Abrading Process Patents (Class 451/28)
  • Patent number: 11407616
    Abstract: A belt of an elevator system includes one or more tension elements extending longitudinally along a length of the belt, and an elastomeric jacket at least partially enveloping the one or more tension elements. The jacket defines a traction side configured to be interactive with a traction sheave of the elevator system and a back side opposite the traction side. A protective tape is applied to the elastomeric jacket at the back side. A method of assembling an elevator system includes forming a belt, and installing the belt in a hoistway of the elevator system. One or more additional components of the elevator system are installed in the hoistway. A protective tape is removed from a jacket of the belt after installation of the one or more additional components is completed.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: August 9, 2022
    Assignee: OTIS ELEVATOR COMPANY
    Inventors: Hong Yang, Xiaoyuan Chang
  • Patent number: 11376706
    Abstract: The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: July 5, 2022
    Assignee: PBMC SA
    Inventors: Denis Munier, Doniphan Mollard
  • Patent number: 11376800
    Abstract: An imprint master template including a first fine pattern unit having an upper surface on which a fine pattern is formed, a second fine pattern unit disposed adjacent to the first fine pattern unit and having an upper surface on which a fine pattern is formed, and a supporting part configured to support the first fine pattern unit and the second fine pattern unit. A side surface of the first fine pattern unit faces a side surface of the second fine pattern unit. The side surface of the first fine pattern unit includes a first surface which is perpendicular to the upper surface and a second surface which is inclined at a predetermined angle with respect to the first surface. The side surface of the second fine pattern unit includes a first surface which is perpendicular to the upper surface and a second surface which is inclined at a predetermined angle with respect to the first surface.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: July 5, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kang Soo Han, Moonjung An, Gugrae Jo, Hyungbin Cho
  • Patent number: 11351654
    Abstract: An abrasive article is provided that has a backing having opposed first and second major surfaces, an abrasive layer disposed on the first major surface, and a plurality of protrusions extending outwardly from the second major surface. The protrusions comprise a polymer having a Shore A hardness ranging from 5 to 90. These articles provide an alternative sanding solution enabling abrasive articles lacking an attachment layer to be handled effectively and efficiently, providing for a technically superior abrasive sheet on the marketplace that does not use or require an attachment layer.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: June 7, 2022
    Assignee: 3M Innovative Properties Company
    Inventors: Paul D. Graham, Douglas A. Davis, Yugeun P. Yang, Thomas E. Pahl, James J. Kobe, Christopher J. Lee, Thomas B. Galush, John G. Petersen
  • Patent number: 11348798
    Abstract: A method of fabricating a semiconductor device can include providing an integrated circuit electrically coupled to a metallization pad on a semiconductor wafer, the integrated circuit and the metallization pad covered by a cap structure. A channel can be cut in a portion of the cap structure that covers the metallization pad using a cutting tool having a tip surface and a beveled side surface to expose an upper surface of the metallization pad in the channel extending in a first direction and a conductive material can be deposited in the channel to ohmically contact the upper surface of the metallization pad in the channel.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: May 31, 2022
    Assignee: Akoustis, Inc.
    Inventors: Robert C. Dry, Brook Hosse
  • Patent number: 11345107
    Abstract: A tread for bonding to a tire carcass to form a retreaded tire having a length, a width, a top side and a bottom side. The tread also includes a central portion and a pair of wing portions extending laterally from the central portions. The top sides of each wing portion include one or more discontinuities having a longitudinal component and configured to resist deflection when subjected to a force from the bottom side and to deflect downwardly when subjected to a force from the top side. In particular embodiments, the one or more discontinuities are arranged within each wing portion are arranged within a thickened portion of each wing portion.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: May 31, 2022
    Assignee: Compagnie Generale des Etablissements Michelin
    Inventors: Dimitri Tsihlas, E. Bruce Colby, Cesar E. Zarak, Michael Widmyer
  • Patent number: 11325171
    Abstract: Disclosed herein are an apparatus of manufacturing a panel for home appliance by performing uniform surface processing on the panel and a method of manufacturing a home appliance by performing uniform surface processing on a panel. The apparatus of manufacturing a panel for home appliance includes a contacting roller configured to perform surface-processing on a panel that is to be processed; a pressing roller configured to press the panel toward the contacting roller; and a supporting roller configured to support a center middle portion of the contacting roller.
    Type: Grant
    Filed: February 17, 2018
    Date of Patent: May 10, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Do Soo Sung, Young Deog Koh, Cheol Hee Cho, Jin O Kwak
  • Patent number: 11311978
    Abstract: A lapping apparatus includes a processing part and a fixing part. The processing part is provided for a target object to be seated and polishes a lower surface of the target object seated as it rotates. The fixing part is provided for pressing the seated target object against the processing part so that the lower surface of the target object is fixed in a state of being seated on the processing part. The fixing part rotates relative to the processing part along with the target object by shear force applied to the target object from the processing part so that the processing of the lower surface of the target object is made when the processing part rotates while the fixing part fixes the target object, and the location axes of the fixing part and the processing part do not match.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: April 26, 2022
    Assignee: XTR TECHNOLOGIES INC.
    Inventor: Robert Sunghyun Paik
  • Patent number: 11305397
    Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/?5° C., or even +/?0.5° C.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: April 19, 2022
    Assignee: Seagate Technology LLC
    Inventors: Andrew Habermas, Dat Quach, Jeff O'Konski, Yuhong Xiong, Ricky Anderson, Joshua Zierhut
  • Patent number: 11282731
    Abstract: A wafer cutting device comprises an etching unit, including a wafer holding device and a fluid guide shroud; a gas supply unit; and a chemical reaction liquid supply unit. The wafer holding device includes a carrier disk, which is configured to fix a wafer for cutting and provided with gas apertures, and a gas passage disposed below the carrier disk. The fluid guide shroud is a double-layer structure including an inner layer, an outer layer and a hollow interlayer, located above the wafer holding device and has adjustable spacing with the wafer holding device, and regulates a flow direction of a chemical reaction liquid and protective gases. The gas supply unit supplies a protective gas to the inner layer of the shroud and supplies a protective gas to the carrier disk through the gas apertures. The chemical reaction liquid supply unit supplies the chemical reaction liquid to the interlayer.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: March 22, 2022
    Assignee: JIANGSU LEUVEN INSTRUMENTS CO. LTD
    Inventor: Kaidong Xu
  • Patent number: 11274237
    Abstract: A method of making elongated abrasive particles includes five steps. Step 1) includes providing a mold having parallel linear grooves, partially interrupted at predetermined intervals by transverse obstructions. Step 2) includes filling the parallel linear grooves with a flowable abrasive particle precursor composition. Step 3) includes at least partially drying the flowable abrasive particle precursor composition to form an at least partially dried abrasive particle precursor composition. Step 4) includes separating that composition from the mold, thereby forming elongated precursor abrasive particles having a shape corresponding to portions of the parallel linear grooves disposed between the transverse obstructions. At least one of the first and second opposite ends of the elongated precursor abrasive particles comprises both a molded portion and a fractured portion. Step 5) converts the elongated precursor abrasive particles into elongated abrasive particles.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: March 15, 2022
    Assignee: 3M Innovative Properties Company
    Inventors: Dwight D. Erickson, Negus B. Adefris
  • Patent number: 11260496
    Abstract: A polishing method which can acquire an actual position of a film-thickness measurement point, and can therefore apply an optimum polishing pressure to a substrate such as a wafer is disclosed. The method includes: causing a substrate detection sensor to generate substrate detection signals in a preset cycle and causing a film-thickness sensor to generate a film-thickness signal at a predetermined measurement point during polishing of the substrate while the substrate detection sensor and the film-thickness sensor are moving across the surface of the substrate; calculating an angle of eccentricity of a center of the substrate relative to a center of the polishing head from the number of substrate detection signals; correcting a position of the predetermined measurement point based on the angle of eccentricity; and controlling polishing pressure at which the polishing head presses the substrate based on the film-thickness signal and the corrected position of the predetermined measurement point.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: March 1, 2022
    Assignee: EBARA CORPORATION
    Inventors: Keita Yagi, Yuki Watanabe, Toshimitsu Sasaki
  • Patent number: 11243136
    Abstract: A rotating body load measuring device (100) according to the present invention detects a force acting on a rotating body (30) that is formed in a columnar shape and rotates around a central axis (L60) of a shaft body (60) protruding from a center of an end face, in a state where a main load is applied to the rotating body (30) in a main load direction (P) that is one direction in a radial direction, and includes a load cell (70) having a measurement center (C70) and capable of measuring forces acting in at least three directions with the measurement center (C70) as a reference, in which the load cell (70) is disposed such that the measurement center (C70) and the central axis (L60) overlap when viewed in the main load direction (P), and is connected to the shaft body (60).
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: February 8, 2022
    Assignees: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD., BRIDGESTONE CORPORATION
    Inventors: Tatsuya Ueda, Jiro Agawa, Takumi Tsumura, Makoto Tachibana
  • Patent number: 11203093
    Abstract: An apparatus includes a frame, a separating plate connected to the frame, a sensor aimed at the separating plate, and a support surface connected to the frame. The separating plate and the support surface are coupled with the frame so as to allow for a relative movement between the separating plate and the support surface in a first direction. The separating plate and the support surface are arranged such that when a grinding disc rests against the support surface and when the separating plate and the grinding disc move towards each other, at least one first edge of the separating plate is pushed over grinding disc. The sensor is arranged such that when the separating plate is pushed over the grinding disc, the grinding disc is between the sensor and the separating plate.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: December 21, 2021
    Assignee: FERROBOTICS COMPLIANT ROBOT TECHNOLOGY GMBH
    Inventor: Ronald Naderer
  • Patent number: 11161144
    Abstract: A compounding system for use in finishing a vehicle having a vehicle body having painted surfaces. The compounding system employs a sprayer having a nozzle having a fluid opening that is substantially 3 millimeters in diameter and a reservoir in communication with the fluid opening. Compressed air carries compound paste from the reservoir to the fluid opening to atomize the compound paste into a compound spray that is used to cover all of the painted surfaces of the vehicle with a thin, uniform coating in a single step. The compound paste is removed by buffing all painted surfaces on the vehicle body to a shine in a single step.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: November 2, 2021
    Inventor: Francesco Alfonso Dinardi
  • Patent number: 11161313
    Abstract: A tread support device (10) for a retread process is provided that has a first support roller (12) that rotates about a first support roller axis. A second support roller (16) is present that rotates about a second support roller axis. A third support roller (20) is also included that rotates about a third support roller axis. The first support roller (10), the second support roller (12), and the third support roller (20) all support a tread (24). Also in the tread support device (10), the first support roller axis, the second support roller axis, and the third support roller axis are arranged with respect to one another so as to be located on a circumference of a circle (32).
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: November 2, 2021
    Assignee: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN
    Inventors: Chinglin Pan, Bruce Carney, Michael Chandler, Michael Widmyer
  • Patent number: 11149176
    Abstract: The invention relates to a method for producing an alumina based abrasive particle (1), comprising at least the following steps: forming a sol as a solution or dispersion of alumina particles, gelling the sol by adding gelling agents, forming shaped bodies from the gel using an additive procedure, drying and firing the shaped bodies while retaining the previously achieved geometry of the abrasive particles. Hereby, it is provided that an optically binding binder is added to the sol and/or the gel, the gel is applied additively layer by layer and the binder is set using electromagnetic radiation so as to form the shaped bodies. The produced abrasive particle may be formed, in particular, by six intersecting or overlapping triangular volume regions.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: October 19, 2021
    Assignee: VSM Vereinigte Schmirgel- und Maschinen-Fabriken AG
    Inventors: Achim Jaeger, Thorsten Abel
  • Patent number: 11020838
    Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: June 1, 2021
    Assignee: Seagate Technology LLC
    Inventors: Mihaela Ruxandra Baurceanu, Chea Phann, Kevin Lamber Mayer, Ricky Ray Anderson, Andrew David Habermas
  • Patent number: 10989061
    Abstract: A method of machining a tip profile of a blade for a turbomachine includes coupling the blade to a component of the turbomachine; supporting the component on a machining apparatus, the machining apparatus being configured to remove material from the blade according to a cutting path defined within a coordinate system of the machining apparatus, wherein the component is supported such that a datum axial end face of the component is aligned with a datum of the coordinate system of the machining apparatus; and machining the blade according to the cutting path. A system for machining a tip profile of a blade for a turbomachine accomplishes the method.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: April 27, 2021
    Assignee: SIEMENS ENERGY GLOBAL GMBH & CO. KG
    Inventors: Trevor Milne, Kieran Tatton
  • Patent number: 10840089
    Abstract: A protective-film forming method for a semiconductor substrate suppresses deterioration in the number of LPDs and adhesion of impurities such as particles by forming a new protective-film of a surfactant solution when the semiconductor substrate is detached from a polishing head. The method includes a first protective-film forming process for forming a protective-film by hydrophilizing the front surface of the polished substrate with a surfactant solution and, after the first protective-film forming process, a second protective-film forming process for forming protective-films on the front and back surface of the substrate by detaching the substrate from the polishing head in a state where at least the front surface of the polished semiconductor substrate is in contact with the liquid surface of the protective-film forming treatment liquid comprising a surfactant solution, then by immersing the polished substrate in a protective-film forming treatment liquid.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: November 17, 2020
    Assignee: GLOBALWAFERS JAPAN CO., LTD.
    Inventors: Shin Sakai, Hiroaki Kariyazaki, Tatsuhiko Aoki, Koji Araki
  • Patent number: 10816953
    Abstract: A method for machining a longitudinal profile section having an actual length and a first and a second end, wherein the first and the second end are machined using respectively a first and a second tool head and material is continuously abraded by the first and second rotating tool head during a machining period, the machining period is divided into time increments (?ti), a torque (M(ti,) M?(ti)) of the tool head is measured for each time increment (?ti) and an individual energy consumption (E(?ti), E?(?ti)) is determined for each time increment (?ti), said individual energy consumption corresponding to an individual quantity of material abraded during the time increment (?ti), and a total energy consumption (E(t), E?(t)) both of the first and of the second tool head is determined from the individual energy consumptions (E(?ti), E?(?ti)), said total energy consumption corresponding to the total quantity of abraded material.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: October 27, 2020
    Assignee: Rattunde AG
    Inventor: Ulrich Rattunde
  • Patent number: 10778770
    Abstract: In a network system, an own subsystem recognition unit is provided in each of subsystems, and holds a state and a function of the own subsystem. A shared information communication unit acquires states and functions of the subsystems. An objective acceptance unit accepts a setting of a target state. A shared storage unit stores knowledge regarding a combination structure of functions of the respective subsystems necessary for realizing the target state. A structure setting unit automatically sets a combination structure of functions of the respective subsystems, including determining whether the function of each of the subsystems is to be activated, based on the target state, states and functions of the subsystems, and the knowledge regarding a combination structure. A role determination unit determines functions to be executed by the respective subsystems based on the automatically set combination structure. A role notification unit notifies the subsystems of the determined respective functions.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: September 15, 2020
    Assignee: OMRON CORPORATION
    Inventors: Atsushi Hisano, Ryota Yamada, Tanichi Ando, Yusuke Yamaji, Tetsuji Yamato, Koji Takizawa
  • Patent number: 10766114
    Abstract: A system and method for grinding the exterior of a shaft part with rotationally symmetrical sections and bases which have centering bores and which define a reference longitudinal axis and rotational axis of the shaft part. The shaft part is held between tips which engage into the centering bores during the grinding process using a grinding disk, and the shaft part is additionally supported on the rotationally symmetrical sections by means of a support device. The current diameter values of the rotationally symmetrical sections are measured and transmitted to a controller, by means of which the support device is updated with respect to the measured diameter values while continuously supporting the rotationally symmetrical sections until target dimensions are achieved.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: September 8, 2020
    Assignee: ERWIN JUNKER GRINDING TECHNOLOGY A.S.
    Inventor: Erwin Junker
  • Patent number: 10759968
    Abstract: A polishing agent comprises: a fluid medium; an abrasive grain containing a hydroxide of a tetravalent metal element; a first additive; a second additive; and a third additive, wherein: the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer; the second additive is a cationic polymer; and the third additive is an amino group-containing sulfonic acid compound.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: September 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hisataka Minami, Tomohiro Iwano, Toshiaki Akutsu
  • Patent number: 10688515
    Abstract: A compounding system for use in finishing a vehicle having a vehicle body having painted surfaces. The compounding system employs a spray gun having a nozzle having a fluid opening that is substantially 3 millimeters in diameter and a reservoir in communication with the fluid opening. Compressed air selectively flows past the fluid opening to atomize the compound paste into a compound spray that is used to cover all of the painted surfaces of the vehicle with a thin, uniform coating in a single step. The compound paste is removed by buffing all painted surfaces on the vehicle body to a shine in a single step.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: June 23, 2020
    Inventor: Francesco Alfonso Dinardi
  • Patent number: 10633735
    Abstract: A method for a defined surface treatment of a first carbon coating applied to a surface of a component The first carbon coating is brought into touching contact with at least one second carbon coating that is formed on a surface of a tool or second component and the two carbon coatings are moved relatively with one another so that the first carbon coating is smoothed by the second carbon coating. The first carbon coating and/or the second carbon coating are formed from a-C (amorphous carbon) or ta-C (tetrahedrally bonded amorphous carbon).
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: April 28, 2020
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Volker Weihnacht, Andreas Leson
  • Patent number: 10556309
    Abstract: Methods involving adding a removable fixating material to a partially manufactured workpiece to stabilize a plurality of partially formed objects therein for subsequent manufacturing. In one example, valleys are formed in a workpiece between adjacent partially formed objects so that interconnecting portions remain to interconnect the partially formed objects. Then, the removable fixating material is installed in the valleys, and once the removable fixating material has hardened, the workpiece is further processed to at least remove the interconnecting portions. In some embodiments, a mold is used to install the removable fixating material into the workpiece. In some embodiments, a prefabricated temporary frame is used for installing the removable fixating material into the workpiece. In some embodiments, a temporary frame is formed from the workpiece along with the plurality of objects during manufacturing.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: February 11, 2020
    Assignee: PROTO LABS INC.
    Inventors: James L. Jacobs, II, Chris Stahl
  • Patent number: 10532444
    Abstract: An apparatus for replacing an abrasive sheet in a sanding machine comprising a working head in which it is provided a support body having an engagement surface arranged to engage with an abrasive sheet. The sanding machine also comprises a handling device arranged to actuate the support body in space according to at least two degrees of freedom. The face of the abrasive sheet facing, in use, towards the support body and the engagement surface of this comprises a mutual engagement means of removable type. For example, the mutual engagement means can provide a layer of Velcro, i.e. a velvet layer on a face and a plurality of hooks on the other face, or an adhesive layer, in particular of reversible glue layer, or a plurality of projections and recesses mutually engageable with each other, or similar engagement elements. Furthermore, is provided a removal station in which it is installed a removal device having a sharp edge arranged to remove the sheet from the support body through a plurality of operations.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: January 14, 2020
    Assignee: Fabrica Machinale S.R.L.
    Inventors: Luca Bosio, Renzo Valleggi
  • Patent number: 10414186
    Abstract: Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to attach the particles to the substrate.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: September 17, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Eric A. Vandre, Matthew S. Stay, Matthew R. D. Smith, Ann M. Gilman, Shawn C. Dodds, Jon E. Dable, Evan D. Brutinel
  • Patent number: 10414019
    Abstract: An object of the present invention is to provide a polishing composition enabling polishing of an object to be polished at higher speed. Provided is a polishing composition used for polishing an object to be polished in which the polishing composition contains surface-modified abrasive grains, in which an ionic dispersant is directly modified on the surface of the abrasive grains, and dispersing medium, and aggregation of the abrasive grains is suppressed in the dispersing medium.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: September 17, 2019
    Assignee: FUJIMI INCORPORATED
    Inventors: Takeki Sato, Yukinobu Yoshizaki, Shogo Onishi
  • Patent number: 10408550
    Abstract: There is provided a heat exchanger and a fin material for the heat exchanger that can suppress occurrence of hollow corrosion in a fin and hold cooling performance for a long period of time under a high corrosion environment. The heat exchanger includes an aluminum tube through which a working fluid circulates and an aluminum fin which is bonded to the tube. The fin has a region B around a grain boundary, and a region A around the region B. In the region B, 5.0×104 pieces/mm2 less of Al—Fe—Mn—Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 ?m, are present. In the region A, 5.0×104 pieces/mm2 to 1.0×107 pieces/mm2 of Al—Fe—Mn—Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 ?m, are present.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: September 10, 2019
    Assignee: UACJ Corporation
    Inventors: Takashi Murase, Kotaro Kitawaki, Tomohito Kurosaki, Junji Ninomiya
  • Patent number: 10328465
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: June 25, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito, Masako Kodera, Hiroshi Tomita, Takeshi Nishioka
  • Patent number: 10293466
    Abstract: Structured abrasive articles include a backing and shaped abrasive composites secured to the backing. The shaped abrasive composites include abrasive grits dispersed in a binder matrix. The shaped abrasive composites include a bottom surface and a top surface opposite and not contacting the bottom surface, and at least three sidewalls abutting both the bottom and top surfaces and two other sidewalls. In one embodiment, at least two cusps are formed by the top surface and individual sidewalls. In another embodiment, the top surface includes at least two triangular facets that contact at least two respective sidewalls and at least two cusps. The top surface includes at least one interior recessed portion nearer the cusps than the bottom surface. Methods of abrading a workpiece using the structured abrasive article are also disclosed.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: May 21, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: John D. Haas, Negus B. Adefris, Scott R. Culler
  • Patent number: 10293456
    Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing, for example, a semiconductor substrate, having one or more endpoint detection windows (windows) which at a thickness of 2 mm would have a UV cut-off at a wavelength of 325 nm or lower which are the product of a reaction mixture of (A) from 30 to 56 wt. % of one or more cycloaliphatic diisocyanates or polyisocyanates with (B) from 43 to 69.9999 a polyol mixture of (i) a polymeric diol having an average molecular weight of from 500 to 1,500, such as a polycarbonate diol for hard windows and a polyether polyol for soft windows and (ii) a triol having an average to molecular weight of from 120 to 320 in a weight ratio of (B)(i) polymeric diol to (B)(ii) triol ranging from 1.6:1 to 5.2:1, and a catalyst, preferably a secondary or tertiary amine or bismuth neodecanoate, all weight percent's based on the total solids weight of the reaction mixture.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: May 21, 2019
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Nan-Rong Chiou, Mohammad T. Islam, George C. Jacob, Teresa Brugarolas Brufau
  • Patent number: 10266702
    Abstract: A method of forming a self-cleaning coating on a substrate comprises the step of selecting a substrate, cleaning the substrate, and/or roughening the substrate using an abrasive. In an embodiment, roughening of the substrate create microscopic tortuous grooves. Another embodiment of the method comprises coating the roughened surface with at least one hydrophobic chemical agent. In an exemplary embodiment, the hydrophobic chemical agent covalently binds with the substrate creating nanoscopic grooves. Another embodiment of the present disclosure pertains to an apparatus for depositing a self-cleaning coating on a flat substrate. A further embodiment of the present disclosure pertains to a self-cleaning coating on a substrate comprising a hydrophobic chemical agent covalently bonded to at least one roughened surface of the substrate.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: April 23, 2019
    Assignee: UNIVERSITY OF HOUSTON SYSTEM
    Inventors: Seamus Curran, Kang-Shyang Liao, Killian Barton
  • Patent number: 10220487
    Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: March 5, 2019
    Assignee: Cabot Microelectronics Corporation
    Inventors: Pradip K. Roy, Manish Deopura, Sudhanshu Misra
  • Patent number: 10207388
    Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing, for example, a semiconductor substrate, having one or more endpoint detection windows (windows) which at a thickness of 2 mm would have a UV cut-off at a wavelength of 325 nm or lower which are the product of a reaction mixture of (A) from 30 to 56 wt. % of one or more cycloaliphatic diisocyanates or polyisocyanates with (B) from 43 to 69.9999 a polyol mixture of (i) a polymeric diol having an average molecular weight of from 500 to 1,500, such as a polycarbonate diol for hard windows and a polyether polyol for soft windows and (ii) a triol having an average molecular weight of from 120 to 320 in a weight ratio of (B)(i) polymeric diol to (B)(ii) triol ranging from 1.6:1 to 5.2:1, and a catalyst, preferably a secondary or tertiary amine, all weight percent's based on the total solids weight of the reaction mixture.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: February 19, 2019
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Nan-Rong Chiou, Mohammad T. Islam, George C. Jacob
  • Patent number: 10101314
    Abstract: When machining a workpiece by a machine tool by cutting, a cutting fluid is sprayed to a workpiece machining region. Above a surface of the cutting fluid in a cutting fluid tank, an odor sensor for detecting the odor emitted by the cutting fluid is disposed in the space defined the surface of the cutting fluid in the cutting fluid tank and a cover. Based on the odor detected by the odor sensor, deterioration of the cutting fluid is determined.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: October 16, 2018
    Assignee: FANUC CORPORATION
    Inventor: Takahiro Endou
  • Patent number: 10086500
    Abstract: A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: October 2, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Mahendra Christopher Orilall, Rajeev Bajaj, Fred C. Redeker
  • Patent number: 10076769
    Abstract: Methods and systems for providing cleaning and providing barrier coatings to interior wall surfaces of small diameter nonmetal and composite piping systems in buildings, swimming pools, underground pipes, in-slab piping systems, piping under driveways and various liquid transmission lines. An entire piping system can be cleaned in one single pass by dry particulates forced by air throughout the building piping system by an external generator, and the entire piping system can be coated in one single pass by a machine connected exterior to the piping system. Small pipes can be protected by the effects of water corrosion, erosion and electrolysis, extending the life of piping systems such as plastics, PVC (polyvinyl chloride), composite materials, polybutylene.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: September 18, 2018
    Assignee: Pipe Restoration Technologies, LLC
    Inventors: Larry L. Gillanders, Steven A. Williams, Gregory Ryan, John F. Trout
  • Patent number: 10056247
    Abstract: In accordance with the following step of a method of manufacturing a MOSFET, a first cutting step of cutting a silicon carbide wafer along a plane substantially parallel to a {11-20} plane is performed. After the first cutting step, a second cutting step of cutting the silicon carbide wafer along a plane substantially perpendicular to the {11-20} plane and substantially perpendicular to the first main surface is performed.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: August 21, 2018
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Mitsuhiko Sakai, Hiroyuki Kitabayashi
  • Patent number: 10000677
    Abstract: A method includes: providing a mold having a plurality of mold cavities, wherein each mold cavity is bounded by a plurality of faces joined along common edges; filling at least some of the mold cavities with a sol-gel composition that includes a release agent dispersed therein; at least partially drying the sol-gel composition thereby forming shaped ceramic precursor particles; calcining at least a portion of the shaped ceramic precursor particles to provide calcined shaped ceramic precursor particles; and sintering at least a portion of the calcined shaped ceramic precursor particles to provide ceramic shaped abrasive particles. A sol-gel composition, shaped ceramic precursor particles, and ceramic shaped abrasive particles associated with practice of the method are also disclosed.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: June 19, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: John T. Boden, Scott R. Culler, Dwight D. Erickson
  • Patent number: 9975213
    Abstract: A polishing apparatus connected to a robot arm and used to polish a workpiece includes a bracket, a polishing assembly, and a positioning assembly. The polishing assembly is mounted on the bracket and includes a driver and a polishing plate connected to the driver. The driver is capable of driving the polishing plate to rotate, and defines an annular positioning groove around the spin axis. The positioning assembly includes a first positioning plate and a second positioning plate mounted on the bracket and opposite to the first positioning plate. The first positioning plate and the second positioning plate are clamped into two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: May 22, 2018
    Assignees: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN), HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Tao Zhou
  • Patent number: 9924967
    Abstract: The invention relates to an abrasive body for a grinding tool with an abrasive layer, which has at least one binding agent and abrasive grains, characterized in that thermochromic coloring agents are provided in the abrasive layer. The grinding tool includes elements for connecting the grinding tool to a driving device for rotatingly driving the abrasive body. The grinding tool is used for treating human body parts.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: March 27, 2018
    Assignee: Lukas-Erzett Vereinigte Schleif-und Fraswerkzeugfabriken GmbH & Co. KG
    Inventors: Gerd Fischer, Bernhard Runden
  • Patent number: 9889470
    Abstract: Methods and systems for providing cleaning and providing barrier coatings to interior wall surfaces of small diameter nonmetal and composite piping systems in buildings, swimming pools, underground pipes, in-slab piping systems, piping under driveways and various liquid transmission lines. An entire piping system can be cleaned in one single pass by dry particulates forced by air throughout the building piping system by an external generator, and the entire piping system can be coated in one single pass by a machine connected exterior to the piping system. Small pipes can be protected by the effects of water corrosion, erosion and electrolysis, extending the life of piping systems such as plastics, PVC (polyvinyl chloride), composite materials, polybutylene.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: February 13, 2018
    Assignee: Pipe Restoration Technologies, LLC
    Inventors: Larry L. Gillanders, Steven A. Williams, Gregory Ryan, John F. Trout
  • Patent number: 9839991
    Abstract: Provided are multilayered abrasive articles that include an abrasive composite having shaped features, a carrier film, and a nonwoven web, where the nonwoven web and the carrier film have respective patterns of discrete, three-dimensional protrusions that are aligned with each other. A compressible foam backing extending across a major surface of the nonwoven web opposite the carrier film. Further provided are multilayered abrasive articles that include an abrasive composite, a carrier film, and a non-woven web. The nonwoven web and the carrier film have respective patterns of discrete, three-dimensional protrusions that are aligned with each other and the shaped features and the three-dimensional protrusions of the nonwoven web have an average diameter:average diameter ratio ranging from 1:50 to 1:5.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: December 12, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Kim E. Whittaker
  • Patent number: 9796063
    Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: October 24, 2017
    Assignee: FNS TECH CO., LTD.
    Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin
  • Patent number: 9771505
    Abstract: An abrasive grain includes a surface having at least a first face with a first outline, and at least one second face with a second outline. The first outline does not contain any vertices, but the second outline contains at least one vertex. The abrasive grain may include a ceramic material, especially polycrystalline ?-Al2O3.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: September 26, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Moritz Oldenkotte, Georg Hejtmann, Gert Lindemann, Stefan Fuenfschilling, Petra Stedile, Adrian Jenni, Tony Pleschinger
  • Patent number: 9676981
    Abstract: A method of forming a shaped abrasive particle including forming a precursor shaped abrasive particle having a body including at least one predetermined stress concentration point and at least one predetermined stress concentration vector and processing the precursor shaped abrasive particle and fracturing the precursor shaped abrasive particle substantially along the predetermined stress concentration vector to form a fractured shaped abrasive particle.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: June 13, 2017
    Assignee: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: David Louapre, James A. Salvatore, Alexandra Marazano
  • Patent number: 9669518
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: June 6, 2017
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Yung-Chang Hung