Abstract: The present disclosure relates to a cutting machine comprising a rotating cutting wheel for performing separating cuts in a workpiece, and also relates to a workpiece positioning device for such a cutting machine. The cutting machine comprises a cutting wheel and a drive motor for driving the cutting wheel, a clamping means for clamping the workpiece, means for mechanically positioning the workpiece along one or two translational directions and additionally about one or two rotation axes, and a lifting mechanism for setting the cutting wheel on the workpiece to perform separating cuts in the positioned workpiece using the cutting wheel.

Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

Abstract: A system and method for machining a workpiece to provide a toothed member having a desired tooth pattern. A cutting tool machines the workpiece to a first depth, thereby forming a semi-finished tooth pattern, the first depth less than a full depth to which the workpiece is to be machined to provide the desired tooth pattern. Dimensions of the semi-finished tooth pattern are acquired and compared to nominal dimensions. If the acquired dimensions are not within a tolerance of the nominal dimensions, the geometry of the cutting tool is modified for correcting deviations of the acquired dimensions from tolerance and the workpiece further machined by the modified cutting tool. Once the dimensions of the semi-finished tooth pattern are within tolerance, the workpiece is machined to the full depth for providing the desired tooth pattern.

Abstract: A machining program creating apparatus includes a tool-route generating unit sequentially executing, concerning each line segment, processing for setting an end point of a set tool route as an endpoint of interest and setting a line segment connected to the endpoint of interest as a next tool route and an NC-machining-program-creation processing unit creating the NC machining program. When a line segment not set as a tool route yet is present among line segments connected to the endpoint of interest, the tool-route generating unit sets the line segment not set as a tool route as a next tool route, and, otherwise, the tool route generating unit sets a line segment already set as a tool route as a tool route again between the endpoint of interest and an endpoint forming a line segment not set as a tool route yet.

Abstract: To execute machining for a front surface while rotating a work and, at the same time, apply machining to an eccentric position on an end face, according to an embodiment of the present invention, an NC device includes an arc-superimposition-interpolation control unit configured to rotate a work rotating shaft based on a command of a base axis program for controlling rotation of the work rotating shaft while performing front surface machining using a first cutter holder and, at the same time, subject a second cutter holder to position control on a second machining route obtained by superimposing the rotation of the work rotating shaft on a first machining route based on a command of a superimposition axis program for performing position control for the second cutter holder.

Abstract: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

Abstract: The invention relates to an apparatus for machining bevel gears in an indexing method and method for machining the pitch of gears, wherein the production-related pitch error is compensated. The apparatus (20) comprises an interface (11, 12) and can be connected to a measurement system (10) by means of this interface (11, 12). The interface is designed such that the apparatus (20) can take correction values or correction factors from the measurement system (10) in a form in order to be able to adapt master data or neutral data. The data, which was originally present in a memory (51) of the apparatus (20), is corrected on the basis of these correction values or correction factors before production of one or more bevel gears (31) is initiated on the apparatus (20).

Abstract: A slider comprises a slider section and an element section. The slider section has a first medium facing surface and an air inflow end. The element section has a second medium facing surface, an air outflow end, and a thin-film magnetic head element. The slider section and the element section are produced separately, and bonded to each other so that the air inflow end and the air outflow end are disposed on opposite sides with the first and second medium facing surfaces in between.

Abstract: A recording/reproduction element is mounted on a magnetic head slider via a piezoelectric element so that a displacement of the piezoelectric element performs fine control of the position of the recording/reproduction, thus enabling fine spacing and high track positioning accuracy. This improves linear recording density and track density. A pair of electrodes are formed on both sides of a piezoelectric element to constitute a piezoelectric actuator. One electrode is arranged opposite the rear surface (air flow out end) of a magnetic head slider 11. A recording/reproduction element is arranged on and electrically insulated from the other electrode. The piezoelectric element includes a piezoelectric element displaced in a spacing direction, enabling fine spacing control, a piezoelectric element displaced in the track direction, enabling fine track position control, and a piezoelectric element displaced in a magnetic disc rotation direction, enabling reduction of jitter of a reproduction signal.

Abstract: A two-phase rotary encoder is provided which includes a substrate for the encoder which is double-faced and has a copper-foil-bonded substrate etched thereon, a first ring-shaped electrode pattern and a second ring-shaped electrode pattern formed concentrically around a center hole on the substrate, a smooth, level ring-shaped comb electrode pattern formed on an outermost periphery of the substrate, wiring patterns which cover the electrode patterns through each of external connecting terminals provided on the substrate, and a common external connecting terminal provided on an edge of the substrate, formed on a surface thereof via the center hole or a through hole. The rotary encoder further includes a resin-molded case, a shaft, a gear-shaped rotor, a click mechanism and a tact switch mechanism.

Abstract: A thin-film magnetic head comprises a top pole layer incorporating a throat height defining layer and a yoke portion layer. The throat height defining layer is formed as follows. A magnetic layer to be a track width defining portion is formed on a recording gap layer. Next, the magnetic layer is selectively etched through the use of a mask so as to form an end portion of the magnetic layer for defining the throat height. Next, a nonmagnetic layer is formed to fill the etched portion of the magnetic layer while the mask is left unremoved. Next, the yoke portion layer is formed. Using the track width defining portion as a mask, the magnetic layer, the recording gap layer and a portion of the bottom pole layer are etched.

Abstract: Present processes used for planarizing a cavity filled with a coil and hard baked photoresist require that a significant amount of the thickness of the coils be removed. This increases the DC resistance of the coil. In the present invention, cavity and coil are overfilled with photoresist which is then hard baked. A layer of alumina is then deposited onto the surface of the excess photoresist, following which CMP is initiated. The presence of the alumina serves to stabilize the photoresist so that it does not delaminate. CMP is terminated as soon as the coils are exposed, allowing their full thickness to be retained and resulting in minimum DC resistance.

Abstract: A narrow track width read sensor having a high magnetoresistive sensitivity is made using a self-aligned process which requires the use of only a single resist mask. A plurality of sensor layers is deposited over a substrate. After forming a resist mask in the central region, first lead layers are deposited in the end regions and over the resist mask. Using the resist mask, ion milling is performed such that the first lead layers and sensor layers in the end regions are substantially removed but sensor layers in the central region remain, to thereby form a read sensor having lead overlays on the edges thereof. Hard bias and second lead layers are then deposited in the end regions and over the resist mask. After the resist mask is removed, the top of the read sensor may be oxidized through an exposure to oxygen plasma.

Abstract: Hard biasing of a magnetoresistive sensor or a spin valve sensor in a magnetic read head is initialized by repeatedly applying a magnetic field to the hard biasing at any level of fabrication of the magnetic read head or any combination of levels of fabrication of the read head such as at the wafer level, row bar level, single slider level, head gimbal assembly (HGA) level and/or head stack assembly (HSA) level.

Abstract: A magnetoresistive device having a first pole, a second pole, and a first tapered pole pedestal therebetween and magnetically connected to the second pole. The first tapered pole has a width that increases with increasing distance away from the air bearing surface, ABS. The magnetoresistive device can also include a second tapered pole pedestal magnetically connected to the first pole, and separated from the first tapered pole pedestal by a write gap. The second tapered pole pedestal has a width that increases with increasing distance away from the air bearing surface. A method of the present invention includes defining the trackwidth of a write element by lapping a tapered pole pedestal. More specifically, the trackwidth is given by a known taper angle, a zero throat width, and a throat height, wherein the throat height is controlled precisely by lapping.

Abstract: A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.

Abstract: The present invention uses some type of inflatable membrane during processing to establish a vacuum and/or provide a resilient cushion on which the backside of the wafer can rest. In one aspect, the present invention provides an outer vacuum that allow for attachment of the wafer to the carrier head during processing, and also provides an inner inflatable membrane that provides a resilient cushion on which the backside of the wafer can rest during processing. In other aspects, the present invention provides a membrane that is displaceable with a vacuum within certain cavity regions to provide for attachment of the wafer to the wafer carrier.

Abstract: Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grinding unit grinding edges of short or long sides of the unit liquid crystal display panel in a normal mode and a second grinding unit grinding the edges of the short or long sides of the unit liquid crystal display panel that are not ground by the first grinding unit in the normal mode or grinding the edges of the long and short sides of the unit liquid crystal display panel in an emergency mode.

Abstract: The instant invention provides a vibration insensitive method of precisely polishing an object. The method includes the steps of providing an object to be polished, applying a conductive material to a non-electrical current conductive surface of the object, removing a portion of the object and the conductive material through polishing, and measuring an electric current flowing through the conductive material to monitor a progress of the polishing. Advantageously, the method does not require the polishing process to be interrupted to monitor the progress of the polishing. In fact, since the progress is measured as a function of resistance/electrical current, the progress is measured with an accuracy and precision related to each individual turn of a polishing pad. Advantageously, the instant method is remarkably vibration insensitive and is practical for the simultaneous, automatic, and precise, polishing of monolithic objects.

Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.

Abstract: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a fixed abrasive polishing pad having metal abrasive elements selected to be a compound of metal in the substrate. Alternatively, the metal abrasive elements can include a refractory metal where the substrate includes a refractory metal. Where the substrate includes two metals, the abrasive elements can be selected to planarize the first metal at a rate that is less than approximately twice the rate at which it planarizes the second metal. A single fixed abrasive polishing pad and a single planarizing liquid can be used to planarize both metals.

Abstract: A method and apparatus for sensing a pierce-through condition of a material made by a piercing force in which a shield surrounding a source of the piercing force is supplied with a gas supply to create a pressure within the shield means. A decrease in pressure caused within the shield by a pierce-through condition created by the piercing force is then detected. A method and apparatus for detecting the distance between a nozzle assembly for a machining process and a workpiece to be machined in which gas is supplied to a shield surrounding a nozzle assembly. An increase in pressure in the shield is detected as an open end of the shield approaches a workpiece to be machined. A method and apparatus for obtaining and maintaining a predetermined gap distance between nozzle assembly and a workpiece for a machining process are provided by further detecting when the pressure within the shield means reaches a pressure corresponding values and ranges.

Abstract: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Abstract: A cylinder member holder is used to subject the outer circumferential surface of a cylinder member to cutting machining by non-rotatably supporting left and right ends of a tubular cylinder member by left and right holders and feeding a cutting tool longitudinally of the cylinder member while causing the cutting tool to rotate about the outer circumferential surface of the cylinder member. A plurality of discontinuous solid bodies which fill the inner diameter portion of the cylinder body so as to lie along the longitudinal direction thereof are inserted via a resilient body, thereby reducing or eliminating chatter vibration produced at cutting.