Abstract: This field-effect transistor comprises a conductive substrate (2) serving as the gate electrode, an insulating barrier layer (3), and a superconducting channel layer (1) on top of the barrier layer (3). The superconductor layer (1) carries a pair of mutually spaced electrodes (4, 5) forming source and drain, respectively. The substrate is provided with an appropriate gate contact (6).The substrate (2) consists of a material belonging to the same crystallographic family as the barrier layer (3). In a preferred embodiment, the substrate (2) is niobium-doped strontium titanate, the barrier layer (3) is undoped strontium titanate, and the superconductor (1) is a thin film of a material having a lattice constant at least approximately similar to the one of the materials of the substrate (2) and barrier (3) layers. A preferred material of this type is YBa.sub.2 Cu.sub.3 O.sub.7-.delta., where 0.ltoreq..delta..ltoreq.0.5.

Abstract: A planar type superconductive thin film transistor using oxide superconductive materials and utilizing a long distance proximity effect is obtained with a good reproducibility.In order to obtain the planar type superconductive transistor utilizing the long distance proximity effect, an interlayer separating film that plays a similar role with resists is used together with conventional resists in high temperature annealing process.