Abstract: A processing apparatus includes a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported by the four processing unit supporting mechanisms, the four processing units respectively corresponding to four of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.

Abstract: A method and a device for machining the leading edge of a turbine engine blade by a machining center for which parameters are set is disclosed. The method includes: acquiring a 3D profile of the leading edge of the blade; calculating at least one characteristic of the leading edge from the 3D profile; comparing the value of the calculated characteristic with a known theoretical value of the characteristic to obtain an elementary difference for the characteristic; calculating at least one undulation of the leading edge between at least two consecutive elementary sections from the 3D profile; optimizing the elementary differences obtained as a function of the undulation; setting the parameters of the machining center as a function of the optimized elementary differences for the elementary sections to define machining passes over the leading edge; and machining the leading edge of the blade with the machining center with parameters set.

Abstract: Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around an X-axis that is perpendicular to the Y-axis, and which can be rotationally driven, with an X-carriage that is linearly movable on the machine bed in the X-axis, with a Z-carriage that is linearly movable on the X-carriage with a Z-axis that is perpendicular to the X-axis and the Y-axis, and with a work piece jig, which is arranged on the Z-carriage so as to pivot around a B-axis, which is parallel to the Y-axis, and which is capable of rotating around its A-axis, which is perpendicular to the B-axis.

Abstract: Various methods and apparatus for simultaneously texturing two single-sided hard memory disks is provided. The two disks are placed in a concentric contact merge orientation such that the outwardly facing surface of each disk may be simultaneously subjected to texturing by equipment designed to texture one double-sided disk.

Abstract: The invention relates to a device for loading and unloading optical workpieces, for an optical machine. The device comprises a loading arm (24) which is pivotally driven about an axis (A) and is pivoted in controlled movement sequences on the optical machine between a workpiece magazine (26, 28) and the operating position. The outer end of the loading arm is provided with a device (30) for receiving and placing workpieces. According to the invention, the swivelling axis of the loading arm is the central axis of a spindle (40) which rotates in both directions of rotation (D+, X−) and which can be driven linearly in a lifting motion in both axial directions (X+, X−) by means of drive elements, as well as guided in guide elements in a rotating and displacing manner. The loading arm (24) is fixed to the spindle.

Abstract: A wafer processing module is provided. In one example, the wafer processing module includes a sub-aperture CMP processing system and a pad exchange system including a pad magazine for storing CMP processing pads and a pad exchange robot for transferring CMP processing pads between the sub-aperture CMP processing system and the pad magazine. The wafer processing module includes a module frame that integrates the sub-aperture CMP processing system including the pad exchange system, with a wafer scrubber unit and a wafer SRD unit.

Abstract: A multi-head type polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings, and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces. The polishing apparatus also has a pusher for transferring the workpieces between the rotary transporter and the top rings.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A unidirectional gate disposed between interconnecting fluid transport regions in a manufacturing process. The gate allows workpieces to pass from a first transport region to a second transport region but prevents them from returning to the first region after having passed into the second region. The gate may specifically be used in semiconductor wafer manufacturing, especially where wafers exit a water track into a cassette.

Abstract: A spherical body grinding and polishing apparatus comprises: a rotary shaft having a spiral path groove in the outer cylindrical surface along which spherical bodies to be processed are moved, the rotary shaft being vertically movable and rotatable; and a housing having grinding and polishing surfaces on which the spherical surfaces of the spherical bodies moving along the path groove are slid. When spherical bodies such as silicon spherical bodies are supplied to the apparatus, the spherical bodies are rolled and moved along the spiral path groove formed in the outer cylindrical surface of the rotary shaft while sliding on the inner surface of the housing, so that the outer surfaces of the spherical bodies are ground and polished until the spherical bodies become high in sphericity.

Abstract: A new machine for and method of manufacturing fluted pin fasteners and the pins produced thereby are disclosed which utilize a circular grinding arrangement of a plurality of grinders which grind flutes into a threaded pin. An internally threaded collar threads onto the pin. When the collar engages a surface of a work piece, resistance to further threading increases. When sufficient resistance to threading occurs, the driver deforms the lobes of the collar radially inward toward the axis of the collar. Material of the collar positioned internally from the lobes responds to deformation of the lobes and flows radially inward into the flutes of the pin to lock the collar, pin, and work piece together. The driver then rotates freely, and a joint has been made with a predetermined axial load thereby locking the component parts together.

Abstract: A method of working a workpiece with an apparatus comprising the steps of holding the workpiece by a holding means, rotating the held workpiece by a rotational means in a direction of a tool to match a rotational axis line of the workpiece with a rotation axis line of the tool, matching a vertical axis of the holding means holding the workpiece with an intersection of a swingable rotation axis line of a means for swingably rotating the tool and the tool rotation axis line, and holding the workpiece above the tool and the working the workpiece by exerting work pressure on the workpiece.

Abstract: A grinding apparatus includes a disc-like carrier rotatably driven and having a plurality of holding holes formed in a circumferential direction thereof, the carrier transferring a work fitted in each of the holes, a ring-shaped holder member disposed at an outer peripheral part of the carrier and holding the carrier in a stretched state, an upper and a lower guide members for guiding upper and lower surfaces of the work fitted in the holding hole of the carrier and transferred by rotation of the carrier, and a first grindstone arranged at either an upper or a lower side of a processing position for grinding one of the upper and lower surfaces of the work while the other surface of the work is guided by means of either one of the guide members.

Abstract: Point-grinding apparatus comprising frame means, workpiece transport means operably mounted on the frame means for transporting a plurality of elongated workpieces therealong, workpiece support means disposed adjacent the transport means for supporting the elongated workpieces in contact with the transport means and grinding means including an asymmetrical concave grinding surface disposed adjacent the transport means to engage workpieces supported by the workpiece supporting means, the asymmetrical concave grinding surface being configured and dimensioned such that a surface area of each workpiece which contacts the grinding surface varies relative to the position of the workpiece with respect to the grinding surface. A method for grinding needle points is also provided including the steps of, providing a rotating grinding wheel having an asymmetrical concave grinding surface and feeding at least one workpiece to a first position such that each at least one workpiece is advanced along the grinding surface.