With In Situ Removal Of Nonresist Portion Of Shield Patents (Class 451/30)
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Patent number: 8904628Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.Type: GrantFiled: December 17, 2012Date of Patent: December 9, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sang Moon Lee, Sung Kwon Wi, Jeong Bok Kwak, Won Chul Sim, Young Seuck Yoo, Yong Suk Kim
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Patent number: 8845393Abstract: A cutting method by sandblasting in which cutting through of a workpiece and/or formation of a through-hole in the workpiece are/is performed by forming a resist on a plate-shaped workpiece and projecting abrasive against the workpiece to cut a portion of the workpiece where no resist is formed, comprises the steps of: forming the resist in a predetermined pattern on a front surface and a back surface of the workpiece symmetrically between the front and back by inkjet printing, and projecting the abrasive against each of the front and back surfaces of the workpiece to make a cut from the front surface side communicate with a cut from a back side at an approximately intermediate position of a thickness of the workpiece.Type: GrantFiled: July 21, 2011Date of Patent: September 30, 2014Assignee: Fuji Manufacturing Co., Ltd.Inventors: Keiji Mase, Shozo Ishibashi
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Patent number: 8460065Abstract: A sandblasting apparatus for cutting a plate-shaped workpiece into a plurality of separate tablets includes a chamber defining a cavity, a support assembly received in the cavity, a sandblasting assembly for spraying sand toward the workpiece, a first mask located between the sandblasting assembly and the support assembly, a second mask located between the sandblasting assembly and the support assembly, and a mask switching member for selectively placing the first mask or the second mask over the workpiece. The support assembly is configured for supporting the workpiece and the tablets. The first mask cooperates with the sandblasting assembly to remove unwanted portions of the workpiece thus obtaining a tablet network consisting of a plurality of tablets and a plurality of connecting portions interconnected between the tablets. The second mask cooperates with the sandblasting assembly to remove the connecting portions of the tablet network thus obtaining a plurality of separated tablets.Type: GrantFiled: December 14, 2010Date of Patent: June 11, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Shao-Kai Pei
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Patent number: 8449350Abstract: A sandblasting apparatus includes a processing chamber, a sandblasting nozzle positioned on a top of the processing chamber, a support mechanism, an elevation mechanism, a worktable, and a cutting mechanism. The support mechanism is positioned in the processing chamber and opposite to the sandblasting nozzle. The support mechanism is used for supporting a template with a cutting pattern. The elevation mechanism is positioned on the bottom of the processing chamber. The worktable is located between the support mechanism and the elevation mechanism and configured for supporting a plate for processing and being opposite to the template. The center of worktable defines a through hole matching with the pattern of the template. The cutting mechanism is fixed on the elevation mechanism and faces the through hole. The elevation mechanism drives the cutting mechanism to move toward or away the worktable.Type: GrantFiled: December 2, 2010Date of Patent: May 28, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Shao-Kai Pei
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Patent number: 8047894Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, an information receiver receives information while the lapping plate is being used to lap a slider. The information indicates the quality of a lapping plate. A quality determiner that evaluates the quality of the lapping plate based on the information while the lapping plate is being used to lap the slider.Type: GrantFiled: November 30, 2005Date of Patent: November 1, 2011Assignee: Hitachi Global Storage Technologies, Netherlands, B.V.Inventors: Richard Dale Bunch, Linden James Crawforth, Eduardo Padilla, Xiao Z. Wu
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Patent number: 7972198Abstract: There is provided a groove machining method by means of water jet which machines grooves by means of a water jet device including injection nozzles for injecting a water jet on a face to be machined of a member to be machined, including a step of disposing protection members which are more resistive against an injection power of the water jet than the member to be machined so as to cover a portion which is a part of the face to be machined, and on which grooves are not to be formed in order to form ends of the machined grooves in a travel direction of the injection nozzles inside an outline of the face to be machined, and a step of moving the nozzles across the protection members and the face to be machined while injecting the water jet at a predetermined injection power from the injection nozzles.Type: GrantFiled: March 1, 2007Date of Patent: July 5, 2011Assignee: Kobe Steel, Ltd.Inventors: Koji Noishiki, Hiroyuki Ban
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Patent number: 7914362Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, information that indicates the quality of a lapping plate is received while the lapping plate is being used to lap a slider, and the information is used to evaluate the quality of the lapping plate while the lapping plate is being used to lap the slider.Type: GrantFiled: November 30, 2005Date of Patent: March 29, 2011Assignee: Hitachi Global Storage Technologies, Netherlands B.V.Inventors: Richard Dale Bunch, Linden James Crawforth, Eduardo Padilla, Xiao Z. Wu
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Patent number: 7586047Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric.Type: GrantFiled: January 13, 2005Date of Patent: September 8, 2009Assignee: Sumitomo Electric Industries, Ltd.Inventors: Fumihiro Hayashi, Yasuhito Masuda, Yasuhiro Okuda
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Patent number: 7267608Abstract: A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.Type: GrantFiled: December 5, 2003Date of Patent: September 11, 2007Assignee: Micron Technology, Inc.Inventor: Stephen J. Kramer
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Patent number: 7175507Abstract: A temporary gravesite marker for use in identifying a gravesite until a permanent gravestone is available includes a marker tablet which has a generally rectangular solid form with an upper surface to be marked with alphanumeric characters providing information regarding the deceased. The marker tablet is fabricated from a durable material and includes an upper surface and a substantially parallel bottom surface, both of which are substantially flat. The preferred marker tablet has a two-to-one (2:1) aspect ratio and measures 5½ inches by 11 inches with a 1 1/16 inch thickness. The density of the material selected, based upon the overall volume, yields a weight for the marker tablet of approximately ten pounds. The alphanumeric characters are inscribed into the upper surface of the marker tablet by means of a prepared stencil and by sandblasting.Type: GrantFiled: May 23, 2005Date of Patent: February 13, 2007Assignee: Ceramica, Inc.Inventors: Douglas J. Light, Jeffrey S. McGuire
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Patent number: 7169022Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.Type: GrantFiled: September 8, 2003Date of Patent: January 30, 2007Assignee: Cutsforth Products, Inc.Inventor: David L. Cutsforth
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Patent number: 7063596Abstract: Material is removed from objects to be marked or machined by applying tools having cutouts arranged in a pattern on the objects, filling the cutouts with abrasive particles, pouring a molten metal over the tools to solidify as a backing, and then ultrasonically vibrating the backing to propel the abrasive particles through the cutouts to transfer the pattern to the objects.Type: GrantFiled: June 9, 2003Date of Patent: June 20, 2006Inventor: David Benderly
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Patent number: 6949010Abstract: A temporary gravesite marker for use in identifying a gravesite until a permanent gravestone is available includes a marker tablet which has a generally rectangular solid form with an upper surface to be marked with alphanumeric characters providing information regarding the deceased. The marker tablet is fabricated from a durable material and includes an upper surface and a substantially parallel bottom surface, both of which are substantially flat. The preferred marker tablet has a two-to-one (2:1) aspect ratio and measures 5½ inches by 11 inches with a 1 1/16 inch thickness. The density of the material selected, based upon the overall volume, yields a weight for the marker tablet of approximately ten pounds. The alphanumeric characters are inscribed into the upper surface of the marker tablet by means of a prepared stencil and by sandblasting.Type: GrantFiled: June 3, 2003Date of Patent: September 27, 2005Assignee: Ceramica, Inc.Inventors: Douglas J. Light, Jeffrey S. McGuire
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Patent number: 6905966Abstract: A method for estimating relative remaining film thickness distribution (CMP pattern ratio distribution) among sparse and dense active regions after CMP on the basis of the layout of a mask pattern in a one-chip mask region. In each mask pattern, a reduced region is created by removing an area of a predetermined width from the mask pattern along the edge of the mask pattern. Then, the one-chip mask region is segmentalized into predetermined regions to create a plurality of segmentalized regions. On each of the segmentalized regions, the area ratio of all reduced regions occupying a region that includes a segmentalized region at a fixed position and has the same size and shape as those of the foregoing one-chip mask region is acquired. Based on the acquired area ratio, the distribution of remaining film thickness of a surface protection film in the one-chip mask region, i.e., the CMP pattern ratio, is acquired.Type: GrantFiled: July 28, 2003Date of Patent: June 14, 2005Assignee: Oki Electric Industry Co., Ltd.Inventor: Takeshi Morita
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Patent number: 6855026Abstract: A partition is formed by the process including a step for providing a sheet-like partition material that covers a display area and outside thereof on the surface of the substrate, a step for providing a mask for patterning that covers the display area and the outside thereof, so that a pattern of the portion arranged outside of the display area of the mask is a grid-like pattern, a step for patterning the partition material covered partially with the mask by a sandblasting process, and a step for baking the partition material after the patterning.Type: GrantFiled: October 8, 2003Date of Patent: February 15, 2005Assignees: Fujitsu Limited, Fujitsu Hitachi Plasma Display LimitedInventors: Akihiro Fujinaga, Kazunori Ishizuka, Tatsutoshi Kanae, Kazuhide Iwasaki, Toshiyuki Nanto, Yoshimi Kawanami, Masayuki Shibata, Yasuhiko Kunii, Tadayoshi Kosaka, Osamu Toyoda, Yoshimi Shirakawa
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Patent number: 6848972Abstract: A surface micromachining process for a resin mold including a layer of a resin as a material of the resin mold, which layer has a product's surface forming plane, and a back surface reinforcing member for reinforcing the resin layer. The product's surface forming plane is micromachined by means of at least two masking/blasting treatments. The treatments comprise a primary blasting step of sticking a first mask sheet having a specific window on the product's surface forming plane and blasting blast particles to the product's surface forming plane via the first mask sheet, and a secondary blasting step of peeling the first mask sheet, sticking a second mask sheet different from the first mask sheet on the product's surface forming plane, and blasting blast particles to the product's surface forming plane via the second mask sheet.Type: GrantFiled: August 22, 2002Date of Patent: February 1, 2005Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Hiroshi Shirakawa, Kenji Hosoya
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Patent number: 6827637Abstract: A waterjet cutting system and method of operating such system are disclosed. The waterjet cutting system includes an inflatable and deflatable diaphragm to control the mixing of abrasive particulate material and liquid in a stream used to abrade a target object.Type: GrantFiled: February 13, 2002Date of Patent: December 7, 2004Assignee: Service Metal Fabricating, Inc.Inventors: David M. Lewin, Timothy D. O'Keeffe
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Publication number: 20040180608Abstract: A method for reducing noise in a lapping guide. Selected portions of a Giant magnetoresistive device wafer are masked, thereby defining masked and unmasked regions of the wafer in which the unmasked regions include lapping guides. The wafer is bombarded with ions such that a Giant magnetoresistive effect of the unmasked regions is reduced.Type: ApplicationFiled: February 28, 2003Publication date: September 16, 2004Applicant: INTERNATIONAL BUSINESS MACHINESInventors: Mark A. Church, Wipul Pemsiri Jayasekara, Howard Gordon Zolla
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Patent number: 6772748Abstract: A method of forming a stone inlay in an abrasion-sensitive substrate, such as wood, by forming a depression in the substrate, mounting stone on a damping material capable of absorbing the abrasive energy applied to the stone in reducing the dimensions of the stone to fit the depression, cutting the inlay to size and inserting it into the substrate. The cut inlay/damping material composite may be sold separately as an article of manufacture.Type: GrantFiled: September 5, 2002Date of Patent: August 10, 2004Inventor: Sean Cleary
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Patent number: 6722953Abstract: An abrasive liquid feed apparatus comprises a supply tank for storing an abrasive liquid having a predetermined concentration, an abrasive liquid pipe for transferring the abrasive liquid from the tank to a polishing means and an additive feed means which feeds an additive having a predetermined concentration to the tank. It further comprises an additive concentration measurement means which measures a concentration of the additive in the abrasive liquid in the supply tank, a measurement means which measures an amount of the abrasive liquid in the tank and a control which calculates an amount of the additive to be supplemented to the tank, based on the concentration of the additive measured by the additive concentration measurement means and the amount of the abrasive liquid measured by the metering means. To maintain the concentration of aqueous hydrogen peroxide in the abrasive liquid.Type: GrantFiled: December 13, 2001Date of Patent: April 20, 2004Assignee: Ebara CorporationInventors: Takashi Tanaka, Takashi Tsuzuki, Fujihiko Toyomasu
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Patent number: 6718612Abstract: A method for manufacturing a glass substrate for use in magnetic disk manufacturing comprises the steps of a) forming a glass sheet; b) forming a protective sheet over one or both sides of the glass sheet; c) cutting the glass sheet into workpieces; d) cutting the workpieces into disk-shaped substrates; e) subjecting the edges of the substrates to an edge polishing process; and f) removing the protective layer. Of importance, by leaving the protective layer over the substrate, the substrate surface is protected from damage.Type: GrantFiled: May 5, 2000Date of Patent: April 13, 2004Assignee: Asahi Glass Company, Ltd.Inventor: Christopher H. Bajorek
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Patent number: 6652360Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.Type: GrantFiled: May 25, 2001Date of Patent: November 25, 2003Assignee: Cutsforth Products, Inc.Inventor: David L. Cutsforth
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Patent number: 6612906Abstract: Material is removed from objects to be marked or machined by applying apertured masks having cutouts arranged in a pattern on the objects, applying a liquid mixture of abrasive particles over the masks, and then ultrasonically vibrating the mixture to propel the abrasive particles through the cutouts to transfer the pattern to the objects.Type: GrantFiled: October 22, 2001Date of Patent: September 2, 2003Inventor: David Benderly
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Publication number: 20030121511Abstract: A method for dividing a semiconductor wafer into chips according to the present invention is a method for dividing a semiconductor wafer into a large number of semiconductor chips, the semiconductor wafer having a semiconductor layer formed on a substrate. A first method includes the step of forming a blast-resistant mask on a surface of the semiconductor wafer, the blast-resistant mask having a pattern for leaving a grid-like exposed portion as it is and the step of blasting a fine particular blast material to thereby form dividing grooves reaching a predetermined depth of the substrate in the grid-like exposed portion.Type: ApplicationFiled: September 30, 2002Publication date: July 3, 2003Inventors: Masaki Hashimura, Takao Sato, Koichi Ota
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Patent number: 6544090Abstract: A method for chemically etching of a foam glass layer to provide at least one cavity pattern in the foam glass layer. The method utilizes a substrate with at least one major surface suitable for receiving a glass layer. At least one layer of a glass paste composition in then applied onto the major surface of the substrate. The substrate and glass paste composition are then heated to a temperature sufficient enough to obtain a foam glass layer bonded to the major surface of the substrate. At least a portion of the foam glass layer is chemically etched to obtain at least one cavity pattern in the foam glass layer. The chemical etching of the foam glass layer results in an anisotropic etching rate.Type: GrantFiled: June 16, 2000Date of Patent: April 8, 2003Assignee: E. I. du Pont de Nemours and CompanyInventors: Paul R. Anderson, Charles J. Barnhart, Randall J. Cutcher, Jill M. Wyse
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Patent number: 6533643Abstract: A sandblasting mask device for performing sandblasting processes on wood objects is disclosed. The mask device includes a base and a mask cover. The base has a fixture for fixing a wood object that has a target surface to be worked on. The mask cover is removably fixed on the base. The mask cover includes a mask panel, which contains at least one sandblasting opening of a predetermined shape. When the mask cover is fixed on the base, the wood object is tightly clamped between the mask cover and the base, and the mask panel of the mask cover is closely attached to the target surface of the object. The sandblasting opening of the mask panel will expose a predetermined portion of the target surface of the object for performing the sandblasting process.Type: GrantFiled: January 22, 2002Date of Patent: March 18, 2003Assignee: North America Intellectual Property CorporationInventor: Cheng-Hsing Feng
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Patent number: 6482075Abstract: A process is described for planarizing an isolation structure in a substrate. The process includes depositing a pad protective material over an upper surface of the substrate, and selectively removing portions of the pad protective material to expose portions of the substrate and to form sidewalls in the pad protective material. A trench is formed in the exposed portions of the substrate, and a trench fill material is deposited in the trench and over the pad protective material. A trench protective material is deposited over the trench fill material and in contact with the sidewalls of the pad protective material, such that the pad protective material and portions of the trench protective material together form a continuous protective material layer. Portions of the trench protective material and the trench fill material are selectively removed down to the level of the upper surface of the pad protective material.Type: GrantFiled: September 27, 2000Date of Patent: November 19, 2002Assignee: LSI Logic CorporationInventors: Hemanshu D. Bhatt, Shafqat Ahmed, Robindranath Banerjee, Charles E. May
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Patent number: 6315637Abstract: The present invention is directed to semiconductor processing operations. In one illustrative embodiment, the invention comprises providing a wafer having a layer of photoresist formed thereabove, positioning the layer of photoresist in contact with a polishing pad or a polishing tool, and rotating at least one of the wafer and the polishing pad to remove substantially all of the layers of photoresist.Type: GrantFiled: January 18, 2000Date of Patent: November 13, 2001Assignee: Advanced Micro Devices, Inc.Inventors: Eric M. Apelgren, Jonathan B. Smith, Paul R. Besser
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Patent number: 6276992Abstract: A method of forming a groove on a mother material substrate includes the steps of forming a first layer on a surface of the mother material substrate, the first layer including a chain-polymer material which is soluble in an organic solvent. Then a second layer is formed on the first layer except for a portion where the groove is to be formed. The second layer includes a chain-polymer material having very high resistance to sand blasting. Then a groove is formed by cutting the first layer and the mother material substrate at the portion where the groove is to be formed, by a sand blasting process in which sand is directed from above the second layer downwardly. Then the first and second layers are removed from the mother material by dissolving the first layer using the organic solvent.Type: GrantFiled: December 16, 1998Date of Patent: August 21, 2001Assignee: Murata Manufacturing Co., LTDInventors: Masuyoshi Houda, Masaya Wajima
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Patent number: 6254466Abstract: A tumbler apparatus for abrading and polishing small parts and rocks includes a cylindrical barrel with a closed end and an open end. The inner surface at the open end has a circular sealing edge. A sealing closure for the sealing the barrel at the open end includes a first and a second rigid disc. A resilient band, either an O-ring or a cylinder, is held between the discs. A translating mechanism draws the discs toward one another in a sealing mode, that compresses the band to bulge outwardly to sealingly engage the inner sealing surface of the barrel open end. In a releasing mode, the discs are moved apart, allowing the band to resume it original shape, thereby unsealing the barrel to facilitate removal of the closure for access to the barrel contents. A pressure relief valve at the center of the discs may be optionally provided.Type: GrantFiled: May 16, 2000Date of Patent: July 3, 2001Inventors: Domenic Mucciacciaro, Alvin S. Blum
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Patent number: 6238829Abstract: Disclosed is a method of manufacturing a plasma addressed electro-optical display having a side surface electrode structure. In the display, a display cell is superimposed on a plasma cell. The display cell includes an intermediate substrate, an upper substrate having columns of signal electrodes, and an electro-optical material held therebetween. The plasma cell includes a lower substrate joined to the intermediate substrate, and a plurality of rows of discharge channels formed therebetween and composed of discharge electrodes and barrier ribs.Type: GrantFiled: May 19, 1998Date of Patent: May 29, 2001Assignee: Sony CorporationInventor: Atsushi Seki
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Patent number: 6183347Abstract: A workpiece includes a surface adjoining an aperture. The aperture is filled with a plug to provide a step adjoining the surface. A stream of pliant shot in a carrier fluid is discharged at a shallow angle of incidence against the plug and directed toward the step for selective abrasion thereof.Type: GrantFiled: August 24, 1999Date of Patent: February 6, 2001Assignee: General Electric CompanyInventor: James S. Shaw
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Patent number: 6126513Abstract: Plastic abrasives for sandblasting, in particular, those to be used in sandblast processing for forming barrier ribs and priming ribs; a sandblast processing method with the use of the same; and a method for treating sandblasting waste matters. A plastic abrasive for sandblasting characterized by being soluble in organic solvents or water/organic solvent mixtures and comprising plastic particles having an average particle size of 5 to 100 .mu.m; a method for sandblast processing a plasma display panel substrate by using the plastic abrasive; and a method for treating sandblasting waste matters.Type: GrantFiled: July 10, 1998Date of Patent: October 3, 2000Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Kiminori Oshio, Hiroyuki Obiya
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Patent number: 5910396Abstract: In a method in which a top coating (2) on a relatively hard substrate (1) is patterned by means of a stream of kinetic particles while being masked by a mask (3), the substrate (1) is coated with a damping layer (4) of a ductile material before the top coating (2) is provided.Type: GrantFiled: February 2, 1998Date of Patent: June 8, 1999Assignee: U.S. Philips CorporationInventors: Jacobus M. Dings, Remko Horne, Gerardus N. A. Van Veen
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Patent number: 5909083Abstract: A process for producing a plasma display panel, involving the formation of a predetermined pattern for a plasma display panel, including an electrode pattern and a barrier for defining a discharge space, said process comprising the steps of:forming a predetermined pattern-forming material layer on a substrate;forming a mask pattern, comprising a main component of the material layer, on the pattern-forming material layer:etching the pattern-forming material layer with the mask pattern formed thereon, thereby patterning the pattern-forming material layer; andthen firing the pattern-forming material layer with the mask pattern provided thereon and the mask layer, thereby integrating the pattern-forming material layer and at least part of the mask layer with each other.Type: GrantFiled: February 18, 1997Date of Patent: June 1, 1999Assignee: Dai Nippon Printing Co., Ltd.Inventors: Masaaki Asano, Satoru Kuramochi, Yozo Kosaka
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Patent number: 5833517Abstract: A gradation pattern is formed by sandblasting a surface of a transparent substrate. The gradation pattern comprises countless recesses formed by eroding the surface structure. The distribution density of the recesses is low in the vicinity of sides on which primary illuminating light is incident, and high in the center of the pattern. As the original flat and smooth aspect of the plate is maintained between the recesses, the light guiding performance of the plate is maintained. By adjusting the gradation pattern, any desired bright/dark pattern can be obtained. The cost of manufacturing a light guiding plate and flat optical source device is reduced. A large illumination area having a high uniform brightness is made possible by sandblasting. And many applications and modes of use which were impossible with a conventional light guiding plate having a printed pattern, are now possible.Type: GrantFiled: December 6, 1995Date of Patent: November 10, 1998Assignee: Create KabushikigaishaInventors: Akinobu Konda, Hidemi Konda
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Patent number: 5589160Abstract: Oral compositions, such as oral gels and toothpastes, containing a novel abrasive.Type: GrantFiled: May 2, 1995Date of Patent: December 31, 1996Assignee: The Procter & Gamble CompanyInventor: David E. Rice
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Patent number: 5512005Abstract: The present invention relates to process and apparatus for automatically engraving stone memorial markers comprised of granite or marble. The markers have their polished facing surfaces covered with a cut-out blast-resistant stencil having prescribed lettering, numerals, decorative patterns and the like. The markers are conveyed through a sand blast chamber at a uniform rate and plural direct-air-feed nozzles are moved uniformly transversely thereover to effect precisely uniform engraving of the facing surfaces. The engraving is more precisely defined to a prescribed uniform depth with finer detail than heretofore possible by manual or other automated single-nozzle methods. The plural nozzles are essentially continuously fed with pressurized air and blast cutting media to obtain faster and more accurate engraving.Type: GrantFiled: August 9, 1993Date of Patent: April 30, 1996Assignee: Michael P. ShortInventor: Robert L. Gulling
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Patent number: RE42405Abstract: A partition is formed by the process including a step for providing a sheet-like partition material that covers a display area and outside thereof on the surface of the substrate, a step for providing a mask for patterning that covers the display area and the outside thereof, so that a pattern of the portion arranged outside of the display area of the mask is a grid-like pattern, a step for patterning the partition material covered partially with the mask by a sandblasting process, and a step for baking the partition material after the patterning.Type: GrantFiled: December 4, 2008Date of Patent: May 31, 2011Assignees: Fujitsu Hitachi Plasma Display Limited, Hitachi Plasma Patent Licensing Co., Ltd.Inventors: Akihiro Fujinaga, Kazunori Ishizuka, Tatsutoshi Kanae, Kazuhide Iwasaki, Toshiyuki Nanto, Yoshimi Kawanami, Masayuki Shibata, Yasuhiko Kunii, Tadayoshi Kosaka, Osamu Toyoda, Yoshimi Shirakawa
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Patent number: RE44445Abstract: A partition is formed by the process including a step for providing a sheet-like partition material that covers a display area and outside thereof on the surface of the substrate, a step for providing a mask for patterning that covers the display area and the outside thereof, so that a pattern of the portion arranged outside of the display area of the mask is a grid-like pattern, a step for patterning the partition material covered partially with the mask by a sandblasting process, and a step for baking the partition material after the patterning.Type: GrantFiled: May 27, 2011Date of Patent: August 20, 2013Assignees: Hitachi Consumer Electronics Co., Ltd., Hitachi, Ltd.Inventors: Akihiro Fujinaga, Kazunori Ishizuka, Tatsutoshi Kanae, Kazuhide Iwasaki, Toshiyuki Nanto, Yoshimi Kawanami, Masayuki Shibata, Yasuhiko Kunii, Tadayoshi Kosaka, Osamu Toyoda, Yoshimi Shirakawa