Abstract: Disclosed is a dicing machine for cutting a CSP plate into pellets and for transferring and putting them in a transport tray. The pick-up-and-transport means picks a selected pellet from a diced CSP plate to carry and put the so selected pellet in an allotted cell in a transport tray. On the way to the transport tray storage area, there is cleaning means for wiping and removing minute pieces of debris if any from the rear side of each pellet. The cleaning means includes a wiper in the form of rotary sponge roll, which is wet with washing liquid, and is rotated to expose its clean surface to each pellet all the time.

Abstract: The wafer handling and support system disclosed herein does not use tape and is adapted for use in conjunction with a number of work stations. The wafer handling and support system includes a chuck plate comprised of a non-porous section surrounding a porous section and a robotic arm for transporting a chuck plate/wafer combination under vacuum. The chuck plate is sized to be carried by a wafer chuck and the porous section of the chuck plate is configured to support a wafer. The wafer may be held in place on the chuck plate by the application of a vacuum.

Abstract: A work piece carrier head for the chemical mechanical planarization of a work piece includes a backing plate that is capable of being extended beyond the lower surface of the carrier head during a work piece loading operation. The exposed lateral surface of the backing plate in the extended position provides a reference surface to enable a work piece handling wand to align itself prior to loading the work piece into the carrier head. The work piece handling wand is configured to grip a work piece between a concave cradle and a moveable gripping finger. A work piece held by the wand can be centered relative to the backing plate prior to loading the work piece into the work piece carrier head by registering the wand to the exposed lateral surface of the extended backing plate.

Abstract: The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.

Abstract: A polishing apparatus is used for polishing a plate-like workpiece, such as a semiconductor wafer or a glass substrate. The polishing apparatus has a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a dresser for dressing the polishing surface by pressing a desired position of the polishing surface.

Abstract: Generally, a semiconductor wafer processing system and more specifically, a semiconductor wafer planarization system for polishing a workpiece, such as a semiconductor substrate or wafer. The system generally includes a first polishing module that has a polishing head for retaining a workpiece, a staging module and a set of load cups for transferring the workpiece to and from the polishing head. A primary robot that has a workpiece gripper transfers the workpiece between the first set of load cups and the staging module. The staging module and the load cups comprise transfer locations where processed and unprocessed workpieces may be set within the reach of processing modules and transfer devices so that the dwell time associated with handling polished and unpolished workpieces is reduced. Additionally, a method for transferring wafers about the polishing system is also disclosed.

Abstract: A substrate loader for a semiconductor substrate processing system that generally includes a wall having an exterior side with one or more apertures formed therethrough and a related method of loading a processing system. A door assembly is movably coupled to the wall in each of the apertures and is adapted to temporarily retain the substrate. A first portion of the door assembly substantially closes the aperture when the door assembly is in a first or closed position, and a second portion of the door assembly substantially closes the aperture when the door assembly is in a second or open position. A robot for transferring a substrate in a processing system is also provided.

Abstract: The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.

Abstract: A system for polishing a semiconductor substrate. Specifically, the system includes one or more polishing modules and a cleaning module. A rail is disposed between the polishing modules and the cleaning module. The rail has a first end disposed proximate a transfer station disposed on the polishing module and a second end disposed proximate the cleaning module. A robot is movably disposed on the rail. The robot is adapted to transfer a substrate between the transfer station and the cleaning module. Additional embodiments of the invention include having the cleaning module in an orientation perpendicular to an orientation of the rail and having the cleaning module in an orientation perpendicular to an orientation of the rail.

Abstract: A system for facilitating transfer of a semiconductor wafer into or out of a wafer carrier of a polishing or lapping machine without contacting a face of the wafer. The system includes a wafer transport suitable for placement above the carrier, the transport having at least one open cavity with a size and shape suitable for registering alignment with an opening of the carrier. The cavity and opening together form a compartment adapted to receive and hold the wafer. A liquid delivery conduit having an outlet located above an abrading member of the machine is arranged to deliver a liquid to a position generally beneath the transport. A method for transferring the wafer to or from the machine includes delivering liquid beneath the wafer. The wafer thereby moves between a first position resting on the abrading member and a second position spaced above the abrading member where a tool may engage the edge of the wafer for holding the wafer without contacting the face of the wafer.

Abstract: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

Abstract: To provide a method for storing a carrier (3) for polishing a silicon wafer, which can store the carrier (3) in a manner to reduce scratches on the silicon wafer. The method includes storing a carrier (3) for use in polishing a silicon wafer completely immersed in a liquid. At least a substantial portion of the liquid is deionized water.

Abstract: A semiconductor substrate processing method and apparatus, more specifically, a method and apparatus for polishing a substrate or semiconductor wafer in a polishing system. In one embodiment, the system includes one or more polishing modules, an input module, a first robot and a second robot that provides a compact polishing system that has a minimal tool footprint. The first robot is adapted to transfer the substrate to the input module, while the second robot is adapted to transfer the substrate between the input module and the one or more polishing modules. In another embodiment, the first and second robots have rotary actuators coupled to their grippers that enable the substrate to be orientated between a horizontal and vertical position. The input module is adapted to maintain the substrate in a vertical orientation. The vertical orientation of the substrates facilitates integration of a cleaning system that cleans the substrates while in the vertical orientation.

Abstract: A wafer loading/unloading device and a method for producing wafers in which positioning and mounting can be effected in a stable manner when attaching the wafer to the polishing head and which make it possible to receive or transfer the polished wafer in a stable manner. The wafer loading/unloading device includes a main body portion for supporting a wafer W, a swinging shaft supporting a swinging arm connected to the main body portion, and an arm ascending/descending mechanism supporting the swinging arm such that it can ascend and descend. The main body portion is equipped with a wafer support portion and an action force absorbing mechanism for absorbing vertical force acting on the wafer support portion, so that the impact when attaching or detaching the wafer to or from the polishing head is mitigated. Thus, damage to the wafer and the polishing head is prevented and the wafer is transferred in a stable manner.

Abstract: A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.

Abstract: A singulation system for a BGA product is disclosed, which has a cutting mechanism with a cutting head, a conveyor belt arranged under the cutting head, a cutting table positioned to connect with the conveyor belt, a cleaning station positioned beside the cutting mechanism, a loading frame capable of moving up and down and positioned beside the cleaning station, a cassette storage containing multiple receiving cassettes (each having a BGA product contained therein) and positioned to abut one end of the loading frame, a gripping device arranged at the other end of the loading frame, and a revolving arm assembly arranged among the cutting table, the cleaning station and the loading frame and comprising three revolving arms each having a pivotal end and a distal end respectively extending above the cutting table, the cleaning station and the loading frame with each distal end having a suction device mounted thereon.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract: A tool is provided herein for separating stacked strips of semiconductor structures held by a magazine, which strips have become attached together. The tool is made up of first and second elongated members in side-by-side relation, each member defining a plurality of teeth along an edge thereof. The first and second members are mounted together so as to allow relative reciprocal movement therebetween, so that relative reciprocal movement between the pluralities of teeth is provided. The tool is held with the teeth against the edges of strips carried by the magazine, and the operator squeezes and releases member handles to provide relative reciprocal movement of the teeth. This back-and-forth reciprocal movement causes the teeth to rub against and force apart the strips, to in turn separate them.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: A chemical mechanical polishing system is provided having a buffer station disposed therein or adjacent thereto. The buffer station includes two or more substrate supports for supporting two or more substrates adjacent to an inspection station. The two or more substrate supports are mounted on a mounting plate which is connected to an actuator for moving a pair of substrate supports laterally towards or away from each other over the inspection station.

Abstract: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

Abstract: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

Abstract: A method of transferring a semiconductor die from a wafer containing a plurality of semiconductor dice. There is provided a semiconductor wafer having a top side and an opposing bottom side and a plurality of dice formed therein, each die containing a portion of the top side and the opposing bottom side. The wafer is removably secured to a support and the wafer is operated upon to form individual dice on the support. The support is preferably a flexible film. A tool is disposed between the support and the bottom side of a the die by creating a vacuum between the tool and the bottom side to cause adherence of the die to the tool and the die is removed from the support with the tool and placed in a die carrier with the top side facing the carrier and the vacuum is then released. The film, when flexible, is stretched to separate the dice from each other and create streets between adjacent dice so that the tool can be disposed under the die from the street.

Abstract: A workpiece can be simply taken out from a surface plate by a small force without being damaged even though the workpiece is stuck to the workpiece through the surface tension of polishing liquid intervening between the workpiece and the surface plate. By using a takeout device comprising a chucking means for chucking the workpiece and a posture control mechanism for changing the posture of the chuck means, the workpiece horizontally set on the surface plate is chucked by the chuck means in its horizontal posture, and then the chuck means 15 is inclined by the posture control mechanism so as to lift up one end part of the workpiece W in order to separate the workpiece from the surface plate. Thereafter the workpiece can be lifted up in its entirety so as to be taken out from the surface plate.

Abstract: A unidirectional gate disposed between interconnecting fluid transport regions in a manufacturing process. The gate allows workpieces to pass from a first transport region to a second transport region but prevents them from returning to the first region after having passed into the second region. The gate may specifically be used in semiconductor wafer manufacturing, especially where wafers exit a water track into a cassette.

Abstract: A fixture for manufacturing a precisely shaped part, such as a turbine blade, securely holds a blank for subsequent machining. A blank for use with the fixture generally comprises a tip, a root region longitudinally spaced from the tip, and a midspan region extending therebetween. The blank is further characterized by a sacrificial region extending substantially longitudinally from the root region, a stacking axis and a root centerline from which critical dimensions of the blade are referenced, and a plurality of locators. The first locator, a bore, being disposed at the tip on the stacking axis. The second locator, a notch, being disposed within the sacrificial region aligned with the stacking axis. The third locator, a notch, being disposed within the sacrificial region is characterized by a corner, which is parallel to the root centerline. The fixture includes a base having end walls being spaced apart to accommodate the blank therebetween.

Abstract: In order to take a ground work W out of a work-holding hole of a carrier by chucking the outer periphery of the work W, a surface grinding machine is provided with chucking means for chucking the outer periphery of the work W by a plurality of claw members and a plurality of cutouts into which the claw members of the chucking means can be inserted are made in the edge of the work-holding hole of the carrier, and the ground work W in the work-holding hole is taken out at the position of the cutouts.

Abstract: An opening for loading and unloading ingots is formed at the top of a cover, which covers a processing chamber wherein grooved rollers of a wire saw are disposed. The ingots are exchanged from above the cover through the opening. Even if a plurality of wire saws are arranged at short intervals, the adjacent wire saws can exchange the ingots at the same time, Thus, the ingots can be exchanged efficiently.

Abstract: A rotating fixture releasably carries work pieces in a circular path for parading the work pieces, one-by-one, through machining engagement with a grinding wheel for grinding a desired feature or surface onto each work piece. The fixture is adapted such that the work pieces can be quickly snapped into position, and provision is made for automatically ejecting the finished parts from the fixture. A clamping apparatus clamps the work pieces in place in the fixture, one-by-one, just prior each piece reaching the tool, and then releases the work piece after the machining on each part is finished.

Abstract: A semiconductor wafer surface flattening apparatus achieves stable polish characteristics while maintaining a high throughput value and a small footprint. When an index table 22 rotates by a prescribed angle and indicates a rotation position, a first pre-polish semiconductor wafer is moved to a position near a first platen 23. First through third platens 23 through 25 are installed around the index table 22. First through third carriers 46 through 48 are installed for the platens 23 through 25. One of the carriers 46 through 48 is positioned above each of the platens, respectively. The first carrier above the first platen holds and transports the first pre-polish semiconductor wafer. Then the first pre-polish semiconductor wafer is polished. While the first semiconductor wafer is being polished, a second pre-polish semiconductor wafer is supplied to the index table 22.

Abstract: A polishing amount control system and method for same which can quickly feed back the results of measurement of a coating layer of a workpiece to the next polishing work so as to improve the productivity of the workpieces and further enable high precision polishing work. The thicknesses of the plating layers of the two surfaces of a magnetic disk W polished by a double-side polishing apparatus 1 are measured by an X-ray thickness meter 2. The rotational speeds of the drive motors 15 and 18 of the double-side polishing apparatus 1 are controlled in accordance with the results of the measurement. Specifically, the polishing amounts of the plating layers of the upper surface and lower surface of the magnetic disk W polished next become within 1.8 .mu.m to 2.2 .mu.m by controlling the rotational speeds of the upper platen 13 and the lower platen 11. The thickness difference of the upper and lower surfaces of the same magnetic disk W become within -0.15 .mu.m to +0.15 .mu.

Abstract: A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion.

Abstract: A wafer loading and unloading mechanism is arranged in such a way that polished wafers stored in the loading cassette in a loading robot are not subject to dust contamination. The mechanism for moving loading cassettes mounted in a loading robot upward and downward is provided under the loading cassettes in order to prevent polished wafers from being contaminated with dust which may be generated or become airborne when driving force is transmitted.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring repositioning processes to be conducted simultaneously on at least two drill bits.

Abstract: A wafer edge grinding machine including a chuck rotatable about a first axis, a chuck basin having bottom and side walls surrounding the chuck and a fine aligner disposed over an open top of the basin and configured to deliver wafers to the chuck. The machine further includes a probe having a sensor contact surface and a shifting mechanism adapted to selectively withdraw the sensor contact surface to a storage position and extend the contact surface to a measurement position. The probe also includes a mounting structure adapted to secure the probe to one of the walls in the basin with the probe being mounted in the basis to position the contact surface adjacent the perimeter of a wafer disposed on the chuck. The shifting mechanism includes a remotely operable control adapted to allow a user to operate the shifting mechanism from a location remote from the basin.

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

Abstract: A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided between the workpiece holding section and the robot body and has an area not smaller than the workpiece holding section.

Abstract: A shuttle system for transferring a semiconductor wafer from a receiving station to a horizontal-oriented head drive of a wafer polishing machine includes a linear horizontal rail extending from a first position to a second position; a wafer transfer assembly adjacent to the first position; a wafer conveying assembly movable along the rail from adjacent the first position to adjacent the second position; and wherein the wafer conveying assembly includes a vertically movable and radially movable gripper for gripping peripheral edges of a wafer to be transferred and conveyed from the transfer assembly to the head drive. The transfer assembly includes a transfer receiver for receiving an unpolished wafer from a cassette which receiver is movable to the second position where the gripper is movable to edge-grip the received unpolished wafer. The gripper includes a series of radially movable segments having edge-contacting fingers depending therefrom for gripping the wafer edges.

Abstract: A chemical, mechanical polisher having a plurality of cylindrical rollers rotating orthogonally to a rotating work piece that they wipe and cover that are conditioned to uniformly receive a cleaning agent for polishing the work piece.

Abstract: A sphere polisher capable of making uniform conditions under which balls are polished is provided. The inner and outer polishing circuits are defined by the grooves 23 provided on the rotative disc 10 and the fixed disc 20. The storage conveyor 50 is provided with an outer ball guiding passage 55 and an inner ball guiding passage 56. The ball supply chute 57 is provided with the inner chute portion 57a connecting the inner polishing circuits with the outer ball guiding passage 55, and the outer chute portion 57b connecting the outer polishing circuits with the inner ball guiding passage 56. The ball discharge chute 58 is provided with the inner discharge chute portion 58a connecting the inner polishing circuits with the inner ball guiding passage 56, and the outer discharge chute portion 58b connecting the outer polishing circuits with the outer ball guiding passage 57.

Abstract: A loading apparatus (14) loads a workpiece (16) into a through-feed mechanism (20, 22, 24) which advances the workpiece (16) through a processing device (12) at an advancement speed. The loading apparatus (14) includes a roller assembly (30, 32) which grips the workpiece (16), and further includes a motorized drive train (34) which drives the roller assembly (30, 32) to urge the workpiece (16) toward the through-feed mechanism (20, 22, 24) at a speed greater than the advancement speed. The drive train (34) includes a slip clutch (86) which permits slippage in the drive train (34) under resistance transmitted through the workpiece (16) from the through-feed mechanism (20, 22, 24) to the roller assembly (30, 32). The roller assembly (30, 32) loads the workpiece (16) against the resistance of the through-feed mechanism (20, 22, 24) at a speed not greater than the advancement speed.

Abstract: A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.

Abstract: Wafer demount apparatus automatically demounts and transports a polished semiconductor wafer to an inspection station. The apparatus includes a bridge located between a polishing block supporting wax-mounted wafers and an offload conveyor. The bridge fills the gap and provides a smooth transition surface for the wafers moving from the polishing block to the conveyor. The bridge is also capable of movement to achieve vertical and horizontal alignment with the polishing block.

Abstract: An automatic sample preparation system for polishing and grinding metallurgical and other samples prior to microscopic examination of the samples, including a rack which holds a plurality of abrasive platens, and platen transfer mechanism for selecting one platen from the rack and transferring the same to a platen drive plate for a polishing operation and for later returning the platen to the rack and transferring another selected platen to the platen drive plate, and a polishing head which can be rotated between a polishing position for polishing samples and a wash position where it is over a wash and dry station, the platen transfer mechanism being operated when the polishing head is rotated to its wash position.

Abstract: A method of working a workpiece with an apparatus comprising the steps of holding the workpiece by a holding means, rotating the held workpiece by a rotational means in a direction of a tool to match a rotational axis line of the workpiece with a rotation axis line of the tool, matching a vertical axis of the holding means holding the workpiece with an intersection of a swingable rotation axis line of a means for swingably rotating the tool and the tool rotation axis line, and holding the workpiece above the tool and the working the workpiece by exerting work pressure on the workpiece.

Abstract: In a polishing machine for polishing parts between a table and an upper polishing head, the upper polishing head includes push rods to clear the workpieces after a polishing operation. A push ring engages the push rods as a polishing head is being raised, holding the workpieces in position on the table.

Abstract: An apparatus for grinding tapered points on needles is disclosed. The apparatus has a frame and a transport associated with the frame for transporting a plurality of needles. The transport has a predetermined curvature and a feeder is mounted adjacent the frame for feeding needles to the transport. A grinding wheel is disposed adjacent the transport and has a major diameter at a first end and a minor diameter at a second end, the major diameter being greater than the minor diameter and connected by a curved grinding surface the diameter of which increases progressively therebetween. The curvature of the grinding wheel in a first third portion between the major and minor diameters is of greater mean curvature than the mean curvature of the corresponding opposed portion of the transport. A second third portion of the grinding wheel is of greater mean curvature than the mean curvature of the corresponding opposed portion of the transport.

Abstract: An automatic drill loader is used with a drill grinding machine to automatically present drills to the drill grinding machine workhead for being ground thereat and to carry ground drills to a storage receptacle. The automatic drill loader comprises a magazine, a timing station, and two sets of grippers. The magazine stores a quantity of drills, which may have stepped shanks. The magazine is adjustable to suit drills of different lengths and diameters. The magazine presents one drill at a time to a staging station. A load gripper grips the drill at the staging station and conveys it to the timing station, whereat the drill is linearly and angularly oriented. The load gripper then transports the drill to the drill grinding machine workhead. Simultaneously, an unload gripper carries a ground drill from the drill grinding machine workhead to the storage receptacle.

Abstract: An apparatus for abrading articles. The abrading apparatus includes a number of abrading stations located adjacent to one another so that as an article is abraded at one station, a previously abraded article will be redundantly abraded at the adjacent station. The apparatus further includes fixtures having non-clamping holders which gravitationally retain the articles. The fixtures also allow the articles to be manipulated about an axis so that all surfaces of the articles can be abraded and so that abrasive materials which have collected in surface irregularities of the articles can be emptied therefrom.

Abstract: A steel ball machining apparatus comprises a cylindrical ball storing vessel having an opening, a steel ball machining mechanism, a steel ball supply path for supplying steel balls to said machining mechanism from the opening in said vessel, a steel ball discharge path for discharging the balls from said machining mechanism, and an elevating conveyor is provided between the discharge path and the cylindrical vessel, the elevating conveyor having a ball receiving vessel which is adapted to move between a lower position in which the ball receiving vessel aligns with the discharge path and an upper position over the cylindrical vessel, a lifter of said ball receiving vessel, a ball return path provided at the upper position for feeding the balls from the ball receiving vessel over to the cylindrical vessel, the return path having a ball exit adapted to discharge the balls to said cylindrical vessel at radially different positions therein.