • Patent number: 9798297
    Abstract: A control device (1) for controlling a control target comprising an astatic system (2) that has dead time is provided with: a dead time compensation system (5) that compensates for dead time at the control target based on the dynamic characteristics of the control target; and an integration error compensation system (6) that compensates for integration errors originating in the dead time compensation system (5). The integration error compensation system (6) comprises: an ideal response unit (7) in which the dynamic characteristics of the control target while in a state in which interference is not input are used as a model; and a correction unit (8) that is configured to correct a comparative value for the output of the ideal response unit (7) and the output of the control target and subsequently input the result to the control target.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: October 24, 2017
    Assignee: Kobe Steel, Ltd.
    Inventor: Yoshiharu Nishida
  • Patent number: 9744641
    Abstract: A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: August 29, 2017
    Assignee: LG SILTRON INCORPORATED
    Inventor: Kee Yun Han
  • Patent number: 9703052
    Abstract: An optical device includes: an optical element with a surface including one of a light-receiving portion and a light-emitting portion; a resin layer provided over the one of light-receiving portion and the light-emitting portion; and a resin lens provided over the resin layer, wherein the resin layer includes a first shape larger than a second shape of the resin lens in a direction parallel to the surface.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: July 11, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Mariko Kase, Takashi Shiraishi
  • Patent number: 9599540
    Abstract: The present invention relates to a system and method for measuring conicity using four force-sensors, in which a spindle attached to a tire and four sensors are used to measure lateral force generated in the tire; individual signals measured by the four sensors of the spindle are amplified; a DAQ board for calculating Fy(LFV) obtained by summing the individual signals amplified by an amplifier is calculated, obtaining five signals generated in the amplifier, and converting the analog signals into digital signals is provided; and the conicity is calculated using the digital signals, a predefined delta load and a factor.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: March 21, 2017
    Assignee: Hankook Tire Co., Ltd.
    Inventor: Youn Ki Kim
  • Patent number: 9597764
    Abstract: A cutting machine includes a circular knife and a grinding unit for grinding the circular knife, wherein the grinding unit can be adjusted to grind the circular knife at different angles.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: March 21, 2017
    Assignee: Universal Tissue Technology
    Inventor: Bertoli Barsotti Giovanni
  • Patent number: 9573240
    Abstract: A honing tool holder that provides a capability for automatically feeding the honing elements or stones when in the bore of a work piece, and for automatically stopping the feeding when a particular condition such as a bore size, is reached, so as to enable use of an in-process adjustable feed honing tool in a machine tool, machining center, or the like, lacking a feed mechanism or system. The holder can also include apparatus to automatically prevent feed past a limit. Both the feed force and feed limit can be adjustable, including by simple movements of the tool holder by the machine tool.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: February 21, 2017
    Assignee: Sunnen Products Company
    Inventor: Daniel R. Cloutier
  • Patent number: 9463549
    Abstract: In a method for the automatic gap setting in slide grinding machines having a turntable, the gap width between the turntable and the work container is automatically set by a regulation, with a reference value for the gap width of zero being determined.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: October 11, 2016
    Assignee: ROESLER HOLDING GMBH & CO. KG
    Inventors: Egon Schmidt, Ralf Mueller, Erwin Denninger, Dennis Eichenberg
  • Patent number: 9460942
    Abstract: An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: October 4, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Masahiro Nakaharada, Yoji Sakata, Akira Miyata, Shinichi Hayashi, Suguru Enokida, Tsunenaga Nakashima
  • Patent number: 9452504
    Abstract: A digital panel of a belt sander includes a control module. The control module is electrically connected with a conveyer motor and an abrasive belt wheel motor of the belt sander. The control module is connected with a detection module. The control module is further connected with a digital display module and an operation module. Thereby, the operation module controls the conveyer motor and the abrasive belt wheel motor of the belt sander, and detects the running state of the conveyer motor and the abrasive belt wheel motor through the detection module, and displays the running data of the conveyer motor and the abrasive belt wheel motor through the digital display module for the belt sander to be digitalized.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: September 27, 2016
    Inventor: Bor-Yann Chuang
  • Publication number: 20150111467
    Abstract: A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the step height between the retaining ring and its membrane and a controller for adjusting the movement of the retaining ring based on the step height between the retaining ring and its membrane to ensure the step height remains at a fixed value as the retaining ring wears out.
    Type: Application
    Filed: October 22, 2013
    Publication date: April 23, 2015
    Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Benfu LIN, Wei LU, Alex SEE
  • Publication number: 20150072593
    Abstract: An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 12, 2015
    Applicant: Seagate Technology LLC
    Inventors: Yongjun Zhao, David C. Seets, Mark Ostrowski
  • Patent number: 8956200
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: February 17, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: David P. Druist, Glenn P. Gee, Unal M. Guruz, Edward H. Lee, David J. Seagle, Darrick T. Smith
  • Patent number: 8956201
    Abstract: Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: February 17, 2015
    Assignee: HGST Netherlands, B.V.
    Inventors: David P. Druist, Glenn P. Gee, Edward H. Lee, David J. Seagle, Darrick T. Smith
  • Publication number: 20150044944
    Abstract: The present invention provides a surface processing system for a work piece in the mechanical technical field. The system comprises at least one group of polishing units. A manipulator and several polishers with different polishing precisions are provided on the polishing units. The polishers are arranged around the manipulator in turn. The work piece could be moved by the manipulator between the processing center and the polishing units. The machined work piece is loaded by the manipulator for one time when the manipulator is located at the processing center. When the manipulator is located at the polishing units, the manipulator keeps holding the work piece and transfers the work piece in a preset sequence to each polisher corresponding to the polishing unit where the manipulator is located. The surface of work pieces having different wall thicknesses and complex surfaces could be processed in a large batch with a high efficiency.
    Type: Application
    Filed: July 26, 2014
    Publication date: February 12, 2015
    Applicant: TAIZHOU FEDERAL ROBOT TECHNOLOGY CO., LTD
    Inventor: Qiyue Chen
  • Patent number: 8942842
    Abstract: A method of generating a library of reference spectra includes storing an optical model for a layer stack having at a plurality of layers, receiving user input identifying a set of one or more refractive index functions and a set of one or more extinction coefficient functions a first layer from the plurality of layers, wherein the set of one or more refractive index functions includes a plurality of different refractive index functions or the set of one or more extinction coefficient functions includes a plurality of different extinction coefficient functions, and for each combination of a refractive index function from the set of refractive index functions and an extinction coefficient function from the set of extinction coefficient functions, calculating a reference spectrum using the optical model based on the refractive index function, the extinction coefficient function and a first thickness of the first layer.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: January 27, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Dominic J. Benvegnu, Xiaoyuan Hu
  • Publication number: 20150017745
    Abstract: A polishing method capable of preventing damage to a substrate is disclosed. The polishing method includes inspecting a periphery of a substrate for an abnormal portion, polishing the substrate if the abnormal portion is not detected, and not polishing the substrate if the abnormal portion is detected. The abnormal portion of the substrate may be an foreign matter, such as an adhesive, attached to the periphery of the substrate. After polishing of the substrate, the periphery of the substrate may be inspected again for an abnormal portion.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 15, 2015
    Inventors: Toshifumi KIMBA, Keita YAGI
  • Publication number: 20150017881
    Abstract: A method of grinding spring ends of helical compression springs is carried out using a numerically controlled spring end grinding machine having a grinding unit, a loading unit and a control unit that controls the loading unit and the grinding unit. The grinding unit has a pair of grinding wheels including two rotatable grinding wheels between which is formed a grinding space. The loading unit has at least one loading plate substantially rotatable axially parallel to the grinding wheels and has a plurality of out-of-axis spring receptacles, each to receive a helical compression spring.
    Type: Application
    Filed: January 25, 2013
    Publication date: January 15, 2015
    Inventors: Uwe-Peter Weigmann, Egon Reich, Thomas Kuttler
  • Publication number: 20150017878
    Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.
    Type: Application
    Filed: September 26, 2014
    Publication date: January 15, 2015
    Applicant: Orthodyne Electronics Corporation
    Inventors: Christoph B. Luechinger, Erich C. Mueller, Orlando L. Valentin, Tao Xu
  • Publication number: 20140295737
    Abstract: There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 2, 2014
    Inventors: Ryuichi Kosuge, Tadakazu Sone
  • Publication number: 20140273745
    Abstract: A method of controlling a polishing operation includes receiving a first measurement of a first amount of metal on a substrate made by a first x-ray monitoring system after a first metal layer is deposited on the substrate and before a second metal layer is deposited on the substrate, transferring the substrate to a carrier head of a chemical mechanical polishing apparatus the substrate after the second metal layer is deposited on the substrate, making a second measurement of a second amount of metal on the substrate with a second x-ray monitoring system in the chemical mechanical polishing apparatus, comparing the first measurement to the second measurement to determine a difference, and adjusting a polishing endpoint or a polishing parameter of the polishing apparatus based on the difference.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Boguslaw A. Swedek, Dominic J. Benvegnu, Wen-Chiang Tu
  • Publication number: 20140273746
    Abstract: A chemical mechanical planarization apparatus includes a table, a polishing pad and a detector. The polishing pad is disposed at the table. The detector detects an abnormal condition of the polishing pad.
    Type: Application
    Filed: October 2, 2013
    Publication date: September 18, 2014
    Inventors: Ming Tsan LAI, Yu Hua YEH
  • Publication number: 20140273753
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing pad, a polishing liquid storage mechanism disposed on the polishing pad for storing the polishing liquid on the polishing pad by damming the polishing liquid, and a polishing liquid sensor for measuring a physical quantity representing the freshness of the polishing liquid stored by the polishing liquid storage mechanism. The polishing apparatus further includes a freshness measuring instrument for calculating the freshness of the stored polishing liquid from the physical quantity measured by the polishing liquid sensor, and a freshness controller for controlling supply conditions of the polishing liquid or storage state of the polishing liquid, based on the freshness of the polishing liquid that is determined by the freshness measuring instrument.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Inventors: Hisanori MATSUO, Yoshihiro MOCHIZUKI, Chikako TAKATOH, Tadashi OBO
  • Publication number: 20140187122
    Abstract: A polishing apparatus includes: a pure water supply line configured to supply deaerated pure water into the polishing apparatus; a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to produce gas-dissolved pure water; a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure water; an ultrasonic cleaning unit coupled to the gas-dissolved pure water delivery line and configured to impart an ultrasonic vibration energy to the gas-dissolved pure water, which has been delivered through the gas-dissolved pure water delivery line, and then eject the gas-dissolved pure water onto an object to be cleaned; and a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit.
    Type: Application
    Filed: December 23, 2013
    Publication date: July 3, 2014
    Inventor: Tomoatsu ISHIBASHI
  • Publication number: 20140162532
    Abstract: A method of polishing one side of a wafer, which makes it possible to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth, is provided. In the method according to the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer, the method including the steps of measuring a contact angle of the polishing cloth (S1); determining a rotation speed of the head and the surface plate, based on the measured contact angle of the polishing cloth (S4); and polishing the one side of the wafer by rotating the head and the surface plate at the determined rotation speed (S5, S6).
    Type: Application
    Filed: July 3, 2013
    Publication date: June 12, 2014
    Applicant: SUMCO CORPORATION
    Inventor: Tomonori Kawasaki
  • Publication number: 20140154951
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate—i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: Glen P. Gee, Edward H.P. Lee, David J. Seagle, Darrick T. Smith
  • Publication number: 20140154952
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: David P. DRUIST, Glenn P. GEE, Unal M. GURUZ, Edward H. LEE, David J. SEAGLE, Darrick T. SMITH
  • Patent number: 8712720
    Abstract: A tire measurement system includes a computer with various memory/media elements for storing raw and transformed tire measurement data (e.g., a data set of measured radial or lateral run-out values) as well as software in the form of computer-executable instructions, which are executed by a processor to filter selected run-out values within the obtained data set that spike above adjacent measurements, identify selected ones of the filtered run-out values that lie on a convex hull surrounding the entire set of values, and perform interpolation of the identified selected ones of the run-out values that lie on the convex hull to obtain a final data set of filtered run-out measurements. Similar steps can be performed on an inverted data set to better detect sidewall deformation features such as sidewall depressions.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 29, 2014
    Assignees: Michelin Recherche at Technigue S.A., Societe de Technologie Michelin
    Inventors: Verner Steve Nicholson, Anton Felipe Thomas
  • Publication number: 20140106647
    Abstract: The invention, involving grinding and polishing flat processing and thinning processing of hard and brittle materials such as silicon wafer, sapphire substrate and the glass substrate, belongs to ultra-precision machining technical field and provides a multifunction substrate grinding and polishing device and method for the substrate grinding and polishing, which could be used in the grinding and polishing process of flat substrate such as ceramics, metal and composite materials. The grinding and polishing of substrate are processed in three ways: axial plunge grinding and polishing, radial plunge grinding and polishing and back grinding and polishing of wafer with outer rim. Double-spindle structure consisting of grinding spindle unit and polishing spindle unit is used in the substrate grinding and polishing device where both substrate grinding and polishing can be done. The grinding spindle unit and polishing spindle counterweigh mutually via a traction rope.
    Type: Application
    Filed: January 19, 2012
    Publication date: April 17, 2014
    Inventors: Renke Kang, Xianglong Zhu, Zhigang Dong, Guang Feng, Dongming Guo
  • Publication number: 20140094091
    Abstract: A balancing device for a rotating body is provided, comprising at least one unbalance detector apt to measure the unbalance of the rotating body; two balancing masses apt to be handled along a handling circumference so as to cancel the unbalance; a position sensor apt to detect the mutual position of the balancing masses; and a motor apt to handle independently of each other the balancing masses as a function of their mutual position and unbalance.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 3, 2014
    Applicant: BALANCE SYSTEMS S.R.L.
    Inventor: Gianni TRIONFETTI
  • Publication number: 20140087627
    Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
    Type: Application
    Filed: September 23, 2013
    Publication date: March 27, 2014
    Inventors: Tetsuji TOGAWA, Masaya SEKI, Hiroyuki TAKENAKA
  • Publication number: 20140080229
    Abstract: A semiconductor processing device and a method of operating the same. The method may include measuring at least one property of a semiconductor wafer and determining a recipe for processing the semiconductor wafer based on the at least one property. The semiconductor wafer may be processed with a plurality of chemical mechanical polishing (CMP) modules based on the determined recipe, wherein the recipe comprises a value of at least one parameter for use by each of the plurality of CMP modules. The measurements may be made in situ or by an inline metrology device. The recipe and various parameters associated with the recipe may be determined by a controller of the semiconductor processing device.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: STMicroelectronics, Inc.
    Inventor: John H. Zhang
  • Patent number: 8676367
    Abstract: A system for lot based, multi-step wafer manufacturing processes is provided and includes a transfer apparatus, disposed among tools for performing respective process steps on each wafer of each lot of wafers transferred thereto, the transfer apparatus being configured to transfer each lot from a current tool to a next tool in accordance with a process step sequence, a dispatcher operably coupled to the transfer apparatus to modify the lot order in response to a modification condition detection, a measurement unit configured to receive each wafer of each fully processed lot and to collect measurements therefrom and a processor disposed in signal communication with the dispatcher and the measurement unit to analyze the measurements relative to the lot order for evidence that a process step of a corresponding tool is responsible for performance effects.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: March 18, 2014
    Assignee: International Business Machines Corporation
    Inventor: John M. Yamartino
  • Publication number: 20140073223
    Abstract: A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 13, 2014
    Applicant: AXUS TECHNOLOGY, LLC
    Inventors: Daniel R. Trojan, Richard Ciszek, Clifford Daniel
  • Publication number: 20140065928
    Abstract: An edge grinding apparatus and method for grinding a glass substrate, with which a glass substrate can be ground by a fixed amount and the occurrence of defects can be minimized. The edge grinding apparatus includes an edge grinding unit which grinds a cut edge of a glass substrate while following the cut edge; a measuring unit which obtains positional information of the cut edge; and a control unit which receives the positional information of the cut edge from the measuring unit and controls a position of the edge grinding unit based on the positional information of the cut edge.
    Type: Application
    Filed: October 9, 2012
    Publication date: March 6, 2014
    Applicant: Samsung Corning Precision Materials, Co., Ltd.
    Inventors: Young Chae Ko, Se-Yeon Kim, Yeonhoon Kim, Jun-Seok Kim
  • Publication number: 20140017979
    Abstract: Exemplary embodiments of the subject invention comprise methods and apparatus concerning balanced abrading of a tire surface by an abrading tool. Such an abrading tool may comprise a pair of counter-rotating, driven abrading members, each of the abrading members having a rotational axis generally extending laterally across the tool, the abrading members being spaced apart in a lateral direction of the tool by a desired distance, each of the abrading members having an abrading surface defined by at least one outer diameter, the abrading surface extending axially relative to the rotational axis of the abrading member, wherein each of the abrading has a shaft upon which each abrading member is arranged, each of the shafts being adapted to be driven by a driving source. The tool further includes a body to which each shaft and abrading member is attached.
    Type: Application
    Filed: March 31, 2011
    Publication date: January 16, 2014
    Applicants: MICHELIN RECHERCHE ET TECHNIQUE S.A., COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN
    Inventors: Metodi L. Ikonomov, Cesar E. Zarak, Adib T. Chebli
  • Publication number: 20140015107
    Abstract: Closed loop control may be used to improve uniformity of within wafer uniformity using chemical mechanical planarization. For example, closed loop control may be used to determine a control profile for a chemical mechanical planarization process to more uniformly and consistently achieve the desired extent of variation of within wafer uniformity of a semiconductor wafer.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 16, 2014
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Ching-Kun Chen, Chun-Fu Chen, Chin-Ta Su
  • Publication number: 20140004628
    Abstract: According to an embodiment, a method of manufacturing a semiconductor device includes forming a wiring groove on an insulating film; forming a barrier metal layer and a metal layer; polishing the metal layer by applying a first load on the metal layer; and subsequently polishing the metal layer while applying a second load larger than the first load on the metal layer and spraying a gas onto a polishing pad. The polishing pad is in contact with the metal layer. The barrier metal layer covers an upper surface of the insulating film and an inner surface of the wiring groove, and the metal layer fills an inside of the wiring groove and covers the barrier metal layer.
    Type: Application
    Filed: February 27, 2013
    Publication date: January 2, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hajime EDA, Gaku Minamihaba, Yukiteru Matsui, Akifumi Gawase
  • Publication number: 20130337723
    Abstract: In a polishing method of the present invention, the temperature of a carrier plate is measured, and the amount of polishing removal of a workpiece (workpiece) is accurately controlled based on change in the measured temperature of the carrier plate.
    Type: Application
    Filed: October 19, 2011
    Publication date: December 19, 2013
    Applicant: Sumco Corporation
    Inventors: Ryuichi Tanimoto, Shinichi Ogata, Keiichi Takanashi
  • Publication number: 20130324012
    Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: Makoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Shingo TOGASHI, Satoru YAMAKI
  • Publication number: 20130318762
    Abstract: The invention relates to a method of profiling a running surface of a laid rail by means of a processing vehicle, in particular in the region of a switch, comprising placing a first copying probe element displaceable transversely to the rail in contact with the running edge or the inner side edge and machining the rail.
    Type: Application
    Filed: November 11, 2011
    Publication date: December 5, 2013
    Applicant: Linsinger Maschinenbau Gesellschaft m.b.H.
    Inventor: Johann Knoll
  • Patent number: 8588956
    Abstract: A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: November 19, 2013
    Inventors: Tayyab Ishaq Suratwala, Michael Dennis Feit, William Augustus Steele
  • Publication number: 20130237125
    Abstract: A portable sharpening apparatus is described. The sharpening apparatus includes a body portion and a cavity formed in the body portion for receiving an object to be sharpened. A rotatable abrasive drum capable of sharpening and having an axis of rotation is provided and the abrasive drum is located in the body portion. The apparatus further comprises a motor arranged to drive the abrasive drum and a mouth communicating with the abrasive drum and arranged in the body portion so as to direct an object to be sharpened towards the abrasive drum, wherein the mouth has a supporting means for locating an object to be sharpened at the abrasive drum, the supporting means being such that, when in use, an object to be sharpened is orientated along an axis substantially perpendicular to the axis of rotation of the abrasive drum.
    Type: Application
    Filed: July 25, 2011
    Publication date: September 12, 2013
    Applicant: ELIXAIR INTERNATIONAL LIMITED
    Inventors: Leonard McLaughlin, Oliver Nathaniel Ambrose Price, Peter David Cauwood
  • Publication number: 20130203321
    Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 8, 2013
    Inventors: Hung Chih Chen, Thomas H. Osterheld, Charles C. Garretson, Jason Garcheung Fung