Abstract: A base assembly includes a first horizontal brace, a second horizontal brace, a first horizontal interconnection interconnecting front ends of the first and second horizontal braces, a second horizontal interconnection interconnecting rear ends of the first and second horizontal braces, and first, second, third and fourth vertical posts each releasably secured to the underside of the worktable and the rear ends of the first and second horizontal braces; a control switch secured to the front ends of the first and second horizontal braces, and the first interconnection; and a detachable worktable including first and second sliding rods, an opening, first and second bifurcations, a housing; a chute; first and second bossed holes, two opposite third bossed holes, two opposite fourth bossed holes, first and second C-shaped clamps, a transverse second threaded hole, and screws.

Abstract: The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported and which is supported on the frame (160) in such a way that the roller carrier can be moved in a first direction (x). The device (100) comprises at least a second roller (103), which is supported on the frame (160), and a belt (102), which is guided at least around the two rollers (101, 103) and because of the tension of which a resulting belt force (102) acts on the roller carrier (401). The device (100) also comprises an actuator (302), which is mechanically coupled to the frame (160) and the roller carrier (401) in such a way that an adjustable actuator force (FA) acts between the frame (160) and the first roller (101) in the first direction (x).

Abstract: A method for polishing a ball screw comprising a screw shaft defining a screw axis. The screw shaft is formed with a screw groove. The method comprises the steps of: rotating the screw shaft at a rotational speed about the screw axis; conveying a polishing tape having a polishing portion traveled around an outer peripheral surface of a pressing roller, the press roller being configured to rotate about a rotational axis; guiding the polishing tape such that the polishing portion is traveled around the outer peripheral surface; pressing the polishing portion against the screw groove; tilting the pressing roller such that the rotational axis is aligned with a lead angle; oscillating the pressing roller linearly along the rotational axis; moving the polishing tape at a moving speed in a direction parallel to the screw axis; and synchronizing the rotational speed with the moving speed based on a lead.

Abstract: An abrading device for abrading a floor structure comprises a first abrading assembly and a second abrading assembly. The first and second abrading assemblies each have a rotationally driven contact roll provided with a sleeve having a plurality of cutouts formed in a pattern thereon. An abrading belt is trained over the sleeve. A first oscillation assembly is connected to the first abrading assembly and oscillates the contact roll of the first abrading assembly in a first direction via a linear reciprocating motion. A second oscillation assembly is connected to the second abrading assembly and oscillates the contact roll of the second abrading assembly in a second direction via a linear reciprocating motion. The first and second abrading assemblies consecutively abrade a top surface of the floor structure with the pattern formed by the cutouts on the respective sleeves to form a distressed visible pattern thereon.

Abstract: The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one translational driving means configured to translate the grinding means (6) and at least one eccentric tappet configured to rotatingly move the grinding means (6). The inventive device is characterized in that the grinding aggregate comprises a suctioning device which suctions waste products of the processing, such as chips, through the grinding means. In this way, it is possible to achieve a qualitatively superior grinding result.

Abstract: The invention describes a control unit for a sanding machine, which winds and unwinds the abradant paper over a contact device. This control unit continuously detects the position of one or more of these sanding machines, the abradant unwinding, the movement of the transport system and the position of the workpiece. These parameters are used to regulate the sanding machine(s) in such a way that the workpieces are fed through and the sanding operation executed without interruption.

Abstract: A game ball surface treatment apparatus for abrading, cleaning or polishing game balls includes an outer housing having a base portion and a side wall portion, an inner housing arranged within the outer housing and having a bottom portion and a circumferential wall portion extending upwards from the bottom portion, a damper arranged to interconnect the outer housing and the inner housing, an electric motor fixed to the bottom portion of the inner housing and having an output shaft extending upwards, a rotary disc fixed to the output shaft of the electric motor to support the game balls and provided with an abrading fabric making contact with the game balls, an impeller arranged above the rotary disc to accommodate the game balls in a mutually isolated state, and a lining attached to the circumferential wall portion of the inner housing to make contact with the game balls.

Abstract: The present invention provides a reciprocating lifting motion of abrasive band grinding machine, wherein two control boxes are arranged correspondingly at lower part of the grinding mechanism of the grinding machine; the grinding mechanism is driven by the drive axle of the control box; a motor is coupled below the control box, and the control box is provided with a lifting mechanism, which is adapted with the cam via a main drive axle with worm gear; based on the eccentric rotation characteristic of the cam, the main drive axle could generate reciprocating lifting motion, driving the continuous operation of the grinding mechanism for uniform grinding of the abrasive band surface.

Abstract: An apparatus for grinding a threaded portion of a workpiece, is provided. The threaded portion has a spiral groove formed therein. The apparatus includes a motor, a grinding cord, a detector and a controller. The motor has a rotary portion for rotating the threaded portion of the workpiece about an axis. The grinding cord is configured for being looped around the threaded portion of the workpiece with a middle part thereof engagingly received in a given portion of turns of the spiral groove for grinding the thread portion of the workpiece. The detector is for detecting a rotating cycle of the rotary portion. The controller is communicatively coupled to the detector for controlling the rotary portion to selectively rotate in a first rotating direction or in a reverse second rotating direction based on the received signal from the detector.

Abstract: A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.

Abstract: A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.

Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

Abstract: In a wobbling device of a sand belt grinder of the invention, a set of electromagnetic movable members is disposed outside a sand belt shaft base, and micro switches are disposed under two sides of the sand belt shaft base so that the control of continuously powering on and off is generated and the electromagnetic movable members generate continuously attracting and releasing operations. In addition, the movable members drive the shaft base and a sand belt to generate reciprocated wobbling operations at specific angles. Thus, when the sand belt is grinding, the sand belt generates the leftward and rightward sliding movement in a larger area so that the excellent polishing effect and the economic effectiveness can be obtained.

Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

Abstract: The present invention provides a reciprocating lifting motion of abrasive band grinding machine, wherein two control boxes are arranged correspondingly at lower part of the grinding mechanism of the grinding machine; the grinding mechanism is driven by the drive axle of the control box; a motor is coupled below the control box, and the control box is provided with a lifting mechanism, which is adapted with the cam via a main drive axle with worm gear; based on the eccentric rotation characteristic of the cam, the main drive axle could generate reciprocating lifting motion, driving the continuous operation of the grinding mechanism for uniform grinding of the abrasive band surface.

Abstract: The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one translational driving means configured to translate the grinding means (6) and at least one eccentric tappet configured to rotatingly move the grinding means (6). The inventive device is characterized in that the grinding aggregate comprises a suctioning device which suctions waste products of the processing, such as chips, through the grinding means. In this way, it is possible to achieve a qualitatively superior grinding result.

Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: A slider body characterized by rounded corners and edges and smooth surfaces, formed by polishing with a polymeric fiber and a free abrasive slurry of submicron particles.

Abstract: The invention provides a wire saw in which wire tension fluctuations occurring in swinging of a row of wires can be accommodated to thereby increase a velocity of the wire and to carry out cutting with efficiency and precision by utilizing swinging of the row of wires even with thin wire. In the wire saw having the row of wires formed by winding the wire about a plurality of work rollers provided to a swinging disk many times, for pushing a workpiece against the row of wires caused to reciprocate or travel in one direction at high velocity to cut the workpiece into a plurality of pieces, and for swinging the row of wires in cutting of the workpiece, a feed side pulley for guiding feed side wire going into the work rollers to the work rollers and a retrieving side pulley for guiding retrieving side wire going out of the work rollers to an outside are disposed coaxially on an axial center of rotation of the swinging disk so that the tension fluctuations do not occur in the wire even if the row of wires swings.

Abstract: Disclosed is a grinding machine comprising oscillating driving means (3, 4) for setting grinding means (1) into an oscillating grinding motion and an actuation device (7) that is provided with a plurality of actuation areas (8) which can be triggered such that different zones of the grinding means (1) are alternately actuated independently of the oscillating grinding motion.

Abstract: A belt oscillating apparatus of a belt sander, wherein the belt sander includes a machine frame, a driving wheel, a driven wheel, a sand belt mounted on the driving wheel and the driven wheel, and the belt oscillating apparatus is mounted on the machine frame, comprising two oscillating devices, two transmission devices and a valve. The oscillating devices are pivoted on the machine frame and pivoting the driven wheel therebetween. The transmission devices connect the oscillating devices and the valve. A pneumatic power is provided to the valve to move the driven wheel via the transmissions and the oscillating device. The oscillating devices and the transmission device are working alternately by the sand belt touches the oscillating devices, such that the sand belt is reciprocated between the oscillating devices.

Abstract: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading article has been installed with an abrasive side facing the wrong direction. An alert allows an operator to reinstall the article. As another example, the abrading article may be sensed to determine whether splicing tape is present to hold two pieces of abrading tape together. The article may be advanced until the splicing tape is beyond an abrading zone. As another example, the abrading article may be sensed to determine whether the abrading article has stopped moving while the article drive is advancing because the article has broken. An alert allows an operator to repair the break.

Abstract: A belt sander includes a base, a sanding device, a worktable, a tipping drive device, and a swinging device. The swinging device includes a cylindrical roller, a central shaft, a toothed ring, a drive gear, a cam, and a fixing rod. The swinging device drives the sanding device to produce a slightly reciprocally swinging action during operation of the sanding device. Thus, the grinding path and area of the sand belt are increased largely by the reciprocally and successively swinging action of the swinging device and the sanding device, so that the sand belt can be used to grind the wooden material exactly and efficiently, thereby greatly enhancing the grinding and finishing effect of the belt sander.

Abstract: A wire saw and wafer stabilizing system are provided for holding wafer sections invariantly against vibration and unwanted movement during the sawing process. A stabilizing means is applied to the ends of partially defined wafer sections at an early stage when the wafer sections are partially cut through a silicon ingot or block of silicon material. The stabilizing means serves to stabilize the wafer sections immovably against vibration, oscillation, or unwanted contact during the subsequent sawing process. The stabilizing system also accelerates handling of the wafers after slicing is completed, facilitates the cleaning process, and allows for more rapid or automated placement of the wafers in cassettes. Wafers produced by the stabilizing system are characterized by a minimized total thickness variation, substantially uniform planarity, and substantially without bow or warp.

Abstract: Apparatus and methods are disclosed that promote greater polishing uniformity in linear CMP systems by introducing a relative lateral motion between a CMP belt and a rotating polish head securing a wafer. A belt polish module comprises a linear CMP belt forming a loop around an idle roller and a drive roller, first and second pistons engaging, respectively, first and second ends of the idle roller, and a controller configured to vary the forces applied by the first and second pistons to the ends of the idle roller in order to laterally translate the linear CMP belt. A method for linear CMP comprises rotating a wafer about a vertical axis, contacting the rotating wafer against a linear CMP belt moving in a longitudinal direction, and causing a relative lateral motion between the rotating wafer and the linear CMP belt.

Abstract: A grinding-band swaying device for a band grinding machine includes a motor pivotally connected with a machine base and driving an endless grinding band around two rollers and forming a fulcrum for swaying, a speed-reducing unit and an eccentric wheel. The speed-reducing unit is positioned under the motor, having a shaft connected with the eccentric wheel. An elastic compressing unit is provided between the speed-reducing unit or the motor and the machine base, and then the eccentric wheel is kept to elastically urge the machine base. When the motor together with the speed-reducing unit rotates the eccentric wheel, the speed-reducing unit, the motor and the roller sway regularly with the fulcrum and then the endless grinding band moves forward and also sways regularly synchronously to perform grinding against a work with grinding angles constantly altered to achieve balanced grinding result.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: A sand-belt finishing machine having a reciprocal movement mechanism includes a main body, a swingable support rack, a finishing device, and an eccentric device. Thus, the eccentric unit of the eccentric device produces a driving force to pull and push the first roller of the finishing device, so that the first roller is oscillated successively and produces a vibration or shock force on the sand belt of the finishing device, so as to remove and clear the powder chips attached on the surface of the sand belt.

Abstract: A sand-belt finishing machine having a reciprocal movement mechanism includes a main body, a swingable support rack, a finishing device, and an eccentric device. Thus, the eccentric unit of the eccentric device produces a driving force to pull and push the first roller of the finishing device, so that the first roller is oscillated successively and produces a vibration or shock force on the sand belt of the finishing device, so as to remove and clear the powder chips attached on the surface of the sand belt.

Abstract: Flute grinding cemented carbide workpieces with a diamond containing resin bond grinding wheel is improved by restricting the diamond to comprise a silver-coated diamond; conducting the grinding in the presence of a lubricant consisting of only straight oil; and conducting the grinding at a wheel speed of less than about 30 m/s and preferably about 20 m/s. The preferred diamond is coated with about 25% and 75% silver by weight.

Abstract: A tool support device for use in a belt grinding apparatus (1), the apparatus including, a drive motor (60), a drive shaft (61) and an abrasive belt arranged to be driven by the drive motor, (60) the tool support device (10) including a primary carriage (20) including a plurality of mounting zones (22, 23, 24) thereon, each mounting zone being adapted to receive a primary working tool assembly, (40, 41, 42), one or more of the primary tool assemblies including a secondary carriage (46) operatively mounted to the primary carriage (20) at one or respective one of the mounting zones (22, 23, 24) the primary carriage (20) being mounted for rotary movement so that it can adopt a plurality of working positions, wherein in each working position one of the primary working tools can be selectively disposed at a work station in an operative position, the secondary carriage (46) having a plurality of additional working tools thereon, the secondary carriage (46) being adapted for rotary movement relative to the primary c

Abstract: A polishing bar is provided with a plurality of backings that are carried via blocks of impact absorbent material on a bar of greater stiffness. Each backing is shaped with two surfaces at an angle to each other. A polishing tape is disposed over the angled surfaces of each backing. The portion of the polishing tape over the forward surface of the backing is employed to polish the angled edge of the top wafer of a rotating bonded wafer pair.

Abstract: Embodiments of the invention provide methods and apparatuses to process optical subsystems. In one aspect, the optical subsystems are polished using an orbital polishing apparatus adapted to polish and clean an optical subsystem interconnect surface. The orbital polishing apparatus is adapted to incrementally advance a movable web of polishing material to provide polishing uniformity and consistent polishing performance device to device.

Abstract: A lens (L) with an aspheric surface (10) is held by a vacuum lens holder (12). A lap wall (42) is moved towards the lens surface (10) while in a plastic state. A polishing fabric (PF) is positioned between the lens surface (10) and the lap wall (42) before they are moved together. Fluid pressure in a chamber (44) behind the lap wall (42) is used to move the lap wall (42) and the polishing fabric (PF) against the lens surface (10). This causes the lap wall (42) to take a shape corresponding to the shape of the lens surface (10). Then, the lap wall material (42) is caused or allowed to become a solid. When the lap wall (42) is solid, the polishing fabric (PF) is caused to move relative to the lens (L) and the lap (32). The lap wall (42) holds the polishing fabric (PF) against the lens surface (10) while the polishing fabric (PF) moves across the lens surface (10) and polishes it.

Abstract: A rollers' position moving device for a sand belt machine includes a conveyor in the machine, a sand belt, and plural rollers moving the sand belt. The rollers are deposited across on the conveyor. Further, a first wheel and a second wheel are pivotally connected with one side of each roller, and the first and the second wheel have different diameters so as to rotate with different speeds. The rotating speed disparity of the two wheels can make the two wheels move laterally right and left within a preset distance because of an inner projection surface of the two wheels. Then the rollers are rotated and moved laterally right and left by one of the wheels so that sand grinding of the rollers rotating and moving laterally right and left at the same time can grind a work being ground smooth and glossy.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: A driven roller is mounted with an eccentric-swinging device which has the function of swinging, and the eccentric-swinging device comprises a floating frame, a transmission structure, and a flat plate mounted onto the machine body of the device, and the center section of the floating frame is mounted with a shaft seat, and the bottom surface within a support frame is mounted with corresponding bearings such that the shaft seat holds the bearings formed into a rotating support for the floating frame, and in between the floating frame and the flat plate, a spring which can be pulled downward is mounted, and the transmission structure is attached to the floating frame, corresponding to one lateral side of the flat plate, the transmission structure is synchronously driven by the shaft rod of the driven roller, and the flat plate is mounted with a rotatable shaft center, wherein a free end of the shaft center forms into an eccentric post, and a bearing urging the top face of the flat plate is mounted onto the ecc

Abstract: A sander includes a roller rotatably secured to a support, a bracket rotatably supported on the support at a pivot pin, another roller rotatably secured to the bracket, a sander belt engaged around the rollers. One of the rollers is rotated about the support for twisting the sander belt and for removing some of the dust from the sander belt. An actuator includes a rod engaged with the bracket for rotating the bracket about the support. A valve is coupled to the actuator for selectively supplying the air to the actuator via a rotatable spindle and a lever.

Abstract: A sanding machine for sanding the surfaces of work pieces placed upon a conveyor that transports the work pieces along a first direction towards and beneath a sanding head. The sanding head comprises a sanding belt entrained around an upper tension roller and a lower contact roller. The tension roller and contact roller are provided with a single translational orbital movement by a pair of eccentric shafts operatively connected thereto and rotatably driven by an operatively connected motor. At least one of the upper tension roller and lower contact roller is also driven by an operatively connected motor so as to provide the endless rotation of the sanding belt around the upper tension roller and lower contact roller. In this fashion, the sanding belt is provided with two contemporaneous superimposed movements consisting of rotational movement about the tension roller and contact roller and a single orbital translational movement imparted by the rotating pair of eccentric shafts.

Abstract: A chemical-mechanical polishing apparatus (100, 200) comprising a polishing pad assembly. The polishing pad assembly (300) comprises a removable cap (318) to be rotatably coupled to a drive device of a chemical mechanical polishing apparatus and a polishing pad comprising a fixed abrasive disposed on the removable cap. The removable cap (318) and the polishing pad being a detached unit to be attached to or removed from the drive device.

Abstract: A production type surface finishing apparatus for finishing the surfaces of work-pieces such as cabinet doors and the like which include a plurality of relatively large, very lightweight finishing platens that are simultaneously movable in both a reciprocal and an orbital-like motion. The platen is moved in a reciprocal motion by a first motion-imparting mechanism and is simultaneously moved in a high-frequency, orbit-like motion by a second motion-imparting mechanism that includes shafts which are rotated at relatively high rates of speed. The shafts, and the motors which drive them, are mounted on platforms which are reciprocally movable relative to the main frame of the device. Connected to the rotating shafts by specially designed elastomeric sleeve-like members are specially configured, ring-like member which are provided with a plurality of circumferentially spaced apertures along one edge of the ring. The rings are, in turn, connected to the platen assemblies by novel shaft and bearing assemblies.

Abstract: Magnetic recording media are provided having separately textured data and read/write head landing zones. Separating these zones on the recording surface allows independent optimization of the topology to maximize both recording characteristics and mechanical durability. The landing or contact start stop zone has an average surface roughness greater than that of the data zone. Preferably, a transition zone extends between the contact start stop zone and the data zone, the transition zone varying between the two in average surface roughness. Preferably, the contact start stop zone is textured first, followed by the data zone, thereby ensuring uniform stiction performance. Texture machines for producing such zone texturing and texturing methods are also provided.

Abstract: A sanding apparatus is disclosed which includes a motor and mechanical drive system for imparting rotational and oscillator motion to an output shaft thereof. The motor shaft extends upwardly through a worktable. In one embodiment, the sanding apparatus is convertible between two or more modes of operation. In a spindle sanding mode, a sanding spindle is coupled to the motor output shaft, such that the spindle rotates and oscillates with respect to the worktable. In a belt sanding mode of operation, a belt sanding belt/pulley assembly is attached to the motor shaft. The belt/pulley assembly includes a drive drum and a driven drum about which a sanding belt is entwined. When operated in belt sanding mode, the entire belt/pulley assembly, including the drive drum and the driven drum oscillate up and down with respect to the worktable. In an edge sanding mode of operation, the worktable is articulated so that at least a portion thereof is angularly adjustable with respect to the belt/pulley system.

Abstract: A sanding machine for sanding the surfaces of work pieces placed upon a conveyor that transports the work pieces along a first direction towards and beneath a sanding head. The sanding head comprises a sanding belt entrained around an upper tension roller and a lower contact roller. The tension roller and contact roller are provided with a single translational orbital movement by a pair of eccentric shafts operatively connected thereto and rotatably driven by an operatively connected motor. At least one of the upper tension roller and lower contact roller is also driven by an operatively connected motor so as to provide the endless rotation of the sanding belt around the upper tension roller and lower contact roller. In this fashion, the sanding belt is provided with two contemporaneous superimposed movements consisting of rotational movement about the tension roller and contact roller and a single orbital translational movement imparted by the rotating pair of eccentric shafts.

Abstract: A machine for polishing railway vehicle wheel axles comprising a U-shaped basic structure with a cradle form, on the vertical double walls of which are arranged a pair of support rollers for the respective wheels of a railway axle. A driving assembly having a pair of support arms for abrasive belts is disposed on the intermediate horizontal wall of said cradle and said arms being selective and intermittently displaced from one side to the other between the gap defined by the vertical double walls and selective and vertically displaced upwards between the intermediate horizontal wall of the cradle. The axle to be milled is kept on a horizontal plan in view of the action of the wheels.

Abstract: A device for finishing cylindrical workpieces is described, having an arrangement for rotating the workpiece, two retaining arms, each having a support and a pressure cheek received in it, wherein at least one pressure cheek is floatingly seated on the associated support, and the pressure cheeks at least partially envelop the workpiece, a grinding belt, and belt guidance means guiding the grinding belt in such a way that it at least partially envelops the workpiece and is pressed against the workpiece by the pressure cheeks, as well as an arrangement which puts the retaining arms into a back-and-forth movement parallel with the axis of rotation (A) of the workpiece. Here, either the support or the pressure cheek have a lining of a plastic material, which slightly extends in a T-shape past the lateral walls of the quick-change adapter, and which can at least slightly be compressed elastically.

Abstract: An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire saw in which either the workpiece (or ingot) is rotated, either continuously or reciprocally, about its longitudinal axis or the diamond wire saw is rotated, either reciprocally or continuously, about the longitudinal axis of the workpiece as the diamond wire is driven orthogonally to the longitudinal axis of the workpiece. When the relative rotation is continuous, the wire is advanced from a position tangentially adjoining the outer diameter ("OD") of the ingot to a position tangential to its center or inner diameter ("ID"). When the rotation is reciprocating, the wire is advanced from a position tangentially adjoining the outer diameter to a position through the workpiece.

Abstract: A tungsten carbide surface is finished to an RMS surface roughness of about 25 nm (1.0 microinch) or less by abrasion using diamond grit particles. The tungsten carbide surface is abraded by a sequence of grit particle-containing abrasive members, such as abrasive films, pastes, or slurries, at least one of the members having an average grit particle diameter of about 2 .mu.m or less. The finish is enhanced by oscillating the abrasive member back and forth over the tungsten carbide surface. A different speed is used for at least two consecutive films in the series, thereby generating scratches at different angles which can be distinguished. A superfinish, corresponding to a lack of visible scratches at 100X magnification, can be obtained by abrading the tungsten carbide surface with a diamond slurry or paste having grit particles with an average diameter of about 1 .mu.m or less.

Abstract: An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire saw in which either the workpiece (or ingot) is rotated about its longitudinal axis or the diamond wire saw is rotated about the longitudinal axis of the workpiece as the diamond wire is driven orthogonally to the longitudinal axis of the workpiece and advanced from a position tangentially adjoining the outer diameter ("OD") of the ingot to a position tangential to its center or inner diameter ("ID"). In this manner, the diamond wire cuts through the workpiece at a substantially tangential point to the circumference of the cut instead of straight through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal `kerf" loss and less extensive follow-on lapping operations.