Biologically Derived Cellular Material Other Than Cereal, Cotton, Or Diatomaceous Earth Dnrm Patents (Class 523/446)
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Patent number: 10544256Abstract: The present invention relates to the use of oligo-N,N-bis(3-aminopropyl)methylamine as hardener for epoxy resins, and also to a corresponding curable composition, curing thereof, and the cured epoxy resin obtainable therefrom.Type: GrantFiled: July 8, 2016Date of Patent: January 28, 2020Assignee: BASF SEInventors: Alexander Panchenko, Monika Charrak, Ansgar Gereon Altenhoff, Thomas Reissner, Christian Krausche
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Patent number: 9637700Abstract: Provided herein are compositions comprising at least one estolide compound of formula: in which n is an integer equal to or greater than 0; m is an integer equal to or greater than 1; R1, independently for each occurrence, is selected from optionally substituted alkyl that is saturated or unsaturated, and branched or unbranched; R2 is selected from hydrogen and optionally substituted alkyl that is saturated or unsaturated, and branched or unbranched; and R3 and R4, independently for each occurrence, are selected from optionally substituted alkyl that is saturated or unsaturated, and branched or unbranched. Also provided are uses of the compositions described herein.Type: GrantFiled: August 18, 2015Date of Patent: May 2, 2017Assignee: Biosynthetic Technologies, LLCInventors: Travis Thompson, Jakob Bredsguard, Jeremy Forest
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Patent number: 9359467Abstract: Thermoset/supramolecular hybrid composites and resins, resulting from bringing at least one thermosetting resin precursor, this thermosetting resin precursor including hydroxyl functions and/or epoxy groups, and optionally ester functions, into contact with at least one hardener chosen from carboxylic acids and acid anhydrides, and with at least one compound including, on the one hand, at least one associative group, and on the other hand at least one function enabling the grafting thereof to the thermosetting resin precursor, to the hardener or to the product resulting from the reaction of the thermosetting resin precursor and the hardener, in the presence of at least one transesterification catalyst. Process for manufacturing these materials, process for transforming and process for recycling these materials. Novel solid forms of hybrid composites and resins which can be used in the implementation of these processes.Type: GrantFiled: May 10, 2012Date of Patent: June 7, 2016Assignees: ARKEMA FRANCE, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUEInventors: Ludwik Leibler, Damien Montarnal, François-Genes Tournilhac, Mathieu Capelot
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Publication number: 20120172494Abstract: A process for producing a composite product comprising fibres of a lignocellulosic material or natural fibres and a plastics material utilises a liquid or particulate binder formulation comprising a thermoset resin and a thermoplastic polymer, monomer, or oligomer. A composite product is formed for use as or in forming a feedstock in plastics manufacture may be broken down under heat and mechanical shearing in a plastics extrusion machine to release the major fraction of the fibres, or the product may be useful as an intermediate product in other form or as an end product.Type: ApplicationFiled: June 30, 2010Publication date: July 5, 2012Applicant: NEW ZEALAND FOREST RESEARCH INSTITUTE LIMITEDInventors: Jeremy Martin Warnes, Alan Fernyhough
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Publication number: 20110319524Abstract: Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.Type: ApplicationFiled: May 30, 2011Publication date: December 29, 2011Applicants: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, ARKEMA FRANCEInventors: Ludwik Leibler, Damien Montarnal, Francois-Genes Tournilhac, Mathieu Capelot
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Publication number: 20110178196Abstract: The present invention relates to biodegradable polymer mixtures comprising i) 40% to 95% by weight, based on the total weight of components i to ii, of at least one polyester based on aliphatic or aliphatic and aromatic dicarboxylic acids and aliphatic dihydroxy compounds; ii) 5% to 60% by weight, based on the total weight of said components i to ii, of polyalkylene carbonate, particularly polypropylene carbonate; iii) 0% to 60% by weight, based on the total weight of said components i to iii, of at least one biodegradable homo- or copolyester selected from the group consisting of polylactic acid, polycaprolactone and polyhydroxyalkanoate, and/or of an inorganic or organic filler; iv) 0% to 10% by weight, based on the total weight of said components i to ii, of an epoxy-containing copolymer based on styrene, acrylic ester and/or methacrylic ester, and v) 0% to 15% by weight of an additive selected from the group consisting of lubricant, antiblocking agent, antistat, UV absorber, UV stabilizer, thermal stabilType: ApplicationFiled: September 21, 2009Publication date: July 21, 2011Applicant: BASF SEInventors: Tobias Heinz Steinke, Jürgen Ahlers, Freddy Gruber, Gabriel Skupin
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Publication number: 20110028603Abstract: The invention relates to the use of hyperbranched polymers or oligomers comprising terminal primary and/or secondary amino groups as curing agents for epoxy resins. The invention further relates to a composition containing such polymers or oligomers, an uncured or only partially cured epoxy resin, and at least one optional curing agent for epoxy resins, as well as a cured epoxy resin that can be obtained by curing said components. The invention finally relates to a method for curing epoxy resins. In said method, an uncured or only partially cured epoxy resin is brought to a temperature of 5 to 150° C. or is exposed to microwave radiation along with at least one polymer or oligomer according to the definition above and at least one optional conventional curing agent for epoxy resins.Type: ApplicationFiled: April 9, 2009Publication date: February 3, 2011Applicant: BASF SEInventors: Maxim Peretolchin, Eva Rueba, Daniel Schoenfelder
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Patent number: 7709085Abstract: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.Type: GrantFiled: December 7, 2004Date of Patent: May 4, 2010Assignee: Sekisui Chemical Co., Ltd.Inventors: Koichi Shibayama, Koji Yonezawa, Kazuyoshi Shiomi, Motohiro Yagi, Hidenobu Deguchi, Nobuhiro Goto
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Patent number: 7655871Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.Type: GrantFiled: March 23, 2005Date of Patent: February 2, 2010Assignee: Sumitomo Bakelite Company LimitedInventors: Masataka Arai, Takeshi Hosomi, Hiroaki Wakabayashi
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Patent number: 7423070Abstract: The present invention is a surface-modified base matrix comprised of a porous polymeric base matrix onto which branched hydrophilic polyhydroxy-functional polymers have been covalently attached, wherein the polyhydroxy-functional polymers are hyperbranched polymers presenting a degree of branching (DB) of at least about 0.2 and each polymer is tethered to the base matrix at two or more points. The present matrix can for example be a cross-linked carbohydrate material, such as agarose, and the hyperbranched hydrophilic polymer can e.g. be a copolymer of epichiorohydrin and a sugar. The invention also relates to a method of surface-modification of a porous base matrix by activating functional hydroxy groups thereon and contacting the activated matrix with a hydrophilic hyperbranched hydroxy-functional polymer.Type: GrantFiled: June 18, 2003Date of Patent: September 9, 2008Assignee: GE Healthcare Bio-Sciences ABInventors: Anders Larsson, Ulrika Meyer, Kajsa Stridsberg Fridén, Eva Von Heijne
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Patent number: 7196124Abstract: Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reaction products derived from ricinoleic acid or castor oil estolides, epoxy group-containing compounds such as epoxy resins and/or epoxidized vegetable oil, epoxy hardeners such as polyamine and polycarboxylic acid hardeners, thermally activated free radical initiators such as peroxides, and optionally but preferably include fillers such as limestone or wood flour. The elastomers can be prepared using a two-step, solvent-less procedure at elevated or ambient temperatures. These predominantly “all-natural” elastomers have physical properties comparable to conventional petroleum-based elastomers and composites and exhibit good flexibility, resiliency, abrasion resistance and inertness to hydrolysis.Type: GrantFiled: January 8, 2004Date of Patent: March 27, 2007Assignee: Texas Tech UniversityInventors: Harry W. Parker, Richard W. Tock, Fang Qiao, Ronald S. Lenox
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Patent number: 6753086Abstract: An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formulae (1) and (2) and (D) an inorganic filler. The material exhibits an increased curing rate and an excellent storage stability. (P represents phosphorus atom, R1, R2, R3 and R4 each represent a substituted or unsubstituted aromatic group or an alkyl group, A1 and A2 each represent a divalent aromatic group, B1 represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divaient organic group having 1 to 13 carbon atoms and 0≦m≦0.75.Type: GrantFiled: September 25, 2002Date of Patent: June 22, 2004Assignee: Sumitomo Bakelite Company, Ltd.Inventors: Hiroshi Nagata, Yoshiyuki Goh
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Patent number: 6737157Abstract: The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent of a thin sheet metal mainly due to weight reduction of an automobile body, or for collision safety, and which improve a bending strength and a rigidity of the sheet metal without causing a distortion to the sheet metal. The coating type reinforcement composition of sheet metal according to the present invention comprises a liquid epoxy resin, a latent curing agent and an inorganic filler having an aspect ratio (L/D) of 5 or higher, an amount of the inorganic filler contained being 20 to 50% by weight and the composition being a viscous preparation with a high viscosity.Type: GrantFiled: September 27, 2002Date of Patent: May 18, 2004Assignee: Sunstar Giken Kabushiki KaishaInventors: Masaki Ukai, Yutaka Sugiura, Mutsuhisa Miyamoto
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Patent number: 6723802Abstract: Epoxy resin polyglycoside-based cured polymers and process for the preparation are described. A particular epoxy resin precursor is the diglycidyl ether of bisphenol A. A particular glucose based polymer is a glucose malic acid ester-vinyl copolymer. The polymers have a degree of biodegradability because of the polyglycoside as well as elevated temperature stability and are useful in transportation vehicle settings. Natural source fillers, such as cellulose fibers, which are treated or untreated, exfoliated clays or exfoliated graphite can be used.Type: GrantFiled: August 19, 2002Date of Patent: April 20, 2004Assignee: Board of Trustees of Michigan State UniversityInventors: Lawrence T. Drzal, Seong Ok Han
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Patent number: 6660190Abstract: A fire and flame retardant composition is provided by mixing brazing flux, baking soda, lime and redwood bark to form the basis of the material composition. The basic material is then readily combined with other materials including flammable items such as silicone, epoxy glue, or the like to produce a composite material which remains resistant or impervious to fire and flame. The basic material composition is further combined with a suitable binder such as silicone to form a coating mixture which, when layered upon a fabric such as cotton fabric, produces a fire and flame retardant garment which also produces improved insulation and protective characteristics while remaining flexible.Type: GrantFiled: November 1, 2001Date of Patent: December 9, 2003Inventor: James R. Huhn
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Patent number: 6596204Abstract: A process of micro-encapsulating a volatile liquid includes selecting a volatile liquid, such as Isophorone, and porous ceramic particles for encapsulating the volatile liquid. The volatile liquid and porous particles are mixed and a vacuum is applied to the mixture to impregnate the volatile liquid in the porous particles. A polymer catalyst for the polymer resin, such as an epoxy catalyst for use with an epoxy resin, is mixed with the volatile liquid and porous particles to saturate the particles. The polymer resin, such as epoxy resin, is added to the mixture for forming a resin cured shell around the porous particle holding the volatile liquid to form a microencapsulated volatile liquid. The resin is only cured on the outer shell of the porous particle when coming in contact with the catalyst supported with the volatile liquid in the porous particle.Type: GrantFiled: May 15, 2002Date of Patent: July 22, 2003Inventor: Phillip G. Landers
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Patent number: 6512031Abstract: An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth reaction and crosslinking reaction of the epoxy resin optimizes the reaction conditions to B-stage, giving a semi-cured film having a minimized variation. A laminate includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.Type: GrantFiled: April 14, 2000Date of Patent: January 28, 2003Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsuyoshi Honda, Miyuki Wakao, Toshio Shiobara
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Patent number: 6165558Abstract: A moulding powder which is curable with the application of heat and pressure, comprising a mechanical mixture consisting of: a) a powdered epoxy compound containing on average more than one epoxy group in the molecule and having a softening point of above 60.degree. C., b) a powdered aliphatic or N-heterocyclic amine or a powdered amino group-containing adduct based on an aliphatic, cycloaliphatic, araliphatic or N-heterocyclic amine containing on average more than one amino group in the molecule and having a melting point or softening point of above 60.degree. C. and, optionally, c) customary additives for moulding powders, the particles of a) and b) being smaller than 200 .mu.m, is excellently suited for the preparation of coatings on heat-sensitive substrates and is used in particular in powder coating.Type: GrantFiled: July 16, 1998Date of Patent: December 26, 2000Assignee: Vantico, Inc.Inventor: Hildegard Schneider
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Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom
Patent number: 5095047Abstract: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.Type: GrantFiled: April 2, 1990Date of Patent: March 10, 1992Assignee: Somar CorporationInventors: Osamu Ogitani, Ryuichi Fujii, Toru Shirose -
Patent number: 5088189Abstract: A solder paste flux comprising an epoxy resin, a carboxylic acid, a substantially solid alcohol, cellulose, a catalyst, a solvent for the carboxylic acid and a synthetic resin; a solder paste incorporating this solder paste flux; and a surface mount electronic manufacturing process utilizing the solder paste.Type: GrantFiled: February 28, 1991Date of Patent: February 18, 1992Assignee: Federated Fry MetalsInventor: John E. Brown
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Patent number: 4940852Abstract: A liquid or viscous curable adhesive composition having a prolonged pot life which is composed of a liquid or viscous curable resin which has, preferably evenly and randomly dispersed therethroughout, a multiplicity of rupturable microcapsules containing a curing agent in an amount sufficient to cure the resin. The microcapsules are rupturable upon the application thereto of external pressure, or other mechanical manipulation. Upon rupture, the curing agent is released into coacting relationship with the curable resin and forms therewith an activated adhesive composition.Type: GrantFiled: November 14, 1988Date of Patent: July 10, 1990Assignee: Milton P. ChernackInventor: Milton Chernack
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Patent number: 4853437Abstract: This invention relates to a novel composition comprising a water- and caustic-insoluble, inswellable, fibrous, particulate polymer comprising cross-linked units of a water-soluble polymer and a water-soluble cationic poly(diallylamine)-epichlorohydrin resin. This polymer is useful as an exchange resin, tablet disintegrant, thickener and suspending aid.Type: GrantFiled: March 4, 1988Date of Patent: August 1, 1989Assignee: Hercules IncorporatedInventors: Carl A. Lukach, Arjun C. Sau
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Patent number: 4837250Abstract: A trowelable ablative coating composition is disclosed. The composition comprises an epoxy resin, an amide curing agent, glass microspheres and ground cork. A method for protecting a substrate is also disclosed. The method comprises applying the trowelable ablative coating discussed above to a substrate and curing the coating composition.Type: GrantFiled: April 11, 1988Date of Patent: June 6, 1989Assignee: USBI Booster Production Company, Inc.Inventors: Stephen E. Headrick, Roger L. Hill
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Patent number: 4689358Abstract: A lightweight insulating polymer concrete formed from a lightweight closed cell aggregate and a water resistance polymeric binder.Type: GrantFiled: August 6, 1985Date of Patent: August 25, 1987Assignee: The Brooklyn Union Gas CompanyInventors: H. Peter Schorr, Jack J. Fontana, Meyer Steinberg
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Patent number: 4598110Abstract: A resin composition comprising(I) a granular or powdery resin which is a condensation product of a phenol, an aldehyde and optionally a nitrogen-containing compound having at least two active hydrogens and is characterized by (A) containing spherical primary particles and their secondary agglomerated particles each having a particle diameter of 0.1 to 150 microns, (B) having such a size that at least 50% by weight thereof can pass through a 100 Tyler mesh sieve, and (C) having a free phenol content, determined by liquid chromatography, of not more than 500 ppm, and(II) at least one member selected from the group consisting of (1) a rubbery elastic material, (2) a thermoplastic resin and (3) a curable resin other than said granular or powdery resin (I) and/or a filler material other than said granular or powdery resin (I).Type: GrantFiled: June 12, 1984Date of Patent: July 1, 1986Assignee: Kanebo Ltd.Inventors: Hiroaki Koyama, Shigeo Shimizu
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Patent number: 4486557Abstract: An adhesive binder composition is provided for the preparation of lignocellulosic composite molded articles such as flake or particle board, made from moldable compositions which comprises an organic di- or polyisocyanate a liquid aromatic epoxide and lignin, for application to the lignocellulosic material prior to the molding process to form the composite product.Type: GrantFiled: November 25, 1983Date of Patent: December 4, 1984Assignee: Atlantic Richfield CompanyInventors: James M. Gaul, Tinh Nguyen
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Patent number: 4472543Abstract: A flame retardant diaphragm for speakers, etc. comprises an admixture of natural fibers and inorganic fibers. The admixture is impregnated with a thermosetting resin and an organic bromine compound, and heat-treated under pressure. The organic bromine compound acts as a flame retarder.Type: GrantFiled: May 26, 1982Date of Patent: September 18, 1984Assignees: Pioneer Electronic Corporation, Mogami Denki Kabushiki KaishaInventors: Kazuo Tsuchiya, Fumio Kawahara, Shigeru Watanabe