With In Situ Removal Of Nonresist Portion Of Shield Patents (Class 451/30)
  • Patent number: 8904628
    Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: December 9, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Moon Lee, Sung Kwon Wi, Jeong Bok Kwak, Won Chul Sim, Young Seuck Yoo, Yong Suk Kim
  • Patent number: 8845393
    Abstract: A cutting method by sandblasting in which cutting through of a workpiece and/or formation of a through-hole in the workpiece are/is performed by forming a resist on a plate-shaped workpiece and projecting abrasive against the workpiece to cut a portion of the workpiece where no resist is formed, comprises the steps of: forming the resist in a predetermined pattern on a front surface and a back surface of the workpiece symmetrically between the front and back by inkjet printing, and projecting the abrasive against each of the front and back surfaces of the workpiece to make a cut from the front surface side communicate with a cut from a back side at an approximately intermediate position of a thickness of the workpiece.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: September 30, 2014
    Assignee: Fuji Manufacturing Co., Ltd.
    Inventors: Keiji Mase, Shozo Ishibashi
  • Patent number: 8460065
    Abstract: A sandblasting apparatus for cutting a plate-shaped workpiece into a plurality of separate tablets includes a chamber defining a cavity, a support assembly received in the cavity, a sandblasting assembly for spraying sand toward the workpiece, a first mask located between the sandblasting assembly and the support assembly, a second mask located between the sandblasting assembly and the support assembly, and a mask switching member for selectively placing the first mask or the second mask over the workpiece. The support assembly is configured for supporting the workpiece and the tablets. The first mask cooperates with the sandblasting assembly to remove unwanted portions of the workpiece thus obtaining a tablet network consisting of a plurality of tablets and a plurality of connecting portions interconnected between the tablets. The second mask cooperates with the sandblasting assembly to remove the connecting portions of the tablet network thus obtaining a plurality of separated tablets.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: June 11, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei
  • Patent number: 8449350
    Abstract: A sandblasting apparatus includes a processing chamber, a sandblasting nozzle positioned on a top of the processing chamber, a support mechanism, an elevation mechanism, a worktable, and a cutting mechanism. The support mechanism is positioned in the processing chamber and opposite to the sandblasting nozzle. The support mechanism is used for supporting a template with a cutting pattern. The elevation mechanism is positioned on the bottom of the processing chamber. The worktable is located between the support mechanism and the elevation mechanism and configured for supporting a plate for processing and being opposite to the template. The center of worktable defines a through hole matching with the pattern of the template. The cutting mechanism is fixed on the elevation mechanism and faces the through hole. The elevation mechanism drives the cutting mechanism to move toward or away the worktable.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: May 28, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei
  • Patent number: 8047894
    Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, an information receiver receives information while the lapping plate is being used to lap a slider. The information indicates the quality of a lapping plate. A quality determiner that evaluates the quality of the lapping plate based on the information while the lapping plate is being used to lap the slider.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: November 1, 2011
    Assignee: Hitachi Global Storage Technologies, Netherlands, B.V.
    Inventors: Richard Dale Bunch, Linden James Crawforth, Eduardo Padilla, Xiao Z. Wu
  • Patent number: 7972198
    Abstract: There is provided a groove machining method by means of water jet which machines grooves by means of a water jet device including injection nozzles for injecting a water jet on a face to be machined of a member to be machined, including a step of disposing protection members which are more resistive against an injection power of the water jet than the member to be machined so as to cover a portion which is a part of the face to be machined, and on which grooves are not to be formed in order to form ends of the machined grooves in a travel direction of the injection nozzles inside an outline of the face to be machined, and a step of moving the nozzles across the protection members and the face to be machined while injecting the water jet at a predetermined injection power from the injection nozzles.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: July 5, 2011
    Assignee: Kobe Steel, Ltd.
    Inventors: Koji Noishiki, Hiroyuki Ban
  • Patent number: 7914362
    Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, information that indicates the quality of a lapping plate is received while the lapping plate is being used to lap a slider, and the information is used to evaluate the quality of the lapping plate while the lapping plate is being used to lap the slider.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: March 29, 2011
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Richard Dale Bunch, Linden James Crawforth, Eduardo Padilla, Xiao Z. Wu
  • Patent number: 7586047
    Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric.
    Type: Grant
    Filed: January 13, 2005
    Date of Patent: September 8, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Fumihiro Hayashi, Yasuhito Masuda, Yasuhiro Okuda
  • Patent number: 7267608
    Abstract: A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: September 11, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Stephen J. Kramer
  • Patent number: 7175507
    Abstract: A temporary gravesite marker for use in identifying a gravesite until a permanent gravestone is available includes a marker tablet which has a generally rectangular solid form with an upper surface to be marked with alphanumeric characters providing information regarding the deceased. The marker tablet is fabricated from a durable material and includes an upper surface and a substantially parallel bottom surface, both of which are substantially flat. The preferred marker tablet has a two-to-one (2:1) aspect ratio and measures 5½ inches by 11 inches with a 1 1/16 inch thickness. The density of the material selected, based upon the overall volume, yields a weight for the marker tablet of approximately ten pounds. The alphanumeric characters are inscribed into the upper surface of the marker tablet by means of a prepared stencil and by sandblasting.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: February 13, 2007
    Assignee: Ceramica, Inc.
    Inventors: Douglas J. Light, Jeffrey S. McGuire
  • Patent number: 7169022
    Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: January 30, 2007
    Assignee: Cutsforth Products, Inc.
    Inventor: David L. Cutsforth
  • Patent number: 7063596
    Abstract: Material is removed from objects to be marked or machined by applying tools having cutouts arranged in a pattern on the objects, filling the cutouts with abrasive particles, pouring a molten metal over the tools to solidify as a backing, and then ultrasonically vibrating the backing to propel the abrasive particles through the cutouts to transfer the pattern to the objects.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: June 20, 2006
    Inventor: David Benderly
  • Patent number: 6949010
    Abstract: A temporary gravesite marker for use in identifying a gravesite until a permanent gravestone is available includes a marker tablet which has a generally rectangular solid form with an upper surface to be marked with alphanumeric characters providing information regarding the deceased. The marker tablet is fabricated from a durable material and includes an upper surface and a substantially parallel bottom surface, both of which are substantially flat. The preferred marker tablet has a two-to-one (2:1) aspect ratio and measures 5½ inches by 11 inches with a 1 1/16 inch thickness. The density of the material selected, based upon the overall volume, yields a weight for the marker tablet of approximately ten pounds. The alphanumeric characters are inscribed into the upper surface of the marker tablet by means of a prepared stencil and by sandblasting.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: September 27, 2005
    Assignee: Ceramica, Inc.
    Inventors: Douglas J. Light, Jeffrey S. McGuire
  • Patent number: 6905966
    Abstract: A method for estimating relative remaining film thickness distribution (CMP pattern ratio distribution) among sparse and dense active regions after CMP on the basis of the layout of a mask pattern in a one-chip mask region. In each mask pattern, a reduced region is created by removing an area of a predetermined width from the mask pattern along the edge of the mask pattern. Then, the one-chip mask region is segmentalized into predetermined regions to create a plurality of segmentalized regions. On each of the segmentalized regions, the area ratio of all reduced regions occupying a region that includes a segmentalized region at a fixed position and has the same size and shape as those of the foregoing one-chip mask region is acquired. Based on the acquired area ratio, the distribution of remaining film thickness of a surface protection film in the one-chip mask region, i.e., the CMP pattern ratio, is acquired.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: June 14, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Takeshi Morita
  • Patent number: 6855026
    Abstract: A partition is formed by the process including a step for providing a sheet-like partition material that covers a display area and outside thereof on the surface of the substrate, a step for providing a mask for patterning that covers the display area and the outside thereof, so that a pattern of the portion arranged outside of the display area of the mask is a grid-like pattern, a step for patterning the partition material covered partially with the mask by a sandblasting process, and a step for baking the partition material after the patterning.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: February 15, 2005
    Assignees: Fujitsu Limited, Fujitsu Hitachi Plasma Display Limited
    Inventors: Akihiro Fujinaga, Kazunori Ishizuka, Tatsutoshi Kanae, Kazuhide Iwasaki, Toshiyuki Nanto, Yoshimi Kawanami, Masayuki Shibata, Yasuhiko Kunii, Tadayoshi Kosaka, Osamu Toyoda, Yoshimi Shirakawa
  • Patent number: 6848972
    Abstract: A surface micromachining process for a resin mold including a layer of a resin as a material of the resin mold, which layer has a product's surface forming plane, and a back surface reinforcing member for reinforcing the resin layer. The product's surface forming plane is micromachined by means of at least two masking/blasting treatments. The treatments comprise a primary blasting step of sticking a first mask sheet having a specific window on the product's surface forming plane and blasting blast particles to the product's surface forming plane via the first mask sheet, and a secondary blasting step of peeling the first mask sheet, sticking a second mask sheet different from the first mask sheet on the product's surface forming plane, and blasting blast particles to the product's surface forming plane via the second mask sheet.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: February 1, 2005
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Shirakawa, Kenji Hosoya
  • Patent number: 6827637
    Abstract: A waterjet cutting system and method of operating such system are disclosed. The waterjet cutting system includes an inflatable and deflatable diaphragm to control the mixing of abrasive particulate material and liquid in a stream used to abrade a target object.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: December 7, 2004
    Assignee: Service Metal Fabricating, Inc.
    Inventors: David M. Lewin, Timothy D. O'Keeffe
  • Publication number: 20040180608
    Abstract: A method for reducing noise in a lapping guide. Selected portions of a Giant magnetoresistive device wafer are masked, thereby defining masked and unmasked regions of the wafer in which the unmasked regions include lapping guides. The wafer is bombarded with ions such that a Giant magnetoresistive effect of the unmasked regions is reduced.
    Type: Application
    Filed: February 28, 2003
    Publication date: September 16, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES
    Inventors: Mark A. Church, Wipul Pemsiri Jayasekara, Howard Gordon Zolla
  • Patent number: 6772748
    Abstract: A method of forming a stone inlay in an abrasion-sensitive substrate, such as wood, by forming a depression in the substrate, mounting stone on a damping material capable of absorbing the abrasive energy applied to the stone in reducing the dimensions of the stone to fit the depression, cutting the inlay to size and inserting it into the substrate. The cut inlay/damping material composite may be sold separately as an article of manufacture.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: August 10, 2004
    Inventor: Sean Cleary
  • Patent number: 6722953
    Abstract: An abrasive liquid feed apparatus comprises a supply tank for storing an abrasive liquid having a predetermined concentration, an abrasive liquid pipe for transferring the abrasive liquid from the tank to a polishing means and an additive feed means which feeds an additive having a predetermined concentration to the tank. It further comprises an additive concentration measurement means which measures a concentration of the additive in the abrasive liquid in the supply tank, a measurement means which measures an amount of the abrasive liquid in the tank and a control which calculates an amount of the additive to be supplemented to the tank, based on the concentration of the additive measured by the additive concentration measurement means and the amount of the abrasive liquid measured by the metering means. To maintain the concentration of aqueous hydrogen peroxide in the abrasive liquid.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: April 20, 2004
    Assignee: Ebara Corporation
    Inventors: Takashi Tanaka, Takashi Tsuzuki, Fujihiko Toyomasu
  • Patent number: 6718612
    Abstract: A method for manufacturing a glass substrate for use in magnetic disk manufacturing comprises the steps of a) forming a glass sheet; b) forming a protective sheet over one or both sides of the glass sheet; c) cutting the glass sheet into workpieces; d) cutting the workpieces into disk-shaped substrates; e) subjecting the edges of the substrates to an edge polishing process; and f) removing the protective layer. Of importance, by leaving the protective layer over the substrate, the substrate surface is protected from damage.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: April 13, 2004
    Assignee: Asahi Glass Company, Ltd.
    Inventor: Christopher H. Bajorek
  • Patent number: 6652360
    Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: November 25, 2003
    Assignee: Cutsforth Products, Inc.
    Inventor: David L. Cutsforth
  • Patent number: 6612906
    Abstract: Material is removed from objects to be marked or machined by applying apertured masks having cutouts arranged in a pattern on the objects, applying a liquid mixture of abrasive particles over the masks, and then ultrasonically vibrating the mixture to propel the abrasive particles through the cutouts to transfer the pattern to the objects.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: September 2, 2003
    Inventor: David Benderly
  • Publication number: 20030121511
    Abstract: A method for dividing a semiconductor wafer into chips according to the present invention is a method for dividing a semiconductor wafer into a large number of semiconductor chips, the semiconductor wafer having a semiconductor layer formed on a substrate. A first method includes the step of forming a blast-resistant mask on a surface of the semiconductor wafer, the blast-resistant mask having a pattern for leaving a grid-like exposed portion as it is and the step of blasting a fine particular blast material to thereby form dividing grooves reaching a predetermined depth of the substrate in the grid-like exposed portion.
    Type: Application
    Filed: September 30, 2002
    Publication date: July 3, 2003
    Inventors: Masaki Hashimura, Takao Sato, Koichi Ota
  • Patent number: 6544090
    Abstract: A method for chemically etching of a foam glass layer to provide at least one cavity pattern in the foam glass layer. The method utilizes a substrate with at least one major surface suitable for receiving a glass layer. At least one layer of a glass paste composition in then applied onto the major surface of the substrate. The substrate and glass paste composition are then heated to a temperature sufficient enough to obtain a foam glass layer bonded to the major surface of the substrate. At least a portion of the foam glass layer is chemically etched to obtain at least one cavity pattern in the foam glass layer. The chemical etching of the foam glass layer results in an anisotropic etching rate.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: April 8, 2003
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Paul R. Anderson, Charles J. Barnhart, Randall J. Cutcher, Jill M. Wyse
  • Patent number: 6533643
    Abstract: A sandblasting mask device for performing sandblasting processes on wood objects is disclosed. The mask device includes a base and a mask cover. The base has a fixture for fixing a wood object that has a target surface to be worked on. The mask cover is removably fixed on the base. The mask cover includes a mask panel, which contains at least one sandblasting opening of a predetermined shape. When the mask cover is fixed on the base, the wood object is tightly clamped between the mask cover and the base, and the mask panel of the mask cover is closely attached to the target surface of the object. The sandblasting opening of the mask panel will expose a predetermined portion of the target surface of the object for performing the sandblasting process.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: March 18, 2003
    Assignee: North America Intellectual Property Corporation
    Inventor: Cheng-Hsing Feng
  • Patent number: 6482075
    Abstract: A process is described for planarizing an isolation structure in a substrate. The process includes depositing a pad protective material over an upper surface of the substrate, and selectively removing portions of the pad protective material to expose portions of the substrate and to form sidewalls in the pad protective material. A trench is formed in the exposed portions of the substrate, and a trench fill material is deposited in the trench and over the pad protective material. A trench protective material is deposited over the trench fill material and in contact with the sidewalls of the pad protective material, such that the pad protective material and portions of the trench protective material together form a continuous protective material layer. Portions of the trench protective material and the trench fill material are selectively removed down to the level of the upper surface of the pad protective material.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: November 19, 2002
    Assignee: LSI Logic Corporation
    Inventors: Hemanshu D. Bhatt, Shafqat Ahmed, Robindranath Banerjee, Charles E. May
  • Patent number: 6315637
    Abstract: The present invention is directed to semiconductor processing operations. In one illustrative embodiment, the invention comprises providing a wafer having a layer of photoresist formed thereabove, positioning the layer of photoresist in contact with a polishing pad or a polishing tool, and rotating at least one of the wafer and the polishing pad to remove substantially all of the layers of photoresist.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: November 13, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Eric M. Apelgren, Jonathan B. Smith, Paul R. Besser
  • Patent number: 6276992
    Abstract: A method of forming a groove on a mother material substrate includes the steps of forming a first layer on a surface of the mother material substrate, the first layer including a chain-polymer material which is soluble in an organic solvent. Then a second layer is formed on the first layer except for a portion where the groove is to be formed. The second layer includes a chain-polymer material having very high resistance to sand blasting. Then a groove is formed by cutting the first layer and the mother material substrate at the portion where the groove is to be formed, by a sand blasting process in which sand is directed from above the second layer downwardly. Then the first and second layers are removed from the mother material by dissolving the first layer using the organic solvent.
    Type: Grant
    Filed: December 16, 1998
    Date of Patent: August 21, 2001
    Assignee: Murata Manufacturing Co., LTD
    Inventors: Masuyoshi Houda, Masaya Wajima
  • Patent number: 6254466
    Abstract: A tumbler apparatus for abrading and polishing small parts and rocks includes a cylindrical barrel with a closed end and an open end. The inner surface at the open end has a circular sealing edge. A sealing closure for the sealing the barrel at the open end includes a first and a second rigid disc. A resilient band, either an O-ring or a cylinder, is held between the discs. A translating mechanism draws the discs toward one another in a sealing mode, that compresses the band to bulge outwardly to sealingly engage the inner sealing surface of the barrel open end. In a releasing mode, the discs are moved apart, allowing the band to resume it original shape, thereby unsealing the barrel to facilitate removal of the closure for access to the barrel contents. A pressure relief valve at the center of the discs may be optionally provided.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: July 3, 2001
    Inventors: Domenic Mucciacciaro, Alvin S. Blum
  • Patent number: 6238829
    Abstract: Disclosed is a method of manufacturing a plasma addressed electro-optical display having a side surface electrode structure. In the display, a display cell is superimposed on a plasma cell. The display cell includes an intermediate substrate, an upper substrate having columns of signal electrodes, and an electro-optical material held therebetween. The plasma cell includes a lower substrate joined to the intermediate substrate, and a plurality of rows of discharge channels formed therebetween and composed of discharge electrodes and barrier ribs.
    Type: Grant
    Filed: May 19, 1998
    Date of Patent: May 29, 2001
    Assignee: Sony Corporation
    Inventor: Atsushi Seki
  • Patent number: 6183347
    Abstract: A workpiece includes a surface adjoining an aperture. The aperture is filled with a plug to provide a step adjoining the surface. A stream of pliant shot in a carrier fluid is discharged at a shallow angle of incidence against the plug and directed toward the step for selective abrasion thereof.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: February 6, 2001
    Assignee: General Electric Company
    Inventor: James S. Shaw
  • Patent number: 6126513
    Abstract: Plastic abrasives for sandblasting, in particular, those to be used in sandblast processing for forming barrier ribs and priming ribs; a sandblast processing method with the use of the same; and a method for treating sandblasting waste matters. A plastic abrasive for sandblasting characterized by being soluble in organic solvents or water/organic solvent mixtures and comprising plastic particles having an average particle size of 5 to 100 .mu.m; a method for sandblast processing a plasma display panel substrate by using the plastic abrasive; and a method for treating sandblasting waste matters.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: October 3, 2000
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Kiminori Oshio, Hiroyuki Obiya
  • Patent number: 5910396
    Abstract: In a method in which a top coating (2) on a relatively hard substrate (1) is patterned by means of a stream of kinetic particles while being masked by a mask (3), the substrate (1) is coated with a damping layer (4) of a ductile material before the top coating (2) is provided.
    Type: Grant
    Filed: February 2, 1998
    Date of Patent: June 8, 1999
    Assignee: U.S. Philips Corporation
    Inventors: Jacobus M. Dings, Remko Horne, Gerardus N. A. Van Veen
  • Patent number: 5909083
    Abstract: A process for producing a plasma display panel, involving the formation of a predetermined pattern for a plasma display panel, including an electrode pattern and a barrier for defining a discharge space, said process comprising the steps of:forming a predetermined pattern-forming material layer on a substrate;forming a mask pattern, comprising a main component of the material layer, on the pattern-forming material layer:etching the pattern-forming material layer with the mask pattern formed thereon, thereby patterning the pattern-forming material layer; andthen firing the pattern-forming material layer with the mask pattern provided thereon and the mask layer, thereby integrating the pattern-forming material layer and at least part of the mask layer with each other.
    Type: Grant
    Filed: February 18, 1997
    Date of Patent: June 1, 1999
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Masaaki Asano, Satoru Kuramochi, Yozo Kosaka
  • Patent number: 5833517
    Abstract: A gradation pattern is formed by sandblasting a surface of a transparent substrate. The gradation pattern comprises countless recesses formed by eroding the surface structure. The distribution density of the recesses is low in the vicinity of sides on which primary illuminating light is incident, and high in the center of the pattern. As the original flat and smooth aspect of the plate is maintained between the recesses, the light guiding performance of the plate is maintained. By adjusting the gradation pattern, any desired bright/dark pattern can be obtained. The cost of manufacturing a light guiding plate and flat optical source device is reduced. A large illumination area having a high uniform brightness is made possible by sandblasting. And many applications and modes of use which were impossible with a conventional light guiding plate having a printed pattern, are now possible.
    Type: Grant
    Filed: December 6, 1995
    Date of Patent: November 10, 1998
    Assignee: Create Kabushikigaisha
    Inventors: Akinobu Konda, Hidemi Konda
  • Patent number: 5589160
    Abstract: Oral compositions, such as oral gels and toothpastes, containing a novel abrasive.
    Type: Grant
    Filed: May 2, 1995
    Date of Patent: December 31, 1996
    Assignee: The Procter & Gamble Company
    Inventor: David E. Rice
  • Patent number: 5512005
    Abstract: The present invention relates to process and apparatus for automatically engraving stone memorial markers comprised of granite or marble. The markers have their polished facing surfaces covered with a cut-out blast-resistant stencil having prescribed lettering, numerals, decorative patterns and the like. The markers are conveyed through a sand blast chamber at a uniform rate and plural direct-air-feed nozzles are moved uniformly transversely thereover to effect precisely uniform engraving of the facing surfaces. The engraving is more precisely defined to a prescribed uniform depth with finer detail than heretofore possible by manual or other automated single-nozzle methods. The plural nozzles are essentially continuously fed with pressurized air and blast cutting media to obtain faster and more accurate engraving.
    Type: Grant
    Filed: August 9, 1993
    Date of Patent: April 30, 1996
    Assignee: Michael P. Short
    Inventor: Robert L. Gulling
  • Patent number: RE42405
    Abstract: A partition is formed by the process including a step for providing a sheet-like partition material that covers a display area and outside thereof on the surface of the substrate, a step for providing a mask for patterning that covers the display area and the outside thereof, so that a pattern of the portion arranged outside of the display area of the mask is a grid-like pattern, a step for patterning the partition material covered partially with the mask by a sandblasting process, and a step for baking the partition material after the patterning.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: May 31, 2011
    Assignees: Fujitsu Hitachi Plasma Display Limited, Hitachi Plasma Patent Licensing Co., Ltd.
    Inventors: Akihiro Fujinaga, Kazunori Ishizuka, Tatsutoshi Kanae, Kazuhide Iwasaki, Toshiyuki Nanto, Yoshimi Kawanami, Masayuki Shibata, Yasuhiko Kunii, Tadayoshi Kosaka, Osamu Toyoda, Yoshimi Shirakawa
  • Patent number: RE44445
    Abstract: A partition is formed by the process including a step for providing a sheet-like partition material that covers a display area and outside thereof on the surface of the substrate, a step for providing a mask for patterning that covers the display area and the outside thereof, so that a pattern of the portion arranged outside of the display area of the mask is a grid-like pattern, a step for patterning the partition material covered partially with the mask by a sandblasting process, and a step for baking the partition material after the patterning.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: August 20, 2013
    Assignees: Hitachi Consumer Electronics Co., Ltd., Hitachi, Ltd.
    Inventors: Akihiro Fujinaga, Kazunori Ishizuka, Tatsutoshi Kanae, Kazuhide Iwasaki, Toshiyuki Nanto, Yoshimi Kawanami, Masayuki Shibata, Yasuhiko Kunii, Tadayoshi Kosaka, Osamu Toyoda, Yoshimi Shirakawa