Abstract: A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

Abstract: An electrodeposited wire tool has a core wire extending in a longitudinal direction, a plating layer provided on an outer peripheral surface of the core wire, superabrasive grains held by the plating layer and coating layers covering the outer peripheral surfaces of the superabrasive grains. The coating layers are constituted of electroless Ni—P platings. The coating layers are heat-treated, and the electroless Ni—P platings are partially or entirely crystallized.

Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.

Abstract: The invention relates to a device for machining a strip or plate-shaped metal workpiece, which comprises at least one conveying device which is provided with machining elements. The conveying device guides the machining elements at an angle and/or in a transversal manner in relation to the direction of advancement of the workpiece in the region of the workpiece which is to be machined in an at least approximately linear manner. The machining elements are embodied as abrasive paper and support elements are arranged between said abrasive paper.

Abstract: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading article has been installed with an abrasive side facing the wrong direction. An alert allows an operator to reinstall the article. As another example, the abrading article may be sensed to determine whether splicing tape is present to hold two pieces of abrading tape together. The article may be advanced until the splicing tape is beyond an abrading zone. As another example, the abrading article may be sensed to determine whether the abrading article has stopped moving while the article drive is advancing because the article has broken. An alert allows an operator to repair the break.

Abstract: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: Polishing pads are provided having a polishing surface formed from a material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.

Abstract: A knife sharpener includes a handle and an operation portion in which two grinding members are respectively and pivotably received. An aperture is defined through a top of the operation portion and communicates with the grinding members. Each of the two grinding members has a rod extending radially therefrom so as to be engaged with one of two respective spiral grooves of a shaft rotatably received below the grinding members. A positioning member is removably engaged with the shaft. A width between the two grinding members can be adjusted by rotating the shaft.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

Abstract: A chemical mechanical processing apparatus includes a polishing pad capable to polish a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bottom side, the open region providing space for pad rebound, the open region further having a plurality of tips to hold a substrate in position during rotation of the substrate against the polishing pad, the stepped retaining ring capable to rotate the substrate against the polishing pad; and a dispenser capable to dispense a slurry onto the pad.

Abstract: A saw wire according to the invention has two parallel wire strings having a number of saw elements evenly distributed along the wire strings. A saw element includes a platform and a cutting plate. The platform has grooves intended to receive respective parallel wire strings and a groove which is open towards the bottom to receive a driving wheel and a pulley.

Abstract: A system for chemical mechanical polishing, and a method of chemical mechanical polishing and the preparation of wafer surfaces is provided. The preparation can either be a polishing operation or a buffing operation. The chemical mechanical polishing system includes a carrier to hold and rotate a wafer. The wafer has a surface area and is held by the carrier so that the surface area of the wafer to be processed is exposed. The system further includes a roller that has a process surface. The roller is configured to rotate about an axis, and the rotating process surface of the roller is applied with force against the rotating wafer surface defining a contact region on the wafer. The area of the contact region is less than the surface area of the wafer. The contact region is moved between a first region of the wafer and a second region of the wafer during the processing of the wafer, and the force and linear velocity are manipulated to control a rate of removal.

Abstract: A cutting member for cutting hard materials such as rock, concrete, etc., includes a support unit in the shape of a wire. The free ends of the wire are joined together to form an endless unit. Cutting elements are provided at regular distances from each other along the full length of the wire. Each cutting element is firmly connected to a cutting element carrier and supported on the wire and at least in the mounted condition is firmly connected to a rider for guidingly engaging a portion of a saw. Driver members are attached to the wire and the cutting element carriers are floatingly supported on the wire in functional engagement with the driver members.

Abstract: A universal grinding machine having a plurality of workpiece holders, each of which can be moved independently of each other or jointly, by a separate slide, in the longitudinal direction of the workpiece on a slide guide disposed on the machine bed, or which can be fixed independently of each other or jointly to the machine bed.

Abstract: A chain saw for aggregate material has a nozzle that provides a spray of water to that portion of the saw chain that is traveling between the guide bar and the drive sprocket. The flooding provided by the nozzle washes slurry off of the saw chain. A basin with inclined baffles is provided to collect the slurry carried by the saw chain into the housing. Apertures are provided in the basin for discharging the collected slurry.

Abstract: Abrasive tools and a grinding process are for use in the manufacture of hypodermic needles. In particular, a formulation including selected bond components, and a process for manufacturing grinding wheels having an embrittled bond permits a new method for grinding of fine hollow metal tubes to shape the tips of hypodermic needles with the substantial elimination of metal burrs or fines from the grinding process.

Abstract: In a polishing configuration wherein a polishing material or slurry is applied to a surface of a rotating polishing pad and a product material mounted on a rotating carrier is moved into contact with the polishing material or slurry, the flow of the polishing material or slurry over the surface can be improved by fabricating spiral grooves or channels in the surface of the polishing pad and by mounting the product material is a cavity of the carrier, the cavity having grooves or channels in the side walls to provide a uniform flow over the product material. The angle between the spiral grooves or channels on the polishing pad and a diameter about the axis of rotation should be approximately 40.degree.. The spiral grooves or channels on the polishing pad can be combined with concentric grooves or channels to further improve the flow of polishing material. Similarly, the grooves or channels in the rotating carrier provide further uniformity for the interaction of the polishing material and the product material.

Abstract: The invention relates to a diamond belt for cutting stones, like marble, granite, and others, generally used as an endless, that is continuous, belt, and characterized in that it has a flexible core, consisting of one or more cables (1), there being provided, slipped thereon through bores (2), rigid segments (3), generally made of metal, which are spaced and connected both to each other and to the flexible core (1), by incorporation in a flexible material, such as rubber or plastic, which forms the body (4) of the belt, filling the bores (2) of the rigid segments (3) and the intervals between them, and eventually covering the segments at least partially, the said segments (3) being provided with diamond surfaces, which project slightly above the body (4) of the belt, at least on its active front surface, facing the stone to be cut. Preferably, the diamond surface of each rigid segment (3) of the belt consists of a corresponding sintered diamond element, applied on the body of the rigid segment (3).

Abstract: The cutting wire consists of a wire rope (4) with cutting beads (6) affixed thereto that contain bonded superabrasives such as diamond and a cutting wire connector which connects the cutting wire to produce an endless wire loop for use in a wire sawing machine. The cutting wire connector consists of a double joint which has two joint axes intersecting each other at an angle of 90.degree.. The cutting wire connector consists of two forks (1) at the wire ends (4), an intermediate part (2) and two joint pins (3) which connect each form (1) with the intermediate part (2) in such a way that the connection can be opened easily. The cutting wire connected by means of the joint connector has a long service life while exhibiting increased cutting performance and increased utilization of the operating time of the facilities.