Abstract: A system for machining a bevel on a disk shaped part including a grinding device having an abrasive, a device for securing the part including a support to which the part is fitted and which is integral with an axis of rotation. The securing device further includes a system for orienting the axis of rotation to define the angle of the bevel and a system for moving the support closer to the abrasive in order to machining the part under stress. The invention concerns the field of crystals for timepieces.

Abstract: A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two adjacent grooves is P. An oscillatory movement distance of a workpiece on the polishing pad is set. The oscillatory movement distance enables any particular point on the workpiece to cross the same number of grooves, when a direction between the particular point and the center of the workpiece is perpendicular to a tangential direction of the grooves. The workpiece is then polished with the oscillatory movement distance, so as to achieve a better polishing uniformity for the surface of the workpiece.

Abstract: A device for the finish machining of circumferential surfaces of substantially rotationally symmetrical workpiece portions on workpieces, such as crankshafts and camshafts, which have a workpiece axis and several workpiece portions arranged in offset manner along the workpiece axis, has a plurality of finishing units, each of the finishing units having at least one finishing arm with a pressing device for pressing cutting media onto the circumferential surface of a workpiece portion and a finishing unit is associated with each workpiece portion to be machined in a machining phase. The finishing units are subdivided into a first group of first finishing units and a second group of second finishing units, axially directly adjacent finishing units being alternately associated with the first group and the second group and the first group of first finishing units is angularly displaced with respect to the workpiece axis relative to the second group of second finishing units.

Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading article has been installed with an abrasive side facing the wrong direction. An alert allows an operator to reinstall the article. As another example, the abrading article may be sensed to determine whether splicing tape is present to hold two pieces of abrading tape together. The article may be advanced until the splicing tape is beyond an abrading zone. As another example, the abrading article may be sensed to determine whether the abrading article has stopped moving while the article drive is advancing because the article has broken. An alert allows an operator to repair the break.

Abstract: An apparatus for use in a chemical mechanical planarization (CMP) system is provided. The apparatus includes a platen capable of introducing fluid beneath a polishing pad and a platen support cover configured to surround the platen. The platen is disposed at a first level and the platen support cover is disposed at a second level, the first level being lower relative to the second level. Both the platen and the platen support cover are configured to be disposed below the polishing pad such that the polishing pad is closer to the second level than the first level. The platen support cover has a width at the second level that is substantially equal around the platen. An apparatus and method for controlling pressure beneath a polishing pad is also provided.

Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.

Abstract: Apparatus is provided for superpolishing the inside diameter surface of a seam of a flexible continuous photoreceptor belt.

Abstract: An invention improves edge performance in chemical mechanical polishing processes. A method operation provides a wafer head above a wafer. The wafer head includes a first active retaining ring capable of extension and retraction. Another operation provides a polishing belt below the wafer head, and provides below the polishing belt a platen having a second active retaining ring capable of extension and retraction. Another operation controls positions of the first active retaining ring and the second active retaining ring to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.

Abstract: An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.

Abstract: A single-sided finishing apparatus is provided having a plurality of finishing stations with rotating transfer stations positioned therebetween. A hold down system presents the edge of the workpiece to the finishing head. The rotating transfer station includes a clamp for grasping a leading corner of a workpiece while rollers continue to drive the workpiece forward, thereby rotating the workpiece 90°.

Abstract: A chemical mechanical polishing apparatus has a substrate holder, a polishing belt, and a backing member positioned on a side of the polishing belt opposite the substrate holder. The polishing belt has a polishing surface to contact at least a portion of the substrate held by the substrate holder. The polishing belt is movable in a first direction in a generally linear path relative to the substrate. The polishing belt has a plurality of grooves formed therein.

Abstract: An invention is disclosed for improving edge performance in a chemical mechanical polishing process is disclosed. The system includes a wafer head disposed above a wafer, where the wafer head includes a first active retaining ring capable of extension and retraction. Below the wafer head is a polishing belt, and disposed below the polishing belt is a platen having a second active retaining ring capable of extension and retraction. During operation the first active retaining ring and the second active retaining ring can be controlled to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.

Abstract: An apparatus is provided for polishing balls that comprises a cradle that is supported for rotation about a first axis. The cradle is shaped to support a spherical object and includes a ball spinner positioned and adapted to spin the spherical object in the cradle about a second axis that is oriented at an angle to the first axis. The apparatus also comprises a first drive operably connected to the cradle for rotating the cradle about the first axis at a first speed of rotation, and a second drive connected to the ball spinner to spin the spherical object about the second axis at a second speed of rotation.

Abstract: A polishing bar is provided with a plurality of backings that are carried via blocks of impact absorbent material on a bar of greater stiffness. Each backing is shaped with two surfaces at an angle to each other. A polishing tape is disposed over the angled surfaces of each backing. The portion of the polishing tape over the forward surface of the backing is employed to polish the angled edge of the top wafer of a rotating bonded wafer pair.

Abstract: A method and apparatus for slurry distribution is provided. The apparatus for the distribution of slurry over a polishing pad surface used in chemical mechanical polishing includes a roller positioned over a polishing pad surface. The roller is connected with a gimbaling attachment to a positioning arm and is configured to apply a force against the polishing pad surface while maintaining a surface of the roller substantially parallel to the polishing pad surface. The gimbaled roller drives the slurry into and over the porous texture of the polishing pad surface and ensures a substantially even distribution of slurry. In another example, a double roller apparatus is also provided and is configured to combine slurry distribution and pad conditioning.

Abstract: A polishing media magazine for improved polishing. The polishing media magazine may include a conditioning element for rapid, uniform conditioning and cleaning of the polishing media. The polishing media magazine may include polishing media having sections of raised elevation to contain the fluid and may include a polishing support platen having features adapted to urge the edges of the polishing media upwards. The polishing media may be roll fed from a supply roll across a support platen and onto a take-up roll.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: An orbiting head is rotatably mounted in the housing. The orbiting head has an axial end with a grinding surface for contact with the workpiece having its surface finished. The orbiting head defines a fluid passage with one end having an opening at the grinding surface. A spindle arbor is connected to the orbiting head and rotates with the orbiting head. The spindle arbor also defines a passage having one end connected to the passage of the orbiting head, and having another end connected to a fluid source. A drive is connected to the spindle arbor for driving the spindle arbor and the orbiting head in rotation. The orbiting head is rotated, and the grinding surface is placed into contact with the surface of the workpiece, and in relative rotation to the surface of the workpiece. Fluid is then moved through the passages from the fluid source to the opening in the grinding surface, and from the opening to an area between the grinding surface and the workpiece.

Abstract: A surface polishing method comprises allowing a holder to hold a flat sheet-like workpiece, placing a pad tape in a location opposite to the holder, the pad tape consisting of a tape substrate and grains bonded to the substrate surface, supplying free grains between the holder and the pad tape, and rotating the holder and/or a mechanism holding the tape, thereby causing the free grains to polish the workpiece. An apparatus for practicing the method comprises a holder capable of holding a flat sheet-like workpiece, a tape holding mechanism located opposite to the surface of the workpiece and carrying a pad tape which consists of a tape substrate and grains bonded to the substrate, a rotary mechanism for rotating the holder and/or the tape holding mechanism, and an abrasive supplying mechanism for supplying free grains between the surface of the workpiece and the pad tape.

Abstract: A conveying assembly in a conditioning sub-assembly for conveying a conditioning surface to a polishing pad during conditioning is described. The conveying assembly includes an arm and a guiding component connected to the arm and adapted to guide the conditioning surface about the conveying assembly, thereby allowing another area of the conditioning surface to advance and become available for conditioning.

Abstract: A lapping apparatus for improving the durability of a lap film and the reliability of a lapping apparatus. A shoe having a recessed workpiece retaining section is installed on each of the opposed faces of a pair of clamp arms. A deep groove is formed in the center of the workpiece retaining section. Guide plates are fixed to the shoe so as to block both sides of the deep groove. A drawing roller is disposed in the deep groove and the rotation shaft of the drawing roller is supported by the guide plates. A lap film is introduced to the workpiece retaining sections of the shoes, drawn into the deep grooves in the center of the workpiece retaining sections, and hung around the drawing rollers. Even when the lap film is being fed, the lap film feeding path remains unchanged. Thus, there is no need to clamp the workpiece with a high pressure to bring the lap film into close contact with the face of the workpiece to be processed.

Abstract: A method and apparatus is disclosed for texturizing magnetic storage disks. The disk texturizing apparatus utilizes a combination of servomotors for rotating the disk and oscillating the disk towards and away from a texturizing media. The servomotors are controlled by a closed-loop control system which monitors and synchronizes the angular and linear position of the disk. Through such control, the disk rotation speed may be modulated in conjunction with the linear oscillation, thereby allowing a higher degree of triangularity in the texturization pattern. A pattern generation system and a graphical user interface for specifying, modeling, generating, modifying and displaying disk texturizing patterns are also disclosed. The texturizing pattern may be displayed in polar plot and linear plot form so that the user can more easily visualize and design the texturizing pattern.

Abstract: An apparatus for applying a cutting edge on surgical needles having at least one abrading device and a needle holding mechanism. The abrading device includes an abrasive member such as a rotatable abrasive belt or grinding wheel. The needle holding mechanism is positioned for selectively engaging an end of at least one needle with the abrading device to provide a cutting edge on the needle.

Abstract: A grinding apparatus for grinding a stamper for forming a signal recording part, of an information signal recording disc is disclosed. The grinding apparatus includes a turntable holding and rotationally driving the stamper and an abrasive head for bringing a mounting surface of the stamper opposite to its surface carrying projections and recesses for molding the signal recording part of the information signal recording disc into sliding contact with an abrasive member. The rotational velocity of the turntable is controlled depending on the position of the abrasive head with respect to the stamper for rendering the relative speed of sliding contact between the stamper and the abrasive member constant for uniform grinding of the mounting surface of the stamper uniformly across its inner and outer peripheries.