Abstract: Systems and methods include providing a coated abrasive article with an enhanced anti-loading composition in a supersize coat. The anti-loading composition includes a mixture of a metal stearate, at least one performance component, and a polymeric binder composition.

Abstract: A method of forming a vitreous bond abrasive article is presented that includes receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying a plurality of layers of a vitreous bond abrasive article precursor. The vitreous bond abrasive article precursor includes abrasive particles bonded together by a vitreous bond precursor material and an organic compound. The vitreous bond abrasive article precursor further comprises at least one of: at least one tortuous cooling channel extending at least partially through the vitreous bond abrasive article precursor or at least one arcuate cooling channel extending at least partially through the vitreous bond abrasive article precursor. The method also includes generating, with the manufacturing device by an additive manufacturing process, the vitreous bond abrasive article precursor based on the digital object.

Abstract: With a method for the production of a grinding tool, a tool base body is provided, which configures a three-dimensionally shaped adhesive sur-face by application of a bonding agent. The tool base body is positioned in a way that the adhesive surface is arranged in an electrostatic field, be-tween a first electrode and a second electrode. Into the electrostatic field, abrasive grains are introduced, which, due to the electrostatic field, move towards the adhesive surface and adhere to same. The grinding tool produced in this manner has a three-dimensionally shaped abrasive grain layer. The production of the grinding tool is simple, flexible and economical. The grinding tool has a randomly shaped abrasive grain layer and can be applied in a manifold manner with a high cutting performance and a long service life.

Abstract: A simple water jet peening method is usable for a smaller device, and allows use of an existing underwater washing machine. The method includes immersing an object in a water based washing liquid in a washing bath to have a processing surface at a distance of at least 100 mm and less than 300 mm from a liquid surface of the water based washing liquid, and jetting the water based washing liquid from a nozzle downward toward the object in the water based washing liquid contained in the washing bath.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may comprise a plurality of polycrystalline superabrasive particles made of surface functionalized superabrasive particle The surface functionalized superabrasive particles may have halogens or organic moiety instead of hydrogen.

Abstract: A carbide composite for a downhole tool may be formed by depositing a first layer on a substrate, and a second layer at least partially adjacent to the first layer. The first and second layers may each include carbides, metal binders, organic binders, or a combination thereof. The first and second carbide layers may have a different particle size, particle shape, carbide concentration, metal binder concentration, or organic binder concentration from one another.

Abstract: Disclosed are substances and methods of cleaning musical instruments which are capable of abrading or removing dirt and grime from instrument surfaces or cracks. In one embodiment, the substance comprises a plastic flexible material mixed with at least one abrasive material. In one method of use: (1) a lubricant (such as a water/detergent solution) is gently sprayed on to a small area on the surface of a musical instrument; (2) the substance is, with light to medium pressure, rubbed across the lubricated surface multiple times until the area is visibly clean or smooth to the touch; and (3) steps one and two are repeated until the whole instrument is cleaned or smoothed.

Abstract: A method of making an abrasive particle distribution includes: sorting an initial lot of abrasive particles into a plurality of sublots including first and second sublots of the abrasive particles according to their average particle diameter and aspect ratio, and combining the first and second sublots. The initial lot conforms to an abrasives industry specified nominal grade. The first sublot has an average particle diameter and aspect ratio less than the second sublot. A sum of the first sublot and the second sublot contains fewer abrasive particles than the initial lot. The resultant abrasive particle distribution and abrasive articles including the same are also disclosed.

Abstract: Systems and methods are provided for processing abrasive slurry used in cutting operations. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ultrasonically agitated such that abrasive grain contained in the slurry separates from the other components of the slurry and the first solvent. After the abrasive grain has settled to a bottom portion of the container, the other components of the slurry and the first solvent are removed from the tank. The abrasive grain may then be washed with a second solvent. The abrasive grain is then heated and is suitable for reuse in an abrasive slurry.

Abstract: Methods of fabricating polycrystalline diamond include encapsulating diamond particles and a hydrocarbon substance in a canister, and subjecting the encapsulated diamond particles and hydrocarbon substance to a pressure of at least 5.0 GPa and a temperature of at least 1400° C. to form inter-granular bonds between the diamond particles. Cutting elements for use in an earth-boring tool includes a polycrystalline diamond material formed by such processes. Earth-boring tools include such cutting elements.

Abstract: Aggregate abrasive grains (10) for use in the production of abrading or cutting tools are formed. Each aggregate abrasive grain comprises an abrasive core particle and a plurality of abrasive peripheral particles disposed around the core particle. The abrasive particles intended as the core particles (12) are provided with a coating containing a binder. These binder-coated core particles (26) are then surrounded with those particles that are intended to become the peripheral particles (28) of the aggregate grains. The binder-coated core particles surrounded with the peripheral particles are heated up to a temperature at which the binder softens so that the peripheral particles are caused to attach to the core particles.

Abstract: The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.

Abstract: Embodiments of the invention can provide cryogenic treatment processes for diamond abrasive tools. One process in accordance with an embodiment of this invention can include introducing an abrasive tool into a cycling chamber, wherein the tool has a temperature of about ambient temperature; and introducing at least one cryogenic material into the chamber, wherein the internal temperature of the chamber or tool can be controlled by adjusting the flow rate of the at least one cryogenic material. The process can result in a strengthened and toughened abrasive tool. The process can be repeated multiple times.

Abstract: A slurry containing a plurality of monocrystalline diamond particles, wherein the average surface roughness of said particles is less than about 0.95; a major vehicle selected from the group of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof; and one or more optional additives.

Abstract: A surface-modified abrasive grain includes an abrasive grain as a substrate, and a film on the abrasive grain that includes a relatively hydrophilic silane component and a relatively hydrophobic silane component. The film can be a single film layer or multiple film layers, wherein a film layer most proximal to the abrasive grain has a predominately hydrophilic silane component, and a film layer more distal to the abrasive grain includes predominately a relatively hydrophobic silane component. Coated abrasive products and bonded abrasive products include the surface-modified abrasive grains.

Abstract: The invention provides a composition for slicing a substrate using a wire saw wherein the composition comprises a liquid carrier and an abrasive. The invention further provides methods of slicing a substrate using a wire saw and a composition.

Abstract: Azeotropic or azeotrope-like compositions are disclosed. The azeotropic or azeotrope-like compositions are mixtures of E-1,1,1,4,4,4-hexafluoro-2-butene with methyl formate, n-pentane, 2-methylbutane, trans-1,2-dichloroethylene, 1,1,1,3,3-pentafluoropropane, n-butane or isobutane. Also disclosed is a process of preparing a thermoplastic or thermoset foam by using such azeotropic or azeotrope-like compositions as blowing agents. Also disclosed is a process of producing refrigeration by using such azeotropic or azeotrope-like compositions. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as solvents. Also disclosed is a process of producing an aerosol product by using such azeotropic or azeotrope-like compositions. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as heat transfer media. Also disclosed is a process of extinguishing or suppressing a fire by using such azeotropic or azeotrope-like compositions.

Abstract: A hard crystal substrate such as a GaN substrate or a SiC substrate is polished by using polishing oil slurry having abrading particles of artificial diamond clusters dispersed in a dispersant. The artificial diamond clusters include approximately spherical agglomerate particles with average particle size D50 of 20 nm or more and 50 nm or less, having primary particles with particle diameters of 2 nm or more and 10 nm or less. A rough polishing process is carried out first such that an average surface roughness of 0.5 nm or more and 1 nm or less is obtained, followed by a finishing process such that the average surface roughness of said surface becomes 0.2 nm or less.

Abstract: The present invention relates to a method and a system for treating spent abrasive slurry obtained from a process for cutting a body of a substrate material into wafer-like slices, said slurry comprising a lubricant fluid, unspent abrasive particles and fines. The method comprises separating the spent slurry in a first sedimentation step into a solids concentrate comprising unspent abrasive particles and a solids depleted slurry; and subsequently separating the solids depleted slurry by cross-flow filtration into a fines containing fraction and a solids and fines depleted regenerated lubricant fluid.

Abstract: This invention provides a polishing medium for chemical-mechanical polishing, comprising an oxidizing agent for a conductor, a protective-film-forming agent for protecting a metal surface, an acid, and water; (1) the polishing medium having a pH of 3 or less, and the oxidizing agent being in a concentration of from 0.01 to 3% by weight, or (2) the polishing medium containing abrasive grains having an average particle diameter of 50 nm or less, and the abrasive grains having standard deviation of particle size distribution in a value of more than 5 nm.

Abstract: An abrasive slurry, abrasive article, and method is provided for forming an abrasive coating on a surface of a backing. The abrasive slurry includes a continuous phase, a first discontinuous phase of abrasive particles dispersed in the continuous liquid phase, and a second discontinuous phase of binder precursor particles dispersed in the continuous liquid phase, so that the continuous liquid phase carries the first and second discontinuous phases. A coated abrasive article is formed by coating the abrasive slurry onto the surface of the backing, and then removing the continuous phase.

Abstract: A slurry containing a plurality of monocrystalline diamond particles, wherein the average surface roughness of said particles is less than about 0.95; a major vehicle selected from the group of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof; and one or more optional additives.

Abstract: A CMP polishing liquid being capable of using in a chemical mechanical polishing comprising of: a first chemical mechanical polishing step of polishing a conductive substance layer of a substrate having an interlayer insulation film containing convex and concave regions on a surface thereof, a barrier layer coating along the surface of the interlayer insulation film, and the conductive substance layer coating the barrier layer while filling the concave regions, and thus exposing the barrier layer in the convex regions; and a second chemical mechanical polishing step of exposing the interlayer insulation film in the convex regions by polishing the barrier layer exposed in the first chemical mechanical polishing step; characterized in that a difference (B)?(A) is 650 {acute over (?)} or less, wherein the (A) is a polishing amount of the interlayer insulation film in a field area when the interlayer insulation film in the field area having a width of 1,000 ?m or more of the interlayer insulation film region f

Abstract: An abrasive composite, a method for making the abrasive composite, and a polishing apparatus using the abrasive composite are disclosed. The abrasive composite includes a matrix and a plurality of nano-particles distributed therein. The nano-particles are made of at least nano carbon sphere particles and fullerene particles. A ratio by weight of the nano carbon sphere particles to the fullerene particles is advantageously in the range from about 1:2 to about 1:1. The fullerenes are preferably C60 fullerenes. The abrasive composite further includes an amount of diamond particles admixed in the matrix, for improving hardness of the abrasive composite so as to accelerate polishing rate. The abrasive composite is preferably in a form of pellets. The pellets have an average grain size in the range from about 10 nanometers to about 200 nanometers.

Abstract: A polish composition for metallic surfaces containing a polish and abrasive alumina nanoparticles in a water in oil emulsion composition composed of surfactants, suspending agents, and aluminum oxide particles of high purity of 200 nanometers or less having a median particle diameter of 0.24 microns together with an aliphatic hydrocarbon solvent producing a polish having cleaning properties and an enhanced high glossed surface from a single application.

Abstract: This invention provides for provides for abrasive compositions and methods of use of these compositions for the preparation of surfaces for the application of various coatings such as paints, lacquers and varnishes. The abrasive compositions of the invention provide rapid cleaning and dulling of the underlying surface rendering it suitable for the application of paints or other finishes.

Abstract: Methods and compositions are provided for the chemical mechanical planarization of ruthenium. The method includes polishing the ruthenium layer using a low contact pressure and exposing the ruthenium layer to a planarization composition while polishing. The planarization composition comprises a dispersing medium and a plurality of abrasive particles. The method further includes removing the ruthenium of the ruthenium layer as a ruthenium hydroxide if the pH of the composition is in the range of from about 8 to about 12. The planarization composition may further comprise an oxidizing agent, with the ruthenium removed as a ruthenium hydroxide if the pH of the composition is in the range of from about 2 to about 14. The planarization composition may further comprise a complexing agent, with the ruthenium transformed into an ionic state and removed as a ruthenium complex if the pH of the composition is no greater than about 2.5.

Abstract: An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or less when a test piece comprising the water-insoluble matrix material is broken at 80° C. according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.

Abstract: A Chemical Mechanical Polishing(abbreviated as “CMP”) slurry composition for polysilicon and method of forming a self-aligned floating gate of a flash memory device are disclosed for performing CMP process using slurry having higher polishing selectivity to polysilicon than to isolation oxide film which is an etching barrier film.

Abstract: A finishing composition for a variety of surfaces, including, without limitation, paints, metals, plastics and fiberglass, comprises water, wax, soap, scent, hair conditioner, mineral spirits and abrasives.

Abstract: A nitride CMP slurry having selectivity to nitride over oxide. The slurry increases the polishing speed of a nitride film by varying the pH of the slurry, and polishes the nitride film faster than an oxide film by decreasing the polishing speed of the oxide film. As a result, the slurry provides a CMP process for manufacturing a high density and highly integrated semiconductor device and a structural development of new concept device.

Abstract: The invention pertains to a liquid polish for metals, glass, plastics and their derivatives: the novel liquid polish reduces application and buffing time significantly compared to prior art polishes using animal fat, glycerides, oils, wetting agents or tallow and uses unique compounds for increasing contact between the abrasive oxides within said liquid polish and surface contaminants of polished materials.

Abstract: The object of the present invention is to provide an aqueous dispersion for chemical mechanical polishing which can be polished working film for semiconductor devices and which is useful for STI. The aqueous dispersion for chemical mechanical polishing of the invention is characterized by comprising an inorganic abrasive such as silica, ceria and the like, and organic particles composed of a resin having anionic group such as carboxyl group into the molecular chains. The removal rate for silicon oxide film is at least 5 times, particularly 10 times the removal rate for silicon nitride film. The aqueous dispersion may also contain an anionic surfactant such as potassium dodecylbenzene sulfonate and the like. And a base may also be included in the aqueous dispersion for adjustment og the pH to further enhance the dispersability, removal rate and selectivity.

Abstract: A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.

Abstract: A vitreous bonded abrasive article, more particularly a grinding wheel, having improved grinding performance is provided wherein the open pores of the abrasive article contain an impregnant which comprises at least one water insoluble, sulfur bearing organic substance having at least one carbon to sulfur bond, at least about 5% by weight sulfur and a melting point of at least about 30° C. said melting point being at least 10° C. below the decomposition temperature of the substance and selected from the group consisting of substituted and unsubstituted aliphatic, aromatic, cycloaliphatic, alkenyl, alkynyl, alkylaryl, arylalkyl and substituted heterocyclic sulfur bearing organic substances or a mixture of said substances grinding aid. The impregnant is free of a medium, other than the water insoluble, sulfur bearing substance, in which the substance or a mixture of such substances is dissolved or dispersed.

Abstract: A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconductor wafer surface. Another composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.

Abstract: A measurement of polyurethane pad characteristics is used to predict performance characteristics of polyurethane pads used for chemical mechanical planarization (CMP) of semiconductor wafers, and to adjust process parameters for manufacturing polyurethane pads. In-situ fluorescence measurements of a pad that has been exposed to a high pH and high temperature environment are performed. The fluorescence characteristics of the pad are used to predict the rate of planarization of a wafer. A portion of one pad from a manufacturing lot is soaked in an organic solvent which causes the portion to swell. The relative increase in size is indicative of the performance characteristics of pads within the manufacturing lot Statistical Process Control methods are used to optimize the CMP pad manufacturing process. Predicted pad characteristics are available for each pad.

Abstract: A subject matter of the invention is a process for the preparation of particles comprising at least one metal ion, which comprises the stage of bringing into contact a precursor a metal cation, optionally partially hydrolyzed, with at least one water-soluble comb copolymer. Likewise, a subject matter of the invention is particles capable of being prepared according to the process of the invention, said particles exhibiting a mean size of between 2 and 500 nm and preferably between 2 and 300 nm. Finally, it relates to the use of such particles in the mechanical polishing of hard objects, in the preparation of pigments or mixed ceramics for the electronic industry, in the reinforcing of polymeric matrices, in fungicidal or biocidal dispersions, in the scavenging of sulfur derivatives or the scavenging of unpleasant smells.

Abstract: The presently claimed invention relates to a method of making a PcBN cutting tool insert.

Abstract: Alpha alumina abrasive grits which are particularly well-suited to medium to low pressure grinding applications wherein the grits comprise uniformly dispersed microvoids.

Abstract: A method of planarizing a semiconductor wafer having a polishing endpoint layer that includes a ligand is disclosed. One step of the method includes polishing a first side of the wafer in order to remove the ligand from the wafer. Another step of the method includes determining that a chelating agent has bound the ligand due to the polishing step removing the ligand of the polishing endpoint layer. The method also includes the step of terminating the polishing step in response to determining that the chelating agent has bound the ligand. A polishing system is also disclosed which detects a polishing endpoint based upon a chelating agent binding a ligand of a polishing endpoint layer of a semiconductor device.

Abstract: A method of detecting presence of a polishing slurry on a semiconductor wafer subsequent to polishing of the wafer includes the step of adding a chemical marker to the polishing slurry. The method also includes the step of polishing a first side of the wafer in order to remove material from the wafer. In addition, the method includes the step of applying the polishing slurry to the first side of the wafer during the polishing step. Moreover, the method includes the step of ceasing the polishing step when the wafer has been polished to a predetermined level. Yet further, the method includes the step of directing incident electromagnetic radiation onto the wafer subsequent to the ceasing step. The method also includes the step of detecting a physical characteristic of resultant electromagnetic radiation which is produced in response to the incident electromagnetic radiation being directed onto the wafer.

Abstract: An abrasive article is provided having a rebulkable nonwoven web and a continuous sheet-like abrasive coating bonded to the first major surface of the nonwoven web. The abrasive coating comprising a plurality of abrasive particles dispersed in a binder.

Abstract: The present invention is a polishing compound comprising a colloidal solution containing 1˜15 wt. % of silicon oxide particles of 8˜500 nanometer average diameter, wherein said colloidal solution is prepared as a buffer solution which has buffering action between pH 8.7˜10.6 by the addition of one combination selected from groups composed by weak acid and strong base, strong acid and weak base or weak acid and weak base, and logarithms of reciprocal number of acid dissociation constant at 25° C. of said weak acid and/or weak base is 8.0˜12.0.

Abstract: An apparatus for planarizing a semiconductor wafer having a polishing endpoint layer that includes a catalyst material is disclosed. The apparatus is operable to detect the endpoint based upon the chemical slurry whether a catalytic reaction has occurred due to the polishing platen removing a portion of the catalyst material from the wafer.

Abstract: A working fluid according to the invention is supplied to a working point where a working of a workpiece is performed with the working fluid. The working fluid contains a solvent and microcapsules filled with liquid-state substances, the microcapsules being dispersed in the solvent. A working process according to the invention performs a working of a workpiece with the working fluid, the working fluid containing the solvent and the microcapsules filled with the liquid-state substances, the microcapsules being dispersed in the solvent. In the working process according to the invention, the working fluid is supplied to a working point of the workpiece. The working of the workpiece is performed at the working point with the working fluid supplied to the working point.

Abstract: Structured abrasive articles having an abrasive coating including a binder which comprises the reaction product of a binder precursor and a reactive siloxane polymer are described as well as methods of making same. The reactive siloxane polymers have at least one functional group which is capable of reacting with the binder precursor.

Abstract: The invention relates to a rigid sand body consisting of a plurality of sand grains adhering to one another and provided with a coating consisting of wax, wherein the sand body is abradable, as well as to a process for its preparation, which is characterized in that sand grains and wax are heated separately from one another at a temperature of 50-90° C., the heated sand grains and the heated, liquid wax are added together and the composition obtained is allowed to cool for solidification. The sand bodies of the invention are particularly suitable as a sand scrub for skin massage or as a modelling or model component. The invention also relates to a process for producing discrete agglomerated sand grains provided with a coating having burls consisting of wax by abrading the sand body of the invention. The resulting abration sand comprising sand grains surrounded by wax are very well suited as sliding and slipping bases.

Abstract: Corrugated abrasive discs such as grinding wheels are treated by applying a water-resistant coating to the interiors of the corrugations before the corrugations are plugged. Discs having water-sensitive matrices such as magnesium oxychloride cement are thus protected against water or water vapor seepage from aqueous-based plug fill material.