Abstract: In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and/or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.

Abstract: There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 &mgr;m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.

Abstract: A polish head for Chemical Mechanical Polishing includes a backing film of silicone on a rigid support element, preferably, of amorphous ceramic. The silicone backing film is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The head provides a uniform polishing of a semiconductor wafer.

Abstract: A carrier with adjustable pressure zones and adjustable barriers between zones for distributing the pressure on the backside of a wafer. The pressure zones may be created using an elastic web diaphragm. One or more grooves are formed in the surface of the diaphragm to relieve vacuum formed between the diaphragm and wafer.

Abstract: The present invention relates to a polishing apparatus for restoring an optical disk. The objects of the present invention are as follows: to obtain an equal pressure appropriately required for polishing; to correct the accuracy of parallelism between the rotation planes of an optical disk and a polishing sheet; to remove roundness formed on the outer edge of an optical disk and unevenness in polishing; and to prevent clogging of the surface of a polishing sheet by the active elimination of abrasive filings and an occurrence of scratches on the surface of an optical disk due to the clogging. For the purpose of achieving the above objects, in an apparatus for polishing an optical disk composed of a disk rotator A and a polishing mechanism B, the polishing mechanism B has an elastic mechanism D for elastically holding a polishing pad C, a polishing sheet of the polishing pad C has such an elasticity that the deformation amount &Dgr;x is 0.005 mm to 0.

Abstract: An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls thereof and a pattern etched in the base thereof. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. A moistening liquid is dispensed and diffuses into the cavities via the notches cut in the walls and collects in the pattern etched on the base of the cavity thereby increasing the suctional force used to secure the holding disk. When the template is releasably secured within a cavity, rotatably connected to a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head.

Abstract: Embodiments of the present invention are directed to a carrier head for positioning a substrate on a polishing surface. The carrier head includes a housing connectable to a drive shaft to rotate therewith; a base; a detachable plate removably mounted on top of the housing; a gimbal mechanism connecting the housing to the base to permit the base to move with respect to the housing such that the base remains substantially parallel to the polishing surface; and a flexible membrane defining a mounting surface for the substrate.

Abstract: A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim.

Abstract: An apparatus for manufacturing a semiconductor device includes a rotatable spindle, a head detachably connected to the spindle, and a clamp for clamping outer circumferential surfaces of the spindle and the head to one another so that the head may be driven by the spindle. The clamp has an annular clamping frame sized to encircle the outer circumferential surfaces of the spindle and the head, a projection disposed on one end of the clamping frame, a lever pivotally connected to the other end of the clamping frame, and a fastener pivotally connected to the lever and configured to hook over the projection. Once the fastener is hooked over the projection, the lever is pivoted to force the ends of the annular clamping frame together and thereby produce a clamping force that secures the spindle and head to one another. The clamp can be manipulated easily and with a simple motion to clamp the head to the spindle. Also, the parts of the clamp generate little mechanical friction.

Abstract: In the polishing machine, bad influence caused by a surface condition of a retainer ring can be reduced with a simple structure. The polishing machine comprises: a rotatable polishing plate; a top ring including a holding plate for holding and pressing a wafer onto polishing cloth of the polishing plate; a retainer ring in which the holding plate is freely inserted, the retainer ring independently rotating, the retainer ring including a pressing member, which presses the polishing cloth along an outer edge of the wafer so as to make level of the polishing cloth pressed by the pressing member substantially equal to that of the polishing cloth pressed by the wafer; and a positioning member for correctly positioning the retainer ring on the polishing cloth while the retainer ring is rotated.

Abstract: The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms.

Abstract: A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.

Abstract: A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a polishing turn table, the wafer is held by vacuum-chucking the surface to be polished of the wafer such that a surface to be adhered of the wafer forms a convex surface in a vicinity including an arbitrary point in the surface to be adhered within a region surrounding a center of the surface to be adhered of the wafer, and the region being at least not less than 50% of an entire adhesion area; and the wafer is adhered to the wafer holding plate from a central portion of the surface to be adhered of the wafer.

Abstract: An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

Abstract: A carrier head for a chemical mechanical polishing system includes a flexible membrane with a substrate receiving surface, a sensor mechanism to determine if a substrate is properly attached to the carrier head, and means for preventing fluid that may be located between the substrate and the flexible membrane from interfering with the substrate detection mechanism.

Abstract: A flange connection is adapted for interconnecting a rotary spindle and a substantially ring-formed member in such a manner that the ring-formed member is well centered about the axis of the spindle. The spindle has a surface which is well centered about the axis of the spindle and the ring-formed member has an axially projecting sleeve-shaped flange. The flange has in its inner envelope surface an annular bulge that is arranged to enclose and engage the spindle surface centered about the spindle axis.

Abstract: A fixture for selectively locating and retaining hydraulic gerotor rotors in position in respect to a grinding wheel, the fixture clamping the rotor between two oversized positioning rolls located in rotor lobe valleys on opposite sides of the rotor.

Abstract: The present invention relates to an improved spindle unit. The spindle unit includes a body, an external shaft placed into the body and rotating on bearings relative to the body, and an internal shaft placed into the external shaft and coupled thereto. The spindle unit further includes front and rear static journal bearings and a thrust bearing between the external and internal shafts. Flow control valves are provided which have their outlets connected to recesses communicating with the rear and front journal bearings. Operation of the valves in response to measured parameters controls the position of the internal shaft relative to the rotation axis of the external shaft. This is accomplished by controlling the flow of fluid to recesses associated with the front and rear journal bearings. By controlling the position of the internal shaft, one can insure that a workpiece attached to the internal shaft is automatically centered.

Abstract: A vacuum-hydrostatic shoe especially suited for supporting a workpiece in metalworking operations is disclosed. The vacuum-hydrostatic shoe is comprised of a body with a support surface confronting the workpiece. Preferably the support surface is shaped to substantially conform to the workpiece shape. The shoe body comprises hydrostatic pockets. Each hydrostatic pocket has a first pressure opening defined in the support surface and a second pressure opening fluidly connected to a respective first pressure opening. The second pressure openings are also fluidly connected to a supply of pressurized fluid so that a flow of pressurized fluid can be created between the shoe body and the workpiece. The shoe body further comprises a vacuum pocket. The vacuum pocket has a first vacuum opening defined in the support surface and a fluidly connected second vacuum opening. The second vacuum opening is also fluidly connected to a source of vacuum to create a vacuum pressure between the shoe body and workpiece.

Abstract: A polishing head of a polishing apparatus of this invention has a structure in which an air blast port is formed in a lower surface of a carrier 20, and an upper outer peripheral portion 24 of the carrier is so formed as to protrude in a diametric direction, and is placed on a retainer ring 30 to thereby form a seal portion 25. The retainer ring clamps a peripheral edge of a rubber sheet in such a form as to cover the carrier. Consequently, an air chamber 61 is formed between the carrier lower surface and the rubber sheet, and an air pressure of this air chamber pushes a wafer W to a polishing cloth 2.

Abstract: This invention is related to a steady rest, which employs a pair of parallel, sliding, linear moving clamping bars for moving wear pads or rollers toward a workpiece.

Abstract: A method and apparatus are provided for handling planar structures, such as semiconductor wafers, with reduced breakage and cracking. The method includes the step of segmenting a wafer prior to grinding. The apparatus includes a segmented vacuum table for supporting wafer portions in position to be ground to a desired thickness. In another aspect of the invention, adhesive material is employed to individually secure wafer portions in position during the grinding process.

Abstract: Improved chucks for supporting elongate objects having conical end portions, such as single crystal ingots of semiconductor material, while such objects are held and rotated, as in a lathe. A base portion of the chuck includes bores to accept fasteners to fasten the base to a headstock or tailstock of a lathe. The base includes a receptacle for holding an annular chuck insert which has a conical socket surface to engage the body, such as a conical end portion of a single crystal ingot, to be held and rotated. Alternatively, the base may have three or more rollers spaced equally about a central axis and rotatable about roller axes all located in a plane perpendicular to the central axis.

Abstract: The present invention relates generally to a device used to process workpieces. In particular, the invention relates to a carrier that is used to support a workpiece during workpiece honing, grinding, or polishing. The carrier includes a rigid core coated with a fiber-free, scratch-resistant material to prevent scratching of workpieces disposed in the carrier. An adhesive layer is typically used to attach the scratch-resistant layer to the rigid core. The adhesive film and the scratch-resistant films may be attached to the rigid core by hot pressing.

Abstract: A fixture for holding a semiconductor die against an abrasive media for the purpose of thinning the die is described. The fixture provides means for aligning the back of the die to a reference plane that is coplanar with the plane of the abrasive and is in contact with the abrasive media during the thinning process.

Abstract: Workholding apparatus for mounting a workpiece (6) on a machine tool, the apparatus comprising a diaphragm chuck portion (2) and a tailstock portion (4). The chuck (2) includes a backing ring (70) with face portion (74) attached to the diaphragm (44) with the backing ring (70) having a centering locator guide (76) for centering and stopping the axial advancement of a workpiece in the chuck (2). The chuck (2) also includes a support ring (106) including material (109) located at the periphery thereof for sealing the area between the chuck and the workpiece and dampening vibrations brought about by the machining process. The tailstock portion (4) comprises a rotatable tailstock support (112) having at least one workpiece seating surface (117). The tailstock includes a centering locator guide (114) extending axially from the tailstock support (112) and having a generally curved outer surface (115) for centering the workpiece in the chuck (2).

Abstract: A spin index fixture has a housing which is provided with an air inlet shaft for permitting pressurized air to enter the housing and to propagate through grooves disposed along the outer surface of the sleeve. The air then enters into a clearance volume between the housing and the spindle and serves as an air bearing. The spindle is further provided with impelling recesses disposed circumferentially along the outside surface of the spindle at an axial location that is in alignment with the pressurized air inlets. The force of the air against the recesses rotates the spindle about its axis when the pressurized air supply contacts the recesses.

Abstract: An apparatus for abrading articles. The abrading apparatus includes a number of abrading stations located adjacent to one another so that as an article is abraded at one station, a previously abraded article will be redundantly abraded at the adjacent station. The apparatus further includes fixtures having non-clamping holders which gravitationally retain the articles. The fixtures also allow the articles to be manipulated about an axis so that all surfaces of the articles can be abraded and so that abrasive materials which have collected in surface irregularities of the articles can be emptied therefrom.

Abstract: A lap blank and holder assembly includes a lap blank having two spaced apart flat surfaces separated by a given thickness and formed from a material capable of compressing about a member inserted into it. The holder has a projection extending outwardly from a front face thereof and is inserted into the material making up the lap to secure it against rotational and shifting movement while being cut in a surfacing machine. This arrangement further allows the assembly to be placed as an assembly in a finishing machine for subsequent polishing of a cut lens surface in an off-axis polishing procedure.