Abstract: A processing apparatus includes a chuck table for holding a workpiece that has a mark representing a crystal orientation, a processing unit, a cassette stage for placing thereon a cassette for storing a plurality of workpieces therein, a temporary rest table, a spinner table, a robot for delivering a workpiece, a determining section for determining whether a workpiece has been properly processed or has not been properly processed, and a control unit for performing a control process for orienting the mark of the workpiece in a predetermined direction if the determining section determines that the workpiece has been properly processed and storing the workpiece in the cassette, and performing a control process for orienting the mark of the workpiece in a direction different from the predetermined direction if the determining section determines that the workpiece has not been properly processed and storing the workpiece in the cassette.

Abstract: A horizontal articulated robot including a base; one or more arms, attached to the base so as to be capable of rotating horizontally; a ball screw spline shaft that is disposed at an end of the one or more arms and that supports a workpiece at one end of the ball screw spline shaft; a ball screw nut through which the ball screw spline shaft passes and which is driven; and two ball spline nuts configured to support the ball screw spline shaft passing through the ball spline nuts, respectively, on both sides of the ball screw nut interposed therebetween in a longitudinal axis direction. At least one of the ball spline nuts drives the ball screw spline shaft about the longitudinal axis with respect to the arms.

Abstract: A robot diagnosing method detects a deviation amount caused by a lost motion and includes: a first step of preparing a robot including a robot arm having at least one joint portion, a work conveyed by the robot, and a prealigner including a processing portion configured to detect a center position of the work; and after the first to fifth steps, a sixth step of detecting the deviation amount caused by the lost motion at the one joint portion based on (i) the center position of the work based on the center position of the work detected in the second step and a command value from a robot control portion in the fourth step and (ii) the center position of the work detected in the fifth step.

Abstract: For the transport of a substrate from a cassette to a back surface cleaning processing unit in a cleaning processing block, a transfer robot rotates the substrate through 90 degrees from a horizontal attitude in which the front surface of the substrate is positioned to face upward into a standing attitude while transporting the substrate out of a cassette to a substrate passing part, and passes the substrate in the standing attitude to the substrate passing part. The substrate passing part holds the substrate in the standing attitude. A main transport robot receives the substrate held in the standing attitude. The main transport robot rotates the substrate through 90 degrees from the standing attitude into a horizontal attitude in which the back surface of the substrate is positioned to face upward while transporting the substrate from the substrate passing part to the back surface cleaning processing unit.

Abstract: An improved destructive and visual measurement automation system and a method for measuring a web thickness of a microdrill are provided. When a dual-axis motion platform module moves the microdrill to a first position, a reflection module reflects a first image in a first direction toward a second direction. A vision module receives the reflected first image in the second direction and outputs the received first image to a computer. According to the first image, the computer performs a positioning procedure and a grinding procedure to drive a drill grinding module to grind the microdrill to a sectional position to be measured of the microdrill. When the microdrill is moved to a second position, the vision module outputs a second image to the computer. According to the second image, the computer performs an image computing procedure to obtain the web thickness at the sectional position to be measured.

Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.

Abstract: A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer.

Abstract: An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus 100 includes a polishing table 110 to which a polishing pad 108 for polishing a substrate 102 is attached, a liquid feeding section configured to feed a liquid 109 to a polishing surface of the polishing pad 108, a top ring 116 configured to suck and convey the substrate 102 from the polishing surface, the substrate 102 being disposed on the polishing surface via the liquid 109 fed by the liquid feeding section, and a control section configured to inject a fluid (N2) into an internal area 109a of the liquid 109 interposed between the substrate 102 and the polishing pad 108.

Abstract: A method and a device for machining the leading edge of a turbine engine blade by a machining center for which parameters are set is disclosed. The method includes: acquiring a 3D profile of the leading edge of the blade; calculating at least one characteristic of the leading edge from the 3D profile; comparing the value of the calculated characteristic with a known theoretical value of the characteristic to obtain an elementary difference for the characteristic; calculating at least one undulation of the leading edge between at least two consecutive elementary sections from the 3D profile; optimizing the elementary differences obtained as a function of the undulation; setting the parameters of the machining center as a function of the optimized elementary differences for the elementary sections to define machining passes over the leading edge; and machining the leading edge of the blade with the machining center with parameters set.

Abstract: The shot-blasting machine for surface treatment of products comprises a base frame, a containing chamber for containing at least a product to be treated associated to the base frame and provided with at least an access opening, one or more projecting organs associated internally of the chamber for projecting a flow of shot-blasting particles onto the product, and automated unloading means associated to the base frame which cause the product to exit from the chamber through the access opening.

Abstract: The invention relates to a method for the operation of a gear or profile grinding machine (1) for the grinding of pre-geared or pre-profiled workpieces (2), wherein the machine comprises at least one tool spindle (3) which can carry at least one grinding tool (4) and wherein the machine comprises at least two workpiece spindles (5, 6) which can at least temporarily be driven to the tool spindle (3) for cooperation of the workpiece (2) with the grinding tool (4). To improve the ratio between primary processing time and secondary processing time the invention proposes that the at least two workpiece spindles (5, 6) are pivoted around a respective axis of rotation (7, 8) for transportation from a grinding position (I) to a loading station (II) and vice versa, wherein the rotation of the two workpiece spindles (5, 6) takes place independently from another. Furthermore, the invention relates to a gear or profile grinding machine.

Abstract: A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

Abstract: A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer.

Abstract: A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

Abstract: A bearing ring grinding machine having a grinding unit arranged to machine the bearings with micron-size tolerances and reduce a grinding cycle period. The grinding unit includes a fixed plate which supports a horizontally movable loader and sliding carriage. A carriage stopper, in the loader, holds the ring against the plate and between two lateral channels. The fixed plate has an opening for passage of a rotatable spindle, equipped with a magnetizable bush, to support the ring during machining and support stops for automatically positioning the ring on the bush. Initially, the carriage releases a ring to be ground which then passes toward the bush. The ring is then secured, machined, carried by a magnetic carrier of an automatic discharge device.

Abstract: A work piece handling apparatus moves workpieces with a plurality of independently movable load cups that have combined multiple axes of motion. The apparatus can load and unload work pieces from a wet process station and move work pieces between wet process stations and maintain wet chemistry delivery to the workpiece without involving a robot. A method of work piece handling using the apparatus provides a significant throughput improvement by reducing the inherent time lag of pneumatic systems and eliminating multiple steps involving the robot during inter-station wafer transfer.

Abstract: A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.

Abstract: A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works (400) integrally with the carriers (500) on the outside of a polishing device main body (110), feeding the works (400) onto a rotating surface plate (111) on the underside of the polishing device main body (110) with the works formed integrally with the carriers (500), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works (400) on the lower side rotating surface plate (111) after the double sides are polished, enabling the works (400) to be discharged automatically from the lower side rotating surface plate (111), providing a brush storage part (180) and a dresser storage part (190) near the polishing device main body (110), and frequently treating a polishing cloth ins

Abstract: The invention relates to a hard finishing machine (1). The machine has one tool (4) which is arranged on a tool spindle (3) and a rotary table (5) with an axis of rotation (6) which is aligned vertically, and a workpiece spindle (7) arranged on the rotary table (5) which carries the workpiece (2). To increase the flexibility of the machine, the rotary table (5) has a first rotational position (I) in which the workpiece (2) can be machined by the tool (4), a second rotational position (II) where the workpiece is loaded on the workpiece spindle (7) at a first station (8), and a third rotational position (III) where the workpiece is unloaded at a second station (9).

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading. At least one of the wafer carrier and the transfer station is configured to dissipate electrostatic charge from the wafer.

Abstract: It is possible to execute a one-step polishing or a plural-step polishing at a high throughput, and it is possible to achieve a reduction of an occupied area on the basis of a compact structure of a whole apparatus. Two platens are respectively provided with a first wafer retention head and a second wafer retention head, and a wafer transfer apparatus on which a wafer is mounted is arranged between two platens. The two wafer retention heads are moved between two platens and the wafer transfer apparatus respectively by a first moving means and a second moving means. Further, a two-step polishing is executed by whirl moving two wafer retention heads from one platen to the other platen at 180 degree respectively by a whirl moving means supporting two moving means.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base, a first wash station disposed on the base adjacent to the first of the four polishing station, and a carousel rotatable about a carousel axis and supported by the base, wherein the carousel comprises six substrate heads alignable to any of the four polishing stations, the two load cups and the first wash station.

Abstract: A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planarized conductive layer on the front surface of the wafer, a chamber within the ECMPR module configured to remove conductive material from an edge region of the wafer, a CMP module configured to receive the wafer from the ECMPR module and polish the planarized conductive layer on the surface of the wafer to form the metallic interconnect structure, and a robot configured to transfer the wafer from the ECMPR module to the chemical mechanical polish (CMP) module. In one aspect of the invention, the ECMPR module deposits conductive material on the front surface of the wafer. The ECMPR module removes at least a portion of the conductive layer from the front surface of the wafer.

Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base and a carousel supported by the base. The carousel comprises six substrate heads and is rotatable about a carousel axis. Each of the six substrate heads is configured to align with any one of the four polishing stations and the two load cups.

Abstract: A load cup for transferring a substrate in a chemical mechanical polishing system is provided. In one embodiment, a load cup for transferring substrates in a chemical mechanical polishing system includes a substrate support having a first side adapted to support a substrate thereon and at least one actuator coupled to the substrate support and adapted to move the substrate support laterally. In another embodiment, a method for transferring a substrate between a polishing head and a load cup includes sensing a position of the polishing head relative to the load cup and automatically aligning the load cup and polishing head in response to the sensed relative position.

Abstract: A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract: A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and causing relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and causing relative movement between this polishing tape and the substrate to polish the bevel portion of the substrate.

Abstract: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The different positions include multiple polishing positions and one or more loading/unloading positions. In some embodiments, the CMP apparatus is configured such that a semiconductor wafer is polished at a loading/unloading position. The CMP apparatus may also be configured to continuously polish one or more semiconductor wafers while the wafer carriers are being transferred to different positions. Thus, the CMP apparatus can continuously process the semiconductor wafers without significant idle periods. Consequently, in these embodiments, the efficiency of the CMP apparatus is significantly increased.

Abstract: An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system also has a wafer handling subsystem for transporting each of the wafers into or out of the appropriate one of the plurality of processing subsystems. The plurality of processing subsystems and wafer handling subsystem form an integrated system.

Abstract: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The different positions include multiple polishing positions and one or more loading/unloading positions. In some embodiments, the CMP apparatus is configured such that a semiconductor wafer is polished at a loading/unloading position. The CMP apparatus may also be configured to continuously polish one or more semiconductor wafers while the wafer carriers are being transferred to different positions. Thus, the CMP apparatus can continuously process the semiconductor wafers without significant idle periods. Consequently, in these embodiments, the efficiency of the CMP apparatus is significantly increased.

Abstract: The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.

Abstract: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

Abstract: A method and apparatus for discharging work product from a device wherein a roller which is biased to push against the top of the work product cooperates with a stopper which engages the surface of the work product for displacing the work product, one-by-one from the device to a discharge chute.

Abstract: Surface planarization equipment of a semiconductor wafer safely transfers wafers to an unloading cassette. In addition to the unloading cassette, the surface planarization equipment includes a loading cassette configured to hold wafers awaiting surface planarization, an index table including a plurality of first rotary vacuum wafer chucks that receive wafers from the loading cassette, at least one grinding head disposed above the index table and operative to perform a planarization process on the wafers supported by the chucks, a cleaning and drying unit including a second wafer rotary vacuum chuck receiving the wafers from the index table after the planarization process is completed and from which the cleaned and dried wafers are transferred to the unloading cassette. A position detector includes one or more sensors disposed beside respective ones of the vacuum chucks to stop the chucks at desired positions.

Abstract: A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runner disks to a predetermined loading and unloading position. The position of the centers of the reception openings in a runner disk located in the loading position is measured and stored by means of an optical identification system. A gripping means of a robot arm is successively oriented towards the measured center positions of the reception openings, and the position of the centers of the individual openings is determined and stored by first and second optical identification systems. The individual wafer crystals are tilted while being inserted by the gripping means of the loading arm into the reception openings.

Abstract: The invention relates to a device for loading and unloading optical workpieces, for an optical machine. The device comprises a loading arm (24) which is pivotally driven about an axis (A) and is pivoted in controlled movement sequences on the optical machine between a workpiece magazine (26, 28) and the operating position. The outer end of the loading arm is provided with a device (30) for receiving and placing workpieces. According to the invention, the swivelling axis of the loading arm is the central axis of a spindle (40) which rotates in both directions of rotation (D+, X−) and which can be driven linearly in a lifting motion in both axial directions (X+, X−) by means of drive elements, as well as guided in guide elements in a rotating and displacing manner. The loading arm (24) is fixed to the spindle.

Abstract: A device for smoothing gear wheels includes a loading station for supplying the gear wheels, a smoothing station for smoothing the flanks of the teeth, an inspection station for inspecting the degree of smoothing, and an unloading station for carrying away the processed gear wheels, wherein the stations are arranged around a rotary transport device for conveying the gear wheels from station to station.

Abstract: A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to the retaining ring. The wafer chuck, inside the cone, is restrained from moving laterally in respect to the cone by the flexure. The wafer, which is supported by the wafer chuck, is moved into the retaining ring by the wafer chuck after the cone has become aligned with the retaining ring. An adjustment mechanism is provided to ensure the co-planar orientation of the wafer and fixture. Other embodiments include a sensor for detecting the presence of the wafer on the chuck, and in the cone, and minimizes particulate contamination to the wafer.

Abstract: The invention relates to a device for loading and unloading optical workpieces, for an optical machine. Said device comprises a loading arm (24) which is pivotally driven about an axis (A) and is pivoted in controlled movement sequences on the optical machine between a workpiece magazine (26, 28) and the operating position. The outer end of the loading arm is provided with a device (30) for receiving and placing workpieces. According to the invention, the swivelling axis of the loading arm is the central axis of a spindle (40) which rotates in both directions of rotation (D+, X−) and which can be driven linearly in a lifting motion in both axial directions (X+, X−) by means of drive elements, as well as guided in guide elements in a rotating and displacing manner. The loading arm (24) is fixed to the spindle.

Abstract: A method for loading substrates in a processing system is provided. In one embodiment, a method for loading substrates utilizes a substrate loader that generally includes a wall having an exterior side with one or more apertures formed therethrough and a related method of loading a processing system. A door assembly is movably coupled to the wall in each of the apertures and is adapted to temporarily retain the substrate. A first portion of the door assembly substantially closes the aperture when the door assembly is in a first or closed position, and a second portion of the door assembly substantially closes the aperture when the door assembly is in a second or open position. A robot for transferring a substrate in a processing system is also provided.

Abstract: In a wafer polishing apparatus 1 according to this invention, waiting units 43 having upper-lower two-stage wafer placement tables each for temporarily keeping a wafer from a load/unload unit 3 to a polishing head 42 or vice versa are provided to a polishing unit 4, and the upper/lower stage wafer placement tables can move individually. A spindle-washing unit 44 for washing polishing heads is disposed inside a lower space below the waiting units.

Abstract: Method and apparatus for discharging works 2, 2a from a centerless grinder 1 are provided, wherein the works are through-fed to the centerless grinder 1, processed with grinding therein, aligned axially along the horizontal direction on a guide plate 3 disposed on the work discharging side of the centerless grinder 1, and pushed out of the front end of the guide plate 3 by means of thrust force provided during the grinding, whereby the works 2 are caused to fall, by means of the own weight thereof, onto a discharge chute 5 disposed below.

Abstract: A pedestal of a load-cup for supporting wafers loaded onto and being unloaded from a chemical mechanical polishing (CMP) apparatus includes a pedestal plate, and a pedestal film which extends over only a limited area at the upper surface of the pedestal plate. This area includes the regions directly around the fluid ports provided in the pedestal plate for vacuum-chucking the wafers and spraying deionized water. The pedestal plate may have a cross-shaped part, the entirety of which bears the fluid ports. The pedestal film may include annular members each extending around only a respective one of the fluid ports, or one or more members each extending radially around several of the fluid ports. By offering a rather limited contact area to the wafer supported on the pedestal, the pedestal film reduces the amount of contaminants which could be transferred to the wafer surface in contact therewith.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers to polish a corresponding number of semiconductor wafers on a single polishing pad in parallel. In one embodiment, the wafer carriers are used to transfer semiconductor wafers between one or more wafer transfer stations and the polishing pad. In other embodiments, one or more wafer transfer arms are used to transfer the semiconductor wafers between the wafer transfer station(s) and the wafer carriers. The CMP apparatus is configured to sequentially process semiconductor wafers to increase the throughput of the apparatus. In addition, the components of the CMP apparatus are arranged such that the footprint of the apparatus is minimized.