Abstract: A component insertion device including a robot and a control portion is provided. The control portion is configured to control the operation of the robot. The robot includes a gripper, a dummy component and a force sensor. The gripper is configured for gripping a workpiece component. The dummy component is mounted protruding outward on a location in the gripper and away from the gripped workpiece component. The dummy component has a corresponding part with the same shape as that of a specific part of the workpiece component and exhibits rigidity. The force sensor is configured for detecting, through the gripper, a contact reaction force received by the dummy component from the surrounding of a slot or hole of a receiving portion by which the specific part of the workpiece comment is to be inserted via using the device. Component insertion method and program of using the device are also provided.

Abstract: A deburring machine for removing burrs from workpieces includes a framework, a deburring mechanism and a transport mechanism. The deburring mechanism mounted on the framework, includes deburring units positioned on the framework. The transport mechanism is positioned on the framework adjacent to the deburring units. The transport mechanism includes a base, multi-station rotating plate and a first driver. The base is positioned on the framework. The multi-station rotating plate is rotatably positioned on the base. The first driver is positioned on the framework and connects with the base. The first driver is capable of driving the multi-station rotating plate to transport the workpieces to the plurality of deburring units, the plurality of deburring units are capable of removing the burrs of the workpieces.

Abstract: A processing apparatus includes a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported by the four processing unit supporting mechanisms, the four processing units respectively corresponding to four of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.

Abstract: A workpiece feeder is capable of feeding a roller to a roller end face processing machine in a stable posture, a roller end face processing machine, and a roller for a rolling bearing processed by such a roller end face processing machine are provided. The workpiece feeder for roller end face processing includes: a carrier ring having a plurality of recesses arranged in a radially-inner surface thereof at a predetermined pitch along a circumferential direction; a regulating wheel fitted into the carrier ring to form roller fitting cavities between a radially-outer surface of the regulating wheel and the plurality of recesses; a carrier support for supporting the carrier ring on a radially-outer side with respect to the plurality of recesses; and rotational force applying means for applying a rotational force to the carrier ring on the radially-outer side with respect to the plurality of recesses.

Abstract: An apparatus for lapping a portion of an exterior surface of a housing is described. The apparatus includes at least a lapping tool arranged to execute a lapping operation. The lapping tool takes the form of a lapping pad which includes a conduit through which slurry can be transported for local deposition on the housing during a lapping operation. The apparatus also includes a stage on which a workpiece in the form of a housing is mounted. During the lapping operation, slurry is passed through the slurry conduit in the lapping tool, the lapping tool and the housing are moved in various motions. In this way, a gradual transition region is created between an accessory region and the remainder of the housing.

Abstract: A deburring machine for removing burrs from workpieces includes a framework, a deburring mechanism and a transport mechanism. The deburring mechanism mounted on the framework, includes deburring units positioned on the framework. The transport mechanism is positioned on the framework adjacent to the deburring units. The transport mechanism includes a base, multi-station rotating plate and a first driver. The base is positioned on the framework. The multi-station rotating plate is rotatably positioned on the base. The first driver is positioned on the framework and connects with the base. The first driver is capable of driving the multi-station rotating plate to transport the workpieces to the plurality of deburring units, the plurality of deburring units are capable of removing the burrs of the workpieces.

Abstract: A paper edge cleaner in which paper is carried along a paper guide by a paper carrying roller. A grinder grinds both sides of the paper parallel to the paper movement to remove burr from the paper. The paper is supported by a support.

Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.

Abstract: To propose a method for realizing appropriate delivering of works to carriers in the conventional transfer process. Specifically, in a polishing method for polishing a work retained in a carrier, at least one carrier for retaining a work to be polished is placed between an upper plate and a lower plate; the work is fit in a hole of the carrier; the carrier and the work are inserted between the upper plate and the lower plate; and at least one of the upper plate and the lower plate is rotated while supplying a polishing agent to a space between the upper plate and the lower plate. In fitting the work in the hole of the carrier, an end portion of the work is held and the work is carried to a position above the lower plate; the work is positioned with respect to the hole of the carrier on the lower plate; and the work is released from the hold and guided by a guide to be slowly carried down toward the hole.

Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.

Abstract: Provided are a workpiece feeder for roller end face processing which is capable of feeding a roller to a roller end face processing machine in a stable posture, a roller end face processing machine which is capable of stably and highly accurately processing both end faces of the roller fed by such a workpiece feeder for roller end face processing, and a roller for a rolling bearing processed by such a roller end face processing machine.

Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.

Abstract: A grinding machine has a machine bed, a first spool and a second spool mounted on the machine bed. The spools are capable of storing stock to be ground and are rotatable in a coordinated manner. A grinding wheel is mounted on the machine bed. The first spool is capable of continuously unwrapping the stock, the second spool is capable of continuously wrapping the stock and the grinding wheel is adapted to grind the stock during its travel between the first spool and the second spool. The grinding machine can be used to continuously grinding a slender stock. The stock is continuously unwrapped from the first spool and continuously wrapped on the second spool. The stock is ground during its travel from first spool to the second spool.

Abstract: A vertical type of double disc surface grinding machine of the present invention comprises a clamp device which can clamps and holds a work like a brake disc at a correct clamping position under a stable state even when a configuration of a work upper surface is complicated. This machine is equipped with a pair of upper and lower grinding wheels, a work holding jig which is self rotatable, and said clamp device. The clamp device is equipped with a clamp unit freely rotatable through a bearing onto a clamp rod of an elevator actuator. The clamp unit is equipped with a steel ball contacting with a central concave portion of a work upper surface.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: Surface planarization equipment of a semiconductor wafer safely transfers wafers to an unloading cassette. In addition to the unloading cassette, the surface planarization equipment includes a loading cassette configured to hold wafers awaiting surface planarization, an index table including a plurality of first rotary vacuum wafer chucks that receive wafers from the loading cassette, at least one grinding head disposed above the index table and operative to perform a planarization process on the wafers supported by the chucks, a cleaning and drying unit including a second wafer rotary vacuum chuck receiving the wafers from the index table after the planarization process is completed and from which the cleaned and dried wafers are transferred to the unloading cassette. A position detector includes one or more sensors disposed beside respective ones of the vacuum chucks to stop the chucks at desired positions.

Abstract: An apparatus, system, and method thereof for material positioning and shaping. The apparatus includes a two-section positioning system which includes a guide and follower thereon for positioning along a path.

Abstract: A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to the retaining ring. The wafer chuck, inside the cone, is restrained from moving laterally in respect to the cone by the flexure. The wafer, which is supported by the wafer chuck, is moved into the retaining ring by the wafer chuck after the cone has become aligned with the retaining ring. An adjustment mechanism is provided to ensure the co-planar orientation of the wafer and fixture. Other embodiments include a sensor for detecting the presence of the wafer on the chuck, and in the cone, and minimizes particulate contamination to the wafer.

Abstract: The method allows simultaneous polishing of a plurality of objects of a similar type, preferably silicon wafers. The polishing process is interrupted briefly at least once. During the polishing pause, the carriers on which the objects to be polished have been mounted are rotated onward sequentially and then the polishing operation is continued. The objects are mounted on one or more carriers which are at a free position during the polishing operation. This has the advantage that the polishing operation does not have to be additionally interrupted for the purpose of loading and unloading the carrier. This saves valuable machine time, so that the throughput is increased. At the same time, the fact that each wafer is processed at a plurality of polishing plates stabilizes the result of polishing, since the individual abrasion properties of the individual polishing plates are averaged out.

Abstract: A grinding machine includes at least a turntable, rotary chuck tables for holding workpieces to be machined, a first grinding device for grinding the workpiece held on the chuck table and a second grinding device for grinding the first-ground workpiece held on the chuck table. The first grinding device comprises at least a first grinding wheel having pieces of grindstone set so as to define together a first grinding plane, and a first spindle fixed to the first grinding wheel. Likewise, the second grinding device comprises a second grinding wheel having pieces of grindstone set so as to define together a second grinding plane and a second spindle fixed to the second grinding wheel.

Abstract: A chemical mechanical polishing process rotates a wafer having an alignment mark at a wafer rotation rate and a polishing surface at an off-matched rotation rate. The wafer rotation rate and the off-matched rotation rate are not equal. The wafer rotating at the wafer rotation rate and the polishing surface rotating at the off-matched rotation rate touch to polish a plurality of points on the wafer. The rotation of the wafer rotating at the wafer rotation rate is adjusted with respect to the polishing surface rotating at the off-matched rotation rate to achieve an approximately zero averaged rotation rate velocity for each of the points on the wafer with respect to the polishing surface polishing the wafer upon a completion of the total polishing time.

Abstract: A multi-head type polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings, and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces. The polishing apparatus also has a pusher for transferring the workpieces between the rotary transporter and the top rings.

Abstract: Machine for machining using abrasive belts circular workpieces supported by at least one pair of parallel rollers. To pass the workpieces under the machining station(s) 6, the support rollers 16 driven in rotation are moved in translation parallel to their axes. The rollers 16 are preferably mounted on a table 13 mobile in translation which can also carry means 19 for positioning the workpieces to be machined.

Abstract: A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.

Abstract: An apparatus for simultaneously machining a plurality of lens blanks to provide a lens surface on each blank corresponding to a selected lens prescription includes a tool support assembly and a lens blank assembly. The tool support assembly movably supports at least one tool. The lens blank support assembly includes a plurality of lens blank retainers for supporting a plurality of lens blanks. The tool support assembly and the lens support assembly move relative to each other such that the tool alternatingly engages each of the plurality of lens blanks for machining an individual lens prescription in a raster-like manner on each of the plurality of lens blanks.

Abstract: An apparatus for removing semiconductor wafers from within the runner disks in a double-sided polishing machine. The apparatus includes a suction head adapted to be connected to a vacuum, which has a plurality of suction ports such that all semiconductor wafers received by a runner disk may be gripped simultaneously. The apparatus also includes an arm on which the suction head is rotatably supported about a vertical axis and which, in turn, is pivotally supported about a vertical axis at a spacing from the suction head or is supported so as to be linearly adjustable or adjustable in height. The apparatus also includes a rotary drive for the suction head, a drive for the arm, a lifting drive for the arm, and a control device for activating the drives such that the semiconductor wafers may be deposited on a lay-down device in a predetermined, aligned position.

Abstract: Disclosed is an improvement in a grinding machine comprising at least a turn table, rotary chuck tables for holding work pieces to be machined, a first grinding means for grinding the work piece held on the chuck table and a second grinding means for grinding the first-ground work piece held on the chuck table. The first grinding means comprises at least a first grinding wheel having pieces of grindstone set so as to define together a first grinding plane, and a first spindle fixed to the first grinding wheel. Likewise, the second grinding means comprises a second grinding wheel having pieces of grindstone set so as to define together a second grinding plane and a second spindle fixed to the second grinding wheel.

Abstract: The apparatus includes a frame and a holder rotatably secured to the frame for releasably holding a first workpiece of the workpieces. A mechanism is provided for rotating the holder from a loading station to a grinding station and a grinder is movably secured to the frame and selectively positionable relative to the first workpiece when the first workpiece is located at the grinding station. A control is included for selectively positioning the grinding means relative to the first workpiece for grinding the first workpiece and a further holder is rigidly secured to and spaced relative to the holder. The arrangement is such that when the holder is rotated in a direction towards the grinding station, the further holder is rotated in a direction towards the loading station for loading a second workpiece of the workpieces at the loading station so that sequential grinding and loading of the workpieces is permitted.

Abstract: Apparatus and method for cleaning, rinsing and drying work pieces such as semiconductor wafers. The apparatus can be combined, in an integrated apparatus, with a CMP machine. The apparatus includes one or more brush boxes with water tracks to convey work pieces to and from the brush boxes. Each brush box and its associated water track provide for the containment of cleaning agents such as HF used in the cleaning process so that different cleaning agents used in different brush boxes are kept segregated. The efficiency of the brush box is enhanced by providing for movement of work pieces back and forth through the brush box. Thus work pieces can make more than one pass through a brush box.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A parallel alignment device for chemical mechanical polishing using a plurality of carrier devices (123) rotatably coupled to a turret means. The apparatus (100) includes a turret and plurality of rotatable polishing surfaces (111) positioned around the turret. The apparatus also includes a plurality of carrier devices (123) rotatably coupled to the turret, where the carrier devices (123) are each adapted to hold a workpiece to be polished on at least one of the rotatable polishing surfaces. Each of the carrier devices is operably independently to each other during a process for chemical mechanical polishing.

Abstract: A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.

Abstract: A working apparatus of a magnet member comprises: a transfer path for guiding magnet members to be ground in one direction; transfer means for pushing the plurality of magnet members in a transfer direction to continuously send out the magnet members to the transfer path; a pair of grinding means disposed such as to sandwich the transfer path for grinding opposite surfaces of the transferred magnet member; and pushing means disposed downstream from the grinding means for pushing the magnet member in a direction opposite from the transfer direction. With this structure, it is possible to work the magnet member into a predetermined shape with excellent productivity.

Abstract: There is disclosed a polishing machine capable of flattening a wafer surface uniformly. The machine can modify the flatness of the surface during polishing. The machine has an index table and a polishing head 18. The table attracts the wafer to be polished such that the wafer faces upward. The table rotates to the primary polishing station. The polishing head has a pressure application cylinder 21 and a base plate 22. The cylinder is held to a carrier at a given angle. The base plate holds polishing cloth 24 and is mounted to the cylinder so as to be swingable in three dimensions. The cloth touches the wafer surface and rotates at a high speed, thus flattening it. At the second polishing station, polishing cloth attached to another polishing head touches the wafer surface and rotates at a high speed, thus finally polishing the wafer surface.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, for example oscillate radially within the rotatable support. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: A rotating fixture releasably carries work pieces in a circular path for parading the work pieces, one-by-one, through machining engagement with a grinding wheel for grinding a desired feature or surface onto each work piece. The fixture is adapted such that the work pieces can be quickly snapped into position, and provision is made for automatically ejecting the finished parts from the fixture. A clamping apparatus clamps the work pieces in place in the fixture, one-by-one, just prior each piece reaching the tool, and then releases the work piece after the machining on each part is finished.

Abstract: A polishing system and a method of control of the same enabling reliable transfer of the workpieces into and out of the system while maintaining the precision of polishing of the workpieces. Provision is made of a polishing apparatus 1, a first transfer apparatus 2, a second transfer apparatus 3, and a control apparatus 4. In the polishing apparatus 1, workpieces W held in m number of holding holes 14 formed in n number of carriers 14 are polished on their two surfaces by a lower platen 10 and an upper platen 19. The control apparatus 4 finds the revolution angle of the carriers 14 when the workpieces reach the desired thickness, makes the carriers revolve until the revolution angle of a whole multiple of 360.degree./n closest to the revolution angle found, and then makes the polishing apparatus 1 stop.

Abstract: A wafer loading and unloading mechanism is arranged in such a way that polished wafers stored in the loading cassette in a loading robot are not subject to dust contamination. The mechanism for moving loading cassettes mounted in a loading robot upward and downward is provided under the loading cassettes in order to prevent polished wafers from being contaminated with dust which may be generated or become airborne when driving force is transmitted.

Abstract: A method of working a workpiece with an apparatus comprising the steps of holding the workpiece by a holding means, rotating the held workpiece by a rotational means in a direction of a tool to match a rotational axis line of the workpiece with a rotation axis line of the tool, matching a vertical axis of the holding means holding the workpiece with an intersection of a swingable rotation axis line of a means for swingably rotating the tool and the tool rotation axis line, and holding the workpiece above the tool and the working the workpiece by exerting work pressure on the workpiece.

Abstract: An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a carousel, which provides circumferential positioning of the heads relative to the polishing pads, and the wafer heads oscillate radially as supported by the carousel to sweep linearly across the respective pads in radial directions with respect to the rotatable carousel. Each polishing station includes a pad conditioner to recondition the polishing pad so that it retains a high polishing rate. Washing stations may be disposed between polishing stations and between the polishing stations and a transfer and washing station to wash the wafer as the carousel moves. A transfer and washing station is disposed similarly to the polishing pads.

Abstract: A dry abrasive delabeling apparatus for both plastic and glass bottles, sometimes called a label stripper, in which the bottles are fed by an in-feed starwheel to a circular starwheel which rotates the bottles slowly. Within the starwheel are wire bristle brushes rotating at a high speed against the bottles to flick off paper, foil, or plastic from the label on the bottle while restraining the bottle in close contact to the ends of the wire bristle by means of a rubber bladder to press against the bottles. The bottles are held against the wire bristles while the bottles are rotated as they are held against the bladder. The debris is vacuumed away from the apparatus.

Abstract: An electric servomotor drive system for controlling the regulating wheel of a centerless grinder is disclosed. The electric servomotor replaces the transmission normally used on centerless grinders and provides infinitely variable speed control of the regulating wheel. The system is designed for retrofitting centerless grinders manufactured by a variety of machine tool builders.

Abstract: Point-grinding apparatus comprising frame means, workpiece transport means operably mounted on the frame means for transporting a plurality of elongated workpieces therealong, workpiece support means disposed adjacent the transport means for supporting the elongated workpieces in contact with the transport means and grinding means including an asymmetrical concave grinding surface disposed adjacent the transport means to engage workpieces supported by the workpiece supporting means, the asymmetrical concave grinding surface being configured and dimensioned such that a surface area of each workpiece which contacts the grinding surface varies relative to the position of the workpiece with respect to the grinding surface. A method for grinding needle points is also provided including the steps of, providing a rotating grinding wheel having an asymmetrical concave grinding surface and feeding at least one workpiece to a first position such that each at least one workpiece is advanced along the grinding surface.