Abstract: An apparatus for grinding wafers includes a grind chuck, formed of a soft material having a high elastic modulus, formed on a grind table. A grind unit grinds the wafer held by the grind chuck. Deionized water is supplied onto the wafer by a supply duct. A dam is formed on the grind table to surround the grind chuck, so that the wafer and the grind unit are submerged during grinding of the wafer. Also, an exhaust hole is formed through the grind table within an area surrounded by the dam, to exhaust the deionized water from the area surrounded by the dam.

Abstract: A chuck means for flat workpieces, in particular semi-conductor wafer for the chemical-mechanical polishing, comprising a circular housing which is attached to a driving spindle for rotation therewith and has a top wall and an annular side wall, a retaining ring which forms the lower part of the side wall, a chuck plate of rigid, however elastically deformable material which has an upper and a lower side and a plurality of openings at the lower side as well which openings are in connection with radial and axial parallel passages in the chuck plate, the passages being in fluid connection with an axial passage in the spindle, the axial passage being connected to a vacuum and/or fluid source, the chuck plate being floatingly and vertically movably located in the housing, a plurality of pressure chambers above the chuck plate, the pressure chambers having lower wall portions which are yieldable and engage the upper side of the chuck plate, pressure manifold means which are connected with a fluid source under pres

Abstract: Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization.

Abstract: A semiconductor wafer assembly is constituted such that the back surface of a tape is stuck to the surface of a frame and a semiconductor wafer is stuck to the surface of the tape. A machining apparatus has chuck tables for supporting the semiconductor wafer assembly, and each of the chuck tables has a semiconductor wafer placing surface for supporting the back surface of the tape to which the semiconductor wafer is stuck and an annular frame placing surface for supporting the back surface of the frame, formed, in the outer peripheral side of the semiconductor wafer mounting surface, at a position below the semiconductor wafer placing surface with a level difference therebetween.

Abstract: To devise a carrier device in which no air can accumulate between the flexible board and the carrier surface when the flexible board is held securely by vacuum suction by the carrier surface, the carrier surface of the carrier device on which the flexible board is placed is provided with an opening for supplying a vacuum and with several grooves which extend radially from the opening, the grooves being connected to one another only at the opening.

Abstract: This invention relates generally to the reduction of particulate material generation by workpiece handling components. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the surface and, in a preferred embodiment, through the application of an ion beam assisted diamond-like-carbon film coating deposition.

Abstract: The present invention provides a dual purpose workpiece handoff station for intermediately staging a semiconductor wafer, or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine. The handoff station includes a workpiece processing surface; such as a polishing pad or buffing pad, defining a plurality of apertures for applying fluids, including water, chemicals, slurry, or vacuum, to the surface of a workpiece. In operation, a workpiece carrier moves a polished wafer from a primary polishing surface to the handoff station, and polishes, buffs, or cleans the wafer in the handoff station by rotating the wafer and oscillating the wafer across the handoff station polishing surface while pressing the wafer thereon.

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract: A carrier with adjustable pressure zones and adjustable barriers between zones for distributing the pressure on the backside of a wafer. The pressure zones may be created using an elastic web diaphragm. One or more grooves are formed in the surface of the diaphragm to relieve vacuum formed between the diaphragm and wafer.

Abstract: A pedestal of a load-cup for supporting wafers loaded onto and being unloaded from a chemical mechanical polishing (CMP) apparatus includes a pedestal plate, and a pedestal film which extends over only a limited area at the upper surface of the pedestal plate. This area includes the regions directly around the fluid ports provided in the pedestal plate for vacuum-chucking the wafers and spraying deionized water. The pedestal plate may have a cross-shaped part, the entirety of which bears the fluid ports. The pedestal film may include annular members each extending around only a respective one of the fluid ports, or one or more members each extending radially around several of the fluid ports. By offering a rather limited contact area to the wafer supported on the pedestal, the pedestal film reduces the amount of contaminants which could be transferred to the wafer surface in contact therewith.

Abstract: A polishing head for performing chemical-mechanical polishing on a linear polisher has a dual stage wafer carrier assembly that incorporates a removable subcarrier. When in use, a main pressure chamber exerts a downforce on the subcarrier housing, while a separate secondary pressure chamber residing between the subcarrier housing and the subcarrier exerts a slightly different downforce on the subcarrier. Since the second pressure chamber exerts the downforce pressure directly on the subcarrier, the direct pressure application, as well as a more uniform distribution of pressure ensures for an improvement to the uniformity of pressure distribution. Additionally, the easily removal subcarrier allows for faster and easier removal of the subcarrier for cleaning and maintenance, as well as for changing inserts and improving process repeatability.

Abstract: A pedestal of a load-cup for supporting wafers loaded onto and being unloaded from a chemical mechanical polishing (CMP) apparatus includes a pedestal plate, and a pedestal film which extends over only a limited area at the upper surface of the pedestal plate. This area includes the regions directly around the fluid ports provided in the pedestal plate for vacuum-chucking the wafers and spraying deionized water. The pedestal plate may have a cross-shaped part, the entirety of which bears the fluid ports. The pedestal film may include annular members each extending around only a respective one of the fluid ports, or one or more members each extending radially around several of the fluid ports. By offering a rather limited contact area to the wafer supported on the pedestal, the pedestal film reduces the amount of contaminants which could be transferred to the wafer surface in contact therewith.

Abstract: A wafer holder includes a mounting plate for mounting a wafer and having a plurality of fluid holes, a decompressor for absorbing the wafer toward the mounting plate while sucking air between the mounting plate and the wafer through the fluid holes, and a liquid supply unit for supplying a liquid toward the wafer to release the wafer from the wafer holder. The liquid has a specific resistance lower than the specific resistance of water.

Abstract: A polishing apparatus (100) and method for polishing and planarizing a substrate (105) is provided that achieves a high-planarization uniformity across the substrate, while providing a more efficient use of slurry. In one embodiment, the apparatus (100) includes a subcarrier (160) with a flexible member (185) attached to a lower surface (165) of it on which the substrate is held. The flexible member (185) has at least one hole (195) therein so that a pressurized fluid introduced between the flexible member and the subcarrier (160) directly presses the substrate (105) against a polishing surface (125) during operation. The number and size of the holes (195) are selected to provide sufficient friction between the flexible member (185) and the substrate (105) to cause it to rotate when a drive mechanism rotates the subcarrier (160).

Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

Abstract: The present invention relates to an apparatus for cutting a wafer, wherein the wafer cutting process is performed along a back side of a wafer, a semiconductor chip being formed on the front side thereof, by cutting the wafer along the back side of the wafer by directly recognizing the semiconductor chip shape formed on the front side of the wafer thereby minimizing cutting defects due to sawing blade misalignment.

Abstract: A vacuum chuck/insert assembly (100) for firmly supporting a semiconductor wafer (106) during wafer processing. The vacuum chuck comprises a chuck (102) and a removable insert (104). The chuck includes a base (108) and a plurality of spacers (112) for holding the insert in spaced relationship to the base of the chuck. The chuck further includes first and second vacuum seals (116, 118) and vacuum ports (128) extending through the base of the chuck. The insert includes a base (132) and a plurality of spacers (136) for holding the wafer in spaced relationship to the base of the insert. The insert further includes a vacuum seal (140) and vacuum ports (146) extending through the base of the insert. During operation, vacuum applied to the vacuum chuck/insert assembly holds the insert firmly in contact with the chuck and the wafer firmly in contact with the insert.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

Abstract: A multi-zoned carrier for a chemical-mechanical planarization (CMP) polishing device includes a center cell, a middle cell, and an outer cell. Each of the cells are in fluid communication with each other through multiple conduits equipped with flow restrictors. The combination of cells and conduits allows more uniformity and planarity to be achieved during the chemical-mechanical planarization (CMP) polishing process.

Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

Abstract: A wafer mounting plate for use in a polishing apparatus is disclosed. The wafer mounting plate includes a metal plate and a screen mounted to a top surface of the metal plate. The metal plate is normally formed of circular shape and provided with a plurality of vacuum passageways therethrough. The metal plate has a bottom surface for engaging a membrane member and a wafer by vacuum through the plurality of vacuum passageways, and a top surface for engaging a pressurizing means, such as a pneumatic gasket. The screen mounted to the top surface of the metal plate has a multiplicity of apertures each of a size not larger than 0.5 mm in diameter. The screen is mounted sandwiched between the top surface of the metal plate and the pressurizing means. The screen effectively prevents debris of a wafer breakage from entering a vacuum system that is used for holding the wafer on the wafer mounting plate.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: The wafer handling and support system disclosed herein does not use tape and is adapted for use in conjunction with a number of work stations. The wafer handling and support system includes a chuck plate comprised of a non-porous section surrounding a porous section and a robotic arm for transporting a chuck plate/wafer combination under vacuum. The chuck plate is sized to be carried by a wafer chuck and the porous section of the chuck plate is configured to support a wafer. The wafer may be held in place on the chuck plate by the application of a vacuum.

Abstract: A substrate holder is described which has a movable plate elastically mounted inside a main body. With the substrate holder, a polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate. In a first (downward) mode the movable plate stays in mechanical contact with the substrate whereas in a second (upward) mode an air cushion is generated in a chamber between the movable plate and the substrate for pressurizing the substrate onto the polishing pad.

Abstract: A chemical mechanical polishing machine is provided with a platen that has an integral sub-pad. A fixed abrasive polishing layer is mounted, without adhesive between the polishing layer and the sub-pad, to the top surface of the platen and the sub-pad. The polishing layer is vacuum mounted, for example, to the integral sub-pad of the platen. A cooling arrangement is provided in the platen that cools the polishing layer and improves product quality.

Abstract: The present invention uses some type of inflatable membrane during processing to establish a vacuum and/or provide a resilient cushion on which the backside of the wafer can rest. In one aspect, the present invention provides an outer vacuum that allow for attachment of the wafer to the carrier head during processing, and also provides an inner inflatable membrane that provides a resilient cushion on which the backside of the wafer can rest during processing. In other aspects, the present invention provides a membrane that is displaceable with a vacuum within certain cavity regions to provide for attachment of the wafer to the wafer carrier.

Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A central portion of the flexible membrane is formed of a first material with a different rigidity than a second material that forms the annular portion of the flexible membrane.

Abstract: An apparatus for removing semiconductor wafers from within the runner disks in a double-sided polishing machine. The apparatus includes a suction head adapted to be connected to a vacuum, which has a plurality of suction ports such that all semiconductor wafers received by a runner disk may be gripped simultaneously. The apparatus also includes an arm on which the suction head is rotatably supported about a vertical axis and which, in turn, is pivotally supported about a vertical axis at a spacing from the suction head or is supported so as to be linearly adjustable or adjustable in height. The apparatus also includes a rotary drive for the suction head, a drive for the arm, a lifting drive for the arm, and a control device for activating the drives such that the semiconductor wafers may be deposited on a lay-down device in a predetermined, aligned position.

Abstract: The present invention delineates a carrier for an apparatus (10) which polishes a surface of a semiconductor wafer (56, 124). In a preferred embodiment, the carrier includes a rigid plate (34) connected to one or more diaphragms (40, 42) of soft, flexible material that provide pressurizable cavities (50, 52) having respective surfaces for contacting the back surface of the wafer. A plurality of conduits (28a, 28c) are used to selectively pressurize the diaphragm cavities. The carrier head may also include an inter-diaphragm cavity (54) formed between a portion of one diaphragm, a portion of another diaphragm, and the semiconductor wafer. The inter-diaphragm cavity is provided with its own conduit (28b) by which a source of pressurized fluid and a source of vacuum are selectively connected to the inter-diaphragm cavity. During operation, pressure and/or vacuum may be applied through one or more cavities to chuck (90) a wafer, and to pressurize (96) the cavities during polishing.

Abstract: A carrier head for a chemical mechanical polishing apparatus. A layer of conformable material is disposed in a recess of the carrier head to provide a mounting surface for a substrate. The conformable material may be elastic and undergo normal strain in response to an applied load. The carrier head may also include a support fixture detachably connected to a backing fixture, a retaining ring connected directly to the conformable material, and a shield ring which projects over a portion of the layer of conformable material.

Abstract: A retainer ring of a polishing head of a CMP apparatus facilitates the removal of contaminants, such as slurry debris, which have found their way into the polishing head. The retainer ring includes an annular ring body, and a plurality of contaminant outlets extending from the inner peripheral surface of the ring body to the outer peripheral surface of the ring body. Inner openings defined at the inner peripheral surface of the ring body and outer openings defined at the outer peripheral surface of the ring body by the contaminant outlets are horizontally elongated slots. Also, each of the contaminant outlets consists of a plurality of inner holes and an outer hole which is joined to the plurality of inner holes. The contaminant outlets occupy at least 30% of the radially innermost peripheral surface along a line extending circumferentially along the surface.

Abstract: A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.

Abstract: A polishing head for performing chemical-mechanical polishing on a linear polisher has a flexible diaphragm coupling between a wafer carrier and a support housing which houses the wafer carrier. The diaphragm allows the carrier to move-substantially in the vertical direction within the housing, but a center shaft assembly limits movement in the horizontal direction.

Abstract: A polishing apparatus for polishing a subject surface of a thin-plate-like object that is held by a rotary polishing head with a polishing pad that is mounted on the surface of a rotary polishing surface table. The polishing head has sucking structures such as suction grooves and a through-hole. An elastic holding film that is formed with a plurality of through-holes are attached to the object holding surface of the polishing head. The object is polished in a state that it is sucked and held by the polishing head via the holding film by vacuum suction force.

Abstract: An abrasive machine is capable of solving the liquation of metal ions, and improving abrading accuracy. In the abrasive machine, an abrasive plate has an abrasive face capable of abrading a wafer. A holding section includes: a head member located above the abrasive face; a holding plate provided between the head member and the abrasive face, the holding plate having a holding face capable of holding the wafer; and a bellows fixed between the holding plate and the head member, the bellows allowing the holding plate to move close to and away from and incline with respect to the head member, the bellows forming a pressure chamber. Pressing means presses the wafer onto the abrasive face, with the holding plate, by pressurizing the pressure chamber. The bellows is made by cutting a block of plastic without forming seams.

Abstract: A carrier head for a chemical mechanical polishing apparatus a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.

Abstract: A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.

Abstract: Holding device for a spectacle lens for the purpose of inserting and removing the spectacle lens into or from a container and/or of mounting and removing it on or from a spectacle lens holding shaft of a spectacle lens edge processing machine by means of a handling apparatus, which holding device comprises a base which is held by the handling apparatus and has a depression, a controllable vacuum-pressure connection at the depression, and a spherical cap, which is arranged in the depression, bears tightly against an annular surface of the depression and has an opening to the depression and a sealing region at the edge of the spherical cap for the purpose of bearing against an optical surface of the spectacle lens.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: A system for facilitating transfer of a semiconductor wafer into or out of a wafer carrier of a polishing or lapping machine without contacting a face of the wafer. The system includes a wafer transport suitable for placement above the carrier, the transport having at least one open cavity with a size and shape suitable for registering alignment with an opening of the carrier. The cavity and opening together form a compartment adapted to receive and hold the wafer. A liquid delivery conduit having an outlet located above an abrading member of the machine is arranged to deliver a liquid to a position generally beneath the transport. A method for transferring the wafer to or from the machine includes delivering liquid beneath the wafer. The wafer thereby moves between a first position resting on the abrading member and a second position spaced above the abrading member where a tool may engage the edge of the wafer for holding the wafer without contacting the face of the wafer.

Abstract: The invention relates to an apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step. The apparatus includes a perimeter pin for lifting the substrate from the surface of the chuck to a first position wherein the substrate is disposed on the perimeter pin during lifting. The perimeter pin is configured to overcome a holding force at an interface of the substrate and the surface. Generally, the holding force is generated between the substrate and the surface during the processing step. The apparatus further includes a center pin for moving the substrate from the first position to a second position wherein the substrate is disposed on the center pin during moving. The second position is further away from the surface of the chuck than the first position.

Abstract: Disclosed is a CSP plate holder for use in dicing a CSP plate into individual pellets and in transporting and putting them in a transport tray. The CSP plate holder is composed of a flat plate for sucking and fixedly holding a CSP plate thereon. The flat plate has pellet areas each allotted to each of the individual pellets. Each pellet area has a through hole for sucking and fixedly holding the pellet while the CSP plate is being diced. Each pellet area has at least one suction hole for sucking and fixedly holding the pellet while the CSP plate is being transported. The flat plate has duct passages permitting the suction holes to communicate with a suction source for applying a suction force to the pellet. In addition, the flat plate has at least one minute through hole made in each pellet area.

Abstract: The present invention provides a wafer carrier for use with a chemical mechanical planarization apparatus. The wafer carrier includes a vacuum chuck and a retainer ring. The vacuum chuck is configured to hold and rotate a wafer for planarizing a surface topography of the wafer on a polishing pad. The vacuum chuck includes an inner region for holding the wafer and an outer region and further has a groove adapted to decouple the inner region and the outer region. The inner and outer regions of the vacuum chuck are arranged to move independently in a direction orthogonal to a polishing surface of the polishing pad. The retainer ring is disposed on the outer region of the vacuum chuck and is configured to retain the wafer during CMP processing. In this configuration, the decoupled retainer ring and the wafer are arranged to move independently to align to the polishing surface of the polishing pad during CMP processing.

Abstract: A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of the spindle shaft and having a seating for an adapter chuck, and a flexible vacuum/gas line provided between the seating and the spindle shaft. The arm is adjustable as to its angle of inclination relative to an axis of the spindle shaft.

Abstract: An eyeglass lens processing system, including: a data input unit, which inputs frame shape data for processing a lens to be fitted to an eyeglass frame and layout data for providing a layout of the lens with respect to a frame shape; a lens processing unit, having two shafts for clamping the lens, for grinding a periphery of the lens; a first conveying unit, which conveys a tray on which the lens is placed and to which a management code is applied, the management code interrelating the lens placed on the tray to the data inputted by the data input unit; a lens measuring unit, which obtains at least an optical center position of the lens; a second conveying unit that picks and holds the lens, disposes the lens at a predetermined position of the lens measuring unit, and mounts the lens to the shafts of the lens processing unit after measurement by the lens measuring unit; and an arithmetic unit, which obtains processing data based on: (1) data, read out based on the management code applied to the tray from the

Abstract: A method and apparatus are provided for handling planar structures, such as semiconductor wafers, with reduced breakage and cracking. The method includes the step of segmenting a wafer prior to grinding. The apparatus includes a segmented vacuum table for supporting wafer portions in position to be ground to a desired thickness. In another aspect of the invention, adhesive material is employed to individually secure wafer portions in position during the grinding process.

Abstract: The polishing uniformity of a material on a substrate is improved by using a polishing method where an applied pressure on the backside of the substrate is changed during the polishing process. The method is especially useful for polishing thin material layers requiring precise control of polishing across the substrate, e.g., for TaSiN layers used in the formation of gate stacks and stacked capacitors.