The Material Primarily Contains Elemental Selenium, Tellurium, Or Sulfur, Or Compound Thereof (e.g., Zinc Sulfide) Patents (Class 516/96)
  • Patent number: 11465947
    Abstract: The present invention is directed to a flowable mixture including: a) a hydrated clay suspension and b) sulfur derived from elemental sulfur. Preferably, the flowable mixture includes elemental sulfur particles and a hydrated, absorbent clay, such as bentonite clay. The flowable mixture is preferably a liquid mixture for use as a fertilizer or fungicide.
    Type: Grant
    Filed: January 16, 2016
    Date of Patent: October 11, 2022
    Assignee: Stoller Enterprises, Inc
    Inventors: Jerry Stoller, Ritesh Sheth
  • Patent number: 9574272
    Abstract: A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: February 21, 2017
    Assignee: RAMOT AT TEL-AVIV UNIVERSITY LTD
    Inventors: Gil Markovich, Daniel Azulai, Olga Krichevski
  • Patent number: 7704315
    Abstract: Aqueous dispersion containing a metal oxide powder with a fine fraction and a coarse fraction, in which—the metal oxide powder is silicon dioxide, aluminum oxide, titanium dioxide, zirconium dioxide, cerium oxide or a mixed oxide of two or more of the aforementioned metal oxides,—the fine fraction is present in aggregated form and has a mean aggregate diameter in the dispersion of less than 200 nm,—the coarse fraction consists of particles with a mean diameter of 1 to 20 ?m, —the ratio of fine fraction to coarse fraction is 2:98 to 30:70, and—the content of metal oxide powder is 50 to 85 wt. %, referred to the total amount of the dispersion. The aqueous dispersion is produced by a process comprising the steps:—production of a fine fraction dispersion by dispersing the pulverulent fine fraction in water by means of an energy input of at least 200 KJ/m3?, and—introducing the coarse fraction in the form of a powder into the fine fraction dispersion under dispersing conditions at a low energy input.
    Type: Grant
    Filed: July 19, 2005
    Date of Patent: April 27, 2010
    Assignee: Degussa AG
    Inventors: Monika Oswald, Corinna Kissner, Roland Weiss, Andreas Lauer
  • Patent number: 7683098
    Abstract: Methods for manufacturing nanomaterial dispersions, such as nanomaterial concentrates, and related nanotechnology are provided. The nanomaterial concentrates provided can be more cheaply stored and transported compared to non-concentrate nanomaterial forms.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: March 23, 2010
    Assignee: PPG Industries Ohio, Inc.
    Inventor: Tapesh Yadav
  • Patent number: 7338618
    Abstract: A doped-type metal sulfide phosphor nanoparticle dispersion, comprising a doped-type metal sulfide phosphor nanoparticle dispersed in a hydrophobic organic solvent, wherein the doped-type metal sulfide phosphor nanoparticle comprises a surface that is modified with a surface modifier, the surface modifier being a compound represented by formula [I]: HS-L-WFormula [I] wherein L represents a divalent linking group; and W represents COOM or NH2, in which M represents a hydrogen atom, an alkali metal atom, or NX4, in which X represents a hydrogen atom or an alkyl group.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: March 4, 2008
    Assignee: Fujifilm Corporation
    Inventors: Hiroyuki Hirai, Keiko Sugihara, Junji Nishigaki
  • Patent number: 6017967
    Abstract: The invention relates to a metal sulfide dispersion used for electroplating nonconductors such as substrates used for the formation of a printed circuit board. A printed circuit board made using the dispersion could have metallized through-holes comprising electrodeposited copper on the walls of the holes with an adsorbed layer of metal sulfide particles between the circuit board base material and the copper on the walls of the through-holes. The metal sulfide is characterized by spherical particles having a mean diameter of less than 100 nanometers and a particle size distribution where less than 10 percent of the particles within the dispersion have a diameter twice that of the mean diameter of all particles within the dispersion.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: January 25, 2000
    Assignee: Shipley Company, L.L.C.
    Inventors: Egon Matijevic, Matthias Schultz, Wade Sonnenberg, John J. Bladon, Patrick J. Houle, Thong B. Luong