Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: Crosslinkable resin compositions that are cured easily by irradiation with active energy beams and particularly cured quickly with ultraviolet ray are provided, which comprises a polymer containing a maleimido group and an ethylenically unsaturated group. The composition may be an aqueous composition. They provide cured films which are excellent in durability, free from coloring and odors, and also excellent in abrasion resistance, adhesion to substrates, surface smoothness, and chemical resistance.

Abstract: Triazine ring based polymers for photoinduced liquid crystal alignment introduces photoactive groups for inducing, reinforcing, improving and preserving liquid crystal alignment, for example photoreactor such as cinnamate, coumarin, chalcone and maleimide, as a chain to have at least one photoactive group. One of the photoactive groups can experience Fries rearrangement which induces liquid crystal alignment, and other groups can experience photodimerization, photoisomerization, photocrosslinkng or photodegradation to reinforce, change or preserve the generated alignment.

Abstract: A method for producing a solvent resistant, low-extractable, film from an actinic radiation curable homogenous aqueous composition containing a water soluble compound, having at least one alpha, beta-ethylenically unsaturated radiation polymerizable double bond, and water as essential components.

Abstract: A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C?C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C?C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: Provided are radiation-cured, laminated materials, radiation-curable adhesive compositions suitable for use in forming the laminated materials, and methods of making laminated materials.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: The present invention provides a novel photosensitive compound having an azido group suitable for exposure to light of a short wavelength; a photosensitive resin containing the photosensitive compound; and a photosensitive composition containing the photosensitive compound or photosensitive resin. The photosensitive compound containing a photosensitive unit represented by formula (1): wherein R is selected from among the following groups, R: X is selected from among the following groups, X: and each of Y and Z represents a hydrogen atom, an alkyl group, an acetal-group-containing alkyl group, an aryl group, an aralkyl group, or a substituent containing a base-forming nitrogen atom, wherein at least one of R and X contains an azido group.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: The invention is directed to the use of multifunctional thiol compounds as adhesion promoters and/or primers to enhance the adhesion of photo or electron beam curable polymers, coatings, adhesives, or sealants to gold, other precious metals, and their alloys. Actinic radiation and electron beam (“EB”) radiation can be used to cure such compositions. The resulting cured compositions are optically clear, low Tg (≦30° C.), high refractive index (>1.50 at 1541 nm), thermally, oxidatively, and hydrolytically stable adhesives and/or coatings for glass and/or metal. The adhesive compositions containing such multifunction thiols can survive, without delamination or separation, testing conditions of 85° C. and 85% relative humidity (“RH”) for a time in excess of 500 hours.

Abstract: A radiation-curable composition is comprised of the reaction product of an amine-terminated (poly)aminoamide and a mono-(meth)acrylate or a poly-(meth)acrylate. The radiation-curable composition is a liquid at room temperature and does not undergo substantial volume contraction upon curing and exhibit excellent adhesion to porous and non porous substrates alike.

Abstract: Disclosed is a negative-type photosensitive resin composition comprising component (A) that is a product of the Michael addition reaction between an amino group-containing compound (a-1) represented by the general formula (I): (wherein n is an integral number of 1-4), and a polyethyleneglycol di(meth)acrylate (a-2) represented by the general formula (II): (wherein R1 is a hydrogen or a methyl, and m is an integral number of 4-14). The composition of the invention is broadly be applicable in the technical fields of photo masks for etching use in the fabrication of CRT shadow masks, and lead frames for the mounting of IC chips; phosphor patterning of CRT; and further those of photosensitive resin plates, dry films, aqueous photosensitive paints, and aqueous photosensitive adhesives, etc.

Abstract: An ocular lens having a desired shape without having a deformation induced by its process, and having a uniform coat layer on its surface, is proceeded by single mold polymerization. The ocular lens is produced by a process comprising a step of irradiating at least one part of the molding surface for the ocular lens of the mold with an excimer light, a step of coating a compound fixable to the ocular lens surface by an interaction with a polymerizable component in the ocular lens material, or its solution on the mold surface after irradiating with an excimer light, a step of filling the ocular lens material into the mold after coating, and polymerizing, a step of releasing a polymer obtained by the polymerization from the mold, and obtaining an ocular lens stock material having above-mentioned component fixed on its surface, and a step extracting unfixed unreacted components from obtained ocular lens stock material.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: The present invention aims to provide an adhesive composition showing high adhesion and cohesion as well as good heat resistance. Adhesive compositions of the present invention include an imide (meth)acrylate, a monomer having a glass transition temperature of −50° C. or less when it is homopolymerized, and a photoinitiator, wherein the content of the imide (meth)acrylate is 1-20 parts by weight per 100 parts by weight of the monomer.

Abstract: The present invention is a short time curing method of epoxy resin compositions composed of epoxy resins with more than 1.8 epoxy groups and curing agents which can react with epoxy groups and cure the epoxy resins at ambient temperatures or under the temperature raising conditions radiating microwave in the range of 300 MHz to 30 GHz frequency.

Abstract: Self-photoinitiating liquid oligomeric compositions having tertiary amine groups are provided by Michael Addition reaction of:

Abstract: Polyamides, polyesters, and polyamideesters are efficiently synthesized in a microwave process with precise temperature control. Compared to conventional thermal polymerizations, the microwave process takes less time and produces polymers with equivalent or superior physical properties.

Abstract: An active energy beam-curable adhesive composition is provided. The adhesive composition comprises (A), (B), and if required, (C) components. The component (A) is urethane (meth)acrylate derived from polyester polyol or polycarbonate polyol. The component (B) is a compound having at least one ethylenically unsaturated group together with at least one a cyclic imide group represented by the following general formula (1) .

Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.

Abstract: A coating powder comprising a macrocyclic oligomer and a ring-opening polymerization agent is applied to an article, fused, and converted to a linear polymer at a temperature of from about 160 to about 400° C. The powder has the low melt viscosity and friability of a thermoset powder but is converted at high fusing temperatures to a tough coating having the good impact resistance and good elongation of a thermoplastic powder. The oligomer is a polyester, polycarbonate, polyamide, polyimide, polyamideimide. The article may be coated electrostatically or in a fluidized bed.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: New imido(meth) acrylates of general formula (1), wherein R1, R2 and R3 may be the same or different and each represents H or CH3; R4 to R7 may be the same or different and each represents H or CmH2m+1 (in which m is 1 to 6); and n represents 1 to 4, and radiation-curable compositions prepared from them, easily cured by the irradiation with radiations, particularly ultraviolet rays, to form cured compositions excellent in weather resistance, abrasion resistance and adhesion to a base, and free from the problem of odor.

Abstract: A surfacially ultraviolet radiation-crosslinked article formed of a homogeneous composition including an elastoplastic material, a cross-linker component that is cross-linkable by free-radical polymerization, and a free-radical source material generating free radicals in exposure to ultraviolet radiation, wherein the elastoplastic material is surfacially cross-linked by exposure to ultraviolet radiation, wherein the sub-surface bulk volume of the article is non-cross-linked, and the article is resiliently deformable from and resiliently recoverable to a shape of the article when it was exposed to ultraviolet radiation for surfacial cross-linking thereof. The article is particularly amenable to embodiment as a catheter, or other similar medical device for cardiovascular or other medical procedures.

Abstract: A photocurable resin composition comprising a propenyl ether group-containing compound (A) having propenyl ether groups of the following formula (1) and having a number-average molecular weight of not less than 500, and a cationic photopolymerization initiator (B).CH.sub.3 --CH.dbd.CH--O-- (1)The object is to provide a photocurable resin composition which cures at a higher speed than a vinyl ether compound on exposure to light irradiation, and has improved flow characteristics, physical property of cured resin, and adhesion to metal.

Abstract: Photosensitive polyimides (Ps-PIM) materials have been synthesized that belong to three families of Ps-PIM materials. Through the use of precursors, various catalytic compositions with differing photosensitivities are provided. The results are Ps-PIM materials having increased photosensitivities at wavelengths longer than approximately 330 to 350 nm and an associated catalytic system that is insensitive to oxygen. A variety of applications, including use in holographic systems, are improved by the present invention.

Abstract: A high-performance composite reinforcing material for optical fiber cables, exhibiting excellent protective effect when incorporated into a reinforcing component of optical fiber cables, and having a degree of flexibility applicable to curved wiring of a small radius of curvature.

Abstract: The present invention is directed to a non-emissive, bimodal cured polymeric network which has an onset degradation temperature that is about 100.degree. C. above the onset degradation temperature of a base polymer. The novel cured polymeric network comprises the cured reaction product of the following ingredients: (a) combination of one or more liquid carrier monomers or prepolymers which combination is reactive to form a base polymer by exposure to ultraviolet (UV) radiation in the presence of a UV photosensitizer at a temperature, T.sub.uv ; and (b) between about 10 and 100 wt-% based on ingredient (a) of a combination of one or more monomers or prepolymers which combination is reactive to form a cured high temperature stable polymer by heating at a temperature, T.sub..DELTA.. Ingredient (b) is soluble or dispersible in ingredient (a) at a temperature, T.sub.s, wherein T.sub.s is equal to or lower than T.sub.uv, and T.sub.uv is at least about 50.degree. C. lower than T.sub..DELTA..

Abstract: A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance.The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material.In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction.

Abstract: An acrylate is polymerized by the photo-decomposition of ##STR1## to make a polymeric intermediate containing dithiocarbamate groups at both its ends, and a hard polymer-forming monomer is polymerized by the photo-decomposition of this dithiocarbamate group-containing polymeric intermediate to form blocks of a polymer of said hard polymer-forming monomer on both sides of said polymeric intermediate, thereby forming an ABA type block copolymer.

Abstract: A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance.The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material.In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction.

Abstract: An AB-type block copolymer represented by formula (I): ##STR1## wherein R.sup.1 represents a hydrocarbon group having 1 to 10 carbon atoms; R.sup.2 represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms; R.sup.3 represents a benzyl group, ##STR2## wherein R.sup.4 represents an alkyl group having 1 to 10 carbon atoms, or an alkyl group having 1 to 18 carbon atoms; M represents a group represented by the formula (M.sup.2).sub.m --(M.sup.1).sub.n or (M.sup.1).sub.m --(M.sup.2).sub.n, each of m and n being a natural number of 20 to 5000; is prepared by a process of first polymerizing either a monomer for forming the M.sup.1 block or a monomer for forming the M.sup.2 block in the presence of a sulfur-containing compound having formula (XIII): ##STR3## wherein R.sup.1, R.sup.2 and R.sup.

Abstract: This invention concerns cyclic aromatic amide oligomer compositions and a process for preparing such cyclic oligomers.

Abstract: Substantially fully imidized polyimidesiloxanes which are based on a selected pyridine compound are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from the dianhydride, a difunctional siloxane monomer and an organic diamine that has the formula ##STR1## wherein X is hydrogen, halogen, phenyl or combinations thereof,Z=--O--, --S--, ##STR2## >C(CX.sub.3).sub.2, --or --Y--Ar--Y--, Ar' is an aromatic radical of 6 to 10 carbon atoms, ##STR3## Y=--O--, --S--, ##STR4## >C(CX.sub.3).sub.2, or --. n=0 or 1.

Abstract: A process for rapidly forming a flexible mold for finely detailed objects from a radiatively curable molding composition includes coating at least a portion of the surface of a three-dimensional object with a fluid molding composition. The coating is cured by exposing the fluid coating to radiative energy to form an elastic, flexible layer of cured molding composition on the object. The coating and curing steps can be repeated to build up the flexible mold until a predetermined minimum has been attained. The cured molding composition is removed from the object, and is suitable for immediate use as a mold to cast duplicate reproductions of the object.

Abstract: Polyamide compositions which contain as part of their repeat structure a reactive diacetylene groups are disclosed. The cross-polymerized products of these polyamides are thermochromic polydiacetylene compounds. The compositions of the present invention do not exhibit a hysteresis effect during temperature cycling.

Abstract: Polyimides of aromatic tetracarboxylic acid derivatives and aromatic diamines where both ortho-positions relative to a phenylene radical bonded to an imide group of the polymer are substituted by alkyl groups can be radiation-crosslinked with organic chromophoric polyazides. Solutions of said polyimides and polyazides in organic solvents can be used as radiation-sensitive coating compositions for, for example, preparing insulating and protective films and in particular for producing printed circuits and integrated circuits.