Abstract: Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1.

Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

Abstract: Disclosed is a polyamideimide-based film coating composition free from any restricted substance or a substance which might possibly be a restricted one such as N-methyl pyrrolidone and N-ethyl pyrrolidone and capable of replacing a conventional coating composition using a solvent such as N-methyl pyrrolidone. The polyamideimide-based film coating composition of the present invention is a polyamideimide-based film coating composition comprising a polyamideimide resin and a solvent, the polyamideimide resin being dissolved as a binder in the solvent, wherein the solvent contains ?-butyrolactone and cyclopentanone, and a volume of ?-butyrolactone is 50% by volume or more compared to a total volume of ?-butyrolactone and cyclopentanone.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: The present invention discloses a thermosetting resin composition comprising: a bifunctional or multifunctional epoxy resin, a styrene-maleic anhydride (SMA) copolymer with a styrene/maleic anhydride molar ratio of 5-12:1 as a curing agent, a BPA epoxy resin with a low or high bromine content or tetrabromobisphenol A as a flame retardant agent, an accelerator and a solvent. The cured resin composition of the invention has a very low dielectric property, improved thermal reliability and better toughness. A copper clad laminate made of the resin composition and a reinforced material such as glass fiber cloth has a very low dielectric constant and dissipation factor, high Td, better toughness and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs and also applied to the common use of epoxy resins, such as molding resins, and composite materials for construction, automobiles and aviation.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: Disclosed herein is a flame retardant thermoplastic resin composition including a polycarbonate resin, a branched acrylic copolymer, and a flame retardant. The flame retardant thermoplastic resin composition can have good compatibility as well as good flame retardancy, scratch resistance, colorability and appearance without requiring the addition of a compatibilizer.

Abstract: The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.

Abstract: A cured epoxy coating comprising from about 30% to about 40% of at least one epoxy resin selected from the group consisting of diglycidyl ethers of bisphenol A, from about 55% to about 60% of a particulate flame retardant, from about 1% to about 4% of at least one multifunctional hindered phenol; and no more than about 5% of at least one adhesion promoter. The cured coating provides insulation for electrical current carriers and has an average surface roughness from about 10 ?m to about 13 ?m as measured using a Pethometer M4P 150 surface profile measuring instrument.

Abstract: The curable casting compound comprises an epoxy resin having at least one aminoglycidyl group in the molecule, a curative, and a fluorosurfactant. In the manufacture of products based on this casting compound, the shaping and curing operation can be shortened considerably.

Abstract: A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single component epoxy coating precursor includes an epoxy resin, a first solvent, and a blocked amine. The single component epoxy coating precursor has a viscosity after 30 days at a temperature of 55° C. of less than 16 stokes.

Abstract: A powder coating composition and method of applying it to a substrate, such as medium density fibreboard, consisting of a glycidyl methacrylate resin, a dicarboxylic acid cross-linking agent, a catalyst selected from phosphines, phosphonium, ammonium 2-phenyl-2-imidazoline, substituted imidazoline and isopropyl imidazole Bis-A epoxy resin adduct and a matte texturing agent. The inventive formulation is able to create a matte texture finish on the surface of the substrate. Since the cured final coating is resistant to yellowing and moisture, it is of great utility in the kitchen cabinet making industry.

Abstract: A curable composition for build-up which comprises (A) a bisepoxy compound represented by formula (I) shown below and (B) a polyepoxy compound having a polyhydric phenol skeleton at a weight ratio (A)/(B) of 3/97 to 20/80.

Abstract: Bromine containing 1,2-bis(phenyl)difluoromethane derivatives, a method for their preparation and their use in flame retardant compositions.

Abstract: There is provided a lubricating polymer-containing liquid which comprises a film-forming lubricating polymer, preferably a fluoropolymer, and a liquid medium predominantly comprised of cyclic hydrofluorocarbon wherein said lubricating polymer is dissolved or dispersed. A lubricative polymer film of good performance is formed by coating, for example, a magnetic recording hard disk, an ink jet recording head or a cleaning blade of an image-forming device with the lubricating polymer containing liquid, and then removing the liquid medium.

Abstract: The present invention relates to a polyol, polyurethane resin, rigid polyurethane foam, preparation process thereof and a preparation process of a rigid polyurethane foam composite. The polyol comprises an epoxy resin based polyol, which may be combined with a phenol resin based polyol component and/or an aromatic amine based polyol component. The polyurethane resin, foam and composite using the polyol as a raw material has resistance to dissolution in a hydrochlorofluorocarbon and a hydrofluorocarbon which are foaming agents having very low public environmental hazards and can be used as a thermal insulation material or a thermal insulation structure for refrigerators, freezers, insulation panels, ships and vehicles.

Abstract: A process for preparing a sterically stabilized non aqueous dispersion of a polyepoxide of epoxy equivalent weight in the range 350 to infinity, which comprises reacting a sterically stabilized non-aqueous dispersion of a compound with at least two epoxy groups with a diol of formula (1) ##STR1## in which B is a group of formula (2) ##STR2## where D is a methylene group or propane -2, 2-diyl.

Abstract: A primer composition for use on fiberglass reinforced polyester substrates combining an ether type low molecular weight epoxy resin, an amino functional silane and halogenated hydrocarbon solvent.

Abstract: A composition is provided comprising an epoxy resin, a curing agent for the epoxy resin, and a halogenated aromatic vinyl monomer. The composition exhibits sufficiently low viscosity to be suitable for fiber-reinforced composites applications, high Tg and flame retardancy.

Abstract: A high solids coating composition which comprises 10-96 percent by weight resin solids of a low molecular weight epoxy oligomer, 2-35 percent by weight crosslinking glycoluril-formaldehyde resin and a primary sulfonic acid catalyst. The oligomer is condensed upon heating into a high molecular weight polymer film with simultaneous crosslinking with the crosslinking agent to provide the desired film properties.

Abstract: A flame retardant diaphragm for speakers, etc. comprises an admixture of natural fibers and inorganic fibers. The admixture is impregnated with a thermosetting resin and an organic bromine compound, and heat-treated under pressure. The organic bromine compound acts as a flame retarder.

Abstract: A process for producing a colloidal solution of a curable resin which comprises:blending (a) 5 to 90% by weight of a polyfunctional maleimide component and (b) 95 to 10% by weight of at least one thermosetting resin,heating them to form a composition, andblending the resulting composition with at least one low boiling point solvent having a boiling point of more than room temperature and less than 150.degree. C., in which the thermosetting resin is rich soluble, but the maleimide component is poor soluble, thereby forming a colloidal solution of a curable resin is disclosed. The colloidal solution is used as a coating, as an impregnating agent for a coil, or for preparing prepreg.

Abstract: Adhesives and coatings, especially two-component epoxy laminating adhesives, are prepared so as to be flame-resistant in the so-called part B or polyamide component thereof by including in that component a chlorinated hydrocarbon solvent together with an adduct of a polyamide and an aromatic hydroxy or epoxy compound. By this approach, the amine is tied up and is rendered resistant to premature reaction with the chlorinated hydrocarbon solvent within the part B component, which premature reaction would lead to the formation of undesirable crystals within the part B component and reduce its pot life. When the part B component is blended with an epoxy-containing part B component, the polyamine adduct gradually disassociates in order to free the polyamine to catalyze setting of the two-component system, particularly the epoxy resin of the part A component.

Abstract: Ink compositions especially suitable for printing electronic circuit patterns on a substrate such as a flexible polyester substrate; methods for developing electrolessly and electrolytically the circuit configurations as articles of manufacture; flexographic printing with the ink composition has been disclosed as the preferred method.

Abstract: An aqueous based coating composition comprises a flow control agent, a water solubilized epoxy adduct of an epoxy compound and an amino-substituted aromatic carboxylic acid, and a curing agent. The coating composition is applied to conversion coated steel parts to provide an improved corrosion resistant organic coating thereon.