Rotary Patents (Class 451/402)
  • Patent number: 9033762
    Abstract: A master servo motor and a slave servo motor that synchronously drive for rotation a master main spindle provided with a center that supports one end of a work piece and a slave main spindle provided with a center that supports the other end of the work piece are included. Before grinding, a slip detection cycle that detects a limit current value for the servo motors, at which the work piece and the centers slip, is executed and, during grinding, a grinding condition is changed to prevent a slip between the work piece and the centers in advance at the time when any one of current values of the servo motors has reached a slip threshold value set on the basis of the limit current value.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: May 19, 2015
    Assignee: JTEKT Corporation
    Inventor: Akira Makiuchi
  • Patent number: 8979615
    Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: March 17, 2015
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Masayuki Nakanishi, Naoki Matsuda, Atsushi Yoshida
  • Publication number: 20150038065
    Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
    Type: Application
    Filed: August 18, 2014
    Publication date: February 5, 2015
    Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
  • Patent number: 8808062
    Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: August 19, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
  • Patent number: 8597081
    Abstract: A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: December 3, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Kwang Choi, Hong-Jin Kim, Keon-Sik Seo, Sol Han, Kun-Tack Lee, Byoung-Ho Kwon
  • Patent number: 8562390
    Abstract: A double-disc grinding apparatus having at least: a rotatable ring-shaped holder for supporting a sheet-like wafer having a notch for indicating a crystal orientation from an outer circumference side along a radial direction, the holder having a protruding portion to be engaged with the crystal-orientation-indicating notch; and a pair of grindstones for simultaneously grinding both surfaces of the wafer supported by the holder, in which the holder is provided with at least one protruding portion separately from the protruding portion to be engaged with the crystal-orientation-indicating notch, and the both surfaces of the wafer are simultaneously ground by the pair of the grindstones while the wafer is supported and rotated with the at least one protruding portion being engaged with a wafer-supporting notch formed on the wafer.
    Type: Grant
    Filed: April 20, 2009
    Date of Patent: October 22, 2013
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Kenji Kobayashi, Tadahiro Kato
  • Patent number: 8479372
    Abstract: A ring fixture system for rotating a ring to perform engraving work. The system comprises a vise-securable fixture base with opposing mandrels connected through spaced arms of the fixture base at a ring-engraving location between the arms to form a mandrel assembly. The mandrels are provided with sets of detents with different degrees of rotational spacing, and the detents on one mandrel of the mandrel assembly can be engaged independently of the other set of detents on the other mandrel. The fixture base further includes a tool-supporting bridge connected between the fixture arms above the ring-engraving location to hold an engraving tool orthogonally to the ring axis, and may further include a sliding tool support on the bridge. Also, a method is disclosed for engraving a ring using the ring fixture system with the detents and tool-supporting bridge.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: July 9, 2013
    Assignee: SDL Precision, LLC
    Inventors: David B. Lark, Christian DeCamillis, David W. Skrzypczak
  • Publication number: 20130143472
    Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 6, 2013
    Applicant: WHITE DRIVE PRODUCTS, INC.
    Inventor: Hollis N. White, JR.
  • Patent number: 8454413
    Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: June 4, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
  • Publication number: 20130090044
    Abstract: The present invention provides a drum for a shot blasting apparatus that uniformly treats the works to be treated by increasing the level of agitation of the works that are buried at the bottom of the drum, and, further, suppressing the traces of collisions on the works, which traces are caused by the works colliding with each other. The present invention also provides the shot blasting apparatus using the drum. The drum comprises a hollow middle part, a lower-half part having the shape of a truncated cone, having a closed, bottom, and having a projecting part for agitating that is connected to both the lower-half part and the middle part, and that agitates the works, wherein the projecting part for agitating has at least two surfaces, one being the surface for picking-up the works and the other being the surface for having the works slide down.
    Type: Application
    Filed: October 14, 2010
    Publication date: April 11, 2013
    Inventors: Ryo Tatematsu, Mitsuo Ishikawa, Tsunetoshi Suzuki
  • Patent number: 8360820
    Abstract: A robotic manipulator for clamping a workpiece includes a power source, a first rotary member, and a clamping mechanism. The first rotary member is connected to and rotated by the power source. The clamping mechanism is non-rotatably connected to the first rotary member and includes a first clamping member and a second clamping member capable of coupling to and decoupling from the first clamping member. The first clamping member and the second clamping member are coupled to each other. A receptacle is defined between the first clamping member and the second clamping member to receive the workpiece. The receptacle has a shape and size substantially the same as the workpiece.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: January 29, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Shang-Xuan Song, Cheng Zhang
  • Publication number: 20120289129
    Abstract: A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.
    Type: Application
    Filed: January 20, 2011
    Publication date: November 15, 2012
    Applicants: FUJIKOSHI MACHINERY CORP., SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Hiromasa Hashimoto, Kouji Morita, Takashi Aratani, Hiromi Kishida, Satoru Arakawa
  • Patent number: 8298046
    Abstract: Retaining rings are presented with specially designed inserts that increase rigidity and improve heat dissipation. Inserts that are more rigid, and that have better ability to conduct heat, are inserted into pockets positioned along the outer portion of the rings. The pockets do not compromise the upper, lower or inner portion of the rings. Because the inserts are more rigid than the material used in the body of the ring, they absorb the deforming forces resulting from fastening the ring to the carrier head. Because they are better conductors than the material used in the body of the ring, the ring is better able to dissipate heat generated during polishing. Moreover, because the inserts are positioned in the outer portion of the ring, the inserts are not exposed to the polishing surface during polishing and therefore are less likely to react undesirably with the chemicals used during polishing.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: October 30, 2012
    Assignee: SPM Technology, Inc.
    Inventors: George J. Frank, Jr., Adam W. Manzonie, William B. Sather
  • Patent number: 8221198
    Abstract: A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: July 17, 2012
    Assignee: Fujitsu Limited
    Inventors: Fumihiko Tokukra, Mitsuo Takeuchi
  • Publication number: 20120156966
    Abstract: An apparatus includes a base, a table rotatable on the base, and a plurality of arms extending above the table's top surface and extending laterally for supporting differently sized cylindrical objects above the top surface. An adjustment mechanism simultaneously adjusts the arms rotationally, such that the ends of the arms can be automatically adjusted to support any one of the differently sized objects without further change. A controller is programmed to automatically control the adjustment mechanism. The adjustment mechanism includes a center gear connected to planetary gears on each of the arms, and a center shaft that extends upwardly through a tubular drive shaft, the center shaft being movable between a lowered position where the arms are locked to the table and a raised position where the center gear is fixed to the base such that the arms adjust position when the table is rotated by its drive mechanism.
    Type: Application
    Filed: November 30, 2011
    Publication date: June 21, 2012
    Inventors: Gary E. Mulder, Gary L. Vander Stel
  • Publication number: 20120088441
    Abstract: A processing apparatus including a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported to the four processing unit supporting mechanisms, the four processing units respectively corresponding to four ones of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.
    Type: Application
    Filed: October 12, 2011
    Publication date: April 12, 2012
    Applicant: DISCO CORPORATION
    Inventors: Satoshi Yamanaka, Toshiyasu Rikiishi, Nobuyuki Takada
  • Publication number: 20120083189
    Abstract: A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.
    Type: Application
    Filed: September 23, 2011
    Publication date: April 5, 2012
    Inventors: Jae-Kwang Choi, Hong-Jin Kim, Keon-Sik Seo, Sol Han, Kun-Tack Lee, Byoung-Ho Kwon
  • Publication number: 20120040595
    Abstract: A template for polishing Silicon Carbide, Sapphire, Germanium, Silicon and pattern wafers having a slurry inlet, channels, outlets and pockets for holding said wafers terminating in peripheral vacuum ports in order to facilitate an efficient flow of slurry over the semiconductor wafers during a polishing process.
    Type: Application
    Filed: August 13, 2010
    Publication date: February 16, 2012
    Inventors: Phuong Van Nguyen, Thang Van Tran
  • Publication number: 20110237164
    Abstract: A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.
    Type: Application
    Filed: January 7, 2011
    Publication date: September 29, 2011
    Inventors: Masaya SEKI, Kenya Ito, Masayuki Nakanishi
  • Publication number: 20110217911
    Abstract: A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.
    Type: Application
    Filed: February 28, 2011
    Publication date: September 8, 2011
    Inventors: One-Moon CHANG, Jae-Phil Boo, Soo-Young Tak, Jong-Sun Ahn, Shin Kim, Kyoung-Moon Kang
  • Publication number: 20110171886
    Abstract: A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller disposed under the wafer, the second polishing roller extending in the direction in which the wafer extends. The wafer polishing apparatus uses the roller to polish the wafer. Thus, the wafer polishing apparatus may easily polish a wafer having a large area.
    Type: Application
    Filed: January 11, 2011
    Publication date: July 14, 2011
    Inventor: Hyung-Rak Lee
  • Publication number: 20110171882
    Abstract: A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.
    Type: Application
    Filed: January 5, 2011
    Publication date: July 14, 2011
    Inventors: Jong-sun Ahn, In-seak Hwang, Soo-young Tak, Shin Kim, One-moon Chang
  • Publication number: 20110136411
    Abstract: A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 9, 2011
    Inventors: Masayuki NAKANISHI, Masunobu Onozawa, Masaya Seki
  • Patent number: 7946325
    Abstract: A centering device (13) is arranged to surround a loading table (11) on which a lens blank (1) is to be set, to set the geometric center of the lens blank (1) to coincide with the center of the loading table (11). The centering device (13) includes three clamp pins (31) which press the peripheral surface of the lens blank (1). When centering is ended, the loading table (11) on which the lens blank (1) is set is pushed up by a moving device (12) from a centering position (H1) to a block position (H2), and a peripheral portion of the lens blank (1) on a concave surface side is urged against the lower surfaces of locking portions (31A) of clamp pins (31). After a predetermined amount of wax (4) is dripped onto the lens blank (1), a lens holding unit (2) is moved downward by a predetermined amount and urged against the wax on the lens blank (1) to spread the wax thin and let the wax to solidify. Thus, the lens blank (1) and lens holding unit (2) are bonded to each other.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: May 24, 2011
    Assignee: Hoya Corporation
    Inventors: Jun Kawakubo, Satoshi Annaka
  • Publication number: 20110039476
    Abstract: A double-disc grinding apparatus having at least: a rotatable ring-shaped holder for supporting a sheet-like wafer having a notch for indicating a crystal orientation from an outer circumference side along a radial direction, the holder having a protruding portion to be engaged with the crystal-orientation-indicating notch; and a pair of grindstones for simultaneously grinding both surfaces of the wafer supported by the holder, in which the holder is provided with at least one protruding portion separately from the protruding portion to be engaged with the crystal-orientation-indicating notch, and the both surfaces of the wafer are simultaneously ground by the pair of the grindstones while the wafer is supported and rotated with the at least one protruding portion being engaged with a wafer-supporting notch formed on the wafer.
    Type: Application
    Filed: April 20, 2009
    Publication date: February 17, 2011
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Kenji Kobayashi, Tadahiro Kato
  • Publication number: 20100311312
    Abstract: The double-side polishing apparatus is capable of uniformly polishing a wafer and highly preventing an outer edge of the wafer from being damaged. The apparatus comprises: a lower polishing plate and an upper polishing plate for polishing both sides of the wafer; a carrier having a main body part, in which a through-hole for holding the wafer is formed. Edges of the through-hole in an upper face and a lower face of the carrier are coated with coating layers, which are composed of an abrasion-resistant material and which have a prescribed width and a prescribed thickness. A resin cushion ring, which has a prescribed width and whose thickness is equal to that of the main body part of the carrier, is provided to an inner circumferential face of the thorough-hole. The wafer is held in the resin cushion ring.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 9, 2010
    Inventor: Masanori FURUKAWA
  • Publication number: 20100261418
    Abstract: A method for manufacturing a magnetic disk is provided that includes the steps: forming a layer of a lubricant material on a surface of a magnetic storage medium, the layer of lubricant material also being located on an interior and/or exterior edge of the medium; and removing at least some of the lubricant material from the edge 160 of the medium.
    Type: Application
    Filed: March 23, 2010
    Publication date: October 14, 2010
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Thuan Luu, Walter Crofton, Bill Liu, David Spaulding, Kwang Kon Kim
  • Publication number: 20100184362
    Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.
    Type: Application
    Filed: March 30, 2010
    Publication date: July 22, 2010
    Inventor: Takemi Miyamoto
  • Patent number: 7708623
    Abstract: A grinding method and to a cylindrical grinding machine grinds metal rod that is pushed through a chuck of a workpiece spindle head. Two backrest seats are ground on and two backrests are then seated. The support of an end area enables a front cone to be ground. A grinding wheel comprised of two different individual wheels serves to grind the front cone and is advanced toward the round rod in the X-direction. The front cone is lodged in a hollow punch at a front end of a quill by displacement of the quill. The desired cylindrical grinding a final contour of the end area is done. Working the rod is done with a single chucking and the end area is cut off from the round rod by one of the individual wheels.
    Type: Grant
    Filed: February 13, 2008
    Date of Patent: May 4, 2010
    Assignee: Erwin Junker Maschinenfabrik GmbH
    Inventor: Erwin Junker
  • Patent number: 7666069
    Abstract: The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by ear between components of the wafer holder are trapped by an airtight cover. Since the wafer holder moves horizontally while being fixed to a guide rail, the wafer conveyor system reduces friction between the guide rail and the wafer holder.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: February 23, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Kyoung Kim, Yun-Jung Jee, Kyoung-Su Shin, Chung-Sam Jun
  • Patent number: 7635292
    Abstract: A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: December 22, 2009
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
  • Patent number: 7628681
    Abstract: A mechanism for suppressing grinding-cutting vibration comprises a C-shaped base, a fixed support seat, a clamp device and a vibration absorber. Based on vibration absorbing principle of the vibration theory, the clamp device is connected to the movable cutting machine, so as to move along with the cutting machine during the machining operation, and the clamp force applied to clamp the workpiece is adjustable. By such arrangements, the vibration energy produced at the time of cutting the workpiece can be transferred to the vibration absorber through the clamp device, and then a part of the vibration energy will be absorbed by the vibration absorber, thus achieving the objective of reducing vibration of the cut position.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: December 8, 2009
    Assignee: Hiwin Technologies Corp.
    Inventors: Fu-Ching Wang, Chih-Chun Cheng, Wen-Nan Cheng
  • Patent number: 7591714
    Abstract: A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.
    Type: Grant
    Filed: April 5, 2006
    Date of Patent: September 22, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Young Ko, Dae-Sang Chan, Sang-Jun Kim
  • Publication number: 20090221220
    Abstract: The invention relates to a device for polishing the end of at least one optical fiber mounted in a connector, the device comprising a moving part supporting at least one connector and another moving part carrying a polishing film, the movement of these two parts being synchronized. According to the invention, these two parts are in direct contact via a movement transmission element, movement of one of them giving rise to movement of the other.
    Type: Application
    Filed: February 10, 2009
    Publication date: September 3, 2009
    Inventors: Baudouin Bareel, Peter D'Hondt
  • Patent number: 7507148
    Abstract: A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: March 24, 2009
    Assignee: Sumco Techxiv Corporation
    Inventors: Masamitsu Kitahashi, Toshiyuki Kamei, Hidetoshi Takeda, Hiroyuki Tokunaga, Tamoaki Tajiri
  • Patent number: 7467990
    Abstract: A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended to provide excess backpressure to select small areas of a wafer known to exhibit resistance to removal vis-à-vis the surrounding wafer surface. Distensible elements may be in the form of expandable pneumatic chambers or electro-mechanical elements such as solenoids, shape memory elements, electrostatic plates, etc.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: December 23, 2008
    Assignee: Strasbaugh
    Inventor: Alan Strasbaugh
  • Publication number: 20080188164
    Abstract: The invention relates to a method for grinding a cutting tool, especially a knife. The aim of the invention is to provide a method which allows configuration of individual leaf or blade geometries at comparatively low costs. For this purpose, the cutting tool is contacted with the effective surface of a grinding device, and the cutting tool and the grinding device can be displaced in relation to each other by at least three degrees of freedom.
    Type: Application
    Filed: September 2, 2005
    Publication date: August 7, 2008
    Applicant: ZWILLING J.A. Henckels AG
    Inventor: Joachim Droese
  • Publication number: 20080139091
    Abstract: A grinding method and to a cylindrical grinding machine grinds metal rod that is pushed through a chuck of a workpiece spindle head. Two backrest seats are ground on and two backrests are then seated. The support of an end area enables a front cone to be ground. A grinding wheel comprised of two different individual wheels serves to grind the front cone and is advanced toward the round rod in the X-direction. The front cone is lodged in a hollow punch at a front end of a quill by displacement of the quill. The desired cylindrical grinding a final contour of the end area is done. Working the rod is done with a single chucking and the end area is cut off from the round rod by one of the individual wheels.
    Type: Application
    Filed: February 13, 2008
    Publication date: June 12, 2008
    Applicant: Erwin Junker Maschinenfabrik GmbH
    Inventor: Erwin Junker
  • Patent number: 7303466
    Abstract: A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; and at least one annular barrier of elastic material extending from the bottom surface of the support. Each barrier has an annular partition portion that extends through the pressure chamber and divides the pressure chamber into respective pressure zones on opposite sides thereof, and an annular contact portion that abuts the membrane such that the barrier contacts the membrane but is not fixedly attached thereto. The contact portion includes a pair of annular flanges extending laterally in opposite directions at the lower end of the partition portion.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: December 4, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Phil Boo, Jue-Young Lee
  • Patent number: 7220173
    Abstract: The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by ear between components of the wafer holder are trapped by an airtight cover. Since the wafer holder moves horizontally while being fixed to a guide rail, the wafer conveyor system reduces friction between the guide rail and the wafer holder.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: May 22, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Kyoung Kim, Yun-Jung Jee, Kyoung-Su Shin, Chung-Sam Jun
  • Patent number: 7210990
    Abstract: In order to provide a treatment apparatus for treating workpieces or groups of workpieces that are conveyed from an inlet to an outlet of the treatment apparatus, wherein the treatment apparatus comprises a plurality of treatment levels and with said treatment apparatus the workpieces to be treated are passed from level to level in a safe and controlled manner, it is proposed that the treatment apparatus comprises a housing and receiving chambers, which rotate relative to the housing, for receiving the workpieces or groups of workpieces, wherein the receiving chambers are disposed in at least two different chamber levels and an outlet opening in the housing is associated with a first chamber level, through which the workpieces or groups of workpieces travel first, and an inlet opening is associated with a second chamber level, through which the workpieces or groups of workpieces travel after the first chamber level, and wherein the treatment apparatus comprises at least one transfer apparatus, which moves the
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: May 1, 2007
    Assignee: Durr Ecoclean GmbH
    Inventors: Richard Buchmann, Andreas Metzger
  • Patent number: 7196009
    Abstract: A method of fabricating a lapping carrier is provided that includes the steps of defining at least one opening extending through a workpiece that is sized to receive a wafer, and cryogenically tempering the workpiece to produce a lapping carrier. By cryogenically tempering the workpiece, the conversion of the crystalline structure of the workpiece to a martensite crystalline structure is enhanced, thereby improving the hardness of the lapping carrier. A lapping carrier is also provided that has a crystalline structure, of which at least 70% is a martensite crystalline structure. An apparatus for lapping a wafer is further provided that includes a hardened lapping carrier and at least one lapping plate proximate the lapping carrier for lapping wafer(s) disposed within the at least one opening defined by the lapping carrier.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: March 27, 2007
    Assignee: SEH America, Inc.
    Inventors: Brian L. Bex, David K. Chen
  • Patent number: 7175514
    Abstract: An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a plurality of connector fixtures that may receive a variety of connectors at varying angles. Each connector fixture communicates with a corresponding polishing pad. Thus, fiber optic cable connectors having a variety of polished end faces may be provided with the apparatus. The apparatus also eliminates the potential for contamination among polishing films, reduces polishing steps, and saves labor and maintenance costs.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: February 13, 2007
    Assignee: CIENA Corporation
    Inventors: Thomas Boyer, Waqar Mahmood, Keith Chandler, Andrei Cspikes
  • Patent number: 7101271
    Abstract: An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: September 5, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jin-Ok Moon
  • Patent number: 7063604
    Abstract: A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is disposed within the carrier such that if the pressure in the bladder is regulated, the amount of force on the edge of the wafer changes. If a polishing process would cause material near the edge of the wafer to be removed at a higher rate than from the rest of the wafer, then the pressure is regulated within the bladder to reduce the force against the edge of the wafer. By reducing the force against the edge of the wafer, material is removed from the front side of the wafer at a uniform rate.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: June 20, 2006
    Assignee: Strasbaugh
    Inventor: Larry A. Spiegel
  • Patent number: 7048621
    Abstract: A carrier bead for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining ring is substantially restrained relative to the carrier base. The junction is further configured such that the profile of a bottom surface of the retaining ring is substantially decoupled from flexing and/or expansion of carrier base.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: May 23, 2006
    Assignee: Applied Materials Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga
  • Patent number: 7040971
    Abstract: A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.
    Type: Grant
    Filed: September 20, 2004
    Date of Patent: May 9, 2006
    Assignee: Applied Materials Inc.
    Inventors: Steven M. Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
  • Patent number: 7008309
    Abstract: A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended to provide excess backpressure to select small areas of a wafer known to exhibit resistance to removal vis-á-vis the surrounding wafer surface. Distensible elements may be in the form of expandable pneumatic chambers or electro-mechanical elements such as solenoids, shape memory elements, electrostatic plates, etc.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: March 7, 2006
    Assignee: Strasbaugh
    Inventor: Alan Strasbaugh
  • Patent number: 7008310
    Abstract: A wafer carrier for use in polishing disks. The wafer carrier includes a main body and an integral visual inspection wear indicator. The main body has at least one opening formed therein adapted to receive a disk. The visual inspection wear indicator provides a visual indication of when the main body has reached the end of its useful life. The inspection wear indicator may have several portions to incrementally identify the approximate wear stage, that is, the approximate remaining useful life.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: March 7, 2006
    Assignee: Entegris, Inc.
    Inventor: Todd E. Andres
  • Patent number: 6910949
    Abstract: A polishing head for use in an apparatus for chemically-mechanically polishing semiconductor wafers is provided. The polishing head includes a first side having at least a portion thereof operably connectable with a spindle on the apparatus; and a second side opposite the first side, the second side having a substantially spherical cap shape comprising an outer region adapted to apply a first force onto a semiconductor wafer against a polishing pad, and an inner region adapted to apply a second force onto the semiconductor wafer against the polishing pad, the second force being different from the first force, whereby the first force and the second force cause the polishing pad to planarize the semiconductor wafer substantially uniformly. A method of polishing semiconductor wafers is also provided.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: June 28, 2005
    Assignee: Lam Research Corporation
    Inventor: Allan M. Radman