Abstract: A tire tread compound, particularly useful for truck tires, comprises a base polymer of natural or synthetic rubber, a filler at least 50% of which is carbon black and between 2 and 10 parts of epoxy resin per hundred parts of polymer.

Abstract: Disclosed herein is an epoxy resin composition for sealing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a mold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone containing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of denatured silicone oil A having hydroxyphenyl groups, denatured silicone oil B having epoxy groups and/or bifunctional epoxy resin having epoxy groups on both ends.In addition to heat resistance, moisture resistance, a low elastic modulus, a low thermal expansion coefficient and a high glass-transition temperature, the epoxy resin composition according to the present invention has toughness which is higher than that of a conventional one, due to fine dispersion of silicone.

Abstract: This invention relates to water soluble crayon compositions which are comprised of (i) one or more water soluble block polymers characterized by an ABCBA structure and (ii) a coloring agent, and to crayons produced therefrom. This invention also relates to processes for the production of water soluble crayon compositions and for the manufacture of crayons.

Abstract: Described is a liquid sprayable epoxy composition comprising a liquid epoxy resin, an effective reinforcing amount of a fiber, an elastomeric component and an amine containing epoxy curing agent capable of curing the composition at equal or greater than 40.degree. F. temperatures wherein the cured product is light stable and has a hardness on the Shore D scale. Further described is a method of forming in situ a cured product such as a truck bed liner by spraying, brushing or troweling the epoxy composition onto the substrate such as the trunk bed, curing and forming the product on the substrate at a temperature of at least 40.degree. F. temperature. The ratio of epoxy reactive groups to amine reactive groups ranges from 0.9 to 1.1:1. Further described is a technique of modifying the coating coefficient of friction by sand embedment between the induction period and cure set time of applied epoxy composition.

Abstract: An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains(a) an epoxy resin,(b) a rubber-modified phenolic resin comprising a phenolic resin, and a methylmethacrylate-butadiene-styrene copolymer and a thermosetting silicon rubber dispersed in said phenolic resin,(c) a curing accelerator, and(d) a silica powder.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

Abstract: A two part primer composition comprising a main component comprising at least one styrene-ethylene-butene-styrene block copolymer or styrene-ethylene-propylene-styrene copolymer, said copolymer being copolymerized with maleic anhydride hydrogenated, and an amine catalyst, and a curing component comprising an epoxy resin having two or more functional groups, which has excellent heat-resistant adhesion and durable adhesion and is suitable for adhering between polyolefinic substances or between an polyolefinic substance and other organic substance.

Abstract: A novel thermoplastic resin composition is here provided which contains(I) 100 parts by weight of a polyoxymethylene resin alone or a mixture of the polyoxymethylene resin and a polycarbonate resin, with(II) 0.1 to 100 parts by weight of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m.Furthermore, a novel method for preparing the above-mentioned thermoplastic resin composition is also provided here.

Abstract: A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption.

Abstract: An impact resistance thermoplastic molding composition contains, each percentage being based on A+B, from 80 to 55% by weight of a hard matrix A of a copolymer containing at least 95% by weight of an aromatic vinyl monomer a.sub.11 of from 8 to 10 carbon atoms and at least one comonomer a.sub.12 in a proportion of 0.1 to 5% by weight, based on A, and from 45 to 20% by weight of a soft phase B which, uniformly dispersed in the hard matrix, has an average particle diameter d.sub.50 (volume average) of from 3.5 to 9 .mu.m and is obtainable by polymerization of the mixture of monomers a.sub.11 and a.sub.12 in the presence of an elastomer (rubber) and subsequent isolation of the useful product, wherein the comonomer a.sub.12 has the general formula I ##STR1## where X is --OR.sup.2, --COOR.sup.2 or --CONHR.sup.3,R.sup.1 is hydrogen or methyl andR.sup.2 and R.sup.3 are each alkyl of from 1 or 2 to 10 carbon atoms with at least one OH or epoxy group or at least one other polar group.

Abstract: A molding additive composition comprising a mixture of low profile additive and a surfactant additive containing a silicon-oxyalkylene copolymer flow control agent and surface modifying agent; and a molding composition comprising a polyester molding resin, a low profile additive, a silicon-oxyalkylene copolymer flow control agent and surface modifying agent and a crosslinking monomer. In another embodiment, the invention embraces a molding composition comprising a polyester molding resin, a crosslinking monomer, a low profile additive, a reinforcing fiber, and a silicon-oxyalkylene copolymer flow control agent and surface modifying agent.

Abstract: Disclosed is an ungelled, modified chlorinated polyolefin resin suitable for providing a highly adherent, solvent resistant film on a thermoplastic polyolefin substrate. The modified chlorinated polyolefin resin is prepared by grafting an unsaturated polycarboxylic acid and/or an unsaturated acid anhydride onto a chlorinated polyolefin resin to form an acid- and/or anhydride-modified chlorinated polyolefin resin. The resulting acid- and/or anhydride-modified chlorinated polyolefin resin is reacted with an organic monohydric alcohol to form an esterified product containing acid functionality. The resulting esterified product is reacted with a polyepoxide to form the ungelled modified chlorinated polyolefin resin.Also disclosed is a method of preparing an ungelled modified chlorinated polyolefin resin of the invention, a coating composition containing a resin of the invention, and a method of forming a hardened film from the coating composition on a thermoplastic polyolefin substrate.

Abstract: Thermoplastic molding compositions based on thermoplastic polyesters (a.sub.1), graft polymers incorporating acrylate rubbers as grafting base (a.sub.2) and a two-shell graft sheath, copolymers of aromatic vinyl monomers and acrylonitrile or methacrylonitrile (a.sub.3) and glass fibers (B) have a balanced range of properties.

Abstract: Novel reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.

Abstract: A structural adhesive having excellent anti-corrosion properties which comprises: (A) a rubber modified epoxy resin prepared by reaction of a bisphenol epoxy resin and a butadiene-acrylonitrile-(meth)acrylic acid copolymer, (B) an urethane modified epoxy resin, (C) a latent curing agent, and (D) a rust inhibiting pigment selected from the group consisting of: (i) a rust inhibiting pigment comprising aluminum orthophosphate and a zinc compound, (ii) a rust inhibiting pigment comprising aluminum metaphosphate, a zinc compound and/or an alkaline earth metal compound, and (iii) a rust inhibiting pigment comprising aluminum metaphosphate and a zinc compound and optionally an alkaline earth metal compound, wherein the adhesive contains said rubber modified epoxy resin (A) and said urethane modified epoxy resin (B) in a weight ratio of 1:9 to 3:1, and said latent curing agent (C) and said rust inhibiting pigment (D) at 0.

Abstract: The flameproofing agent content of molding compositions containing polyesters (a.sub.1), acrylate graft polymers (a.sub.2), styrene/acrylonitrile copolymers (a.sub.3) and glass fibers can be reduced without affecting the flame resistance by adding finely divided PTFE.

Abstract: Thermoplastic molding composition based on thermoplastic polyesters (a.sub.1), graft polymers incorporating acrylate rubbers as grafting base (a.sub.2), copolymers of aromatic vinyl monomers and acrylonitrile or methacrylonitrile (a.sub.3) and glass fibers (B) have particularly good mechanical properties if the (meth)acrylonitrile content in component (a.sub.3), based on the total weight of (a.sub.3), is less than the (meth)acrylonitrile content of component (a.sub.22).

Abstract: Thermoplastic molding compositions based on thermoplastic polyesters (a.sub.1), graft polymers incorporating acrylate rubbers as grafting bases (a.sub.2), copolymers of aromatic vinyl monomers and acrylonitrile or methacrylonitrile (a.sub.3) which contain a polymeric component (B) having carboxyl, carboxyl derivative, hydroxyl or epoxy groups or, alternatively, where graft polymers (a.sub.2) or copolymers (a.sub.3) carry such groups have a balanced range of properties.

Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

Abstract: The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.

Abstract: Thermoplastic molding compositions contain as essential components(A) from 1 to 90% by weight of a polycarbonate,(B) from 1 to 90% by weight of a polyester,(C) from 1 to 90% by weight of a polyamide,(D) from 0.5 to 30% by weight of a polymeric component having hydroxyl groups and in addition(E) from 0 to 30% by weight of an impact-modifying rubber and(F) from 0 to 60% by weight of a fibrous or particulate filler.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very unlikely that a semiconductor device sealed with it would become warped.

Abstract: A hydroxy functional epoxy-polyester graft copolymer and solvent-based thermosetting coating composition comprising said copolymer and blocked polyisocyanate crosslinking agent. The coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, the composition may be formulated as a high solids composition sprayable with conventional spraying equipment. The hydroxy functional epoxy-polyester graft copolymer is the product of polymerization of certain lactone monomers in the presence of hydroxy functional epoxy ester resin precursor. The precursor resin is the reaction product of diepoxide with aliphatic diol and, subsequently, with acid component comprising primary hydroxy functional acid. The polymerization of the lactone monomers is carried out at a temperature between about 50.degree. C. and about 300.degree. C.

Abstract: A polyolefin resin composition comprising a polyolefin modified with an unsaturated carboxylic acid, at least one member selected from the group consisting of polyepoxides, polyisocyanates, and polyamines, and a reinforcement.

Abstract: An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.

Abstract: Polyester compositions having present a small amount of a salt of salicyclic acid and a cation of a metal from Group IA of the periodic Table of Elements, for example sodium salicylate, have been found to have good crystalization and other properties.

Abstract: A hardenable polyester molding material contains a mixture ofI. an ethylenically unsaturated ester or a terminally unsaturated vinyl ester,II. copolymerizable monomers,III. 6-25% by weight, based on I+II, or a graft polymer P, in which there are grafted onA. 5-95% by weight of an elastomeric polymer,B. 95-5% by weight of a polyadduct, polycondensate or acrylic polymer which contains olefinic double bonds, with or withoutC. 0-90% by weight of vinyl monomers, andIV. 5-300% by weight, based on I+II, of fibrous reinforcing agents.

Abstract: A polyester resin composition for forming an impact resistant article is described, comprising from 40 to 97 parts by weight of polyethylene terephthalate and from 3 to 60 parts by weight of at least one polyester selected from(1) an ethylene terephthalate-based polyester comprising from 5 to 25 wt % of at least one dibasic acid represented by formula (I) ##STR1## wherein A and B each represents a hydrogen atom, an alkyl group, or a phenyl group, and n is an integer of not less than 10, and ester bond-forming derivatives,(2) an ethylene terephthalate-based polyester comprising 3 to 25 wt % of at least one polyalkylene glycol having a molecular weight of from about 500 to 20,000, and(3) polyarylate, which composition further contains, per 100 parts by weight of the polyester, (a) from 0.05 to 10 parts by weight of at least one of an inorganic crystal nucleating agent having an average particle diameter of not more than 50 .mu.

Abstract: An epoxyester linear block oligomer made with n-1 moles fatty acid units terminated with carboxylic acid groups and n moles of epoxy oligomer, when filled with carbon black, is a particularly effective electrically conductive primer for use over organic-based composites to be electrostatically painted.

Abstract: An epoxyester linear block oligomer made with n-1 moles fatty acid units terminated with carboxylic acid groups and n moles of epoxy oligomer is particularly suited for chip-resistant paints made with a low pigment volume concentration.

Abstract: This invention is directed to acid neutralizing additives for engine oils, which additives comprise polymeric particles bearing epoxide groups on the polymerized particle and a non-polar polymeric stabilizer attached thereto.

Abstract: This invention is directed to acid neutralizer additives for engine oils, which additive comprise polymeric particle bearing amine functionality on the polymerized particle and a non-polar polymeric stabilizer attached thereto.

Abstract: A polyolefin resin composition comprising a polyolefin modified with an unsaturated carboxylic acid, at least one member selected from the group consisting of polyepoxides, polyisocyanates, and polyamines, and a reinforcement.

Abstract: Dispersions or slurries of carboxyl-containing polymers in mineral spirits in which the polymer settles and is difficultly redispersible are converted to dispersions or slurries in which the tendency to settle is reduced and which are readily redispersible with minimum agitation are obtained when there is added to the dispersions or slurries a linear or branched block copolymer of propylene oxide and ethylene oxide as well as glyceryl tris-12-hydroxystearate and/or mixed saturated C.sub.18 -C.sub.36 fatty acid triglycerides.

Abstract: Novel epoxy-polyester graft copolymer and novel, solvent-based thermosetting coating composition comprising said copolymer and blocked polyisocyanate crosslinking agent. Coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as a chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, composition may be formulated as a high solids composition sprayable with conventional spraying equipment. Epoxy-polyester monomers in presence of hydroxy functional epoxy ester resin precursor. Precursor resin is formed by reaction of diepoxide, chain extended with diphenol and dicarboxylic acid, with hydroxy functional secondary amine in chain terminating reaction.

Abstract: Novel epoxy-polyester graft copolymer and novel, solvent-based thermosetting coating composition comprising said copolymer and blocked polyisocyanate crosslinking agent. Coating composition may be formulated as hot sprayable, high solids coating composition suitable for use as chip resistant automotive vehicle primer adapted for use on body panel areas subject to chipping by stones, gravel and other road debris. Alternatively, composition may be formulated as a high solids composition sprayable with conventional spraying equipment. Epoxy-polyester graft copolymer is prepared by polymerization of lactone monomers in presence of hydroxy functional epoxy ester resin precursor. Precursor resin is formed by reaction of diepoxide, previously chain extended with dicarboxylic acid, with hydroxy functional secondary amine in chain terminating reaction.

Abstract: An epoxy resin composition for encapsulating semiconductors and semiconductor elements is disclosed. This epoxy resin composition mainly comprises (a) a polyfunctional epoxy compound, (b) a styrene type block copolymer or styrene type block copolymer and liquid rubber, (c) a hardener for the epoxy compound and (d) an inorganic filler.

Abstract: A composition suitable for forming surface coatings, laminates or composite materials formed by bringing together:(a) a first polymer containing carboxylic acid, anhydride or acid chloride groups,(b) an amine or alcohol or a derivative thereof which is a tertiary amine, a ketimine, an acetal or an oxazolidine and(c) a second polymer capable of cross-linking with the first polymer in the presence of the amine or alcohol.The components may be initially in two packs and either mixed prior to application or sprayed onto the surface simultaneously from separate nozzles.The surface coatings are particularly suitable for coating surfaces which are otherwise difficult to coat and protect and may be applied to wet or rusted surfaces without surface preparation.

Abstract: Crosslinked, preferably acrylic, preferably melamine crosslinked, polymer particles formed by reactions comprising free radical addition polymerization of:(a) between about 0.5 and about 20 weight percent each of first and second monomers, each bearing functionality capable of crosslinking reaction with the other, wherein (i) either both additionally are ethylenically unsaturated monomers or (ii) the first monomer additionally is ethylenically unsaturated and the second monomer bears multiple crosslinking functionality and no ethylenic unsaturation; and(b) between about 60 and about 99 weight percent of at least one other monoethylenically unsaturated monomer;in the presence of (I) an organic liquid which is a solvent for the polymerizable monomers, but a non-solvent for the resultant polymer, and (II) polymeric dispersion stabilizer bearing, on the average, more than one long chain non-polar hydrocarbon molecules and at least one pendant vinyl unsaturation.

Abstract: Provides new and improved water-reducible coating compositions and methods of making them. Three preferred processes are disclosed. These differ in the manner of incorporating and chemical nature of an extender polymer.Broadly, the process of the invention is one for forming an aqueous dispersion of a fluent resinous composition ofa. a mixture in an organic solvent of(i) an ionizable graft polymer of an epoxy resin and an addition polymerized resin, the addition polymerized resin being bonded to aliphatic backbone carbon atoms of the epoxy resin by carbon-to-carbon bonds, and(ii) an extender resin;b. an aqueous vehicle, andc. an ionizing agent;the ionization present from said combined components being sufficient to establish the components as a dispersion in the aqueous vehicle, and then addition polymerizing a quantity of addition polymerizable monomer, under addition polymerizing conditions, in said aqueous dispersion, the aqueous dispersion serving as a vehicle therefor.

Abstract: A high solid coating composition comprising(A) a film-forming polymer having functional group(s) capable of reacting with the crosslinking agent (D) hereinafter referred to,(B) a volatile organic liquid diluent in which the polymer (A) is carried,(C) polymer microparticles having an average diameter of from 0.02 to 40 microns, which are insoluble in the combination of the film-forming polymer (A) and the diluent (B) and are maintained in a stabilized state of dispersion therein, and(D) a crosslinking agent dissolved in the diluent (B),which is characterized in that the microparticles (C) are composed of crosslinked copolymer of .alpha.,.beta.-ethylenically unsaturated monomers carrying thereon a resinous portion having an amphoionic group of the formula: ##STR1## wherein R is a member selected from optionally substituted alkylene having 1 to 6 carbon atoms and phenylene group and Y is --COOH or --SO.sub.3 H.

Abstract: Curable polymeric products are the reaction product of a polymer containing secondary hydroxyl groups and an aliphatic unsaturated isocyanate.

Abstract: Curable polymeric products are the reaction product of a polymer containing secondary hydroxyl groups and an aliphatic unsaturated isocyanate.