Abstract: The present invention provides a polishing pad, a polishing apparatus and a polishing method for a silicon wafer. The polishing pad comprises a polishing surface in contact with the silicon wafer. The polishing surface is provided with at least one groove. When polishing the silicon wafer, the edge of the silicon wafer is at least partially suspended above the groove. The polishing pad, polishing apparatus and silicon wafer polishing method according to the present invention can reduce the polishing rate at the edge of the silicon wafer while keeping the polishing rate of the entire wafer basically unchanged, thereby improving the flatness of the edge thickness of the silicon wafer as well as improving the production yield.

Abstract: A grinding wheel includes a plurality of grinding stone groups arranged in an annular array, each of the grinding stone groups including at least three grinding stone segments having different thicknesses which include a smallest thickness, an intermediate thickness, and a largest thickness. The grinding stone segments in each of the grinding stone groups are successively arranged in the order of the grinding stone segment having the smallest thickness, the grinding stone segment having the intermediate thickness, and the grinding stone segment having the largest thickness, with uniform gaps left therebetween. The grinding stone segments in the grinding stone groups have respective radially inner edges aligned with each other in an annular shape.

Abstract: A disc containing copper for sapphire polishing; the annular surface of the disc is provided with a spiral grinding groove or concentric circular grinding grooves thereon; and stepped grooves are provided at the edges along both the outer ring and inner ring of the annular surface of the disc.

Abstract: The present disclosure illustrates an eraser wheel assembly structure in which an eraser wheel body is fastened with a shell cover by a fastener, so the eraser wheel body can be driven by the grinding tool to rotate for removing glue. The eraser wheel body is disposed in the shell cover and has a plurality of glue removing blocks. The shell cover has a plurality of positioning studs and configured to respectively insert positioning holes of the eraser wheel body. The shell cover has a blocking wall facing a peripheral edge of the disc-based base and a gap to tolerate a radial extension of the disc-shaped base during operation, so as to prevent the peripheral edge of the disc-shaped base from being escaped from the blocking wall and unable back to its former position because of no gap tolerable for the radial extension of deformed disc-shaped base.

Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

Abstract: An inexpensive rotary grinding tool with reduced noise level of the grinding is provided. The rotary grinding tool comprises a metal disk having a grinding surface on at least a part of its surface and a holder for supporting the metal disk. The grinding surface has hard grains having a Mohs hardness in excess of 9 brazed thereon at a surface density of at least 20 grains/cm2. The holder has at its center a securing means for securing the holder on rotary shaft of a rotary drive unit. The holder and the metal disk are joined together to constitute the rotary grinding tool.

Abstract: Apparatus and method for sharpening a workpiece, such as a cutting tool. An abrasive disc is rotatable about a disc rotational axis and includes a plurality of spaced apart, radially disposed apertures extending therethrough from a first surface to an opposing second surface of the disc. The first surface is configured to facilitate sharpening of a workpiece by contacting engagement of the workpiece against an abrasive layer adjacent the first surface between adjacent first and second apertures of said plurality. The first surface further induces controlled axial displacement of the workpiece away from the disc as the second aperture approaches the workpiece during disc rotation. The first surface is preferably concave so as to extend into the disc between each adjacent pair of the apertures. Alternatively, the first surface is provided with different compressibilities to induce the controlled axial displacement of the workpiece.

Abstract: A dressing device for sharpening or conditioning of a blade or the like includes one or more disk pairs each having a pair of disks respectively presenting a plurality of ribs. The disks are oriented in face-to-face relationship with the ribs thereof in meshed, intercalated relationship to thereby create circumferential dressing openings. The ribs are configured to create sharpened edge on a knife blade or the like.

Abstract: A chemical-mechanical polishing apparatus is provided that creates a uniform kinematical pattern on the surface of a wafer being polished. The apparatus may have a polishing pad comprising a polishing pad surface having a center point that lies within an axis of motion for the polishing pad and a plurality of grooves entrenched in the polishing pad surface and defining a pattern of shapes. The pattern has an axis of symmetry that is offset from the polishing pad surface center point. The apparatus may be operated in a manner such that the kinematics of the CMP process are uniform across the surface of the wafer.

Abstract: A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common direction.

Abstract: The present invention relates to an improved cutting wheel, comprising a disk-shaped abrasive body having two opposite faces and a non-uniform thickness.

Abstract: Abrasive tools containing high concentrations of hollow filler materials in a resin bond are suitable for polishing and backgrinding of hard materials, such as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grain, such as diamond abrasive, along with the hollow filler material and resin bond.

Abstract: A method and apparatus for manufacturing reclosable bags having slide zippers on a form-fill-seal machine is provided. In a first embodiment the sliders are preapplied to the zipper and the bags are made using conventional form-fill-seal techniques. In a second embodiment a coil of sliders is fed into the form-fill-seal machine where the sliders are applied to the zippers by an insertor mechanism. In a third embodiment a magazine of individual or connected sliders is used to feed a slider insertor mechanism which then applies the sliders to the interlocked zippers. In a fourth embodiment bulk sliders are introduced into a vibratory feeding bowl which then orients and feeds the sliders to the slider insertor mechanism.

Abstract: A polishing pad for chemical mechanical polishing capable of simultaneously realizing a reduction of process costs by the reduction of the amount of usage of a polishing slurry and an improvement of a polishing quality of a wafer surface, and a polishing apparatus and a polishing method using the same, provided with a first area A at a side of a predetermined radial line R of the polishing pad in the direction of rotation or advance 30 of the polishing pad, a second area B at an opposite side thereof, and grooves having projecting portions 203 in a direction opposite to the direction of rotation or advance 30 of the polishing pad formed only in the second area B.

Abstract: A polycrystalline diamond cutting element has a non-planar, non-linear interface between a substrate and a table. The substrate has one or more protrusions mounted on the surface of the substrate and in spaced relationship. Each protrusion has a generally curved shape such as a delta or triangular shape that extends from the center of the substrate toward the perimeter of the substrate. The depth of the groove between protrusions generally increases along the path toward the perimeter of the element. Similarly, the depth of each protrusion from groove to groove varies along the path toward the perimeter of the element. A thicker, superhard layer such as a diamond layer is provided toward the circle of the element to increase working life. The resulting cutting element is symmetrical about the central axis to alleviate the need for proper orientation of the cutting element during assembly into a drill bit. In another embodiment, a depression is used in place of the protrusion to form a substrate.

Abstract: A grinding wheel with tips which can be uniformly abraded regardless of the position of the tips is disclosed. In the wheel, the inside and outside tips may be formed by bonding diamond dust of the same concentration with resinoid or metal bonds of lower and higher abrasion resistances, respectively. Alternatively, the inside and outside tips may be formed using the same resinoid or metal bond. In this case, the outside tips are laden with diamond dust, while the inside tips are laden with no diamond dust or cheap abrasive. As a further alternative, the concentration of the diamond dust of the tips may be stepwisely reduced from the outside toward the inside. In addition, the top surface of each tip may be inclined downward from the outside toward the inside to compensate for the eccentric abrasion of the tips due to the circumferential speed difference between the inside and outside tips.

Abstract: An abrader blade with integral depth control wings. The depth control wings which slide on a portion of the material being abraded to limit the depth of abrasion. The cutting surface of the abrasive surgical device is covered with abrading material. In a preferred embodiment tungsten carbide particles are brazed onto the blade substrate with an equal quantity of cobalt phosphorous braizing alloy. In this preferred embodiment an additional coating is added with a braze alloy specially developed for medical cutting. The carbide particles, the cobalt, the phosphorous and metal phosphides formed during the brazing process are all biocompatable. These blades are especially desirable for abrading bone material into particular shapes for interfacing with prosthesis parts. Several specific blades are disclosed.

Abstract: A polishing tool having a polishing wheel that forms a set of pockets wherein the pockets receive a stream of water and are formed such that a high hydrostatic pressure builds in the pockets as the polishing tool rotates in a high precision grinding machine and addresses a surface of a substrate. The high hydrostatic pressure removes material from the surface of the substrate while preserving the precise thickness variation control of the high precision grinding machine.