Abstract: An abrasive disc assembly for a tool having an externally threaded, motor-driven spindle. The assembly includes an abrasive disc having a central bore formed therethrough and a male portion having an internally-threaded hub portion and a flange portion. The outer dimension of the hub portion is sized to be received within the central bore and the internally-threaded hub portion is enmeshingly engagable with the externally threaded, motor-driven spindle. The assembly further comprises an articulating locking finger extending from the male portion and having a retaining surface. The articulating locking finger is deflectable between a locked position and a deflected position. Finally, the assembly includes a female portion having a central cavity and an engagement surface.

Abstract: A polishing head for use in a polishing machine for optical surfaces, having an axis of rotation and a base body having a holding structure intended to be arranged at a polishing spindle and having a transport element intended to be held at a tool change arm, the transport element being positionable against a holding element of the tool change arm in order to perform a tool change, wherein at least one locking element is provided which can be positioned against the tool change arm such that a positive and/or non-positive joint results.

Abstract: A polishing head for use in a polishing machine for optical surfaces, having an axis of rotation and a base body having a holding structure intended to be arranged at a polishing spindle and having a transport element intended to be held at a tool change arm, the transport element being positionable against a holding element of the tool change arm in the axial direction relative to the axis of rotation in order to perform a tool change, wherein at least one locking element is provided which can be positioned against the tool change arm in the circumferential direction U such that a positive and/or non-positive joint results.

Abstract: A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping element includes a first upper clamper and a first lower clamper for clamping a first area of a first polishing pad. The second clamping element includes a second upper clamper and a second lower clamper for clamping a second area of the first polishing pad, the first area and the second area are opposite to each other. When the first polishing pad will be disconnected from the bottom surface of the polishing head and replaced by a second polishing pad, the first clamping element and the second clamping element are released from the first polishing pad.

Abstract: An improved milling machine makes use of individually controlled x-axis, y-axis, and z-axis carriages. These carriages provide positive and precise control of the position of the cutting tools and the blank to be cut. The tools are located in spindles that are moved in the x-axis. A work piece or blank is manipulated in the y-axis and the z-axis. The tools are offset in the x-axis. Lights on a work space door are used to signal the condition of the mill machine and the milling operation. A tool changer allows the tools to be changed to accommodate other materials. A camera or other sensor is used to detect the location and wear on the tools.

Abstract: A machine tool is described, in particular a grinding machine, with a tool storage device. The tool storage device contains an outer magazine wheel (34) and an inner magazine wheel (58), which are independently concentrically rotatable in a controlled manner. The outer magazine wheel (34) preferably holds grinding tools (56), while the inner magazine wheel (58) preferably holds grinding wheel protectors (68). The grinding tool (56) and the grinding wheel protector (68) are removed from the tool storage device and are returned to the latter by the tool spindle (30). The grinding tools (56) and grinding wheel protectors (68) can be exchanged independently in arbitrary combinations and possibly also simultaneously.

Abstract: An exchangeable spindle assembly for a machine tool. The spindle assembly includes an assembly attachment coupling being connectable to said machine tool, a tool spindle having a predetermined spindle diameter, and a spindle drive coupling being connectable with a drive mechanism of the machine tool. The drive coupling communicates with the tool spindle whereby rotation of the drive coupling effects rotation of the tool spindle. The spindle assembly further includes at least one coolant distribution manifold being connectable with a coolant supply source on the machine tool via a coolant connection on the spindle assembly. The spindle assembly being arranged in a manner whereby upon mounting the spindle assembly on the machine tool, the assembly attachment coupling, spindle drive coupling and coolant connection are all concurrently connectable to the machine tool. Additional connections may be included.

Abstract: A tool magazine is located adjacent to the work space of a machine tool. The tool magazine has a magazine wheel (34) that is rotatable in a controlled manner about a vertical axis and exhibits tool holders (50) on its periphery, in which tools can be held with the tool axis directed radially with respect to the magazine wheel (34) and can be removed with their shafts directed toward the inside of the magazine wheel (34). The horizontally aligned tool spindle is displaceable along the horizontal Y-axis and along the vertical Z-axis and can be lowered into the magazine wheel (34) from above, in order to directly remove the tools from the inside of the magazine wheel (34).

Abstract: A system for chemical mechanical planarization comprises a platen assembly for holding an object to be planarized and a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad. The polishing pad is smaller in surface area than the object. The polishing head is movable from a first region overlying the platen assembly to a second region. The puck holder assembly comprises a backing surface for positioning the substrate, and a clamp ring positioned proximate to the backing surface for supplying mechanical force to the substrate to hold the substrate in place during a polishing operation. A spring mechanism is disposed in the housing for resiliently biasing the clamp ring toward the substrate.

Abstract: A polishing device includes a wafer chuck mechanism which retains a wafer while its plane to be polished faces upward, a polishing pad component which possesses a polishing plane which polishes the wafer, a polishing head, and a shift mechanism which enables a relative displacement of said polishing pad component in relation to the wafer. A fixation and retention mechanism fixes and retains said polishing pad component to the polishing head in a detachable fashion while its polishing plane faces downward. The displacement distance of the shift mechanism ranges from the polishing position of the wafer to the exchange position of the polishing pad component, so that the polishing pad component is automatically exchanged.

Abstract: A rolled plate joining apparatus for joining rolled plates by cutting one surface of the tailing end of a preceding rolled plate and the other surface of the leading end of a succeeding rolled plate while traveling in the width direction and by overlapping the resulting cut surfaces to be joined. The joining apparatus includes machining apparatuses each having a cutter for cutting the undersurface of the tailing end and the upper surface of the leading end, a traversing apparatus for running said machining apparatuses in the plate width direction to move said machining apparatuses to waiting positions outside of the plate width, and cutter cooling apparatuses provided in said waiting positions for cooling said cutters.

Abstract: A polishing device includes a wafer chuck mechanism which retains a wafer while its plane to be polished faces upward, a polishing pad component which possesses a polishing plane which polishes the wafer, a polishing head, and a shift mechanism which enables a relative displacement of said polishing pad component in relation to the wafer. A fixation and retention mechanism fixes and retains said polishing pad component to the polishing head in a detachable fashion while its polishing plane faces downward. The displacement distance of the shift mechanism ranges from the polishing position of the wafer to the exchange position of the polishing pad component, so that the polishing pad component is automatically exchanged.

Abstract: A mechanism and a method for automatically exchanging polishing tools in a mold polishing device. A polishing tool, which is mounted on a spindle of an arm of a robot, is pressed onto and displaced along the work surface to polish the same. A T-shaped holder is provided at a leading end portion of the spindle, and the polishing tool is provided with a pair of notches that allow a pair of latch pins to be press-fitted thereinto and forcibly withdrawn therefrom. A tool stand and a tool removal stand are provided in the vicinity of the mold setting area. A plurality of polishing tools are disposed on the tool stand. A horizontal slot of a narrow width that allows passage of the latch pins is formed in the tool removal stand. The arm, together with the holder, is raised such that the latch pins pass upward through the slot of the tool removal stand. The polishing tool is thereby removed from the holder.

Abstract: The present invention relates to an automated random, orbital abrading apparatus and a method and apparatus for positioning the back-up pad of the apparatus at a known location within its range of motion at the end of an abrading cycle.

Abstract: A milling, surfacing and polishing machine with automatic tool change comprises tool fastening and tightening means and tool drive means.

Abstract: The present invention relates to an automated random, orbital abrading apparatus and a method and apparatus for positioning the back-up pad of the apparatus at a known location within its range of motion at the end of an abrading cycle.

Abstract: An automated robotic quick change force controlled arbor device particularly to apply a sanding disk to surface finish metal and an automatic replacement of the disk.