Process Of Forming A Composition Containing A Nonreactive Material (nrm) And A Polymer Containing More Than One 1,2-epoxy Group, Or A Preformed Polymer Derived From Or Admixed With A Reactant Containing More Than One 1,2-epoxy Group, Or With A Polymer Derived From An Epihalohydrin And A Polyhydric Phenol Or Polyol; Or Composition Or Product Thereof Patents (Class 523/400)
  • Patent number: 11887865
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Chenghan She
  • Patent number: 11834426
    Abstract: Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: December 5, 2023
    Assignee: CAMBIUM BIOMATERIALS, INC.
    Inventor: Andrew Guenthner
  • Patent number: 11807752
    Abstract: A process for the production of a graft copolymer composition is presented, which is based on acrylonitrile-styrene-acrylate (ASA) or acrylonitrile-butadiene-styrene (ABS) graft copolymers. The graft copolymers obtained by emulsion polymerization and precipitation show improved dewatering behavior after precipitation. Based on this method ASA and ABS graft copolymers with low residual humidity can be obtained. Furthermore, the invention relates to a process for the production of a thermoplastic molding composition comprising at least one thermoplastic styrene copolymer, in particular a styrene-acrylonitrile copolymer, the graft copolymer obtained by the process, and optional further components.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: November 7, 2023
    Assignee: INEOS STYROLUTION GROUP GMBH
    Inventors: Tobias Schulz, Wolfgang Fischer
  • Patent number: 11802176
    Abstract: A bio-based epoxy resin obtained from a reaction mixture comprising a glycidyl ether component and a bio-based component comprising a fatty acid and a rosin acid, wherein the glycidyl ether component comprises at least two epoxide groups.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: October 31, 2023
    Assignee: INGEVITY SOUTH CAROLINA, LLC
    Inventors: Yongning Liu, Wumin Yu, Zhigang Chen
  • Patent number: 11781033
    Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: October 10, 2023
    Assignee: LINTEC Corporation
    Inventors: Masanori Yamagishi, Akinori Sato
  • Patent number: 11767449
    Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: September 26, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Hirokuni Ogihara, Fumio Furusawa, Shinya Nakamura, Takatoshi Ikeuchi, Takashi Yamamoto
  • Patent number: 11732155
    Abstract: The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one first amine-based epoxy curing agent; (b2) optionally, at least one second amine-based epoxy curing agent; (b3) at least one mineral filler; (b4) at least one phenolic lipid; wherein part (A) and/or part (B) comprise at least one triphenylmethane dye. The curable casting resin precursor is suited for encapsulating metal parts such as cable joints and the like.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: August 22, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Mathis A. Muth, Michael Petry, Adrian T. Jung
  • Patent number: 11705414
    Abstract: A semiconductor packaging structure includes a die including a bond pad and a first metal layer structure disposed on the die, the first metal layer structure having a first width, the first metal layer structure including a first metal layer, the first metal layer electrically coupled to the bond pad. The semiconductor packaging structure also includes a first photosensitive material around sides of the first metal layer structure and a second metal layer structure disposed over the first metal layer structure and over a portion of the first photosensitive material, the second metal layer structure electrically coupled to the first metal layer structure, the second metal layer structure having a second width, where the second width is greater than the first width. Additionally, the semiconductor packaging structure includes a second photosensitive material around sides of the second metal layer structure.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: July 18, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Sreenivasan K. Koduri
  • Patent number: 11702537
    Abstract: A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, ? ? ? D × ? ? ? H ? ? ? D + ? ? ? H ? 1.0 , where ?D is a standard deviation of tablet diameters and ?H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: July 18, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Sang Jin Kim, Sang Kyun Kim, Tae Shin Eom, Dong Hwan Lee, Young Joon Lee, Yong Han Cho
  • Patent number: 11688526
    Abstract: Disclosed herein are electrically conductive thermoplastic polyester compositions comprising: a) at least one thermoplastic polyester; b) conductive carbon black; c) at least one ethylene copolymer based impact modifier; and d) at least one hyperbranched polyester having an acid number of about 80-340 mg KOH/g.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: June 27, 2023
    Assignee: DuPont Polymers, Inc.
    Inventor: Yunfeng Jiao
  • Patent number: 11655385
    Abstract: Water based, energy curable ink jet compositions that have good insulating properties are described herein. The inventive water based energy curable ink jet compositions include a water soluble or water dispersible component polymerizable by free radical polymeration upon exposure to polymerizing radiation, wherein the cured ink jet compositions have good insulating properties, exhibited for example, by its breakdown voltage. Also described are electronic devices including ink jet-printed layers of the ink jet compositions.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: May 23, 2023
    Assignee: Sun Chemical Corporation
    Inventors: Michael George Pickrell, Derek Ronald Illsley
  • Patent number: 11643508
    Abstract: The present invention relates to a method for the preparation of a lignin prepolymer, comprising (a) providing a lignin; (b) reacting the lignin with a hydroxyl functionalization reagent to provide a lignin derivative containing at least one hydroxyl group, said hydroxyl group being obtained as a result of the interaction between the lignin and the hydroxyl functionalization reagent (c) reacting the lignin derivative obtained in step (b) with a functionalization reagent selected from the group consisting of fatty acids, fatty acid derivatives and mixtures thereof capable to react with the lignin derivative resulting in a covalent bond between the fatty acid and/or or the fatty acid derivative and the lignin derivative.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: May 9, 2023
    Assignee: ANNIKKI GMBH
    Inventors: Kerstin Wallisch, Simone Knaus
  • Patent number: 11578228
    Abstract: A vehicle bond filler formulation is provided that includes a part A having curable resin and a monomer reactive diluent. A part B storage-separate, cure initiator package contains a free-radical cure initiator. At least one color changing dye adapted to change color upon mixing the part A and the part B and within ±5 minutes of cure of the curable resin to a sandable condition is present in either the part A or a separate part C, a guide coat colorant, or a combination thereof. A process of for repairing a vehicle body is also provided that includes mixing a part A containing the at least one color changing dye with the part B to form an internal guide coat mixture applied to a substrate of the vehicle body in need of repair. The mixture cures causing the color changing dye to the terminal change color within ±5 minutes of cure of the curable resin to a sandable condition.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: February 14, 2023
    Assignee: Illinois Tool Works Inc.
    Inventors: Helena Twardowska, Andrew Schirmer
  • Patent number: 11578432
    Abstract: Systems and methods are provided for fabrication of enhanced carbon fiber laminates that utilize encapsulated catalyst. One embodiment is a method that includes acquiring a batch of dry fibers, and acquiring a batch of catalyst capsules that each comprise catalyst that accelerates polymerization of monomers of a resin, and a shell that encapsulates the catalyst and liquefies at a curing temperature. The method further includes interspersing the catalyst capsules among the dry fibers, and impregnating the fibers with the resin after interspersing the catalyst capsules with the fibers.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: February 14, 2023
    Assignee: The Boeing Company
    Inventors: Keith Daniel Humfeld, Gwen Marie Lanphere Gross
  • Patent number: 11560465
    Abstract: Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 24, 2023
    Assignee: ENEOS Corporation
    Inventors: Yoshinori Nishitani, Masaki Minami
  • Patent number: 11542419
    Abstract: A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: January 3, 2023
    Assignee: Illinois Tool Works Inc.
    Inventor: Guruprasad Sudhindra Kumar
  • Patent number: 11535699
    Abstract: A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: December 27, 2022
    Assignee: Hilti Aktiengesellschaft
    Inventors: Nicole Behrens, Alexander Bornschlegl
  • Patent number: 11499036
    Abstract: A rubber composition exhibiting an improved processability/stiffness compromise is based on at least a diene elastomer, a reinforcing filler, a crosslinking system, between 1 and 30 parts by weight per hundred parts by weight of elastomer, phr, of an epoxy resin and between 1 and 15 phr of a specific amine-comprising hardener comprising in particular at least two primary amine functional groups located on at least one six-membered aromatic ring and at least two Ri radicals, which are identical or different, selected from the group consisting of linear or branched C1-C6 alkyl radicals, halogens, and ethers, tertiary amines, thioethers, ketones, esters and amides, substituted by linear or branched C1-C6 alkyl radicals, the said ring not comprising a hydrogen atom located in the ortho position with respect to the primary amine functional groups.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: November 15, 2022
    Assignee: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN
    Inventors: Emmanuel Landreau, Philippe Laubry
  • Patent number: 11479684
    Abstract: A radiation curable inkjet ink composition that includes (A) a mono-ethylenically unsaturated oligomer, (B) a mono-ethylenically unsaturated monomer, and (C) a solvent, wherein the radiation curable inkjet ink composition is substantially free of a photoinitiator and wherein a total weight of the mono-ethylenically unsaturated oligomer (A) is less than or equal to the total weight of the mono-ethylenically unsaturated monomer (B). A printed article including the radiation curable inkjet ink composition in cured form, and a method of forming an image with a thermal inkjet printhead are also provided.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: October 25, 2022
    Assignee: Kao Corporation
    Inventors: Muslim Contractor, Stan Nowacki, Stephen Buchanan, Stephen Cummings
  • Patent number: 11441027
    Abstract: The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa·s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 13, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Akihiko Ito, Hiroaki Sakata
  • Patent number: 11352897
    Abstract: A seal assembly for a gas turbine engine according to an example of the present disclosure includes, among other things, a seal that has a main body extending circumferentially between opposed mate faces. The main body has a sealing portion and an engagement portion extending outwardly from sealing portion along at least one of the mate faces. The main body includes one or more braided core plies having a first fiber construction and arranged to establish an internal cavity. An overwrap having one or more braided overwrap plies follows a perimeter of the one or more braided core plies to establish the engagement portion and the sealing portion. The one or more braided overwrap plies have a second fiber construction differing from the first fiber construction. A method of fabricating a seal for a gas turbine engine is also disclosed.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: June 7, 2022
    Assignee: RAYTHEON TECHNOLOGIES CORPORATION
    Inventor: Robin H. Fernandez
  • Patent number: 11292943
    Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: April 5, 2022
    Assignee: The Boeing Company
    Inventors: Peter Babilo, Randall Jay Moss
  • Patent number: 11267224
    Abstract: Provided are methods of preparing an electrically activated shape memory polymer composite capable of thermal shape reformation using electric power to heat the composite through its matrix glass transition temperature. The methods may include providing a polymer matrix component comprising a diglycidyl ether resin and at least one curing agent, adding into the polymer matrix component at least one nano-filler component, sonication and mixing the polymer matrix component and the nano-filler component to form a mixture, curing the mixture under curing conditions, and laminating the cured mixture with at least one elastic laminated layer.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: March 8, 2022
    Assignee: UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA
    Inventors: Jin Ho Kang, Emille J. Siochi, Ronald K. Penner, Travis L. Turner
  • Patent number: 11242428
    Abstract: Hydroxyaldimines of formula (I), their reaction products, in particular products of their reaction with polyisocyanates, and compositions including isocyanate groups and containing such reaction products. The hydroxyaldimine permits compositions which have good storage stability, a long open time, low odour, rapid, bubble-free curing and good mechanical properties, and which are not susceptible to plasticizer migration and have a particularly low content of monomeric diisocyanates. In particular, it permits reactive hot-melt adhesives with a particularly good workability.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: February 8, 2022
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Urs Burckhardt, Andreas Kramer, Martin Schmider
  • Patent number: 11208580
    Abstract: A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 ?m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 28, 2021
    Assignee: SIKA TECHNOLOGY AG
    Inventor: Antonio Voci
  • Patent number: 11186675
    Abstract: The disclosure describes an epoxy resin composition and a transformer including the same. The epoxy resin composition according to an embodiment of the present invention includes an epoxy resin having a glycol-based functional group in a main chain, a filler, a curing agent, and an imidazole-based catalyst, and the transformer according to an embodiment includes an insulated conductor wound in multiple layers in a vertical direction; a semi-conductive layer which is provided on the insulated conductor and disperses a concentrated electric field; and an insulator which is casted on the insulated conductor and the semi-conductive layer and forms an outer shape of the transformer, and the insulator consists of the epoxy resin composition including the epoxy resin having the glycol-based functional group in the main chain, the filler, the curing agent, and the imidazole-based catalyst.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 30, 2021
    Assignee: LSIS CO., LTD.
    Inventors: Sang-Eon Kim, Wook-Dong Cho, Heon-Seop Song, Tae-Yun Kang, Han-Gil Kim, Hyeon-Jeong Choi
  • Patent number: 11161976
    Abstract: The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: November 2, 2021
    Assignee: HEXION VAD LLC
    Inventors: Kimberly Goodwin, Ganapathy S. Viswanathan, Scott Peace, Anthony Maiorana, Vishal Patil
  • Patent number: 11079635
    Abstract: The disclosure discloses a sealant and a method for fabricating the same, and a display device. The sealant includes a thermal-curing agent and an epoxy resin, wherein the thermal-curing agent includes a diphenyl ketone alcohol compound capable of emitting a fluorescent light and a phosphorescent light simultaneously.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: August 3, 2021
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Display Technology Co., Ltd.
    Inventors: Dong Xu, Xiaoqing Liu, Wenbo Dong
  • Patent number: 11078361
    Abstract: One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: August 3, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tatsuya Arisawa, Hirohisa Goto, Tomoyuki Abe
  • Patent number: 11034821
    Abstract: A rubber composition includes 100 parts by mass of a solid rubber (A), 0.1 to 50 parts by mass of a modified liquid diene rubber (B) having a functional group derived from a silane compound represented by the formula (1), and 20 to 200 parts by mass of a filler (C), the modified liquid diene rubber (B) satisfying (i) to (iii) below: (i) The weight average molecular weight (Mw) is 15,000 to 120,000. (ii) The vinyl content is not more than 70 mol %. (iii) The average number of functional groups per molecule of the modified liquid diene rubber (B) is 1 to 30.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: June 15, 2021
    Assignee: KURARAY CO., LTD.
    Inventors: Hiromi Maeda, Daisuke Koda, Hiroshi Kanbara, Satomi Ohta
  • Patent number: 11028225
    Abstract: Provided is a monomer mixture that is rapidly cured to form a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture of the present invention is a monomer mixture containing at least: a compound represented by Formulas (a-1) and/or (a-2); a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by Formula (c-1).
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: June 8, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Tomoya Mizuta, Keizo Inoue
  • Patent number: 11015018
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: May 25, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Min-Chian Wang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • Patent number: 10982041
    Abstract: An epoxy resin oligomer is provided. The epoxy resin oligomer is obtained by the reaction of at least a first reactant and a second reactant, and the molecular weight of the epoxy resin oligomer is between 3000 and 9000, wherein the mole ratio of the first reactant and the second reactant is between 1:0.9 and 0.9:1, and each of the first reactant and the second reactant is a compound having two polymerizable groups.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: April 20, 2021
    Assignee: SWANCOR ADVANCED MATERIALS Co., Ltd.
    Inventors: Kok-Sheng Tan, Chen-Han Chien, Yu-Tsan Tseng
  • Patent number: 10934387
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: March 2, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Haruaki Sue, Shinichi Kosugi
  • Patent number: 10899944
    Abstract: A coating composition containing added diol functionality to a urethane, a urea, or polyurethane urea functional resin where an adipic acid dihydrazide chain extender, or free adipic acid dihydrazide active hydrogens react with the oxirane group found in glycidol is described. The combination of diisocyanate, a polyether segment, optionally at least one polyester diol segment, optionally at least one poly(tetrahydrofuran) diol segment, optionally and at least one dimethylol propionic acid diol segment, at least one dihydrazide segment and glycidol compound introduces an increased hydrophilic structure, by diol addition, in compositions that are usable as coatings, on for example, medical devices.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: January 26, 2021
    Assignee: Lake Region Manufacturing, Inc.
    Inventor: Peter Anthony Edwards
  • Patent number: 10882955
    Abstract: A process of preparing polybenzoxazines using an alkylammonium salt of an acid having a pKa in acetonitrile of 9 or more as catalyst is described.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: January 5, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: Gregory P. Sorenson, Ilya Gorodisher
  • Patent number: 10851245
    Abstract: A polymeric material comprising a first polymer and a second polymer where the first polymer is a natural or a synthetic polymer and the second polymer is modified lignin. The modified lignin is modified with an alkyl containing group via linker wherein the linker is an ether group and wherein the alkyl containing group is derived from fatty acid methyl ester.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: December 1, 2020
    Inventors: Joseph Samec, Christopher Carrick, Alexander Orebom, Joakim Löfstedt
  • Patent number: 10822517
    Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: November 3, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tien-Shou Shieh, Pei-Hsin Chien
  • Patent number: 10822521
    Abstract: An aqueous basecoat material with improved circulation line stability is disclosed. The aqueous basecoat material includes at least one hydroxyl-functional polymer as a binder component and at least one binder component which is different from the hydroxyl-functional polymer. The aqueous basecoat material also includes at least one carbonyl group-containing polyurethane poly(meth)acrylate and also at least one organic compound having at least two hydrazine, hydrazide and/or hydrazone groups. The aqueous basecoat material also includes at least one branched and/or secondary aliphatic monoalcohol having at least four carbon atoms.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: November 3, 2020
    Assignee: BASF COATINGS GMBH
    Inventors: Bernhard Steinmetz, Norbert Loew
  • Patent number: 10815405
    Abstract: A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: October 27, 2020
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Benjamin Haag, Andreas Lutz, Cathy Grossnickel, Raymond F. Bis
  • Patent number: 10793742
    Abstract: Metal food or beverage containers are coated with a polyether polymer containing at least two ether linkages in the polymer backbone. The polymer is substantially free of segments derived from bisphenol A and epoxides thereof, and is a reaction product of, or can be derived from, (i) an aryl- or heteroaryl-group-containing diepoxide that is not derived from a polyhydric phenol or a glycidyl ester and (ii) a polymer backbone extender that has two functional groups reactive with an epoxy group and which following reaction with the diepoxide provides at least one pendant aryl or heteroaryl group on the polymer backbone, or provides at least one divalent aryl or heteroaryl group in the polymer backbone and linked to the backbone via ether linkages.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: October 6, 2020
    Assignee: VALSPAR SOURCING, INC.
    Inventors: Benoit Prouvost, Sebastien Gibanel
  • Patent number: 10752714
    Abstract: There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: August 25, 2020
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Isao Adachi, Takahiro Sakaguchi, Yuki Sugawara
  • Patent number: 10689548
    Abstract: An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 23, 2020
    Assignee: Polyonics, Inc.
    Inventors: Kenneth T. Robichaud, Donald P. Nieratko, Delilah F. Adams, Robert H. Guyette, Jr.
  • Patent number: 10662315
    Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: May 26, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba
  • Patent number: 10638779
    Abstract: Provided herein is a compound having the formula I wherein R1 and R2 are independently selected from a branched or straight C1-6 alkyl and a C1-6 alkenyl, n is 1, 2, 3, 4, 5, or 6 and x is independently 0, 1, or 2; provided that when n is 1, x is 2. Also provided herein is a method of releasing acetaldehyde into an aqueous solution including delivering a compound of formula I to the aqueous solution, Also provided is a flavor or aroma-modifying composition including i) a flavor or aroma-conferring or modifying ingredient, at least one compound according to formula (I); ii) at least one ingredient selected from the group consisting of a flavor carrier and a flavor base; and iii) optionally at least one flavor adjuvant.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: May 5, 2020
    Assignee: Firmenich SA
    Inventors: Gary B. Womack, Matthew Sillick
  • Patent number: 10636712
    Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 28, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Kyoung Chul Bae, Dong Hwan Lee
  • Patent number: 10626308
    Abstract: The present disclosure relates to a B-stageable adhesive composition and an article prepared by the same. In the present disclosure, the adhesive composition comprises the following components in solid content percentage: (A) 10% to 50% by weight of a first epoxy resin with a weight average molecular weight Mw of 8,000 g/mol or more; (B) 5% to 20% by weight of a second epoxy resin with a weight average molecular weight Mw of 200 to 6,000 g/mol; (C) 30% to 80% by weight of a hydroxyl terminated polyester or derivates thereof; (D) 0.1% to 2.5% by weight of a first curing agent capable of reacting with epoxy group; and (E) 0.1% to 2.5% by weight of a second curing agent capable of reacting with hydroxyl group; the sum of components of the composition is equal to 100% by weight. The coating obtained from the adhesive composition of the present disclosure shows high adhesive strength, excellent heat resistance and flame retardance.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: April 21, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Zhenqian Yang, Liang Qin, Dong Li, Ping Zhou, Xiongjian Wu
  • Patent number: 10604453
    Abstract: Coating compositions suitable for machined cementitious substrates are provided. The coating compositions provide adhesion to the machined cementitious substrate while maintaining high mechanical film strength. The coating compositions are also compatible with industrial implementation, and exhibit good pot life.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 31, 2020
    Assignee: James Hardie Technology Limited
    Inventors: Weiling Peng, Caidian Luo
  • Patent number: 10600707
    Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: March 24, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Shuichi Fujii, Kenji Hagiwara, Shinsuke Yamaguchi
  • Patent number: 10577510
    Abstract: An electrocoating composition is provided herein. The electrocoating composition includes an aqueous carrier. The electrocoating composition further includes a film forming binder. The film forming binder includes an epoxy-amine adduct and a blocked polyisocyanate crosslinking agent. The electrocoating composition further includes an anti-crater agent selected from the group of a polyester resin dispersion, a polyacrylate resin dispersion, and a combination thereof. The electrocoating composition further includes a supplemental anti-crater agent including a polyether modified polysiloxane.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: March 3, 2020
    Assignee: AXALTA COATING SYSTEMS IP CO. LLC
    Inventors: Allisa Gam, Jozef Theresia Huybrechts