Abstract: A grinder includes a brake mechanism, a switch lever, and a slide bar. In the grinder, an interlocking mechanism configured to interlock the brake mechanism with the switch lever includes a link member that is interposed between the switch lever and the slide bar, that moves the slide bar to the forward position at the push-in position of the switch lever, and that moves the slide bar to the retraction position at the initial position of the switch lever.

Abstract: Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A polishing fluid comprising a distributed organic phase and a continuous aqueous phase. The distributed phase has at least one complexing agent and the aqueous phase has abrasive particles dispersed therein. Reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes. Further disclosed is a polishing method, a semiconductor device and semiconductor device fabrication method utilizing the polishing fluid.

Abstract: A polishing fluid comprising a distributed organic phase and a continuous aqueous phase. The distributed phase has at least one complexing agent and the aqueous phase has abrasive particles dispersed therein. Reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes. Further disclosed is a polishing method, a semiconductor device and semiconductor device fabrication method utilizing the polishing fluid.

Abstract: A polishing fluid comprising a distributed organic phase and a continuous aqueous phase. The distributed phase has at least one complexing agent and the aqueous phase has abrasive particles dispersed therein. Reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes. Further disclosed is a polishing method, a semiconductor device and semiconductor device fabrication method utilizing the polishing fluid.

Abstract: There are provided a lens periphery processing method for an eyeglasses lens, a lens periphery processing machine and lens for eyeglass, in which a V shaped portion that fits strongly in a lens frame of eyeglasses frame, can be processed in such a manner that V shaped portion contact with inside of the V shaped groove of the lens frame so that a contact element does not interfere with a holding means for fixing and holding a lens frame, and even if the V shaped groove shape is measured in a state in which the lens frame is tilted, a difference in size due to holding position between the lens frame and a processed eyeglasses lens does not arise.

Abstract: A grinding or polishing machine comprises a rigid platform on which a workhead spindle and a grinding wheel spindle are located. The grinding wheel spindle is mounted on a sub-assembly which is attached to the platform by means of flexures which permit limited movement of the sub-assembly in a direction generally parallel to the direction in which the wheel has to advance to achieve grinding or polishing of a workpiece mounted on the workhead spindle. The flexures generally inhibit movement of the sub-assembly in all other directions. Two grinding wheels are mounted on the platform, one on each of two sub-assemblies, and each sub-assembly is attached to the platform by flexures as aforesaid. The flexure mounting points are located generally centrally of the machine and are located on either side of and close to the machine centre line.

Abstract: A mechanism for honing non round cylinder bores includes a tool body rotatable around a nonrotatable cam with a non round peripheral cam surface and a plurality of honing stones carried by supports for generally radial movement in the tool body. In a preferred embodiment, the supports are swing arms pivotally mounted so that the honing stones follow generally radially oriented arcuate paths determined by cam followers carried by the swing arms. A separately controlled expansion actuating rod axially adjusts expansion shoes that wedge outward stone shoes carried by the swing arms to progressively remove stock from the cylinder and to compensate for wear of the honing stones. Assembly with an associated machine adapter supports the honing mechanism and connects with a conventional honing machine to drive and orient the assembly for accurately honing non round cylinder bores.

Abstract: An apparatus and method for honing, sharpening or grinding a curved peripheral cutting surface of a slicer blade are provided. Included is the use of one of a set of interchangeable cams that generally follows the curved shape of the blade cutting surface, whether same has a constant radius or varying radii. In order to minimize downtime and sanitation operations, the honing is accomplished off-line of the slicer equipment. Preferably, the slicer blade remains perfectly flat during honing, and the movement of one or more honing or grinding wheels is closely controlled so as to provide honed or ground cutting edges which are of substantially uniform width throughout their respective peripheries. Honing is accomplished in accordance with objectively measured sharpness standards by which superior sharpness levels are attained.

Abstract: A grinding machine has a driving mechanism for rotating a drive shaft, a sander supported on the drive shaft, a bracket provided swingably on a housing for supporting the drive shaft, a drive shaft moving mechanism for moving the drive shaft in the axial direction, a hollow member supported on the bracket for ratably support the drive shaft, a drive shaft position switching mechanism for moving the hollow cylinder in its axial direction to take selectably two positions whereby the drive shaft can take smoothly two positions in one of which the drive shaft is not moved in its axial direction, and in the other of which the drive shaft is moved it its axial direction.