Abstract: A carrier head for chemical mechanical polishing includes a base assembly and a membrane assembly connected to the base assembly. The membrane assembly includes a membrane support, an inner membrane secured to the membrane support, wherein the inner membrane forms a plurality of individually pressurizable inner chambers between an upper surface of the membrane and the membrane support, and an outer membrane secured to the membrane support and extending below the inner membrane, the outer membrane having an inner surface and an outer surface, wherein the outer membrane defines a lower pressurizable chamber between the inner surface of the outer membrane and a lower surface of the inner membrane, wherein the inner surface is positioned for contact by a lower surface of the inner membrane upon pressurization of one or more of the plurality of chambers, and wherein the outer surface is configured to contact a substrate.

Abstract: Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300A and 300B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.

Abstract: A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.

Abstract: A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.

Abstract: A system for association of data elements within a document is disclosed. An input data receiving subsystem receives an input data source of the document. A feature generation subsystem obtains one or more lists of personal data, generates one or more personal data features representing a relationship between one or more personal data elements. An affinity computation subsystem assesses each of the one or more personal data features, computes affinity score between the one or more personal data elements, generates one or more affinities. A personal data relationship identification subsystem assigns the one or more personal data elements to corresponding one or more identification stages, derives a set of identities corresponding to the one or more personal data elements. An identity filtration subsystem receives the one or more affinities and the set of identities, determines a validation of the set of identities, filters out the set of identities.

Abstract: A polishing head capable of preventing contact between both side walls of an elastic membrane when a negative pressure is formed in a pressure chamber formed by the elastic membrane. The polishing head includes: a first elastic membrane configured to press the workpiece against the polishing pad; a retainer ring surrounding the first elastic membrane; a second elastic membrane configured to press the retainer ring against the polishing pad; a carrier to which the first elastic membrane is secured; and an attachment member arranged in a pressure chamber formed by the second elastic membrane and fixing the second elastic membrane to the carrier. The attachment member has a support portion extending toward the retainer ring along a side wall of the second elastic membrane.

Abstract: A chuck includes a chuck surface, a plurality of vacuum ports being distributed over the chuck surface. Each of the vacuum ports is open to a conduit that is connectable to a suction source that is operable to apply suction to that vacuum port. A flow restrictor is located within each conduit and is characterized by a flow resistance. The flow resistance of the flow restrictor in at least one conduit is less than the flow resistance of the flow restrictor in at least one other conduit.

Abstract: The present invention relates to a turntable mechanism, including a flat plate and a rotating device for driving the flat plate to rotate, where the flat plate rotates to generate a negative pressure between a lower surface of the flat plate and a surface of an adsorbed object, the flat plate and the adsorbed object adhere together by an adsorption force generated by the negative pressure, and in this case, a gap is kept between the lower surface of the flat plate and the surface of the adsorbed object. In the present invention, a continuous, consistent, and stable fluid film is formed between the turntable and the adsorbed object, and a secondary flow is not easily generated, thereby ensuring that the adsorption force between the rotating flat plate and the adsorbed object is more stable.

Abstract: A grinding apparatus includes a chuck table that holds a wafer on a holding surface; a grinding unit that has a spindle unit in which a spindle with an annular grindstone mounted to a tip thereof is rotatably supported and that grinds the wafer by use of the grindstone; a grinding feeding mechanism that puts the grinding unit into grinding feeding in a grinding feeding direction perpendicular to the holding surface; a first height gauge that measures the height of the holding surface; a second height gauge that measures the height of an upper surface of the wafer; and a calculation section that calculates the difference between the height of the holding surface and the height of the upper surface of the wafer, as the thickness of the wafer. In the grinding apparatus, the first height gauge and the second height gauge are disposed in the grinding unit.

Abstract: An elastic member that includes a plurality of pressure chambers is manufactured without using a mold having a complicated shape. According to one embodiment, a laminated membrane used in a substrate holder of a substrate processing apparatus is provided. Such a laminated membrane includes a first sheet material and a second sheet material disposed on the first sheet material. A part of the first sheet material is secured to a part of the second sheet material.

Abstract: A compressible lip for a suction cup has in its engagement area one or more sectional areas, each of which comprises a flow passage capable of forming a flow restriction together with a surface of an object to be engaged by the lip. The flow restriction formed restricts airflow from the sectional area, thus allowing a suction cup provided with such lip to maintain an overall high vacuum level despite of pressure loss in one, or some, of its sectional areas. A suction cup having such compressible lip is also disclosed.

Abstract: A machining support configured to reduce spring back of a sheet following a machining operation on the sheet is presented. The machining support comprises a porous material with a plurality of surfaces including a support surface having a contour configured to contact and support the sheet; sealing material covering each of the plurality of surfaces except the support surface; and a vacuum port configured to provide a vacuum to the porous material.

Abstract: Provided is a glass film manufacturing method in which manufacture-related processing is performed on a glass film while the glass film (G) is conveyed, the glass film manufacturing method comprising the step of conveying the glass film (G) on a suction roller (46), wherein the suction roller (46a) is configured to suck only a center portion of the glass film in a width direction of the glass film (G).

Abstract: A suction cup can include a body and a skirt connected to a periphery of the body. The body can have an elliptical cross-section with a major axis that is longer than a minor axis. The body can include an aperture extending from a proximal side to a distal side. A stem can be positioned within the primary aperture. The stem can include an air conduit that can allow air to flow from the proximal side of the body.

Abstract: A support structure includes a discrete object side and a recess in the discrete object side, the recess formed to mate with a fixture side of a workpiece. A method for manufacturing a support structure includes registering a discrete object model to a blank model and forming a recess in a discrete object side of the fixture blank model.

Abstract: A cutting force analyser is provided, comprising weighing means adapted to determine the weight of an object and force applied to the object; a record of a force threshold for cutting the object; and indicating means. The analyser is formed to use the weighing means to differentiate between the weight of the object and cutting force applied to it, to compare the cutting force with the force threshold, and to use the indicating means to communicate how the force compares with the threshold.

Abstract: A method of processing a food item that includes moving a food item along a direction towards an automated slicer, wherein prior to the food item being sliced by the automated slicer the food item that is being moved has a length, L, as measured along the direction. The method further includes determining a thickness, T, of a slice of the food item to be generated by the automated slicer and slicing the food item that has the length, L, by the automated slicer so that a maximum possible number, Nmax, of slices of the food item are generated that have the thickness, T.

Abstract: A wafer holding apparatus for holding a wafer having undulation. The wafer holding apparatus includes a holding portion having a holding surface for holding the wafer, the holding portion being composed of a plurality of piezoelectric elements having suction holes selectively connected to a vacuum source, the piezoelectric elements having front end surfaces collected to form the holding surface. The wafer holding apparatus further includes a frame member supporting the holding portion and a control unit controlling a voltage to be applied to each of the piezoelectric elements according to the undulation of the wafer, whereby the wafer is held on the holding surface in the condition where the undulation of the wafer is followed by undulation produced on the holding surface due to a change in a length of each of the piezoelectric elements.

Abstract: Disclosed herein is a system for indexing a workpiece. The system comprises a vacuum source and a fixture plate, fluidly coupled with the vacuum source. The system also comprises an indexing stop, coupled to the fixture plate and fluidly coupled with the vacuum source. The indexing stop is actuatable between an extended position and a retracted position relative to the fixture plate. The vacuum source is selectively operable to concurrently apply a suction force to a workpiece supported on the fixture plate to urge the workpiece against the fixture plate and to the indexing stop to actuate the indexing stop from the extended position to the retracted position.

Abstract: Embodiments of the present disclosure generally relate to expandable substrate inspection systems. The inspection system includes multiple metrology units adapted to inspect, detect, or measure one or more characteristics of a substrate, including thickness, resistivity, saw marks, geometry, stains, chips, micro cracks, and crystal fraction. The inspection systems may be utilized to identify defects on substrates and estimate cell efficiency prior to processing a substrate. Substrates may be transferred through the inspection system and/or between metrology units on a track or conveyor, and then sorted via at least one gripper coupled with the high speed rotatory sorting apparatus into respective bins based upon the inspection data. The rotary sorting apparatus maintains a sorting capability of at least 5,400 substrates per hour. Each bin may optionally have a gas support cushion for supporting the substrate as it falls from the rotary sorting apparatus into the respective bin.

Abstract: A method for manufacturing a polishing head, includes: forming, on a lower end surface of an intermediate plate, a groove which extends from an inlet of an incompressible fluid to an outer peripheral portion of the intermediate plate and a groove which extends from an outlet of air to the outer peripheral portion of the intermediate plate, also including, after attaching an elastic film to a lower end surface of a rigid ring and coupling an upper end surface of the rigid ring with the lower end surface of the intermediate plate to form a space section: depressurizing the inside of the space section; and discharging the air in the space section from the outlet while pouring the incompressible fluid into the space section from the inlet after the depressurizing, and closing the inlet and outlet to seal the incompressible fluid in the space section.

Abstract: An apparatus for processing wafer-shaped articles, comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, and comprises a lower surface facing inwardly of the chamber. At least one heating element heats the lower surface of the lid to a desired temperature, so as to prevent condensation of process vapor on the inwardly facing surface of the lid.

Abstract: A reinforcement ring is for placement in a carrier head to abut an inner surface of a perimeter portion of a flexible membrane. The reinforcement ring includes a substantially vertical cylindrical portion, a first flange projecting inwardly from the bottom of the cylindrical portion, and a second flange projecting outwardly from a bottom of the cylindrical portion. The second flange projects downwardly at a non-zero angle from vertical.

Abstract: A device for the fine machining of optically active surfaces in particular spectacle lenses, has a spindle shaft which has a tool-holder portion and is mounted in a spindle housing such that it can rotate about a tool rotation axis. The device has an electric rotary drive with a rotor and a stator that rotates the spindle shaft operatively connected to the rotor about the tool rotation axis. The tool-holder portion can be displaced axially in the direction of the tool rotation axis. The rotor and the stator parts are axially guided in a guide tube along the tool rotation axis. The spindle shaft is in the form of a hollow shaft, via which the tool-holder portion, which is configured to hold a membrane chuck, can be subjected to a fluid.

Abstract: A chucking device is disclosed. The chucking device includes plural protruding portions that support the central portion of a semiconductor substrate and that are provided on a base portion. The chucking device also includes a cylindrical peripheral portion that supports the outer peripheral portion of the semiconductor substrate, plural suction holes that chuck the semiconductor substrate, and a vacuum source that vacuum draws the plural suction holes at differing timings. A plurality of mutually independent vacuum drawable suction holes are provided in at least one portion of the protruding portions.

Abstract: A horizontal scanner, a vertical scanner, and a dual-configuration scanner that is able to convert between a horizontal scanner and a vertical scanner is described herein.

Abstract: A workpiece support apparatus is provided with a plurality of support members. The support members support a workpiece. Each support member moves along a moving path to a machining position while the support member is held at a first holding position for supporting the workpiece or a second holding position which is spaced apart from the first holding position. At least one support member is displaced from the first holding position to the second holding position or from the second holding position to the first holding position along a machining trajectory, before the support member arrives at the machining position whenever each support member is moved to the machining position.

Abstract: Molding bench for curving mirrors comprising a sheet (1) supported on a frame by means of a joint system that prevents the sheet (1) from shifting and moving and to the lower part of which are fixed a series of air pipes (14) having a general air header pipe (3) connected to a vacuum pump. The sheet (1) consists of a square lattice the intersections of which have perforations that match up with a series of suction points of the air pipes (14), intended to produce a vacuum in the bench and which have been previously calibrated, such that said bench can be used to manufacture mirrors having any curvature.

Abstract: A tool configured to install and torque multiple fasteners, such as nuts and/or bolts, positioned in confined and/or hard to reach areas. The tool includes a body portion, a plurality of fastener retainers, and a structure which permits both the remote tightening and torquing of such fasters. The tool also provides an actuator for the remote release of torque loads which may build up in the fastener retainers during such torquing of the fasteners. The actuator includes a lever arm pivotally connected to the body portion and a cam that is rotatable between a first position and a second position. A linkage is engaged by the cam and urges the lever arm to a torquing position upon the cam being in the first position and to a torque release position upon the cam being in the second position.

Abstract: A substrate processing apparatus capable of accurately aligning a center of a substrate, such as a wafer, with an axis of a substrate stage and capable of processing the substrate without bending the substrate is disclosed. The substrate processing apparatus includes a first substrate stage having a first substrate-holding surface configured to hold a first region in a lower surface of the substrate, a second substrate stage having a second substrate-holding surface configured to hold a second region in the lower surface of the substrate, a stage elevator configured to move the first substrate-holding surface between an elevated position higher than the second substrate-holding surface and a lowered position lower than the second substrate-holding surface, and an aligner configured to measure an amount of eccentricity of a center of the substrate from the axis of the second substrate stage and align the center of the substrate with the axis of the second substrate stage.

Abstract: The invention relates to a method for the multi-stage grinding of workpieces (20) made of hard mineral materials using a robot (10). To this end, the workpiece (20) is moved into a processing region (21) and measured and/or oriented there by the robot (10). The robot (10) comprises a grinding head (11) by way of which it then takes up a first abrasive (14) preferably from a storage container (30) and starts a first grinding process. After the first grinding process is complete, the robot (10) releases the first abrasive (14) again and then takes up a second abrasive (14), preferably from the same or some other storage container (30). Then the robot (10) starts a second grinding process, and after the latter is complete, releases the second abrasive (14) again. One or more further grinding processes may be provided, but the grinding method can also be finished after the second grinding process.

Abstract: Hard-material, flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached with vacuum to the flexible elastomeric membrane of a wafer carrier that allows one surface of the workpiece to be in conformal abrading contact with a moving flat-surfaced abrasive. The elastomeric membrane external wafer attachment surface has a pattern of recessed vacuum grooves and vacuum is supplied to the grooves to firmly attach the rigid-material silicon wafer in flat-surfaced contact with the membrane. The attached wafer seals the vacuum grooves and also provides lateral stiffness to the center portion of the membrane. An outer annular extension of the flexible elastomer membrane maintains the wafer at its original membrane-centered location when abrading forces are applied to the rotating wafer. The rotating wafer peripheral edge does not contact a rigid retaining ring during a wafer polishing procedure.

Abstract: A method of transporting a semiconductor wafer having a ring-shaped stiffening portion can include the steps of pressing the semiconductor wafer from the back surface side to the front surface side thereof on a place different from a place at which the semiconductor wafer is to be held, the step of pressing the semiconductor wafer being conducted before holding the semiconductor wafer having the ring-shaped stiffening portion. The method can include releasing the attachment by suction of the front surface of the semiconductor wafer by supplying a positive pressure onto the chuck table, releasing pressing the semiconductor wafer from the back surface side to the front surface side thereof on the place different from the place at which the semiconductor wafer is to be held and picking up the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer.

Abstract: A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.

Abstract: A suction-holding apparatus includes a suction plate made of an air-permeable material, a holding member formed with a through-hole in which the suction plate is placed, and a base to which the holding member is attached. The suction plate includes a jutting-out portion so that the outer edge of the rear face is disposed outwardly from the outer edge of the front face. The through-hole includes a first edge and a second edge spaced apart from each other in the thickness direction. The first edge is adjacent to the base. The holding member includes an eaved portion so that the second edge of the through-hole is disposed inwardly from the outer edge of the rear face.

Abstract: An apparatus for surface finishing workpieces has a workpiece holder, on which a chucking device for releasably fixing the workpieces to be machined is secured, and a container arranged underneath the workpiece holder in order to receive grinding and/or polishing granules, which can be moved relative to the workpiece holder. A chucking device has a chuck, which is designed for at least partially positive holding of the workpiece for conjoint rotation. The chucking device furthermore has a vacuum duct, which can be connected to a vacuum generator and which opens into the chuck in order to hold the workpiece in such a way that it is fixed axially by the application of a vacuum to the vacuum duct. The chuck of the chucking device is arranged on an adapter piece, which can be fixed releasably on a supporting part of the chucking device.

Abstract: A device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film.

Abstract: A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

Abstract: Among other things, one or more techniques and/or systems are provided for driving a body of a polishing head using an alignment gear. That is, an alignment gear, coupled to a housing of the polishing head, can transfer rotational force from the housing to the body responsive to the alignment gear being mated with a channel associated with the body. For example, the housing can supply pressure to the body, resulting in the body and the housing moving towards one another into a mated state. When the body and the housing are in the mated state, the alignment gear can mate with the channel (e.g., the alignment gear can fit within the channel). In this way, the alignment gear can drive the body by transferring rotational force to the body, resulting in the body rotating a semiconductor wafer against a polishing pad to polish the semiconductor wafer, for example.

Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.

Abstract: A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.

Abstract: A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit contacting with the glass and capable of being passively rotated due to the rotation of the glass, a moving unit for moving the upper unit in a horizontal or vertical direction, and a polishing slurry supply unit for supplying a polishing slurry to the glass through the upper unit.

Abstract: A reticle carrier for a polishing tool capable of accommodating a reticle includes a base plate with an obverse and reverse surfaces, a retaining ring secured to the obverse surface of the base plate forming a recess defined by the obverse surface of the rigid base plate and internal edges of the retaining ring. A reticle pad supports a reticle in the recess. The base plate and the reticle pad having an array of matching, aligned passageway holes therethrough for exhaustion of air from space between the base plate and a the reticle and for supply of air to that space so a vacuum can retain a the reticle in place on the reticle carrier under vacuum conditions and application of air under pressure can eject a reticle from the reticle carrier.

Abstract: A wafer carrier with a wafer mounting plate disposed under a plenum which can be pressurized and depressurized to alter the shape of the wafer mounting plate and a plenum, formed with the wafer mounting plate and the wafer itself, to which vacuum can be applied to hold the wafer to the wafer mounting plate during polishing

Abstract: A polishing head is presented. The polishing head includes a housing having top and bottom surfaces. The housing is formed from a single piece of material. The polishing head includes grooves disposed on the bottom surface and an inlet in communication with the grooves for coupling to a pressure medium supply to supply a pressure medium to the grooves. The pressure medium when supplied to the grooves exerts pressure on a template when attached to the bottom surface to provide back side pressure on a back surface of an article when temporally attached to the template.

Abstract: A suction apparatus 1 holds a wafer W by performing vacuum-suctioning on the wafer W. The suction apparatus 1 comprises a suction substrate 2. The suction substrate 2, which is rigid, comprises a plurality of pin-like protrusions 2a formed so that the tip-end faces (upper surfaces) thereof are the same height. An elastic coating layer is coated by way of an undercoat layer 4 on the tip-end faces of the protrusions 2a. When the wafer W is suctioned, even if a foreign matter is interposed between the wafer W and the suction surface, because the foreign matter embeds itself into the coating layer 3, the planarization of the wafer W is improved. In addition, because the coating layer 3 can be made comparatively thinner, undulations in the wafer W can be reduced and, to that end, the planarization of the wafer W in the suctioned state can be improved.

Abstract: A robotic manipulator for clamping a workpiece includes a power source, a first rotary member, and a clamping mechanism. The first rotary member is connected to and rotated by the power source. The clamping mechanism is non-rotatably connected to the first rotary member and includes a first clamping member and a second clamping member capable of coupling to and decoupling from the first clamping member. The first clamping member and the second clamping member are coupled to each other. A receptacle is defined between the first clamping member and the second clamping member to receive the workpiece. The receptacle has a shape and size substantially the same as the workpiece.

Abstract: Techniques for manufacturing sheet product of varying surface profile and products thus manufactured are disclosed herein. In some embodiments, the disclosed invention provides a method for profiling a surface of a sheet product having a first profile on first surface. In one embodiment, the method includes creating a profiling template or contoured support surface. A profiled surface may be formed by arranging the profiling template and the sheet product such that the profiling template is located between the sheet product and a support surface, conforming the arrangement of the sheet product and the profiling template to the support surface such that conformance causes the sheet product to have a second surface profile on the first surface, and processing the sheet product to form a third surface profile on the first surface.

Abstract: An automatic machine and an automatic method for grinding the perimetric edge of rectangular or nonrectangular of glass sheets arranged substantially vertically, comprising at least one conveyor and at least one workhead provided with an abrasive tool for grinding the glass sheet at its edge, following its perimetric profile by way of the relative action of movement of the glass sheet and movement of the at least one workhead. During grinding, the glass sheet is no longer supported and moved by the conveyor but by at least one carriage, to which the glass sheet is coupled by way of at least one sucker.

Abstract: A chemical mechanical head includes a retaining ring to maintain a substrate beneath the mounting surface during polishing. The retaining ring has a lower portion with a bottom surface for contacting a polishing pad during polishing and made of a first material, such as plastic, and an upper portion made of a second, different material, such as metal.