Process Of Forming A Composition Containing A Nonreactive Material (nrm) And A Polymer Containing More Than One 1,2-epoxy Group, Or A Preformed Polymer Derived From Or Admixed With A Reactant Containing More Than One 1,2-epoxy Group, Or With A Polymer Derived From An Epihalohydrin And A Polyhydric Phenol Or Polyol; Or Composition Or Product Thereof Patents (Class 523/400)
  • Patent number: 10822521
    Abstract: An aqueous basecoat material with improved circulation line stability is disclosed. The aqueous basecoat material includes at least one hydroxyl-functional polymer as a binder component and at least one binder component which is different from the hydroxyl-functional polymer. The aqueous basecoat material also includes at least one carbonyl group-containing polyurethane poly(meth)acrylate and also at least one organic compound having at least two hydrazine, hydrazide and/or hydrazone groups. The aqueous basecoat material also includes at least one branched and/or secondary aliphatic monoalcohol having at least four carbon atoms.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: November 3, 2020
    Inventors: Bernhard Steinmetz, Norbert Loew
  • Patent number: 10822517
    Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: November 3, 2020
    Inventors: Tien-Shou Shieh, Pei-Hsin Chien
  • Patent number: 10815405
    Abstract: A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: October 27, 2020
    Inventors: Benjamin Haag, Andreas Lutz, Cathy Grossnickel, Raymond F. Bis
  • Patent number: 10793742
    Abstract: Metal food or beverage containers are coated with a polyether polymer containing at least two ether linkages in the polymer backbone. The polymer is substantially free of segments derived from bisphenol A and epoxides thereof, and is a reaction product of, or can be derived from, (i) an aryl- or heteroaryl-group-containing diepoxide that is not derived from a polyhydric phenol or a glycidyl ester and (ii) a polymer backbone extender that has two functional groups reactive with an epoxy group and which following reaction with the diepoxide provides at least one pendant aryl or heteroaryl group on the polymer backbone, or provides at least one divalent aryl or heteroaryl group in the polymer backbone and linked to the backbone via ether linkages.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: October 6, 2020
    Inventors: Benoit Prouvost, Sebastien Gibanel
  • Patent number: 10752714
    Abstract: There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: August 25, 2020
    Inventors: Isao Adachi, Takahiro Sakaguchi, Yuki Sugawara
  • Patent number: 10689548
    Abstract: An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 23, 2020
    Assignee: Polyonics, Inc.
    Inventors: Kenneth T. Robichaud, Donald P. Nieratko, Delilah F. Adams, Robert H. Guyette, Jr.
  • Patent number: 10662315
    Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: May 26, 2020
    Inventors: Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba
  • Patent number: 10638779
    Abstract: Provided herein is a compound having the formula I wherein R1 and R2 are independently selected from a branched or straight C1-6 alkyl and a C1-6 alkenyl, n is 1, 2, 3, 4, 5, or 6 and x is independently 0, 1, or 2; provided that when n is 1, x is 2. Also provided herein is a method of releasing acetaldehyde into an aqueous solution including delivering a compound of formula I to the aqueous solution, Also provided is a flavor or aroma-modifying composition including i) a flavor or aroma-conferring or modifying ingredient, at least one compound according to formula (I); ii) at least one ingredient selected from the group consisting of a flavor carrier and a flavor base; and iii) optionally at least one flavor adjuvant.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: May 5, 2020
    Assignee: Firmenich SA
    Inventors: Gary B. Womack, Matthew Sillick
  • Patent number: 10636712
    Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 28, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Kyoung Chul Bae, Dong Hwan Lee
  • Patent number: 10626308
    Abstract: The present disclosure relates to a B-stageable adhesive composition and an article prepared by the same. In the present disclosure, the adhesive composition comprises the following components in solid content percentage: (A) 10% to 50% by weight of a first epoxy resin with a weight average molecular weight Mw of 8,000 g/mol or more; (B) 5% to 20% by weight of a second epoxy resin with a weight average molecular weight Mw of 200 to 6,000 g/mol; (C) 30% to 80% by weight of a hydroxyl terminated polyester or derivates thereof; (D) 0.1% to 2.5% by weight of a first curing agent capable of reacting with epoxy group; and (E) 0.1% to 2.5% by weight of a second curing agent capable of reacting with hydroxyl group; the sum of components of the composition is equal to 100% by weight. The coating obtained from the adhesive composition of the present disclosure shows high adhesive strength, excellent heat resistance and flame retardance.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: April 21, 2020
    Inventors: Zhenqian Yang, Liang Qin, Dong Li, Ping Zhou, Xiongjian Wu
  • Patent number: 10604453
    Abstract: Coating compositions suitable for machined cementitious substrates are provided. The coating compositions provide adhesion to the machined cementitious substrate while maintaining high mechanical film strength. The coating compositions are also compatible with industrial implementation, and exhibit good pot life.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 31, 2020
    Assignee: James Hardie Technology Limited
    Inventors: Weiling Peng, Caidian Luo
  • Patent number: 10600707
    Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: March 24, 2020
    Inventors: Yoshihiro Tsutsumi, Shuichi Fujii, Kenji Hagiwara, Shinsuke Yamaguchi
  • Patent number: 10577510
    Abstract: An electrocoating composition is provided herein. The electrocoating composition includes an aqueous carrier. The electrocoating composition further includes a film forming binder. The film forming binder includes an epoxy-amine adduct and a blocked polyisocyanate crosslinking agent. The electrocoating composition further includes an anti-crater agent selected from the group of a polyester resin dispersion, a polyacrylate resin dispersion, and a combination thereof. The electrocoating composition further includes a supplemental anti-crater agent including a polyether modified polysiloxane.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: March 3, 2020
    Inventors: Allisa Gam, Jozef Theresia Huybrechts
  • Patent number: 10570317
    Abstract: An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: February 25, 2020
    Assignee: ZEPHYROS, INC.
    Inventors: Morgan Chene, Christophe Henry
  • Patent number: 10549516
    Abstract: A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: February 4, 2020
    Inventors: Frank L. Palmieri, John W. Connell, Christopher J. Wohl, Jr.
  • Patent number: 10544255
    Abstract: The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: January 28, 2020
    Inventors: Haosheng Xu, Xianping Zeng, Liexiang He
  • Patent number: 10544299
    Abstract: A process for forming a thermosetting resin in a nitrogen atmosphere is provided. The process includes the steps of a) reacting a polycarboxylic acid and/or anhydride and a polyhydric alcohol to provide a hydroxyl-containing intermediate; b) reacting the hydroxyl-containing intermediate with a vinyl-containing organic acid or vinyl containing alkyl ester in the presence of an esterification catalyst, a polymerization inhibitor and an azeotropic agent; and c) reacting any residual vinyl-containing organic acid and residual esterification catalyst with an epoxide.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: January 28, 2020
    Assignee: Reichhold LLC 2
    Inventors: Hildeberto Nava, Yongning Liu
  • Patent number: 10533095
    Abstract: A curable coating composition and the use, especially in heat exchangers, for heating and/or cooling water, in particular tap water, is described. The curable coating comprises, based on solids after curing, 35-80% by weight of an epoxysilane according to the general structure 1 and/or its hydrolysation and/or condensation products, 1: R1R2aSiR3b with R1 being 3-glycidyloxypropyl, R2 being methyl, R3 being alkyloxy or acyloxy, a being 0, 1 or 2 and b being 3?a and 20-65% by weight of a blocked polyisocyanate and optionally further components. The coating provides improved corrosion protection on aluminium surfaces, reduces limescale formation on heat exchanger surfaces and is able to withstand lateral and/or temporal temperature gradients when coated on heat exchanging surfaces.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: January 14, 2020
    Assignee: Teknologisk Institut
    Inventors: Stefan Holberg, Claus Bischoff
  • Patent number: 10508176
    Abstract: Disclosed herein is a foamable resin composition for a foam sheet including polylactic acid resin particles, each of the particles having a particle size of about 1 ?m to about 100 ?m. A process for preparing a particulate polylactic acid resin includes: introducing a polylactic acid resin and then forming a molten polylactic acid spray solution; and injecting the molten polylactic acid spray solution by a melt spray method and simultaneously cooling the molten polylactic acid spray solution to obtain a particulate polylactic acid. In addition, disclosed herein is a process for preparing a foam sheet using the foamable resin composition for a foam sheet including a polylactic acid resin.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: December 17, 2019
    Assignee: LG HAUSYS, LTD.
    Inventors: Jun-Beom Shin, Sung-Yong Kang, Min-Hee Lee, Hea-Won Kwon, Kyoung-Min Kang
  • Patent number: 10508204
    Abstract: Photo-protected microcapsules containing a photopolymer composition are dispersed in an epoxy coating to form an autonomic self-healing material. The capsule shell wall is formulated to protect the photopolymer composition from electromagnetic radiation exposure prior to rupture of the capsule shell, so that the photopolymer composition (e.g., a UV curable epoxy resin) remains active until triggered by damage to the capsule shell. Carbon black pigment is a suitable UV protector for the capsules. Upon sufficient damage to a region of the coating, the capsules will rupture and the photopolymer composition will fill and cure in and/or around the damaged region in the presence of electromagnetic radiation, achieving autonomic healing of the damaged coating.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: December 17, 2019
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Michael Thomas Odarczenko, Scott R. White, Nancy R. Sottos
  • Patent number: 10501620
    Abstract: A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: December 10, 2019
    Assignee: Intel Corporation
    Inventors: Makoto Fujimura, Yohei Tateishi, Takeshi Sakano
  • Patent number: 10414857
    Abstract: A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: September 17, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Timothy A. Morley, Rainer Koeniger, Sergio Grunder, Sylvie Vervoort, Nebojsa Jelic
  • Patent number: 10392473
    Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured even in the presence of oxygen and/or water to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition contains a multifunctional vinyl ether compound in an amount of 10 to 80 weight percent, a bifunctional oxetane compound represented by Formula (b) in an amount of 0.5 to 20 weight percent, and a monofunctional oxetane compound represented by Formula (b?) in an amount of 5 to 80 weight percent. In the formulae, Ring Z is selected from an aromatic hydrocarbon ring and a structure including two or more aromatic hydrocarbon rings bonded to each other through a single bond or a linkage group; R represents a monovalent aliphatic hydrocarbon group; R? is selected from hydrogen and ethyl; and m represents an integer of 0 or more.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: August 27, 2019
    Inventors: Tomoya Mizuta, Keizo Inoue
  • Patent number: 10363708
    Abstract: The present disclosure provides a composition for preparing a lightweight transparent composite, a method of preparing a composite using the same, and a composite prepared by the method. The lightweight transparent composite having excellent impact resistance, scratch resistance, weather resistance, and high hardness can be prepared by thermally curing a mixture of a glass fiber reinforcement having a refractive index of 1.4 to 1.6 and a curable resin having a deviation in refractive index of ?0.005 to +0.005 from the glass fiber reinforcement. When the lightweight transparent composite is applied to transparent windows for automobiles, the lightweight transparent composite can be useful in enhancing fuel efficiency, achieving easier handling characteristics due to reduction in vehicle center of gravity, and improving juddering and dimensional stability even during car driving due to excellent hardness.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: July 30, 2019
    Inventors: Young Ho Choi, Sang Sun Park, Kyung Mo Yang, Seok Hwan Kim
  • Patent number: 10351760
    Abstract: Polymeric clay stabilizers including at least one ionic repeating unit for treatment of subterranean formations. A method of treating a subterranean formation that can include obtaining or providing a composition comprising including a polymeric clay stabilizer including at least one ionic repeating unit, wherein the clay stabilizer has a melting point or glass transition temperature that is equal to or less than 100° C. The method can also include placing the composition in a subterranean formation.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: July 16, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Nathan Carl Schultheiss, Humberto Almeida Oliveira, Chandra Sekhar Palla-Venkata, Zheng Lu
  • Patent number: 10336875
    Abstract: A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: July 2, 2019
    Inventors: Hui Li, Kehong Fang
  • Patent number: 10316211
    Abstract: Coating compositions that include a thermoplastic dispersion and an epoxy-functional stabilizer having polyhydric phenols that exhibit estrogenic activity less than bisphenol S.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 11, 2019
    Assignee: SWIMC LLC
    Inventors: Jeffrey Niederst, Richard H. Evans, Robert M. O'Brien, Kevin Romagnoli, Mark S. Von Maier, Mary E. Tishey, Gregory M. Paulson
  • Patent number: 10287236
    Abstract: A method i for forming an epoxidized polymer is provided. The method may include mixing an epoxidized plant oil with a synthetic epoxy resin and crosslinking the epoxidized plant oil and the synthetic epoxy resin using a curing agent. The epoxidized plant oil may be formed via: converting plant oil triglycerides to fatty amide alcohols via aminolysis using primary or secondary amines, converting the fatty amide alcohols to epoxidized fatty amide alcohols, and reacting the epoxidized fatty amide alcohols with vinyl monomers to obtain epoxidized plant oil monomers.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 14, 2019
    Assignee: University of South Carolina
    Inventors: Chuanbing Tang, Zhongkai Wang, Liang Yuan
  • Patent number: 10246575
    Abstract: The invention relates to a polymer composition, and to a semifinished plastics product, the surface of which has been formed at least to some extent from the polymer composition. The invention further relates to a production process associated therewith for the semifinished plastics product. A feature of the polymer composition is that it comprises from 50 to 99.7% by weight of a polymer and from 0.3 to 20% by weight of one or more adhesion-promoting additives. The invention further relates to plastics-metal hybrid components and production of these.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: April 2, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Karl Kuhmann, Maximilian Gruhn, Olivier Farges, Martin Risthaus, Kathrin Lehmann
  • Patent number: 10233926
    Abstract: The present invention recites a method of fabricating a stator for a downhole motor, the method comprising the steps of providing a stator tube having an interior surface and applying a bonding agent to the interior surface of the stator tube. Additionally, a mandrel is positioned within the stator tube, the mandrel having an outer geometry that is complimentary to a desired inner geometry for the stator. Furthermore, a reinforcing material is introduced into the stator tube to fill space between the mandrel and the interior surface of the stator tube and subsequently solidified to bond the reinforcing material to the interior surface of the stator tube. The mandrel is then removed from the bonded stator tube and reinforcing material such that a stator is fabricated.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: March 19, 2019
    Inventors: Hossein Akbari, Julien Ramier, Olivier Sindt
  • Patent number: 10214611
    Abstract: An epoxy group-terminated impact modifier is described, comprising the reaction product of a) two or more polyols, b) one or more polyisocyanates, and c) at least one epoxy resin comprising a primary or secondary hydroxy group-containing epoxy compound, wherein the polyols comprise a1) at least one polyether polyol and a2) at least one OH-terminated rubber, wherein the weight ratio of polyether polyol to OH-terminated rubber is in the range from 7:3 to 2:8; an isocyanate-terminated prepolymer as possible intermediate product is described; furthermore a method for producing same is described. The products obtained are suitable for improving the impact resistance of epoxy resin compositions, in particular of 1K or 2K epoxy resin adhesives.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: February 26, 2019
    Inventors: Tina Voci, David Hofstetter, Christian Krüger, Jan Olaf Schulenburg
  • Patent number: 10179827
    Abstract: A method for synthesizing a modified polymer comprising epoxide groups along the polymer chain, by a hydrosilylation reaction of the unsaturations with a hydrosilane bearing an epoxide function in the presence of a suitable catalyst is provided. The method is simple, reproducible and able to be used on an industrial scale, and makes it possible to obtain high grafting yields, since they may reach 100%.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: January 15, 2019
    Inventor: Rachid Matmour
  • Patent number: 10174200
    Abstract: The present technology provides an epoxy resin composition for a fiber-reinforced composite material, a method for producing an epoxy resin composition for a fiber-reinforced composite material, a prepreg, and a honeycomb panel. The epoxy resin composition for a fiber-reinforced composite material of the present technology contains: a reaction product obtained by reacting 100 parts by mass of a phosphorus-containing epoxy resin containing a phosphorus atom in the backbone thereof, and not less than 5 parts by mass and not greater than 20 parts by mass of an amino-terminated butadiene-acrylonitrile rubber; an epoxy resin other than the phosphorus-containing epoxy resin; a curing agent; and a curing accelerator.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: January 8, 2019
    Assignee: The Yokohama Rubber Co., LTD.
    Inventors: Mitsuhiro Iwata, Tomohiro Ito
  • Patent number: 10155842
    Abstract: The present invention relates to a composition containing, besides a thermosetting resin of epoxy type and a hardener of anhydride type, at least one catalyst comprising an organometallic titanium complex. This composition enables the manufacture of vitrimer resins, that is to say resins that can be deformed in the thermoset state. It also relates to a kit for manufacturing this composition, an object obtained from this composition and a kit for manufacturing this object. Another subject of the invention relates to an organometallic titanium complex corresponding to the structure titanium bis(3-phenoxy-1,2-propane dioxide) (Ti(PPD)2), and the use thereof as vitrimer effect catalyst in systems based on epoxy resin and on hardener of anhydride type.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: December 18, 2018
    Inventors: Christophe Duquenne, Sebastien-Jun Mougnier, Francois-Genes Tournilhac, Ludwik Leibler
  • Patent number: 10144826
    Abstract: A polycarbonate resin composition includes: a polycarbonate resin; a polyalkylene glycol compound; and an organic-inorganic hybrid pigment, and has a yellow index (YI) of about ?2 to about 4 after irradiation with gamma rays, as measured in accordance with ASTM D1925 after irradiating an about 3 mm thick specimen with gamma rays at about 25 kGy and leaving the specimen for 7 days. The polycarbonate resin composition can exhibit excellent properties in terms of color and impact resistance after being irradiated with ionizing radiation.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: December 4, 2018
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Jong Chan Hur, Hyun Hye Jang, O Sung Kwon, Jun Ho Chi, Woo Suk Chei
  • Patent number: 10144840
    Abstract: Curable formulations, cured formulations, and mixtures and composites thereof are described herein, as well as methods of making and using the formulations, mixtures, and composites.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: December 4, 2018
    Assignee: Poly6 Technologies
    Inventor: Keith Hearon
  • Patent number: 10119046
    Abstract: Compositions, methods, and coating composition using a curing agent are provided herein. In one embodiment, a curing agent for epoxy resins may be prepared using a formulation including: (a) an adduct of: (i) a diglycidyl ether of a bisphenol, and (ii) a first polyamine; (b) a second polyamine; and (c) water; wherein the composition has an amine hydrogen equivalent weight, based on solids, of less than or equal to 105.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: November 6, 2018
    Assignee: HEXION INC.
    Inventors: David Flosser, Patricia Garcia, Larry Steven Corley, Bedri Erdem, Lucy Phan
  • Patent number: 10100255
    Abstract: A liquid crystal alignment agent contains a polymer composition, a polysiloxane, and a solvent. The polymer composition is obtained by subjecting a mixture including a tetracarboxylic dianhydride component and a diamine component to a reaction. The diamine component includes first and second diamine compounds. The polysiloxane contains an epoxy-based group. A liquid crystal display element made from the aforesaid liquid crystal alignment agent has reduced ion density.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 16, 2018
    Inventors: Shin-Rong Chiou, Wan-Ting Huang, Tsung-Pei Tsai
  • Patent number: 10100254
    Abstract: A liquid crystal alignment agent contains a polymer composition, a polysiloxane, and a solvent. The polymer composition is obtained by subjecting a mixture including a tetracarboxylic dianhydride component and a diamine component to a reaction. The diamine component includes first and second diamine compounds defined herein. The polysiloxane contains an epoxy-based group and a polymerizable unsaturated group defined herein. A liquid crystal display element made from the aforesaid liquid crystal alignment agent has reduced ion density.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 16, 2018
    Inventors: Shin-Rong Chiou, Wan-Ting Huang, Tsung-Pei Tsai
  • Patent number: 10093771
    Abstract: The present invention relates to a polyester resin with excellent solubility in generic solvents, especially with excellent solubility at a temperature of 0° C. or lower. According to the present invention, by using the polyester resin with excellent solubility in generic solvents, solubility at a lower temperature, especially the solubility at a temperature of 0° C. or lower, is enhanced, making it easier to prepare paints, coatings and the like. The polyester resin related to the present invention contains 0.05 to 0.5 mol of an isosorbide-derived structural unit and 0.015 to 0.4 mol of a trihydric or higher alcohol-derived structural unit relative to 1 mol of a polycarboxylic acid-derived structural unit.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: October 9, 2018
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akifumi Kondo, Yoko Tamura, Masaaki Kiura, Asako Kaneko
  • Patent number: 10081157
    Abstract: A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: (R1: C1-C12 chain alkyl group or the like; H is bonded to at least one of the carbon atoms of the aromatic ring at ortho- or para-position with respect to C to which the oxygen atom is bonded).
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: September 25, 2018
    Inventors: Yoshihiro Fukuda, Takayuki Matsumoto, Masaki Minami, Naoyuki Sekine, Masanori Nakajima
  • Patent number: 10076909
    Abstract: The present invention provides an inkjet ink comprising: an aqueous polyurethane (meth)acrylate dispersion, which is redispersible in water after thermal drying and before curing; a water-dispersible or water-soluble photoinitiator; a surfactant; and a coloring agent. The ink of the present invention is particularly suitable for printing onto a food packaging.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: September 18, 2018
    Assignee: Fujifilm Specialty Ink Systems Limited
    Inventors: Nigel Gould, Christopher Daniel
  • Patent number: 10074457
    Abstract: A dielectric material for a transducer is manufactured from a composition that includes metal oxide particles having hydroxy groups, a rubber polymer having a functional group capable of reacting with an epoxy group, a bisphenol type epoxy resin, both ends of which have an epoxy group, and a cross-linking agent. In the dielectric material for a transducer, the metal oxide particles are bound to the rubber polymer via the bisphenol type epoxy resin. A transducer includes a dielectric layer made of the dielectric material for a transducer and a plurality of electrodes arranged with the dielectric layer interposed therebetween.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: September 11, 2018
    Inventors: Shigeaki Takamatsu, Shinji Kumagai
  • Patent number: 10000461
    Abstract: Polycyclocarbonate compounds and upgraded molecular weight polymers made from such compounds are provided. The polymers have particular utility in coating compositions, especially for use on food and beverage contact substrates that are formed into or will be formed into containers or container components.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: June 19, 2018
    Assignee: SWIMC LLC
    Inventors: Sebastien Gibanel, Benoit Prouvost
  • Patent number: 9972507
    Abstract: Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: May 15, 2018
    Inventors: Naoyuki Kushihara, Kazuaki Sumita
  • Patent number: 9959985
    Abstract: Provided is an aqueous liquid composition including a water-based medium containing water, a polymer having at least one type of groups selected from hydroxyl groups and amino groups, and phosphonobutanetricarboxylic acid. The polymer is at least one polymer selected from the group consisting of a polysaccharide, polyamino acid, polyvinyl alcohol, polyallylamine, polyvinylamine, a polyamidine, a polyethylenimine, and their derivatives.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: May 1, 2018
    Inventors: Yosuke Ichinomiya, Kozaburo Hayashi, Yoshihiko Iijima, Nobuyuki Kobayashi
  • Patent number: 9897680
    Abstract: A method of fabricating ultrasound bone phantom material compatible with magnetic resonance imaging (MRI) is provided. The bone phantom material has ultrasound and physical parameters that are characteristic of human cortical and trabecular bones, and is well suited for the fabrication of bone phantoms intended for the development and testing of ultrasound medical diagnostic imaging techniques as well as high-intensity focused ultrasound (HIFU) therapy methods and other MRI imaging applications.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: February 20, 2018
    Inventors: Roman Gr. Maev, Adrian Pawel Wydra, Emil Strumban
  • Patent number: 9890244
    Abstract: Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: February 13, 2018
    Inventors: W. C. Peter Tsang, Andrew Bell
  • Patent number: 9873793
    Abstract: A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: January 23, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Atsushi Masunaga, Hideyuki Umetsu
  • Patent number: 9869060
    Abstract: The present invention relates to a water-soluble cationic acrylamide-based polymer having one or more acetoacetate groups. The invention also relates to a method for producing the water-soluble polymer which comprises polymerizing ethylenically unsaturated monomers in an aqueous phase, wherein the monomers comprise (a) (meth)acrylamide, (b) ethylenically unsaturated cationic monomer, (c) ethylenically unsaturated monomer having one or more acetoacetate groups, and (d) optionally other ethylenically unsaturated monomer. The invention further relates to the use of the water-soluble polymer as a strength agent in the production of paper and board. The invention further relates to a process for producing paper and board which comprises providing an aqueous cellulosic suspension, adding to the suspension water-soluble polymer having one or more ketone groups, and dewatering the obtained suspension.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: January 16, 2018
    Assignee: KEMIRA OYJ
    Inventors: Ulf Jonas Anders Engstrom, Per Anders Restorp