Abstract: Provided is an adhesive composition that enables, in assembling a camera module, sufficient curing of a site where ultraviolet rays do not reach, while the adhesive is being cured; and that can reduce or prevent a change in the distance between a lens and an image sensor in a heating step, when a lens holder is adhered to a substrate having the image sensor fixed thereon. A thermal- and UV-curing adhesive composition contains (a) an epoxy (meth)acrylate resin; (b) a (meth)acrylic acid ester; (c) a heat-curing agent; and (d) a photopolymerization initiator, wherein the epoxy (meth)acrylate resin (a) contains 20% by weight or more of a (meth)acryloyl group based on the total weight of the resin, and the weight ratio of the epoxy (meth)acrylate resin (a) to the (meth)acrylic acid ester (b) (a)/(b) is from 30/70 to 70/30.

Abstract: The invention relates to a coating formulation for preparing a hydrophilic coating, wherein the hydrophilic coating formulation comprises a supporting monomer and/or polymer comprising at least 2 reactive moieties capable of undergoing polymerization reactions, a polyelectrolyte, a Norrish Type I photoinitiator, and a Norrish Type II photoinitiator.

Abstract: A method of generating reactive species which includes exposing a photoreactor composition to radiation, in which the photoreactor composition comprises a wavelength-specific sensitizer associated with a reactive species-generating photoinitiator. Also described are methods of polymerizing unsaturated monomers and curing an unsaturated oligomer/monomer mixture.

Abstract: A method of generating reactive species which includes exposing a photoreactor composition to radiation, in which the photoreactor composition comprises a wavelength-specific sensitizer associated with a reactive species-generating photoinitiator. Also described are methods of polymerizing unsaturated monomers and curing an unsaturated oligomer/monomer mixture.

Abstract: An aqueous base developable negative resist composition comprising a phenolic resin, a radio-chemical acid generator and a small molecule which upon irradication and postbake reacts with the phenolic resin to decrease its rate of dissolution.

Abstract: Multilayer, photosensitive recording materials which can be developed with aqueous media contain one or more layers of a mixture which is crosslinkable by photopolymerization, soluble or dispersible in aqueous media and based on polymer containing hydroxyl and/or amide groups, as binders, compatible photopolymerizable monomers and photopolymerization initiators, which mixture contains from 0.1 to 10% by weight, based on its total amount, of an aldehyde of the general formula I ##STR1## where R is hydrogen, hydroxyl, C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, C.sub.6 -C.sub.10 -aryl or C.sub.6 -C.sub.10 -aryloxy.

Abstract: A photopolymerizable composition composed of a polymerizable monomer and an initiator capable of polymerizing said monomer upon exposure to visible light, characterized in that said initiator consists essentially of (a) at least one kind of photosensitizer selected from an .alpha.-diketone, quinone, and derivatives thereof, and (b) at least one kind of accelerator selected from an aldehyde containing no amino groups and derivatives thereof.

Abstract: A UV and thermally curable composition comprising(1) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(2) a thermal initiator for (1) selected from the group consisting of substituted or unsubstituted pinacols, azo compounds, thiurams, organic peroxides and mixtures thereof,(3) a photoinitiator for (1) selected from the group consisting of aldehyde and ketone carbonyl compounds having at least one aromatic nucleus attached directly to the ##STR2## group, benzoin alkyl ethers, diethoxyacetophenone and 2,2-dimethoxy-2-phenylacetophenone,(4) a thermoplastic material, and(5) a non-polymerizable plasticizer for (4).The exposure of the composition to UV radiation under atmospheric conditions and heat in seriatim results in a cured solid product which can be utilized as adhesives, coatings, gaskets, sealants, resists and the like.