Abstract: The present invention provides rubber compositions and tires which provide improved overall performance in terms of wet grip performance and dry grip performance. Included is a rubber composition having a hardness that reversibly changes with water, satisfying the relationships (1) and (2) below, and having a stress at break of 8.0 MPa or more, Hardness when dry?Hardness when water-wet?1??(1) wherein each hardness represents the JIS-A hardness at 25° C. of the rubber composition, 0.90?Volume when water-wet/Volume when dry?1.01??(2) wherein each volume represents the volume at 25° C. of the rubber composition.

Abstract: A liquid developer containing toner particles and a carrier liquid, the toner particles containing a resin component, wherein the resin component includes a resin A and a resin B, the resin A has a unit Y1 represented by the formula (1) and a unit Y2 represented by the formula (2), the resin B has a unit Y3 represented by the formula (3) and a unit Y4 selected from the units represented by the formulae (4) to (8), the resin A has a unit Y2 content of 1% to 20% by mass, the resin B has a unit Y3 content of 5% to 90% by mass, the resin component has a resin A content of 50% to 99% by mass, and the resin component has a resin B content of 1% to 50% by mass.

Abstract: The present invention relates to a process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port, the process including: a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to a second supply port side by the kneader at a temperature at which the powdery material is not melted; a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid material; and a step of further kneading a kneaded product thereof while cooling.

Abstract: The present invention concerns a two-part sizing composition comprising: (A) A precursor comprising: (a) An aminosilane (e.g. A1100) and (b) a polymer or copolymer containing carboxylic acid and/or anhydride, both having a functionality, F?3, and (B) A binder comprising a multi-functional epoxy resin of functionality, F?3. Glass fibres sized with the reaction product of the above composition yield a higher resistance to hydrolysis of polymeric matrix composite materials reinforced with such fibres. The sizing composition of the present invention is particularly advantageous for use with polyester resins, such as PET.

Abstract: The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Abstract: A composition comprising a copolyamide and a crosslinked polyolefin. The present invention relates to a composition comprising at least one semi-aromatic polyamide and at least one crosslinked polyolefin, wherein the crosslinked polyolefin is obtained from at least one product (A) comprising an unsaturated epoxide and from at least one product (B) comprising an unsaturated carboxylic acid anhydride. According to the invention, the weight contents of (A) and B), denoted respectively [A] and [B], are such that the [B]/[A] ratio is between 3 and 14.

Abstract: A curable liquid formulation comprising: (i) one or more near-infrared absorbing polymethine dyes; (ii) one or more crosslinkable polymers; and (iii) one or more casting solvents. The invention is also directed to solid near-infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition.

Abstract: The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.

Abstract: Provided are a polymer for an organic electroluminescent element, which has high light emission efficiency and is applicable to a wet process, a cured product thereof, and an organic electroluminescent element using the cured product. The polymer for an organic electroluminescent element is represented by the following general formula (1) and includes an indolocarbazole skeleton and a polymerizable group as pendants in a repeating unit constituting a main chain, in which the polymer has a weight-average molecular weight of 1,000 to 1,000,000. An organic electroluminescent element that uses the cured product of the polymer for an organic electroluminescent element in an organic layer is also disclosed.

Abstract: There is provided a photosensitive resin composition for microlenses. A photosensitive resin composition for microlenses including a component (A), a component (B) and a solvent. The component (A): a copolymer having a maleimide structural unit of Formula (1) and a repeating structural unit of Formula (2). The component (B): a photosensitizer (in Formula (2), R0 is a hydrogen atom or a methyl group; R1 is a single bond or a C1-5 alkylene group; R2 is a thermally cross-linkable monovalent organic group; and in the repeating structural unit of Formula (2), R0s are optionally different from each other).

Abstract: This present application relates to microcapsules or compositions containing microcapsules wherein the microcapsules comprise a polymerizable lactamic copolymer. More particularly, certain aspects are directed to the use of polymerizable lactamic copolymers in the formation of coatings on microencapsulated particles. These polymerizable lactamic copolymers can result in surface modified microencapsulated particles that may be anionic, non-ionic, or cationic.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

Abstract: A process for the manufacture of a polymer dispersion comprising the steps of i) providing a mixture comprising from 2 to 60 parts by weight of a first polypropylene polymer having sufficient carboxylic acid and/or carboxylic acid anhydride groups equivalent to an acid value of from 2 to 50 mg KOH/g nv polymer and from 40 to 98 parts by weight of a second polymer having a molar excess of functional groups capable of reacting with the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene ii) causing the polymers to melt at a chosen temperature under conditions of high shear in an extruder to form an intimate mixture of the polymers iii) causing some of the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene to react with at least some of the functional groups of the second polymer to form a reaction mixture, under conditions of high shear in an extruder iv) rapidly cooling the reaction mixture outside the extruder to form a solid product v) optionally breaking up

Abstract: The invention relates to an elastomer material including flexible polymer chains containing crosslinking bridges having covalent bonds and crosslinking bridges having noncovalent bonds. The invention also relates to a method for preparing such elastomer material.

Abstract: To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 ?m or less, a film being formed by aggregation of the organic elastic fine particles, is provided.

Abstract: A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.

Abstract: The invention provides an abrasion resistant coating composition for an optical element. The composition includes a polymerisable epoxy monomer having an average of at least two epoxy groups in the monomer molecule. The composition is capable of forming an abrasion resistant coating on an optical element after ionic polymerisation. The coating composition may also include an ionically polymerisable alkene monomer having an average of at least two polymerisable double bonds in the molecule.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: A zero VOC aqueous coating composition comprising a halogen-free propylene/&agr;-olefin copolymer having an &agr;,&bgr;-unsaturated dicarboxylic acid or anhydride grafted thereon, a neutralizing base, a water-dispersible resin containing at least two epoxy groups and an acid catalyst is applied to a plastic substrate comprising a propylene polymer. The dried coating promotes adhesion of a subsequent coating to the polypropylene-based surface of the article.

Abstract: A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.

Abstract: The invention relates to a process for preparing a composition contains a polymer and a crosslinking agent which comprises mixing a polymer that is solid at room temperature with a crosslinking agent, the polymer and the crosslinker having complementary reactive groups, at a temperature at which the viscosity of the polymer (measured according to Emila) is less than 5000 dpas, in a means for achieving a homogeneous composition in such a short time that less than 20% of the reactive groups of one of either the polymer or crosslinking agent has reacted, and subsequently cooling and comminuting the composition.The mixing is preferably effected in a static mixer at a temperature higher than 140.degree. C.

Abstract: The present invention relates to a low solvent content-type resin composition, a low solvent content-type coating composition containing such a resin composition as a binder, and a method for coating such a coating composition. The resin composition comprises an oligomer containing an alicyclic epoxy group in a molecule and having a number average molecular weight (Mn) of 300 to 2000, a weight average molecular weight (Mw) of 300 to 4000 and an Mw/Mn ratio of 1 to 2.5. The coating composition comprises such a resin composition and a cationic polymerization catalyst, wherein the content of an organic solvent content is 0 to 40 wt. %. Since the present composition contains a low molecular weight oligomer, the viscosity of the composition is low even though the solid content is high. Accordingly, the content of the organic solvent can be much reduced.

Abstract: A zero VOC aqueous coating composition comprising a halogen-free propylene/.alpha.-olefin copolymer having an .alpha.,.beta.-unsaturated dicarboxylic acid or anhydride grafted thereon, a base, and a water-dispersible resin containing at least two epoxy groups is applied to a plastic substrate comprising a propylene polymer. The dried coating promotes adhesion of a subsequent coating to the polypropylene-based surface of the article.

Abstract: An aqueous coating composition useful for a finish for automobiles and trucks in which the film forming binder comprises a neutralized half-ester product of an acrylic polymer having at least two reactive anhydride groups and an epoxy-containing, optionally silane-containing crosslinker. The composition may be used as a multi-package system. The composition is characterized by improved environmental resistance and excellent clarity and appearance, particularly for clearcoats.

Abstract: The present invention relates to binder compositions containingA) 10 to 99 parts by weight of a copolymer component containing at least one copolymer prepared from olefinically unsaturated compositions having a weight average molecular weight of 1,500 to 75,000 and having in chemically bound form both(i) 1 to 30% by weight of cyclic carboxylic anhydride groups (calculated as C.sub.4 H.sub.2 O.sub.3) and(ii) 1 to 29% by weight of epoxide groups (calculated as C.sub.2 H.sub.3 O) andB) 1 to 90 parts by weight of a hydroxyl component containing at least one organic polyol having at least two hydroxyl groups per molecule,provided that for every anhydride group of component A) there are 0.1 to 10 hydroxyl groups of component B).

Abstract: A free flowing powder of discrete particles of a polar group-containing modified propylene polymer (MPP) is disclosed. This MPP powder has an average particle size of less than about 5 microns and comprises about 25-45 wt. % of discrete particles of the MPP and about 55-75 wt. % of a liquid which is a solvent for a film forming resin material, all wt. percentages being based on the total weight of the powder. The preferred MPP is maleic anhydride polypropylene. The preferred film forming resin solvent is methyl ethyl ketone (MEK). The MPP powder is adapted to be suspended in a primer composition containing a film forming resin, preferably an epoxy resin.

Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder contains reactive binder components of about(a) 25-90% by weight, based on the weight of the binder, of an acrylic polymer having at least two reactive anhydride groups composed of polymerized monomers of an ethylenically unsaturated anhydride and polymerized monomers from the group consisting of alkyl methacrylate, alkyl acrylate and any mixtures thereof, wherein the alkyl groups have 1-8 carbon atoms and the polymer has a weight average molecular weight of about 2,000-50,000;(b) 5-50% by weight, based on the weight of the binder, of a glycidyl component having at least two reactive glycidyl groups;(c) 5-50% by weight, based on the weight of the binder of an acid functional monomeric, oligomeric or polymeric compound which may or may not contain hydroxyl functionality; andthe composition contains about 0.1-5% by weight; based on the weight of the binder, of a catalyst.

Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder contains reactive binder components of about(a) 25-90% by weight, based on the weight of the binder, of an acrylic polymer having at least two reactive anhydride groups composed of polymerized monomers of an ethylenically unsaturated anhydride and polymerized monomers from the group consisting of alkyl methacrylate, alkyl acrylate and any mixtures thereof, wherein the alkyl groups have 1-8 carbon atoms and the polymer has a weight average molecular weight of about 2,000-50,000;(b) 5-50% by weight, based on the weight of the binder, of a glycidyl component having at least two reactive glycidyl groups; and(c) 0.1-7% by weight, based on the weight of the binder, of a phosphonium catalyst or a blend of a phosphonium catalyst and a tertiary amine catalyst which may or may not contain hydroxyl groups.

Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder contains reactive binder components of about(a) 25-90% by weight, based on the weight of the binder, of an acrylic polymer having at least two reactive anhydride groups composed of polymerized monomers of an ethylenically unsaturated anhydride and polymerized monomers from the group consisting of alkyl methacrylate, alkyl acrylate and any mixtures thereof, wherein the alkyl groups have 1-8 carbon atoms and the polymer has a weight average molecular weight of about 2,000-50,000;5-50% by weight, based on the weight of the binder, of a glycidyl component having at least two reactive glycidyl groups;5-50% by weight, based on weight of the binder, of a polymeric component containing multiple hydroxy groups; andthe composition contains about 0.1-5% by weight; based on the weight of the binder, of a catalyst.

Abstract: Curable, high solids, liquid coating compositions are disclosed. The resinous binder comprises a copolymer of an alpha-olefin or cycloolefin and an olefinically unsaturated monoanhydride which may include a half-ester thereof. The coating compositions are useful as clear coats in color-plus-clear automotive coatings and have good humidity resistance and mar resistance.

Abstract: Thermally stable bisimido polymers, devoid of diamine component and well adapted for the production of laminates, are prepared by copolymerizing (a) an N,N'-bismaleimide with (b) an acrylate comonomer, e.g., a novolak epoxy (meth)acrylate, in the presence of a catalytically effective amount of (c) an imidazole compound, and, optionally, (d) a chlorinated or brominated epoxy resin, or admixture thereof with a non-chlorinated or non-brominated epoxy resin.

Abstract: A vulcanizable rubber composition comprising (1) 100 parts by weight of a polymer composition comprising(I) a vinylidene fluoride resin,(II) at least one rubber selected from the group consisting of acrylic rubbers, .alpha.,.beta.-unsaturated nitrile-conjugated diene copolymer rubbers and hydrides of .alpha.,.beta.-unsaturated nitrile-conjugated diene copolymer rubbers, said acrylic rubber consisting of (A) 30 to 99.9% by weight of an alkyl acrylate and/or an alkoxy-substituted alkyl acrylate, (B) 0.1 to 10% by weight of a crosslinkable monomer and (C) 0 to 70% by weight of another ethylenically unsaturated compound copolymerizable with (A) and (B) (the sum of (A), (B) and (C) is 100% by weight) and said .alpha.,.beta.-unsaturated nitrile-conjugated diene copolymer rubber consisting of (D) 10 to 60% by weight of an .alpha.,.beta.

Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder contains reactive binder components of about(a) 25-94% by weight, based on the weight of the binder, of an acrylic polymer having at least two reactive anhydride groups composed of polymerized monomers of an ethylenically unsaturated anhydride and polymerized monomers from the group consisting of alkyl methacrylate, alkyl acrylate and any mixtures thereof, wherein the alkyl groups have 1-8 carbon atoms and the polymer has a weight average molecular weight of about 2,000-50,000;(b) 5-50% by weight, based on the weight of the binder, of a glycidyl component having at least two reactive glycidyl groups;(c) 1-40% by weight, based on the weight of the binder, of a self-stabilized dispersed resin; andthe composition contains about 0.1-5% by weight; based on the weight of the binder, of a catalyst.

Abstract: The resin composition which contains thermosetting resin as Component (A), a thermoplastic resin as Component (B), and at least one compound selected from the group consisting of an epoxy resin capable of dissolving the thermoplastic resin and a reactive diluent possessing at least one epoxy group as Component (C) in a ratio such that the proportions of Components (A), (B), and (C) fall respectively in the ranges of 30 to 96% by weight, 2 to 50% by weight, and 2 to 49% by weight, based on the total weight of the resin composition. The resin composition is capable of producing a molded article combining the highly satisfactory mechanical and thermal properties of a thermosetting resin and the highly satisfactory toughness of a thermoplastic resin.

Abstract: Fiber-reinforced compositions comprising a structural fiber and a cyanate ester resin formulation having an N-substituted urea compound as a latent cure accelerator provide rapid-curing prepreg with good out-time characteristics. The prepreg may be used to form composite articles with good toughness and excellent retention of properties on extended exposure to moisture at elevated temperatures.

Abstract: Curable, high solids, liquid coating compositions are disclosed. The resinous binder comprises a copolymer of an alpha-olefin or cycloolefin and an olefinically unsaturated monoanhydride which may include a half-ester thereof. The coating compositions are useful as clear coats in color-plus-clear automotive coatings and have good humidity resistance and mar resistance.

Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder contains reactive binder components of about(a) 25-94% by weight, based on the weight of the binder, of an acrylic polymer having at least two reactive anhydride groups composed of polymerized monomers of an ethylenically unsaturated anhydride and polymerized monomers from the group consisting of alkyl methacrylate, alkyl acrylate and any mixtures thereof, wherein the alkyl groups have 1-8 carbon atoms and the polymer has a weight average molecular weight of about 2,000-50,000;(b) 5-50% by weight, based on the weight of the binder, of a glycidyl component having at least two reactive glycidyl groups;(c) 1-40% by weight, based on the weight of the binder, of a self-stabilized dispersed resin; andthe composition contains about 0.1-5% by weight; based on the weight of the binder, of a catalyst.

Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder contains reactive binder components of about(a) 25-90% by weight, based on the weight of the binder, of an acrylic polymer having at least two reactive anhydride groups composed of polymerized monomers of an ethylenically unsaturated anhydride and polymerized monomers from the group consisting of alkyl methacrylate, alkyl acrylate and any mixtures thereof, wherein the alkyl groups have 1-8 carbon atoms and the polymer has a weight average molecular weight of about 2,000-50,000;(b) 5-50% by weight, based on the weight of the binder, of a glycidyl component having at least two reactive glycidyl groups; and(c) 0.1-7% by weight, based on the weight of the binder, of a phosphonium catalyst or a blend of a phosphonium catalyst and a tertiary amine catalyst which may or may not contain hydroxyl groups.

Abstract: A vulcanizable rubber composition comprising (1) 100 parts by weight of a polymer composition comprising(I) a vinylidene fluoride resin,(II) at least one rubber selected from the group consisting of acrylic rubbers, .alpha.,.beta.-unsaturated nitrile-conjugated diene copolymer rubbers and hydrides of .alpha.,.beta.-unsaturated nitrile-conjugated diene copolymer rubbers, said acrylic rubber consisting of (A) 30 to 99.9% by weight of an alkyl acrylate and/or an alkoxy-substituted alkyl acrylate, (B) 0.1 to 10% by weight of a crosslinkable monomer and (C) 0 to 70% by weight of another ethylenically unsaturated compound copolymerizable with (A) and (B) (the sum of (A), (B) and (C) is 100% by weight) and said .alpha.,.beta.-unsaturated nitrile-conjugated diene copolymer rubber consisting of (D) 10 to 60% by weight of an .alpha.,.beta.

Abstract: An adhesive composition comprising 10 to 80% by weight of a binder composed of an aminoalkyl ester group-containing acrylic copolymer shown ##STR1## wherein R denotes an alkylene possessing 2 to 3 carbon atoms, as a pendant group and an epoxy resin, and if desired a rust-proofing pigment and a silane coupling agent.

Abstract: Acid-curable resin compositions are described which comprise a mixture of a furan resin and a minor amount of an acid-curable epoxy resin. The acid-curable resin compositions may contain other components such as catalysts, solid particulate materials, etc. The procedures for curing such acid-curable resin compositions as well as methods for forming shaped, filled bodies such as sand cores and molds also are described. Sand cores and molds produced in accordance with the method of the invention exhibit good compression strength, good chemical resistance and increase resistance to stress cracking.

Abstract: Stabilized acetal polymer molding compositions are formed by first preparing an intimate dispersion of an amidine stabilizer in a carrier resin comprising an ionic polymer, i.e. an "ionomer", and compounding the dispersion with the acetal polymer. The resulting composition is found in many cases to have improved stability over compositions prepared by adding the amidine compound in an undispersed form.

Abstract: Stabilized acetal polymer molding compositions are formed by first preparing an intimate dispersion of cyanoguanidine or melamine in a carrier resin, e.g. a non-ionic carrier resin such as an ethylene/ethyl acrylate copolymer, and compounding the dispersion with the acetal polymer. The resulting composition is found in many cases to have improved thermal stability over compositions prepared by adding the cyanoguanidine or melamine as pure crystals.

Abstract: Processes for the preparation of random-fiber thermoset composite sheets by employing a latent curing agent thermoset resin formulation or a coreactant thermoset system such that uncured thermoset composite sheets are formed which can be subsequently formed and cured into articles of manufacture.

Abstract: The invention discloses a polyfunctional imide-containing phenolic imide which is the reaction product of a polyanhydride having at least three anhydride groups and aromatic compound having a single aromatic primary amine group. A varnish is prepared by the addition of an epoxy crosslinking agent to the imide. Fibrous substrates can be impregnated with the varnish and partially cured to prepare prepregs, and stacks of prepregs can then be heated and pressed to prepare laminates or printed circuit boards.

Abstract: A low temperature curing coating composition containing 10-80% by weight of binder and 20-90% by weight of an organic solvent in which the binder is(1) a polymer of polymerized monomers selected from the following group: styrene, methyl methacrylate, an alkyl methacrylate, an alkyl acrylate, each having 2-12 carbon atoms in the alkyl group and the polymer having pendant amino ester groups or hydroxy aminoester groups;(2) an epoxy resin and(3) a polyamine curing agent,The composition is used as a primer or topcoating for metal substrates and curings at temperatures of 0.degree. C. to ambient temperatures and at high relative humidity and provides a primer that has excellent adhesion to the substrate and provided a durable, corrosion resistant finish.

Abstract: A high solids coating composition which comprises 10-96 percent by weight resin solids of a low molecular weight epoxy oligomer, 2-35 percent by weight crosslinking glycoluril-formaldehyde resin and a primary sulfonic acid catalyst. The oligomer is condensed upon heating into a high molecular weight polymer film with simultaneous crosslinking with the crosslinking agent to provide the desired film properties.

Abstract: This invention is directed to curable molding compositions containing a mixture of a poly(acrylate); a polymerizable ethylenically unsaturated monomer which serves to crosslink the poly(acrylate) to a thermoset product; a crosslinkable vinyl monomer having a reactivity ratio (r.sub.1) with styrene of greater than one and at least one of the following: (i) a second crosslinkable vinyl monomer having a reactivity ratio (r.sub.1) with styrene of greater than one, (ii) an epoxy compound having at least one 1,2-epoxy group per molecule, and (iii) an unsaturated fatty acid ester; and a thermoplastic polymer low profile additive. The curable molding compositions exhibit improved shrink control during the curing reaction. This invention is also directed to fiber reinforced thermoset resin articles which exhibit generally improved surface appearance quality and can be produced by a rapid injection molding process from the curable molding compositions.