Abstract: Provided in the present invention is a wafer warpage regulation epoxy functional film. The wafer warpage regulation epoxy functional film includes the raw material components, in percentage by mass, 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2% of a coloring agent; and the epoxy resin includes a bisphenol F-type epoxy resin and a phenolic epoxy resin. Besides, the above raw material components are stirred and mixed to obtain a slurry, the slurry is coated to a back of a wafer body, and after curing, the epoxy functional film which is formed by the phenolic epoxy resin has high shrinkage and large warpage, to drive the back of the wafer body to warp so as to drive a front of the wafer body to warp backwards.

Abstract: An antifriction coating formulation composition comprising (a) a soluble resin, (b) an insoluble polymer, (c) optionally a solid lubricant, and (d) a solvent.

Abstract: A composition suitable for coating a metallic substrate that is susceptible to corrosion is disclosed. The composition comprises a carrier medium, 2D material/graphitic platelets, and one or both of conductive carbon black particles and carbon nanotubes, in which the 2D material/graphitic platelets comprise nanoplates of one or more 2D materials and or nanoplates of one or more layered 2D materials and or graphite flakes in which the graphite flakes have one nanoscale dimension and 25 or less layers, the conductive carbon black particles have a mean particle size in the range of 1 nm to 1000 nm, and the carbon nanotubes are single or multiwalled.

Abstract: An amino functionalized siloxane resin particle obtainable by polycondensation of a cationic alkoxysilane surfactant according to general formula I (I) and an amino functionalized alkoxysilane according to general formula (II). The amino functionalized siloxane resin particle can be incorporated in jettable liquids for inkjet printing.

Abstract: The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20° C. and 60° C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.

Abstract: A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

Abstract: A method for improving the cleanability of an epoxy paint coat on a surface is provided. A paint composition, and its use in improving cleanability is also provided. A kit-of-parts comprising the components of the paint composition is also provided.

Abstract: The embodiments relate to a polyamide-based film excellent in optical properties such as transmittance, haze, and yellow index and mechanical properties such as modulus and thickness uniformity, to a process for preparing the same, and to a cover window and a display device comprising the same. The polyamide-based film comprises a polyamide-based polymer and has an XRD pattern comprising a first peak whose highest point is located in a section where 2? is 14° to 16°.

Abstract: A water-adaptive cement self-healing system, a preparation method and an application thereof are provided. A pH-triggered shell curing agent, an inorganic nano-emulsifier, and a polysaccharide shell material are added into deionized water to obtain an aqueous phase; an active diluent of epoxy is added to an epoxy to obtain a first oil phase; the aqueous phase is mixed with the first oil phase to obtain an oil/water emulsion; a surfactant is added into paraffin oil to obtain a second oil phase; the second oil phase is mixed with the oil/water emulsion to obtain an oil/water/oil emulsion; an acidic liquid is added into the oil/water/oil emulsion dropwise to obtain a solid, followed by centrifuging, washing, and freeze-drying to obtain a self-healing capsule; and then an epoxy curing agent is mixed with the self-healing capsule to obtain the water-adaptive cement self-healing system based on an oil/water/oil double-emulsion template.

Abstract: Adhesive compositions comprising a polyester polyol that includes residues of at least one 2,2,4,4-tetraalkylcyclobutane-1,3-diol, including, for example, 2,2,4,4-tetramethylcyclobutane-1,3-diol (TMCD). Adhesive compositions may exhibit enhanced properties as compared to conventional adhesive compositions, and may be suitable for a wide variety of end use applications, including, flexible packaging, woodworking, automotive uses, and electronics.

Abstract: A method of preparing a modification-free, recyclable and photothermally-driven self-repairing epoxy anticorrosion coating. A bisphenol A epoxy resin is employed as a film-forming material, and a polybasic acid is used as a curing agent. A carbon material is introduced as a photothermal filler to construct a catalyst-free epoxy-anhydride curing system, which is cured at 110-130° C. for 4-12 h to obtain the recyclable and photothermally-driven self-repairing epoxy anticorrosion coating.

Abstract: Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.

Abstract: Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of ?50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

Abstract: Disclosed is a nanoporous membrane including a porous support layer and a selective layer. The selective layer, being deposited on a surface of the porous support layer, has an effective pore size smaller than that of the porous support layer and contains an array of polymeric nanoparticles that have on their surfaces a plurality of —C(?O)XR groups. Also disclosed are methods of fabricating a nanoporous membrane described above and using the nanoporous membrane for separating a mixture that contains two solutes.

Abstract: Compositions and methods are described which provide a protective coating to coils or springs via a polymerization process such as by covalent bonding that includes grafting to the metal surface.

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.

Abstract: Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.

Abstract: A process for the production of a graft copolymer composition is presented, which is based on acrylonitrile-styrene-acrylate (ASA) or acrylonitrile-butadiene-styrene (ABS) graft copolymers. The graft copolymers obtained by emulsion polymerization and precipitation show improved dewatering behavior after precipitation. Based on this method ASA and ABS graft copolymers with low residual humidity can be obtained. Furthermore, the invention relates to a process for the production of a thermoplastic molding composition comprising at least one thermoplastic styrene copolymer, in particular a styrene-acrylonitrile copolymer, the graft copolymer obtained by the process, and optional further components.

Abstract: A bio-based epoxy resin obtained from a reaction mixture comprising a glycidyl ether component and a bio-based component comprising a fatty acid and a rosin acid, wherein the glycidyl ether component comprises at least two epoxide groups.

Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.

Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Abstract: The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one first amine-based epoxy curing agent; (b2) optionally, at least one second amine-based epoxy curing agent; (b3) at least one mineral filler; (b4) at least one phenolic lipid; wherein part (A) and/or part (B) comprise at least one triphenylmethane dye. The curable casting resin precursor is suited for encapsulating metal parts such as cable joints and the like.

Abstract: A semiconductor packaging structure includes a die including a bond pad and a first metal layer structure disposed on the die, the first metal layer structure having a first width, the first metal layer structure including a first metal layer, the first metal layer electrically coupled to the bond pad. The semiconductor packaging structure also includes a first photosensitive material around sides of the first metal layer structure and a second metal layer structure disposed over the first metal layer structure and over a portion of the first photosensitive material, the second metal layer structure electrically coupled to the first metal layer structure, the second metal layer structure having a second width, where the second width is greater than the first width. Additionally, the semiconductor packaging structure includes a second photosensitive material around sides of the second metal layer structure.

Abstract: A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, ? ? ? D × ? ? ? H ? ? ? D + ? ? ? H ? 1.0 , where ?D is a standard deviation of tablet diameters and ?H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Abstract: Disclosed herein are electrically conductive thermoplastic polyester compositions comprising: a) at least one thermoplastic polyester; b) conductive carbon black; c) at least one ethylene copolymer based impact modifier; and d) at least one hyperbranched polyester having an acid number of about 80-340 mg KOH/g.

Abstract: Water based, energy curable ink jet compositions that have good insulating properties are described herein. The inventive water based energy curable ink jet compositions include a water soluble or water dispersible component polymerizable by free radical polymeration upon exposure to polymerizing radiation, wherein the cured ink jet compositions have good insulating properties, exhibited for example, by its breakdown voltage. Also described are electronic devices including ink jet-printed layers of the ink jet compositions.

Abstract: The present invention relates to a method for the preparation of a lignin prepolymer, comprising (a) providing a lignin; (b) reacting the lignin with a hydroxyl functionalization reagent to provide a lignin derivative containing at least one hydroxyl group, said hydroxyl group being obtained as a result of the interaction between the lignin and the hydroxyl functionalization reagent (c) reacting the lignin derivative obtained in step (b) with a functionalization reagent selected from the group consisting of fatty acids, fatty acid derivatives and mixtures thereof capable to react with the lignin derivative resulting in a covalent bond between the fatty acid and/or or the fatty acid derivative and the lignin derivative.

Abstract: A vehicle bond filler formulation is provided that includes a part A having curable resin and a monomer reactive diluent. A part B storage-separate, cure initiator package contains a free-radical cure initiator. At least one color changing dye adapted to change color upon mixing the part A and the part B and within ±5 minutes of cure of the curable resin to a sandable condition is present in either the part A or a separate part C, a guide coat colorant, or a combination thereof. A process of for repairing a vehicle body is also provided that includes mixing a part A containing the at least one color changing dye with the part B to form an internal guide coat mixture applied to a substrate of the vehicle body in need of repair. The mixture cures causing the color changing dye to the terminal change color within ±5 minutes of cure of the curable resin to a sandable condition.

Abstract: Systems and methods are provided for fabrication of enhanced carbon fiber laminates that utilize encapsulated catalyst. One embodiment is a method that includes acquiring a batch of dry fibers, and acquiring a batch of catalyst capsules that each comprise catalyst that accelerates polymerization of monomers of a resin, and a shell that encapsulates the catalyst and liquefies at a curing temperature. The method further includes interspersing the catalyst capsules among the dry fibers, and impregnating the fibers with the resin after interspersing the catalyst capsules with the fibers.

Abstract: Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.

Abstract: A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.

Abstract: A rubber composition exhibiting an improved processability/stiffness compromise is based on at least a diene elastomer, a reinforcing filler, a crosslinking system, between 1 and 30 parts by weight per hundred parts by weight of elastomer, phr, of an epoxy resin and between 1 and 15 phr of a specific amine-comprising hardener comprising in particular at least two primary amine functional groups located on at least one six-membered aromatic ring and at least two Ri radicals, which are identical or different, selected from the group consisting of linear or branched C1-C6 alkyl radicals, halogens, and ethers, tertiary amines, thioethers, ketones, esters and amides, substituted by linear or branched C1-C6 alkyl radicals, the said ring not comprising a hydrogen atom located in the ortho position with respect to the primary amine functional groups.

Abstract: A radiation curable inkjet ink composition that includes (A) a mono-ethylenically unsaturated oligomer, (B) a mono-ethylenically unsaturated monomer, and (C) a solvent, wherein the radiation curable inkjet ink composition is substantially free of a photoinitiator and wherein a total weight of the mono-ethylenically unsaturated oligomer (A) is less than or equal to the total weight of the mono-ethylenically unsaturated monomer (B). A printed article including the radiation curable inkjet ink composition in cured form, and a method of forming an image with a thermal inkjet printhead are also provided.

Abstract: The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa·s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.

Abstract: A seal assembly for a gas turbine engine according to an example of the present disclosure includes, among other things, a seal that has a main body extending circumferentially between opposed mate faces. The main body has a sealing portion and an engagement portion extending outwardly from sealing portion along at least one of the mate faces. The main body includes one or more braided core plies having a first fiber construction and arranged to establish an internal cavity. An overwrap having one or more braided overwrap plies follows a perimeter of the one or more braided core plies to establish the engagement portion and the sealing portion. The one or more braided overwrap plies have a second fiber construction differing from the first fiber construction. A method of fabricating a seal for a gas turbine engine is also disclosed.

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.

Abstract: Provided are methods of preparing an electrically activated shape memory polymer composite capable of thermal shape reformation using electric power to heat the composite through its matrix glass transition temperature. The methods may include providing a polymer matrix component comprising a diglycidyl ether resin and at least one curing agent, adding into the polymer matrix component at least one nano-filler component, sonication and mixing the polymer matrix component and the nano-filler component to form a mixture, curing the mixture under curing conditions, and laminating the cured mixture with at least one elastic laminated layer.

Abstract: Hydroxyaldimines of formula (I), their reaction products, in particular products of their reaction with polyisocyanates, and compositions including isocyanate groups and containing such reaction products. The hydroxyaldimine permits compositions which have good storage stability, a long open time, low odour, rapid, bubble-free curing and good mechanical properties, and which are not susceptible to plasticizer migration and have a particularly low content of monomeric diisocyanates. In particular, it permits reactive hot-melt adhesives with a particularly good workability.

Abstract: A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 ?m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.

Abstract: The disclosure describes an epoxy resin composition and a transformer including the same. The epoxy resin composition according to an embodiment of the present invention includes an epoxy resin having a glycol-based functional group in a main chain, a filler, a curing agent, and an imidazole-based catalyst, and the transformer according to an embodiment includes an insulated conductor wound in multiple layers in a vertical direction; a semi-conductive layer which is provided on the insulated conductor and disperses a concentrated electric field; and an insulator which is casted on the insulated conductor and the semi-conductive layer and forms an outer shape of the transformer, and the insulator consists of the epoxy resin composition including the epoxy resin having the glycol-based functional group in the main chain, the filler, the curing agent, and the imidazole-based catalyst.

Abstract: The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

Abstract: The disclosure discloses a sealant and a method for fabricating the same, and a display device. The sealant includes a thermal-curing agent and an epoxy resin, wherein the thermal-curing agent includes a diphenyl ketone alcohol compound capable of emitting a fluorescent light and a phosphorescent light simultaneously.

Abstract: One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.

Abstract: A rubber composition includes 100 parts by mass of a solid rubber (A), 0.1 to 50 parts by mass of a modified liquid diene rubber (B) having a functional group derived from a silane compound represented by the formula (1), and 20 to 200 parts by mass of a filler (C), the modified liquid diene rubber (B) satisfying (i) to (iii) below: (i) The weight average molecular weight (Mw) is 15,000 to 120,000. (ii) The vinyl content is not more than 70 mol %. (iii) The average number of functional groups per molecule of the modified liquid diene rubber (B) is 1 to 30.

Abstract: Provided is a monomer mixture that is rapidly cured to form a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture of the present invention is a monomer mixture containing at least: a compound represented by Formulas (a-1) and/or (a-2); a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by Formula (c-1).

Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.

Abstract: An epoxy resin oligomer is provided. The epoxy resin oligomer is obtained by the reaction of at least a first reactant and a second reactant, and the molecular weight of the epoxy resin oligomer is between 3000 and 9000, wherein the mole ratio of the first reactant and the second reactant is between 1:0.9 and 0.9:1, and each of the first reactant and the second reactant is a compound having two polymerizable groups.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: A coating composition containing added diol functionality to a urethane, a urea, or polyurethane urea functional resin where an adipic acid dihydrazide chain extender, or free adipic acid dihydrazide active hydrogens react with the oxirane group found in glycidol is described. The combination of diisocyanate, a polyether segment, optionally at least one polyester diol segment, optionally at least one poly(tetrahydrofuran) diol segment, optionally and at least one dimethylol propionic acid diol segment, at least one dihydrazide segment and glycidol compound introduces an increased hydrophilic structure, by diol addition, in compositions that are usable as coatings, on for example, medical devices.