Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: An apparatus for machining a planar metal workpiece, having at least one machining unit, with which a machining belt, which is driven in circulation, can be guided in an at least approximately linear manner past the region of the workpiece to be machined in an oblique or transverse manner with respect to a feed direction of the workpiece. A movable carrier element having pressure means acts on a rear side of the machining belt in order to influence contact, necessary for machining, between the working side of the machining belt and the workpiece. A drive arrangement, by way of which the carrier element can be motor-driven, is provided such that the carrier element moves substantially parallel to the direction of movement of the machining belt, at least in the working region of the machining belt.

Abstract: An apparatus for machining a strip- or plate-shaped metallic workpiece is proposed, in particular for the deburring of cut edges and/or for the grinding of surfaces of the workpiece, having at least one machining unit which has a revolving drive device which directs a machining element at least approximately linearly past the region of the workpiece to be machined obliquely or transversely to the feed direction of the workpiece. According to the invention, the machining element is designed as a grinding belt, the grinding belt, in the region of the workpiece to be machined, being in operative connection with the drive device in such a way that the drive device drives the grinding belt, and the grinding belt and the drive device are separate from one another at least in a region remote from the workpiece.

Abstract: A belt grinder includes a motor, a driving disc, a contact disc, a grinding belt, and a housing, where the motor and the driving disc are moveable with respect to the contact disc in order to vary the distance between the axis of the contact disc and the axis of the driving disc. An attachment is secured to the belt grinder that includes a contact roll around which the grinding belt is fitted. The center to center distance between the contact roll of the attachment and the contact disc of the belt grinder is maintained as contact rolls of different diameter are used. The motor and driving disc are moveable with respect to the contact disc to vary an angle between the axis of the contact disc and an axis of the driving disc.

Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.

Abstract: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading article has been installed with an abrasive side facing the wrong direction. An alert allows an operator to reinstall the article. As another example, the abrading article may be sensed to determine whether splicing tape is present to hold two pieces of abrading tape together. The article may be advanced until the splicing tape is beyond an abrading zone. As another example, the abrading article may be sensed to determine whether the abrading article has stopped moving while the article drive is advancing because the article has broken. An alert allows an operator to repair the break.

Abstract: A stacked three head finishing apparatus is provided. The apparatus includes a base mountable to a floor, a first head mounted to the base, a second head mounted to the base above the first head, and a third head mounted to the base above the second head. Each of the first, second, and third heads includes a rotatable wheel. A motor imparts rotation to the wheel which may then be used for finishing operations. The height of each head above the floor and the position relative to one another is pre-selected to ensure that all of the heads are within reach of a robot arm and to ensure that nothing will interfere with the movement of the robot arm.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: A method and apparatus for planarizing a microelectronic substrate. The apparatus can include a planarizing medium having a relatively hard polishing pad and a planarizing liquid disposed on a generally non-porous planarizing surface of the polishing pad. The planarizing liquid can include a colloidal suspension of colloidal particles having generally smooth external surfaces. The colloidal particles can have a variety of shapes, including a spherical shape, a cylindrical shape, a cubic shape, and a hexagonal shape, among others. The colloidal particles can be formed from a variety of materials, including silicon dioxide, manganese oxide, and cerium oxide.

Abstract: The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.

Abstract: A lens (L) with an aspheric surface (10) is held by a vacuum lens holder (12). A lap wall (42) is moved towards the lens surface (10) while in a plastic state. A polishing fabric (PF) is positioned between the lens surface (10) and the lap wall (42) before they are moved together. Fluid pressure in a chamber (44) behind the lap wall (42) is used to move the lap wall (42) and the polishing fabric (PF) against the lens surface (10). This causes the lap wall (42) to take a shape corresponding to the shape of the lens surface (10). Then, the lap wall material (42) is caused or allowed to become a solid. When the lap wall (42) is solid, the polishing fabric (PF) is caused to move relative to the lens (L) and the lap (32). The lap wall (42) holds the polishing fabric (PF) against the lens surface (10) while the polishing fabric (PF) moves across the lens surface (10) and polishes it.

Abstract: A power belt sander (10) with a housing (11), which contains means for driving a sanding belt (24) which can be continuously guided by means of a drive roller (23), preferably also by means of a deflection roller (22), is less costly, lighter in weight, and more efficient due to the fact that the sanding belt (24) is supported by a toothed sanding belt (21), wherein the toothed sanding belt (21) is oriented with its toothed side (25) toward the drive roller (23), preferably the guide roller (22).

Abstract: A patterned polishing pad adapted for use in a wafer polishing machine. The patterned polishing pad has a polishing surface adapted to contact frictionally a semiconductor wafer being polished in a chemical mechanical polishing machine. The polishing surface has a first region and a second region. The first region is adapted to contact frictionally the wafer and achieve a first process effect. The second region is adapted to contact frictionally the wafer and achieve a second process effect. The surface of the second region extends a predetermined protrusion amount above the polishing surface with respect to the surface of the first region.

Abstract: A chemical mechanical polishing apparatus has a platen, a polishing sheet extending between a first roller and a second roller, and a support sheet extending between a third roller and a fourth roller. A portion of the polishing sheet extends over a surface of the platen to polish a substrate, and a portion of the support sheet extends between the platen and the polishing sheet. The polishing sheet may be a continuous belt or a reel-to-reel tape, and the support sheet may be a continuous belt or reel-to-reel tape.

Abstract: In a band grinding machine, especially well adapted for grinding wooden frames having transverse and longitudinal wooden pieces, a support table in the form of an endless belt transports the frames in an advancement direction, a transverse grinding assembly with a transversely moving grinding band extending over the width of the support table grinds the entire tops of frames, and two longitudinal grinding assemblies, located behind the transverse grinding assembly in the advancement direction, respectively grind the two longitudinal wooden pieces of each frame, with each longitudinal grinding assembly having a longitudinally moving grinding band with a width very small in comparison to the width of the table, and with at least one of the longitudinal grinding assemblies being adjustable transversely of the advancement direction to allow the spacing of the longitudinal grinding assemblies to be set to match the spacing of the longitudinal frame pieces.

Abstract: A wire saw for cutting shaped articles from a workpiece, having at least two wire webs made from sawing wire, which are used for cutting off the shaped articles and which lie one above the other at a distance h and are tensioned between wire-guide rollers. The wire webs are formed by one or more adjacent and parallel wire segments. In this wire saw, no wire segment covers any other wire segment congruently when the wire webs are viewed from above. The invention also relates to a process for cutting a workpiece with the wire saw.

Abstract: A chemical mechanical polishing apparatus has a platen, a polishing sheet extending between a first roller and a second roller, and a support sheet extending between a third roller and a fourth roller. A portion of the polishing sheet extends over a surface of the platen to polish a substrate, and a portion of the support sheet extends between the platen and the polishing sheet. The polishing sheet may be a continuous belt or a reel-to-reel tape, and the support sheet may be a continuous belt or reel-to-reel tape.

Abstract: A grinding wheel comprising abrasive grains, a bonding material for bonding the abrasive grains, and grain clusters of accumulated filler grains having a size smaller than the abrasive grains. The grinding wheel may be a vitrified grinding wheel, and in this case, chromium oxide having good affinity with the vitrified bonding material may be used as the filler grains.

Abstract: Abrasive tools and a grinding process are for use in the manufacture of hypodermic needles. In particular, a formulation including selected bond components, and a process for manufacturing grinding wheels having an embrittled bond permits a new method for grinding of fine hollow metal tubes to shape the tips of hypodermic needles with the substantial elimination of metal burrs or fines from the grinding process.

Abstract: The cutting wire consists of a wire rope (4) with cutting beads (6) affixed thereto that contain bonded superabrasives such as diamond and a cutting wire connector which connects the cutting wire to produce an endless wire loop for use in a wire sawing machine. The cutting wire connector consists of a double joint which has two joint axes intersecting each other at an angle of 90.degree.. The cutting wire connector consists of two forks (1) at the wire ends (4), an intermediate part (2) and two joint pins (3) which connect each form (1) with the intermediate part (2) in such a way that the connection can be opened easily. The cutting wire connected by means of the joint connector has a long service life while exhibiting increased cutting performance and increased utilization of the operating time of the facilities.

Abstract: In a magnetic tape surface treatment method and apparatus for rubbing together a magnetic tape and a lapping tape and thereby removing projections and adhered matter from the magnetic surface to the magnetic tape pressurized air is blown onto the tapes to prevent the formation of an air film between the contacting surfaces of the two tapes. This enhances the contact quality and improves the surface treatment efficiency.Also uniformity of the surface treatment effect is enhanced by simultaneously controlling the tensions in the magnetic tape before and after the two tapes make contact.