Process Of Forming A Composition Containing A Nonreactive Material (nrm) And A Polymer Containing More Than One 1,2-epoxy Group, Or A Preformed Polymer Derived From Or Admixed With A Reactant Containing More Than One 1,2-epoxy Group, Or With A Polymer Derived From An Epihalohydrin And A Polyhydric Phenol Or Polyol; Or Composition Or Product Thereof Patents (Class 523/400)
  • Patent number: 11499036
    Abstract: A rubber composition exhibiting an improved processability/stiffness compromise is based on at least a diene elastomer, a reinforcing filler, a crosslinking system, between 1 and 30 parts by weight per hundred parts by weight of elastomer, phr, of an epoxy resin and between 1 and 15 phr of a specific amine-comprising hardener comprising in particular at least two primary amine functional groups located on at least one six-membered aromatic ring and at least two Ri radicals, which are identical or different, selected from the group consisting of linear or branched C1-C6 alkyl radicals, halogens, and ethers, tertiary amines, thioethers, ketones, esters and amides, substituted by linear or branched C1-C6 alkyl radicals, the said ring not comprising a hydrogen atom located in the ortho position with respect to the primary amine functional groups.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: November 15, 2022
    Inventors: Emmanuel Landreau, Philippe Laubry
  • Patent number: 11479684
    Abstract: A radiation curable inkjet ink composition that includes (A) a mono-ethylenically unsaturated oligomer, (B) a mono-ethylenically unsaturated monomer, and (C) a solvent, wherein the radiation curable inkjet ink composition is substantially free of a photoinitiator and wherein a total weight of the mono-ethylenically unsaturated oligomer (A) is less than or equal to the total weight of the mono-ethylenically unsaturated monomer (B). A printed article including the radiation curable inkjet ink composition in cured form, and a method of forming an image with a thermal inkjet printhead are also provided.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: October 25, 2022
    Assignee: Kao Corporation
    Inventors: Muslim Contractor, Stan Nowacki, Stephen Buchanan, Stephen Cummings
  • Patent number: 11441027
    Abstract: The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa·s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 13, 2022
    Inventors: Akihiko Ito, Hiroaki Sakata
  • Patent number: 11352897
    Abstract: A seal assembly for a gas turbine engine according to an example of the present disclosure includes, among other things, a seal that has a main body extending circumferentially between opposed mate faces. The main body has a sealing portion and an engagement portion extending outwardly from sealing portion along at least one of the mate faces. The main body includes one or more braided core plies having a first fiber construction and arranged to establish an internal cavity. An overwrap having one or more braided overwrap plies follows a perimeter of the one or more braided core plies to establish the engagement portion and the sealing portion. The one or more braided overwrap plies have a second fiber construction differing from the first fiber construction. A method of fabricating a seal for a gas turbine engine is also disclosed.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: June 7, 2022
    Inventor: Robin H. Fernandez
  • Patent number: 11292943
    Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: April 5, 2022
    Assignee: The Boeing Company
    Inventors: Peter Babilo, Randall Jay Moss
  • Patent number: 11267224
    Abstract: Provided are methods of preparing an electrically activated shape memory polymer composite capable of thermal shape reformation using electric power to heat the composite through its matrix glass transition temperature. The methods may include providing a polymer matrix component comprising a diglycidyl ether resin and at least one curing agent, adding into the polymer matrix component at least one nano-filler component, sonication and mixing the polymer matrix component and the nano-filler component to form a mixture, curing the mixture under curing conditions, and laminating the cured mixture with at least one elastic laminated layer.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: March 8, 2022
    Inventors: Jin Ho Kang, Emille J. Siochi, Ronald K. Penner, Travis L. Turner
  • Patent number: 11242428
    Abstract: Hydroxyaldimines of formula (I), their reaction products, in particular products of their reaction with polyisocyanates, and compositions including isocyanate groups and containing such reaction products. The hydroxyaldimine permits compositions which have good storage stability, a long open time, low odour, rapid, bubble-free curing and good mechanical properties, and which are not susceptible to plasticizer migration and have a particularly low content of monomeric diisocyanates. In particular, it permits reactive hot-melt adhesives with a particularly good workability.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: February 8, 2022
    Inventors: Urs Burckhardt, Andreas Kramer, Martin Schmider
  • Patent number: 11208580
    Abstract: A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 ?m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 28, 2021
    Inventor: Antonio Voci
  • Patent number: 11186675
    Abstract: The disclosure describes an epoxy resin composition and a transformer including the same. The epoxy resin composition according to an embodiment of the present invention includes an epoxy resin having a glycol-based functional group in a main chain, a filler, a curing agent, and an imidazole-based catalyst, and the transformer according to an embodiment includes an insulated conductor wound in multiple layers in a vertical direction; a semi-conductive layer which is provided on the insulated conductor and disperses a concentrated electric field; and an insulator which is casted on the insulated conductor and the semi-conductive layer and forms an outer shape of the transformer, and the insulator consists of the epoxy resin composition including the epoxy resin having the glycol-based functional group in the main chain, the filler, the curing agent, and the imidazole-based catalyst.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 30, 2021
    Assignee: LSIS CO., LTD.
    Inventors: Sang-Eon Kim, Wook-Dong Cho, Heon-Seop Song, Tae-Yun Kang, Han-Gil Kim, Hyeon-Jeong Choi
  • Patent number: 11161976
    Abstract: The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: November 2, 2021
    Assignee: HEXION VAD LLC
    Inventors: Kimberly Goodwin, Ganapathy S. Viswanathan, Scott Peace, Anthony Maiorana, Vishal Patil
  • Patent number: 11079635
    Abstract: The disclosure discloses a sealant and a method for fabricating the same, and a display device. The sealant includes a thermal-curing agent and an epoxy resin, wherein the thermal-curing agent includes a diphenyl ketone alcohol compound capable of emitting a fluorescent light and a phosphorescent light simultaneously.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: August 3, 2021
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Display Technology Co., Ltd.
    Inventors: Dong Xu, Xiaoqing Liu, Wenbo Dong
  • Patent number: 11078361
    Abstract: One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: August 3, 2021
    Inventors: Tatsuya Arisawa, Hirohisa Goto, Tomoyuki Abe
  • Patent number: 11034821
    Abstract: A rubber composition includes 100 parts by mass of a solid rubber (A), 0.1 to 50 parts by mass of a modified liquid diene rubber (B) having a functional group derived from a silane compound represented by the formula (1), and 20 to 200 parts by mass of a filler (C), the modified liquid diene rubber (B) satisfying (i) to (iii) below: (i) The weight average molecular weight (Mw) is 15,000 to 120,000. (ii) The vinyl content is not more than 70 mol %. (iii) The average number of functional groups per molecule of the modified liquid diene rubber (B) is 1 to 30.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: June 15, 2021
    Assignee: KURARAY CO., LTD.
    Inventors: Hiromi Maeda, Daisuke Koda, Hiroshi Kanbara, Satomi Ohta
  • Patent number: 11028225
    Abstract: Provided is a monomer mixture that is rapidly cured to form a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture of the present invention is a monomer mixture containing at least: a compound represented by Formulas (a-1) and/or (a-2); a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by Formula (c-1).
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: June 8, 2021
    Inventors: Tomoya Mizuta, Keizo Inoue
  • Patent number: 11015018
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: May 25, 2021
    Inventors: Yen-Chun Liu, Min-Chian Wang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • Patent number: 10982041
    Abstract: An epoxy resin oligomer is provided. The epoxy resin oligomer is obtained by the reaction of at least a first reactant and a second reactant, and the molecular weight of the epoxy resin oligomer is between 3000 and 9000, wherein the mole ratio of the first reactant and the second reactant is between 1:0.9 and 0.9:1, and each of the first reactant and the second reactant is a compound having two polymerizable groups.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: April 20, 2021
    Inventors: Kok-Sheng Tan, Chen-Han Chien, Yu-Tsan Tseng
  • Patent number: 10934387
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: March 2, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Haruaki Sue, Shinichi Kosugi
  • Patent number: 10899944
    Abstract: A coating composition containing added diol functionality to a urethane, a urea, or polyurethane urea functional resin where an adipic acid dihydrazide chain extender, or free adipic acid dihydrazide active hydrogens react with the oxirane group found in glycidol is described. The combination of diisocyanate, a polyether segment, optionally at least one polyester diol segment, optionally at least one poly(tetrahydrofuran) diol segment, optionally and at least one dimethylol propionic acid diol segment, at least one dihydrazide segment and glycidol compound introduces an increased hydrophilic structure, by diol addition, in compositions that are usable as coatings, on for example, medical devices.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: January 26, 2021
    Assignee: Lake Region Manufacturing, Inc.
    Inventor: Peter Anthony Edwards
  • Patent number: 10882955
    Abstract: A process of preparing polybenzoxazines using an alkylammonium salt of an acid having a pKa in acetonitrile of 9 or more as catalyst is described.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: January 5, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: Gregory P. Sorenson, Ilya Gorodisher
  • Patent number: 10851245
    Abstract: A polymeric material comprising a first polymer and a second polymer where the first polymer is a natural or a synthetic polymer and the second polymer is modified lignin. The modified lignin is modified with an alkyl containing group via linker wherein the linker is an ether group and wherein the alkyl containing group is derived from fatty acid methyl ester.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: December 1, 2020
    Inventors: Joseph Samec, Christopher Carrick, Alexander Orebom, Joakim Löfstedt
  • Patent number: 10822517
    Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: November 3, 2020
    Inventors: Tien-Shou Shieh, Pei-Hsin Chien
  • Patent number: 10822521
    Abstract: An aqueous basecoat material with improved circulation line stability is disclosed. The aqueous basecoat material includes at least one hydroxyl-functional polymer as a binder component and at least one binder component which is different from the hydroxyl-functional polymer. The aqueous basecoat material also includes at least one carbonyl group-containing polyurethane poly(meth)acrylate and also at least one organic compound having at least two hydrazine, hydrazide and/or hydrazone groups. The aqueous basecoat material also includes at least one branched and/or secondary aliphatic monoalcohol having at least four carbon atoms.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: November 3, 2020
    Inventors: Bernhard Steinmetz, Norbert Loew
  • Patent number: 10815405
    Abstract: A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: October 27, 2020
    Inventors: Benjamin Haag, Andreas Lutz, Cathy Grossnickel, Raymond F. Bis
  • Patent number: 10793742
    Abstract: Metal food or beverage containers are coated with a polyether polymer containing at least two ether linkages in the polymer backbone. The polymer is substantially free of segments derived from bisphenol A and epoxides thereof, and is a reaction product of, or can be derived from, (i) an aryl- or heteroaryl-group-containing diepoxide that is not derived from a polyhydric phenol or a glycidyl ester and (ii) a polymer backbone extender that has two functional groups reactive with an epoxy group and which following reaction with the diepoxide provides at least one pendant aryl or heteroaryl group on the polymer backbone, or provides at least one divalent aryl or heteroaryl group in the polymer backbone and linked to the backbone via ether linkages.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: October 6, 2020
    Inventors: Benoit Prouvost, Sebastien Gibanel
  • Patent number: 10752714
    Abstract: There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: August 25, 2020
    Inventors: Isao Adachi, Takahiro Sakaguchi, Yuki Sugawara
  • Patent number: 10689548
    Abstract: An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 23, 2020
    Assignee: Polyonics, Inc.
    Inventors: Kenneth T. Robichaud, Donald P. Nieratko, Delilah F. Adams, Robert H. Guyette, Jr.
  • Patent number: 10662315
    Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: May 26, 2020
    Inventors: Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba
  • Patent number: 10638779
    Abstract: Provided herein is a compound having the formula I wherein R1 and R2 are independently selected from a branched or straight C1-6 alkyl and a C1-6 alkenyl, n is 1, 2, 3, 4, 5, or 6 and x is independently 0, 1, or 2; provided that when n is 1, x is 2. Also provided herein is a method of releasing acetaldehyde into an aqueous solution including delivering a compound of formula I to the aqueous solution, Also provided is a flavor or aroma-modifying composition including i) a flavor or aroma-conferring or modifying ingredient, at least one compound according to formula (I); ii) at least one ingredient selected from the group consisting of a flavor carrier and a flavor base; and iii) optionally at least one flavor adjuvant.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: May 5, 2020
    Assignee: Firmenich SA
    Inventors: Gary B. Womack, Matthew Sillick
  • Patent number: 10636712
    Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 28, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Kyoung Chul Bae, Dong Hwan Lee
  • Patent number: 10626308
    Abstract: The present disclosure relates to a B-stageable adhesive composition and an article prepared by the same. In the present disclosure, the adhesive composition comprises the following components in solid content percentage: (A) 10% to 50% by weight of a first epoxy resin with a weight average molecular weight Mw of 8,000 g/mol or more; (B) 5% to 20% by weight of a second epoxy resin with a weight average molecular weight Mw of 200 to 6,000 g/mol; (C) 30% to 80% by weight of a hydroxyl terminated polyester or derivates thereof; (D) 0.1% to 2.5% by weight of a first curing agent capable of reacting with epoxy group; and (E) 0.1% to 2.5% by weight of a second curing agent capable of reacting with hydroxyl group; the sum of components of the composition is equal to 100% by weight. The coating obtained from the adhesive composition of the present disclosure shows high adhesive strength, excellent heat resistance and flame retardance.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: April 21, 2020
    Inventors: Zhenqian Yang, Liang Qin, Dong Li, Ping Zhou, Xiongjian Wu
  • Patent number: 10604453
    Abstract: Coating compositions suitable for machined cementitious substrates are provided. The coating compositions provide adhesion to the machined cementitious substrate while maintaining high mechanical film strength. The coating compositions are also compatible with industrial implementation, and exhibit good pot life.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 31, 2020
    Assignee: James Hardie Technology Limited
    Inventors: Weiling Peng, Caidian Luo
  • Patent number: 10600707
    Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: March 24, 2020
    Inventors: Yoshihiro Tsutsumi, Shuichi Fujii, Kenji Hagiwara, Shinsuke Yamaguchi
  • Patent number: 10577510
    Abstract: An electrocoating composition is provided herein. The electrocoating composition includes an aqueous carrier. The electrocoating composition further includes a film forming binder. The film forming binder includes an epoxy-amine adduct and a blocked polyisocyanate crosslinking agent. The electrocoating composition further includes an anti-crater agent selected from the group of a polyester resin dispersion, a polyacrylate resin dispersion, and a combination thereof. The electrocoating composition further includes a supplemental anti-crater agent including a polyether modified polysiloxane.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: March 3, 2020
    Inventors: Allisa Gam, Jozef Theresia Huybrechts
  • Patent number: 10570317
    Abstract: An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: February 25, 2020
    Assignee: ZEPHYROS, INC.
    Inventors: Morgan Chene, Christophe Henry
  • Patent number: 10549516
    Abstract: A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: February 4, 2020
    Inventors: Frank L. Palmieri, John W. Connell, Christopher J. Wohl, Jr.
  • Patent number: 10544255
    Abstract: The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: January 28, 2020
    Inventors: Haosheng Xu, Xianping Zeng, Liexiang He
  • Patent number: 10544299
    Abstract: A process for forming a thermosetting resin in a nitrogen atmosphere is provided. The process includes the steps of a) reacting a polycarboxylic acid and/or anhydride and a polyhydric alcohol to provide a hydroxyl-containing intermediate; b) reacting the hydroxyl-containing intermediate with a vinyl-containing organic acid or vinyl containing alkyl ester in the presence of an esterification catalyst, a polymerization inhibitor and an azeotropic agent; and c) reacting any residual vinyl-containing organic acid and residual esterification catalyst with an epoxide.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: January 28, 2020
    Assignee: Reichhold LLC 2
    Inventors: Hildeberto Nava, Yongning Liu
  • Patent number: 10533095
    Abstract: A curable coating composition and the use, especially in heat exchangers, for heating and/or cooling water, in particular tap water, is described. The curable coating comprises, based on solids after curing, 35-80% by weight of an epoxysilane according to the general structure 1 and/or its hydrolysation and/or condensation products, 1: R1R2aSiR3b with R1 being 3-glycidyloxypropyl, R2 being methyl, R3 being alkyloxy or acyloxy, a being 0, 1 or 2 and b being 3?a and 20-65% by weight of a blocked polyisocyanate and optionally further components. The coating provides improved corrosion protection on aluminium surfaces, reduces limescale formation on heat exchanger surfaces and is able to withstand lateral and/or temporal temperature gradients when coated on heat exchanging surfaces.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: January 14, 2020
    Assignee: Teknologisk Institut
    Inventors: Stefan Holberg, Claus Bischoff
  • Patent number: 10508176
    Abstract: Disclosed herein is a foamable resin composition for a foam sheet including polylactic acid resin particles, each of the particles having a particle size of about 1 ?m to about 100 ?m. A process for preparing a particulate polylactic acid resin includes: introducing a polylactic acid resin and then forming a molten polylactic acid spray solution; and injecting the molten polylactic acid spray solution by a melt spray method and simultaneously cooling the molten polylactic acid spray solution to obtain a particulate polylactic acid. In addition, disclosed herein is a process for preparing a foam sheet using the foamable resin composition for a foam sheet including a polylactic acid resin.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: December 17, 2019
    Assignee: LG HAUSYS, LTD.
    Inventors: Jun-Beom Shin, Sung-Yong Kang, Min-Hee Lee, Hea-Won Kwon, Kyoung-Min Kang
  • Patent number: 10508204
    Abstract: Photo-protected microcapsules containing a photopolymer composition are dispersed in an epoxy coating to form an autonomic self-healing material. The capsule shell wall is formulated to protect the photopolymer composition from electromagnetic radiation exposure prior to rupture of the capsule shell, so that the photopolymer composition (e.g., a UV curable epoxy resin) remains active until triggered by damage to the capsule shell. Carbon black pigment is a suitable UV protector for the capsules. Upon sufficient damage to a region of the coating, the capsules will rupture and the photopolymer composition will fill and cure in and/or around the damaged region in the presence of electromagnetic radiation, achieving autonomic healing of the damaged coating.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: December 17, 2019
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Michael Thomas Odarczenko, Scott R. White, Nancy R. Sottos
  • Patent number: 10501620
    Abstract: A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: December 10, 2019
    Assignee: Intel Corporation
    Inventors: Makoto Fujimura, Yohei Tateishi, Takeshi Sakano
  • Patent number: 10414857
    Abstract: A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: September 17, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Timothy A. Morley, Rainer Koeniger, Sergio Grunder, Sylvie Vervoort, Nebojsa Jelic
  • Patent number: 10392473
    Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured even in the presence of oxygen and/or water to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition contains a multifunctional vinyl ether compound in an amount of 10 to 80 weight percent, a bifunctional oxetane compound represented by Formula (b) in an amount of 0.5 to 20 weight percent, and a monofunctional oxetane compound represented by Formula (b?) in an amount of 5 to 80 weight percent. In the formulae, Ring Z is selected from an aromatic hydrocarbon ring and a structure including two or more aromatic hydrocarbon rings bonded to each other through a single bond or a linkage group; R represents a monovalent aliphatic hydrocarbon group; R? is selected from hydrogen and ethyl; and m represents an integer of 0 or more.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: August 27, 2019
    Inventors: Tomoya Mizuta, Keizo Inoue
  • Patent number: 10363708
    Abstract: The present disclosure provides a composition for preparing a lightweight transparent composite, a method of preparing a composite using the same, and a composite prepared by the method. The lightweight transparent composite having excellent impact resistance, scratch resistance, weather resistance, and high hardness can be prepared by thermally curing a mixture of a glass fiber reinforcement having a refractive index of 1.4 to 1.6 and a curable resin having a deviation in refractive index of ?0.005 to +0.005 from the glass fiber reinforcement. When the lightweight transparent composite is applied to transparent windows for automobiles, the lightweight transparent composite can be useful in enhancing fuel efficiency, achieving easier handling characteristics due to reduction in vehicle center of gravity, and improving juddering and dimensional stability even during car driving due to excellent hardness.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: July 30, 2019
    Inventors: Young Ho Choi, Sang Sun Park, Kyung Mo Yang, Seok Hwan Kim
  • Patent number: 10351760
    Abstract: Polymeric clay stabilizers including at least one ionic repeating unit for treatment of subterranean formations. A method of treating a subterranean formation that can include obtaining or providing a composition comprising including a polymeric clay stabilizer including at least one ionic repeating unit, wherein the clay stabilizer has a melting point or glass transition temperature that is equal to or less than 100° C. The method can also include placing the composition in a subterranean formation.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: July 16, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Nathan Carl Schultheiss, Humberto Almeida Oliveira, Chandra Sekhar Palla-Venkata, Zheng Lu
  • Patent number: 10336875
    Abstract: A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: July 2, 2019
    Inventors: Hui Li, Kehong Fang
  • Patent number: 10316211
    Abstract: Coating compositions that include a thermoplastic dispersion and an epoxy-functional stabilizer having polyhydric phenols that exhibit estrogenic activity less than bisphenol S.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 11, 2019
    Assignee: SWIMC LLC
    Inventors: Jeffrey Niederst, Richard H. Evans, Robert M. O'Brien, Kevin Romagnoli, Mark S. Von Maier, Mary E. Tishey, Gregory M. Paulson
  • Patent number: 10287236
    Abstract: A method i for forming an epoxidized polymer is provided. The method may include mixing an epoxidized plant oil with a synthetic epoxy resin and crosslinking the epoxidized plant oil and the synthetic epoxy resin using a curing agent. The epoxidized plant oil may be formed via: converting plant oil triglycerides to fatty amide alcohols via aminolysis using primary or secondary amines, converting the fatty amide alcohols to epoxidized fatty amide alcohols, and reacting the epoxidized fatty amide alcohols with vinyl monomers to obtain epoxidized plant oil monomers.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 14, 2019
    Assignee: University of South Carolina
    Inventors: Chuanbing Tang, Zhongkai Wang, Liang Yuan
  • Patent number: 10246575
    Abstract: The invention relates to a polymer composition, and to a semifinished plastics product, the surface of which has been formed at least to some extent from the polymer composition. The invention further relates to a production process associated therewith for the semifinished plastics product. A feature of the polymer composition is that it comprises from 50 to 99.7% by weight of a polymer and from 0.3 to 20% by weight of one or more adhesion-promoting additives. The invention further relates to plastics-metal hybrid components and production of these.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: April 2, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Karl Kuhmann, Maximilian Gruhn, Olivier Farges, Martin Risthaus, Kathrin Lehmann
  • Patent number: 10233926
    Abstract: The present invention recites a method of fabricating a stator for a downhole motor, the method comprising the steps of providing a stator tube having an interior surface and applying a bonding agent to the interior surface of the stator tube. Additionally, a mandrel is positioned within the stator tube, the mandrel having an outer geometry that is complimentary to a desired inner geometry for the stator. Furthermore, a reinforcing material is introduced into the stator tube to fill space between the mandrel and the interior surface of the stator tube and subsequently solidified to bond the reinforcing material to the interior surface of the stator tube. The mandrel is then removed from the bonded stator tube and reinforcing material such that a stator is fabricated.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: March 19, 2019
    Inventors: Hossein Akbari, Julien Ramier, Olivier Sindt