Abradant Supplying Patents (Class 451/60)
  • Patent number: 10510601
    Abstract: A method of manufacturing a device includes exposing at least one of a source/drain contact plug or a gate contact plug to a metal ion source solution during a manufacturing process, wherein a constituent metal of a metal ion in the metal ion source solution and the at least one source/drain contact plug or gate contact plug is the same. If the source/drain contact plug or the gate contact plug is formed of cobalt, the metal ion source solution includes a cobalt ion source solution. If the source/drain contact plug or the gate contact plug is formed of tungsten, the metal ion source solution includes a tungsten ion source solution.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ling-Fu Nieh, Chun-Wei Hsu, Pinlei Edmund Chu, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Patent number: 10283156
    Abstract: A magnetic-disk glass substrate of the present invention has an average value of squares of inclinations of 0.0025 or less and a frequency at which squares of inclinations are 0.004 or more of 15% or less, in a case where samples of inclinations on a main surface are obtained at intervals of 10 nm.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: May 7, 2019
    Assignees: HOYA CORPORATION, HOYA GLASS DISK VIETNAM II LTD.
    Inventors: Masanobu Itaya, Kinobu Osakabe, Toshio Takizawa
  • Patent number: 10011741
    Abstract: Methods for removing, reducing or treating the trace metal contaminants and the smaller fine sized cerium oxide particles from cerium oxide particles, cerium oxide slurry or chemical mechanical polishing (CMP) compositions for Shallow Trench Isolation (STI) process are applied. The treated chemical mechanical polishing (CMP) compositions, or the CMP polishing compositions prepared by using the treated cerium oxide particles or the treated cerium oxide slurry are used to polish substrate that contains at least a surface comprising silicon dioxide film for STI (Shallow trench isolation) processing and applications. The reduced nano-sized particle related defects have been observed due to the reduced trace metal ion contaminants and reduced very smaller fine cerium oxide particles in the Shallow Trench Isolation (STI) CMP polishing.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: July 3, 2018
    Assignee: VERSUM MATERIALS US, LLC
    Inventors: Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, Jae Ouk Choo, James Allen Schlueter, Jo-Ann Theresa Schwartz, Laura Ledenbach, Steven Charles Winchester, Saifi Usmani, John Anthony Marsella, Martin Kamau Ngigi Mungai
  • Patent number: 9962801
    Abstract: Systems and methods are provided for performing chemical-mechanical planarization. An example system includes: a polishing head, a polishing pad, a slurry distribution component, and a reactant distribution component. The polishing head is configured to perform chemical-mechanical planarization on an article. The polishing pad is configured to support the article. The slurry distribution component is configured to provide a slurry on the polishing pad. The reactant distribution component is configured to provide an oxidizer material on the polishing pad to generate a plurality of radicals to react with the article.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 8, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Shen-Nan Lee, Teng-Chun Tsai, Yung-Cheng Lu
  • Patent number: 9278423
    Abstract: A method for breaking up Chemical Mechanical Polishing (CMP) slurry particles includes receiving a CMP slurry comprising particles suspended in a solution, placing the slurry into a first agitation tank, and agitating the slurry at a first frequency. The first frequency is selected to break up particles having a size within a specified range.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: March 8, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: William Weilun Hong, Kuo-Min Lin, Ying-Tsung Chen
  • Patent number: 9057004
    Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: June 16, 2015
    Assignee: International Business Machines Corporation
    Inventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
  • Publication number: 20150111477
    Abstract: A polishing head for a chemical-mechanical polishing system includes a carrier head, at least one electromagnetism actuated pressure sector and a membrane. The electromagnetism actuated pressure sector is disposed on the carrier head. The membrane covers the electromagnetism actuated pressure sector.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 23, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shich-Chang SUEN, Chin-Hsiang Chan, Liang-Guang Chen, Yung-Cheng Lu
  • Patent number: 8992287
    Abstract: The present disclosure relates to a slurry distribution system having a distribution tube connected between a mixing tank and a CMP tool. The mixing tank is configured to generate a polishing mixture comprising a diluted slurry having abrasive particles that enable mechanical polishing of a workpiece. The polishing mixture is transported between the mixing tank and a CMP tool by way of a transport piping. An energy source, in communication with the transport piping, transfers energy to the abrasive particles within the polishing mixture, thereby preventing accumulation of the abrasive particles within the transport piping.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: March 31, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Chen Wang, Feng-Inn Wu, Chih-Hung Tsai, Huang-Jen Hsu, Te-Chia Hsu
  • Patent number: 8951095
    Abstract: Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for performing a process is provided that includes a first flow controller that has a first fluid input coupled to a first source of fluid and a second flow controller that has a second fluid input coupled to a second source of fluid. A controller is provided for generating an output signal to and thereby controlling discharges from the first and second flow controllers. A variable resistor is coupled between an output of the controller and an input of the second flow controller whereby the output signal of the controller and the resistance of the variable resistor may be selected to selectively control discharge of fluid from the first and second flow controllers.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: February 10, 2015
    Assignees: Samsung Austin Semiconductor, L.P., Samsung Electronics Co., Ltd.
    Inventors: Randall Lujan, Ahmed Ali, Michelle Garel, Josh Tucker
  • Patent number: 8920572
    Abstract: A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: December 30, 2014
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventor: Feng Chen
  • Patent number: 8888559
    Abstract: A wet sanding adjuvant is comprised of a composition comprising: (1) an alkali metal or ammonium salt of an alkoxylated alkyl sulfate; (2) an alkali metal or ammonium salt of an alphaolefin sulfonate; (3) a cellulose derivative selected from the group consisting of hydroxyalkyl cellulose, a carboxyalkyl cellulose and combinations thereof. The adjuvant is used in a method of removing a coating from a surface comprising the steps of: (1) contacting a coated surface with a composition according to the invention to form a wet surface on the coating; (2) abrading the wet surface with an abrasive; (3) removing the composition from the surface.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: November 18, 2014
    Inventor: Richard Eric Nemeth
  • Publication number: 20140335768
    Abstract: An apparatus for reclaiming abrasive blasting material comprises a prime mover, a vacuum pump and a separator unit for separating the abrasive blasting material in the contaminated abrasive blasting material from contaminants. The vacuum pick-up draws the contaminated abrasive blasting material. The separator unit includes a screening device for separating and reclaiming the abrasive blasting material. The screening device comprises a support member having a longitudinal axis and a transverse axis, and an endless flexible screen belt mounted to the support member so as to be movable along an endless closed loop in the direction of the longitudinal axis. The screen belt has a plurality of openings being sized to allow particles of the abrasive blasting material of a desired size to fall therethrough by gravity and to prevent the contaminants larger than the abrasive blasting material from falling therethrough.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 13, 2014
    Inventor: John Russell Roden
  • Patent number: 8870627
    Abstract: To propose a method for realizing appropriate delivering of works to carriers in the conventional transfer process. Specifically, in a polishing method for polishing a work retained in a carrier, at least one carrier for retaining a work to be polished is placed between an upper plate and a lower plate; the work is fit in a hole of the carrier; the carrier and the work are inserted between the upper plate and the lower plate; and at least one of the upper plate and the lower plate is rotated while supplying a polishing agent to a space between the upper plate and the lower plate. In fitting the work in the hole of the carrier, an end portion of the work is held and the work is carried to a position above the lower plate; the work is positioned with respect to the hole of the carrier on the lower plate; and the work is released from the hold and guided by a guide to be slowly carried down toward the hole.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: October 28, 2014
    Assignee: Sumco Corporation
    Inventors: Hiroto Fukushima, Akira Horiguchi, Ken Isobe, Tomonori Miura, Shoji Nakao
  • Publication number: 20140308880
    Abstract: A supplying system of adding gas into the polishing slurry and method thereof are described. The supplying system includes a slurry container, a gas-mixed container, an adjusting device, a first flow controller, and a second flow controller. The supplying system utilizes the adjusting device to mix the polishing slurry with gas for forming the gas-mixed polishing slurry. The supplying system of adding the gas into the polishing slurry and method thereof are capable of increasing the material removal rate of the surface of the substrate in order to improve the processing quality of the substrate.
    Type: Application
    Filed: April 13, 2014
    Publication date: October 16, 2014
    Applicant: National Taiwan University of Science and Technology
    Inventors: Chao-Chang CHEN, Ping-Shen CHOU, Wei-Kang TU
  • Patent number: 8845395
    Abstract: Disclosed is an apparatus for injecting slurry onto the polishing pad surface of a chemical mechanical polishing (CMP) tool. The disclosed apparatus includes a rectilinear shaped injector bottom, where multiple slots are created in the top surface of the injector bottom, allowing the injector bottom to flex and to conform to the polishing pad profile. CMP slurry or components thereof are introduced through one or more top surface openings, travel through the injector body, and exit through a slit or bottom surface opening. The slurry is spread into a thin film by the injector, and is introduced at the gap between the surface of the polishing pad and the wafer, along the leading edge of the wafer, in quantities small enough that all or most of the slurry is introduced between the wafer and the polishing pad.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: September 30, 2014
    Assignee: Araca Inc.
    Inventors: Leonard John Borucki, Yasa Adi Sampurno, Ara Philipossian
  • Patent number: 8834230
    Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: September 16, 2014
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Daisuke Furukawa, Kazumasa Asai, Takahiro Kida, Tadao Tanaka
  • Patent number: 8827769
    Abstract: There is provided a method of producing a substrate for magnetic recording media which is capable of efficiently removing alumina abrasive grains in the latter polishing step that have been stuck in the former polishing step during polishing of the substrate for magnetic recording media in which a NiP plating film has been formed on the surface of an Al alloy substrate, the method including: a rough polishing step for polishing the surface of a substrate for magnetic recording media, which is prepared by forming a NiP plating film on the surface of an Al alloy substrate, using a first grinder while supplying a polishing liquid containing alumina abrasive grains; and a finish polishing step for polishing the substrate for magnetic recording media following washing, using a second grinder while supplying a polishing liquid containing colloidal silica abrasive grains, wherein supply of the polishing liquid containing alumina abrasive grains is stopped and alumina abrasive grains are removed from the grinder b
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: September 9, 2014
    Assignee: Showa Denko K.K.
    Inventors: Yasuyuki Nakanishi, Hidenori Inada, Katsuhiro Yoshimura
  • Patent number: 8821215
    Abstract: The invention provides a polishing composition containing a pyrrolidone polymer, an aminophosphonic acid, a tetraalkylammonium salt, and water, wherein the composition has a pH of about 7 to about 11.7. The invention further provides a method of using such a polishing composition to polish a substrate, especially a substrate containing silicon.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: September 2, 2014
    Assignee: Cabot Microelectronics Corporation
    Inventor: Nevin Naguib Sant
  • Patent number: 8801496
    Abstract: Embodiments of the present invention pertain to reducing agglomeration of particles while manufacturing a lapping plate using an oil-based slurry. According to one embodiment, an oil-based slurry with particles of a known size is applied to a lapping plate. The oil-based slurry is ultrasonically mixed while applying the oil-based slurry to the lapping plate in order to reduce agglomeration of the particles.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: August 12, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Richard D. Bunch, Juan Francisco Coronado Nuno, Sergio Raul Elizalde Rojo, Ernesto Arturo Marguez Waldthausen
  • Patent number: 8764514
    Abstract: Shot blasting particles are constituted by a ceramic material having an apparent relative density of more than 4.0 and less than 5.0 and comprising more than 5% of silica, as a percentage by weight based on the oxides.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: July 1, 2014
    Assignee: Saint-Gobain Centre de Recherches et d'Etudes European
    Inventor: Anne-Laure Beaudonnet
  • Publication number: 20140179203
    Abstract: An abrasive particle having an irregular surface, wherein the surface roughness of the particle is less than about 0.95. A method for producing modified abrasive particles, including providing a plurality of abrasive particles, providing a reactive coating on said particles, heating said coated particles; and recovering modified abrasive particles.
    Type: Application
    Filed: February 28, 2014
    Publication date: June 26, 2014
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventors: Timothy Francis Dumm, Kan-Yin Ng
  • Patent number: 8753174
    Abstract: In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: June 17, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Koji Sato, Takehisa Minowa, Takaharu Yamaguchi, Takayuki Hasegawa, Kazuhito Akada
  • Patent number: 8662963
    Abstract: A chemical mechanical polishing (CMP) system includes a wafer polishing unit producing a used slurry; a slurry treatment system for receiving and treating the used slurry to thereby produce an extracted basic solution; and a post-CMP cleaning unit utilizing the extracted basic solution to wash a polished wafer surface. The post-CMP cleaning unit includes a plurality of rollers for supporting and rotating a wafer, a brush for scrubbing the wafer, and a spray bar disposed in proximity to the brush for spraying the extracted basic solution onto the polished wafer surface.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: March 4, 2014
    Assignee: Nanya Technology Corp.
    Inventors: Li-Chung Liu, Yi-Nan Chen, Hsien-Wen Liu
  • Publication number: 20140011432
    Abstract: In a certain embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector the leading edge of which possess bays, depressions or notches that capture spent slurry and hold it long enough for it to transfer heat from the polishing reaction to the pad or through the injector to the new slurry before the said spent slurry is thrown from the polishing pad. The effect is to considerably improve the removal rate, reduce slurry consumption and reduce operating time.
    Type: Application
    Filed: December 16, 2010
    Publication date: January 9, 2014
    Applicant: Araca, Inc.
    Inventors: Leonard John Borucki, Yasa Adi Sampurno, Ara Philipossian
  • Patent number: 8622783
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: January 7, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • Patent number: 8568203
    Abstract: In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: October 29, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Koji Sato, Takehisa Minowa, Takaharu Yamaguchi, Takayuki Hasegawa, Kazuhito Akada
  • Patent number: 8556681
    Abstract: A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: October 15, 2013
    Assignee: Tosoh SMD, Inc.
    Inventors: Terry L. Banks, David B. Smathers
  • Patent number: 8550877
    Abstract: A method includes: charging a polishing material into a polishing apparatus that polishes a surface of a cylindrical film including a resin; alternately and repeatedly performing a surface-roughening operation of causing the polishing material to collide with the surface of the cylindrical film, thereby roughening the surface, and a cylindrical film replacing operation of replacing the cylindrical film on which roughening of the surface has been completed with another cylindrical film on which roughening of the surface has not been completed; replacing the polishing material by partially discharging the polishing material, and charging a new polishing material so that the percentage of the new polishing material with respect to the total amount of the polishing material after the new polishing material is charged becomes 30% by weight or more; and alternately and repeatedly performing the surface-roughening operation and the cylindrical film replacing operation again.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: October 8, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Hiroshi Shibuya, Yoshitake Ogura, Masato Saito
  • Patent number: 8523639
    Abstract: Embodiments of the invention provide a slurry delivery and rinse system for a chemical mechanical polishing (CMP) apparatus which is capable of self-cleaning, and which can adjustably deliver the slurry agent and rinse agent over a polishing pad. In one embodiment, the fluid delivery system has a distributed slurry delivery arm (DSDA) which contains at least one manifold, usually two or more manifolds attached to the lower surface of the delivery arm. Each DSDA manifold contains a plurality of slurry nozzles disposed along the length of the manifold. The delivery arm also contains a plurality of high pressure rinse nozzles extending from the lower surface of the delivery arm and disposed along the length of the delivery arm, parallel to each DSDA manifold. In one example, the delivery arm contains two DSDA manifolds disposed parallel to each other and a plurality of high pressure rinse nozzles disposed between the manifolds.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: September 3, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Jamie Stuart Leighton, Abhijit Desai, Douglas R. McAllister
  • Patent number: 8517802
    Abstract: A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry supply train. The first slurry supply train may include a slurry mixing tank, day tank, and at least two slurry feed pumps arranged in series pumping relationship. The first slurry supply train defines a first slurry piping loop. In one embodiment, a second slurry supply train defining a second slurry piping loop is provided. The valve manifold box is operable to supply slurry from either or both of the first and second slurry piping loops to the CMP station.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: August 27, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chiang Tseng, Yung-Long Chen, Yi-Wen Huang, Liang-Chieh Huang
  • Patent number: 8506359
    Abstract: A chemical mechanical polishing aqueous dispersion including (A) silica particles, and (B1) an organic acid, the sodium content, the potassium content, and the ammonium ion content of the silica particles (A) determined by ICP atomic emission spectrometry, ICP mass spectrometry, or ammonium ion quantitative analysis using ion chromatography having a relationship in which the sodium content is 5 to 500 ppm and at least one of the potassium content and the ammonium ion content is 100 to 20,000 ppm.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: August 13, 2013
    Assignee: JSR Corporation
    Inventors: Hirotaka Shida, Takafumi Shimizu, Masatoshi Ikeda, Shou Kubouchi, Yousuke Shibata, Kazuhito Uchikura, Akihiro Takemura
  • Patent number: 8507382
    Abstract: Common sources of different (e.g., concentrated) process materials are controllably supplied to multiple blending manifolds associated with multiple process tools, processing stations, or other points of use, to create an independently controllable process material blend for each tool, station, or point of use. Multi-constituent process materials may be circulated from a supply container through a blending manifold to a return container to ensure homogeneity until immediately prior to blending and use. Such containers may include liner-based containers adapted for pressure dispensation.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: August 13, 2013
    Assignee: Foresight Processing, LLC
    Inventors: John E. Q. Hughes, Donald D. Ware, Steven M. Lurcott, Peter Wrschka
  • Publication number: 20130143474
    Abstract: The present disclosure relates to a slurry distribution system having a distribution tube connected between a mixing tank and a CMP tool. The mixing tank is configured to generate a polishing mixture comprising a diluted slurry having abrasive particles that enable mechanical polishing of a workpiece. The polishing mixture is transported between the mixing tank and a CMP tool by way of a transport piping. An energy source, in communication with the transport piping, transfers energy to the abrasive particles within the polishing mixture, thereby preventing accumulation of the abrasive particles within the transport piping.
    Type: Application
    Filed: December 1, 2011
    Publication date: June 6, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Chen Wang, Feng-Inn Wu, Chih-Hung Tsai, Haung-Jen Hsu, Te-Chia Hsu
  • Patent number: 8449347
    Abstract: A system for use in preparing an articulating surface of a component of an orthopaedic implant is provided. The system includes a magnetorheological polishing fluid including a carrier fluid and a plurality of particles suspendable in said carrier fluid. The system also includes a vessel for containing the Magnetorheological polishing fluid. The system also includes a mechanism for delivering the fluid to form a polishing zone and a holder for securing the component and for moveably positioning the articulating surface of the component relative to the polishing zone. The system further includes a controller for determining the rate of material removal from the object, for determining the direction and velocity of movement of the polishing zone relative to the object and for determining the number of cycles of polishing required.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: May 28, 2013
    Assignee: DePuy Products, Inc.
    Inventor: Jeffrey K. Sutton
  • Patent number: 8444455
    Abstract: A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 ?m, while supplying a polishing agent free of solid materials having a pH of at least 11.8, and, in a second step, the front side of the semiconductor wafer is polished, wherein a polishing agent having a pH of less than 11.8 is supplied. A polishing pad for use in apparatuses for polishing semiconductor wafers, has a layer containing abrasives, a layer composed of a stiff plastic and also a compliant, non-woven layer, wherein the layers are bonded to one another by means of pressure-sensitive adhesive layers.
    Type: Grant
    Filed: May 5, 2010
    Date of Patent: May 21, 2013
    Assignee: SILTRONIC AG
    Inventors: Juergen Schwandner, Roland Koppert
  • Patent number: 8425280
    Abstract: A machine has a head with a nozzle, a pipe for supplying water under pressure to the nozzle, and a duct for supplying an abrasive agent, and adding it to the jet of water under pressure. The duct has a first duct portion, fixed with respect to the head in the movements of rotation about a main axis, and a second duct portion, which is fixed with respect to the movements of rotation. A rotating distributor connects the first rotating portion with the second fixed portion of the duct for supplying the abrasive agent. The distributor's stator and rotor are rotatably mounted on one another without the interposition of seal rings and define between them an internal chamber that is substantially at atmospheric pressure and from which the abrasive agent drops by gravity to a duct outlet that converges into the pipe for supplying water under pressure.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: April 23, 2013
    Assignee: Biesse S.p.A.
    Inventors: Marco Siepi, Matteo Traini, Marco Belli
  • Patent number: 8425276
    Abstract: The present invention provides a polishing composition for polishing copper or copper alloy, comprising: an oxidizing agent (A); at least one acids (B) selected from amino acids, carboxylic acids of 8 or less carbon atoms, or inorganic acids; a sulfonic acid (C) having an alkyl group of 8 or more carbon atoms; a fatty acid (D) having an alkyl group of 8 or more carbon atoms; and an N-substituted imidazole (E) represented by the following general formula (1). (In the formula (1), Ra, Rb, and Rc represent H or an alkyl group of 1 to 4 carbon atoms, and Rd represents a group selected from the group consisting of a benzyl group, a vinyl group, an alkyl group of 1 to 4 carbon atoms, and a group in which a portion of H of these groups has been substituted with OH or NH2.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: April 23, 2013
    Assignee: Showa Denko K.K.
    Inventors: Takashi Sato, Hiroshi Takahashi, Yoshitomo Shimazu, Yuji Itoh
  • Patent number: 8376810
    Abstract: A semiconductor wafer processed on both sides simultaneously, the wafer lying in freely movable fashion in a cutout in one of a plurality of carriers that rotate by means of a rolling apparatus, and one thereby being moved on a cycloidal trajectory, the semiconductor wafer being processed in material-removing fashion between two rotating ring-shaped working disks, wherein each working disk comprises a working layer comprising abrasive material, and wherein an alkaline medium comprising no abrasive material is supplied during the processing.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 19, 2013
    Assignee: Siltronic AG
    Inventor: Juergen Schwandner
  • Patent number: 8376812
    Abstract: A grinder with built-in grinding agent dispenser includes a driving shank having an adapter end for operatively coupling with a grinder machine for being driven to rotate, a grinding shaft operatively coupling with the driving shank for being driven to rotate, an abrasive arrangement provided at the grinding shaft for refining a surface of a workpiece, and a grinding agent dispenser built-in within the grinder for guiding a flow of grinding agent. The dispenser has a supplying channel connected to a supplying inlet, and a grinding channel connected to a dispensing outlet and communicatively connected to the supplying channel, wherein the supplying channel and the grinding channel are provided within the driving shank and the grinding shaft, so that when the grinding agent is feeding into the supplying channel via the supplying inlet, the grinding agent is guided to flow to the dispensing outlet, so as to disperse grinding agent.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 19, 2013
    Assignee: Ningbo Jinghengkaixiang Machinery Co., Ltd.
    Inventor: Longjiang Li
  • Patent number: 8360825
    Abstract: A slurry supply system with multiple supply modules and a flushing module concurrently coupled to the multiple supply modules is provided. Each supply module includes a slurry reservoir and at least one delivery line connecting to the slurry reservoir, wherein each delivery line is oriented toward a chemical mechanical polishing apparatus. The flushing module includes a flushing liquid reservoir and multiple flushing lines connecting to the flushing liquid reservoir, wherein each flushing line is coupled to each delivery line thereby the flush module can selectively flush one of the delivery lines.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: January 29, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Tzung Hsu, Paul Tan, Chih-Chiang Yang
  • Patent number: 8360824
    Abstract: Disclosed is a method of processing a synthetic quartz glass substrate for a semiconductor, wherein a polishing part of a rotary small-sized processing tool is put in contact with a surface of the synthetic quartz glass substrate in a contact area of 1 to 500 mm2, and is scanningly moved on the substrate surface while being rotated so as to polish the substrate surface. When the method is applied to the production of a synthetic quartz glass such as one for a photomask substrate for use in photolithography which is important to the manufacture of ICs or the like, a substrate having an extremely excellent flatness and capable of being used even with the EUV lithography can be obtained comparatively easily and inexpensively.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: January 29, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Daijitsu Harada, Masaki Takeuchi, Harunobu Matsui
  • Patent number: 8360817
    Abstract: A polishing apparatus can perform more precise control of a polishing profile without carrying out many polishing tests in advance. The polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along the radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and a polishing profile, performing a simulation and outputting data to the controller 66.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: January 29, 2013
    Assignee: Ebara Corporation
    Inventors: Yu Ishii, Yoichi Shiokawa, Jyoji Heianna, Hisanori Matsuo
  • Patent number: 8353740
    Abstract: The disclosure is directed to a processing fluid including at least 50 wt % of an aliphatic hydrocarbon having an average chain length of 8 to 16 carbons, 0.005 wt % to 10.0 wt % of Lewis active components, and not greater than 1.0 wt % water. The Lewis active components includes a Lewis acid and a Lewis base. The processing fluid has a conductivity of at least 10 nS/m and a Cannon viscosity of about 0.5 cp to about 5 cp at 25° C.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: January 15, 2013
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Douglas E. Ward, Jason A. Sherlock
  • Patent number: 8342905
    Abstract: An optical disk restoration apparatus and optical disk restoration method are provided, which are capable of achieving a high level of capability of restoring a scratched optical disk, without consuming the time and labor of an operator, while reducing the production cost of the apparatus. During a polishing process, an appropriate amount of a polishing agent is dropped onto the readout surface of the optical disk by a polishing agent supply pump to continuously supply the polishing agent to the interface between the optical disk and polishing pads, while a polishing water supply pump is operated to replenish the polishing agent with moisture evaporated by the polishing heat. By this mechanism, the amount and physical properties of the polishing agent at the interface between the optical disk and the polishing pads are appropriately maintained for a long period of time, so that the restoration capability is maintained at high levels.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: January 1, 2013
    Assignee: Elm Inc.
    Inventors: Takakazu Miyahara, Terumasa Miyahara, Kazutoshi Chijiiwa
  • Patent number: 8328601
    Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: December 11, 2012
    Assignees: Golden Sun News Techniques Co., Ltd., CPUmate Inc
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Jui-Ho Liu, Chih-Hung Cheng, Ken Hsu
  • Publication number: 20120288829
    Abstract: A micro-abrasive blasting device comprises a mixing chamber, a delivery conduit extending from external the mixing chamber to the mixing chamber and a discharge conduit extending from the mixing chamber. Abrasive material may selectively be sealed in the chamber by positioning the discharge conduit to abut the inlet port. The chamber may be spherical to deliver consistent powder perturbation at all mixing chamber orientations. Methods of using the device are disclosed. Methods of making the device by blow molding are disclosed.
    Type: Application
    Filed: July 19, 2012
    Publication date: November 15, 2012
    Inventor: Boaz Barry Groman
  • Patent number: 8308528
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to a platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: November 13, 2012
    Assignee: Round Rock Research, LLC
    Inventor: Trent T. Ward
  • Patent number: 8303373
    Abstract: A diluted slurry supplying apparatus utilized in a polishing apparatus for finishing a semiconductor wafer with a slurry containing colloidal silica and water-soluble polymer is provided. The polishing method comprises: a slurry supplier capable of supplying the slurry containing the colloidal silica and the water-soluble polymer; a diluent supplier capable of supplying a diluent containing an aggregation preventing agent to dilute the slurry; a mixer capable of receiving the slurry and the diluent having been supplied from the slurry supplier and the diluent supplier, respectively, the mixer forming a diluted slurry with a pH value of at least 9; and an ultrasonic vibrator capable of applying an ultrasonic vibration to the diluted slurry staying in the mixer or being fed out from the mixer. Here, the diluent supplying apparatus can change a dilution proportion of the diluted slurry.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: November 6, 2012
    Assignee: Sumco Techxiv Corporation
    Inventor: Kazuaki Kozasa
  • Patent number: 8303377
    Abstract: Provide is a heat-resistant roll with improved effectively characteristics, a production method thereof, and a method of producing sheet glass using the heat-resistant roll. A method of producing a heat-resistant roll equipped with a roll portion containing 5% by weight or more of clay includes: a grinding step (S101) of grinding a roll surface of the roll portion; and a surface treatment step (S102) of performing surface treatment of smoothening the ground roll surface in a wet state.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: November 6, 2012
    Assignee: Nichias Corporation
    Inventors: Masaaki Nakayama, Daiji Tahara, Kouji Iwata, Kazuhisa Watanabe
  • Publication number: 20120252326
    Abstract: Particle-delivery devices, abrasive jet systems, and associated devices, systems, and methods are disclosed herein. In certain aspects, the particle-delivery devices can include an elongated fluidizing chamber and a metering assembly. The metering assembly can include a particle flow path extending from the fluidizing chamber. The metering assembly can also include a carrier-gas passage extending to an injection orifice proximate the fluidizing chamber. The metering assembly can be configured to inject carrier gas into the fluidizing chamber to fluidize particles within the fluidizing chamber. Fluidizing the particles at different carrier-gas pressures and/or flow rates can change the rate of particle delivery. For example, the metering assembly can include a metering opening and a regulator configured to change a steady-state pressure and/or flow rate of carrier gas entering the fluidizing chamber.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 4, 2012
    Applicant: OMAX Corporation
    Inventors: Ernst H. Schubert, Erik M. Unangst